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Pre-1940
A timeline of Semiconductors in Computers 的中文翻译,
原文网址:http://www.computerhistory.org/semiconductor/timeline.html
仅供学习之用,无任何商业用途。材料完善中
Only for learning, no commercial use, copyright owned by the Computer History Museum.
1833:半导体现象的首次发现
First Semiconductor Effect is Recorded
1874:半导体点接触整流效应的发现
Semiconductor Point-Contact Rectifier Effect is Discovered
1901:半导体整流器取得探测器专利
Semiconductor Rectifiers Patented as "Cat's Whisker" Detectors
1926:场效应半导体器件概念申请专利
Field Effect Semiconductor Device Concepts Patented
1931:电子半导体理论的发表
"The Theory Of Electronic Semi-Conductors" is Published
1940:pn结的发现
1941:二战中的半导体二极管整流器
Semiconductor diode rectifiers serve in WW II
1947:点接触晶体管的发明
Invention of the Point-Contact Transistor
1948:结晶体管的概念
Conception of the Junction Transistor
1948:欧洲晶体管的发明
The European Transistor Invention
1951:第一生长结晶体管的制备
First Grown-Junction Transistors Fabricated
1951:区域精炼的发展
1952:贝尔实验室授权晶体管技术
Bell Labs Licenses Transistor Technology
1952:消费类晶体管产品的出现
Transistorized Consumer Products Appear
1953:晶体管计算机的出现
Transistorized Computers Emerge
1954:硅晶体管提供优越的工作特性
Silicon Transistors Offer Superior Operating Characteristics
1954:晶体管开发的扩散过程
Diffusion Process Developed for Transistors
1955:氧化物掩蔽膜的发展
1955:光刻技术在硅器件中的应用 Photolithography Techniques Are Used to Make Silicon Devices
1956: 硅片在硅谷首次出现
Silicon Comes to Silicon Valley
1958:隧道二极管高速半导体开关
Tunnel Diode Promises a High-Speed Semiconductor Switch
1958: 硅台面晶体管进入商业生产 Silicon Mesa Transistors Enter Commercial Production
1958: 所有半导体固态电路得以证明
All semiconductor "Solid Circuit" is demonstrated
1959:“平面”制造工艺的发明
Invention of the "Planar" Manufacturing Process
1959:实用单片集成电路概念申请专利
Practical Monolithic Integrated Circuit Concept Patented
1960:第一个平面集成电路的制作
First Planar Integrated Circuit is Fabricated
1960:金属氧化物半导体(MOS)晶体管的论证
Metal Oxide Semiconductor (MOS) Transistor Demonstrated
1960:外延沉积过程中提高晶体管的性能
Epitaxial Deposition Process Enhances Transistor Performance
1961:硅晶体管超过锗晶体管的速度
Silicon Transistor Exceeds Germanium Speed
1961:专用半导体测试装置问世 Dedicated Semiconductor Test Equipment Enters Commercial Market
1962:航天航空系统首先在计算机中应用集成电路
Aerospace systems are first the applications for ICs in computers
1963:互补金属氧化物半导体电路的研发
Complementary MOS Circuit Configuration is Invented
1963:标准逻辑集成电路家族介绍
Standard Logic IC Families introduced
1964:混合型微型电路达到生产总量的高峰
Hybrid Microcircuits Reach Peak Production Volumes
1964:第一个商业MOS集成电路的介绍
First Commercial MOS IC Introduced
1964:第一个被广泛使用的模拟集成电路出现
The First Widely-Used Analog Integrated Circuit is Introduced
1965:“摩尔定律”预测集成电路的发展走向
"Moore's Law" Predicts the Future of Integrated Circuits
1965:主机开始采用集成电路
Mainframe Computers Employ ICs
1965:封装成为系统设计首要问题
Package is the First to Accommodate System Design Considerations
1965:半导体只读存储器芯片的出现
Semiconductor Read-Only-Memory Chips Appear
1966: 半导体高速读写存储器
Semiconductor RAMs Serve High-speed Storage Needs
1966: 集成电路计算机辅助设计工具的开发
Computer Aided Design Tools Developed for ICs
1967: 核心设备供应商改变工业动向
Turnkey Equipment Suppliers Change Industry Dynamics
1967: 专用集成电路采用电脑辅助设计 Application Specific Integrated Circuits employ Computer-Aided Design
1968:专用电流源IC集成了数据转换功能
Dedicated Current Source IC Integrates a Data Conversion Function
1968:集成电路的硅栅技术开发
Silicon Gate Technology Developed for ICs
1969:肖特基势垒二极管双打的速度内存与逻辑
Schottky-Barrier Diode Doubles the Speed of TTL Memory & Logic
1970: MOS动态存储器和磁芯存储器相争
MOS Dynamic RAM Competes with Magnetic Core Memory on Price
1971: 可编程只读存储器
Reusable Programmable ROM Introduces Iterative Design Flexibility
1971:将微处理器的功能集成到CPU芯片上
Microprocessor Integrates CPU Function onto a Single Chip
1974:通用单片机家族公布于世
General-Purpose Microcontroller Family is Announced
1974:电子手表是第一个系统芯片集成电路
Digital Watch is First System-On-Chip Integrated Circuit
1974:量化集成电路工艺设计规则的缩放
Scaling of IC Process Design Rules Quantified
1978:用户可编程逻辑设备的出现
PAL User-Programmable Logic Devices Introduced
1979:单芯片数字信号处理器出现
Single Chip Digital Signal Processor Introduced
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