博文
激光干涉灼蚀直写有机半导体激光器(Advanced Materials)
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紫外激光干涉灼蚀直写单步制作有机半导体激光器（Advanced Materials,23,1860,2011）：
1、用紫外激光干涉灼蚀直写了一维和二维有机半导体激光器，并对比了两者的激光发射性能；
2、证明了紫外激光对有机半导体材料的非改性作用；
3、提出了适用了分布反馈式有机半导体制作的通用方法。
ABSTRACT
Green-emitting polymer lasers based one- and two-dimensional distributed feedback (DFB) mechanisms are achieved through direct writing by interference ablation. The polymer semiconductor material is removed at the bright fringes as the spin-coated polymer film is exposed to the interference pattern of a single UV laser pulse, producing the 1D DFB structures of the light-emitting polymer. Multiple exposing processes enable the fabrication of 2D structures, proving this to be a simple and flexible technique for the realization of a variety of organic laser schemes.
1D-2D有机半导体激光器表面形貌及发射光斑
https://blog.sciencenet.cn/blog-589967-457287.html
下一篇：基于有源波导光栅结构的有机半导体激光器(Optics Express)
