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陈立新专利报告分享 http://blog.sciencenet.cn/u/feixiangfeixian 中美欧日韩五局及PCT专利数据统计分析报告 陈立新 Tel13592308169 QQ86065045

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2021年半导体零配件领域的PCT专利申请状况——中国占23%，美国占14%，日本占49%，欧洲占6%

已有 21977 次阅读 2022-11-30 22:49 |系统分类:博客资讯

陈立新 张琳 黄颖：中美欧日韩五局专利报告3149.doc

█武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖

微信号：13592308169

附录2  2021年PCT国际专利申请统计分析报告

附录2.7 各技术领域的PCT专利申请状况

附录2.7.39 半导体零配件领域的PCT专利申请状况

第39个技术领域是半导体零配件，主要包括安装架、密封层、支架、冷却装置、防辐射保护装置等半导体通用零部件。2021年，该领域的PCT专利申请总计922项（增长率为4.5%），占总申请量的0.4%，是申请量第52多的领域。

2021年，中国局在半导体零配件领域上申请PCT专利211项，占该领域申请量的22.9%。美国局在该领域上申请专利130项，份额为14.1%。日本局申请专利451项，份额为48.9%。欧洲局申请专利58项，份额为6.3%。

 

附表2.7.39-1  2021年半导体零配件领域各专利局的PCT专利申请数量


专利局

申请数量

占本局比例

占领域比例

1

中国

211

0.3%

22.9%

2

美国

130

0.2%

14.1%

3

日本

451

1.0%

48.9%

4

欧洲

58

0.2%

6.3%

5

韩国

33

0.2%

3.6%

6

国际

22

0.2%

2.4%

7

英国

3

0.1%

0.3%

8

法国

3

0.1%

0.3%

9

加拿大

3

0.2%

0.3%

10

澳大利亚

0

0.0%

0.0%

11

土耳其

0

0.0%

0.0%

12

德国

1

0.1%

0.1%

13

以色列

1

0.1%

0.1%

14

瑞典

3

0.2%

0.3%

15

其他

3

--

0.3%


小计

922

--

100%

注：本表按照提交PCT国际专利申请的专利局进行统计。

 


附图2.7.39-1  2021年半导体零配件领域各专利局的PCT专利申请数量对比

 

2021年，在半导体零配件领域上PCT专利申请最多的机构是村田制造公司、三菱电机公司、华为技术公司。

 

附表2.7.39-2  2021年半导体零配件领域的PCT国际专利申请前10机构


机构名称

国家

机构英文名称

2021

1

村田制造公司

日本

MURATA MANUFACTURING CO., LTD.

65

2

三菱电机公司

日本

MITSUBISHI ELECTRIC CORPORATION

57

3

华为技术公司

中国

HUAWEI TECHNOLOGIES CO., LTD.

45

4

京瓷株式会社

日本

KYOCERA CORPORATION

30

5

罗姆株式会社

日本

ROHM CO., LTD.

30

6

长鑫存储技术有限公司

中国

CHANGXIN MEMORY TECHNOLOGIES, INC

26

7

高通公司

美国

QUALCOMM INCORPORATED

23

8

日立安斯泰莫株式会社

日本

HITACHI ASTEMO, LTD.

19

9

电装公司

日本

DENSO CORPORATION

18

10

索尼半导体解决方案公司

日本

SONY SEMICONDUCTOR SOLUTIONS   CORPORATION

18

注：本表数据按照第一申请人进行统计。

 


附图2.7.39-2  2021年半导体零配件领域的PCT国际专利申请前10机构

 

 

 

 

 

 

 

 

致谢

感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时，向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。

如需要中美欧日韩五局及PCT专利数据、专利报告，以及咨询相关专利问题请添加微信号。

微信号：13592308169

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附表  2021年该领域PCT国际专利申请

 

IDTitleApplicant
WO/2021/151130HEAT DISSIPATION DEVICE4MOTEC GMBH & CO KG
WO/2021/108903CREATING STAGING IN BACKPLANE FOR MICRO DEVICE INTEGRATIONVUEREAL INC.
WO/2021/108909HIGH EFFICIENT MICRO DEVICESVUEREAL INC.
WO/2021/226714PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLSVUEREAL INC.
WO/2021/000111INTERDIGITAL CAPACITOR AND MULTIPLYING DIGITAL-TO-ANALOG  CONVERSION CIRCUITHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/000304CAPACITOR AND FABRICATION METHOD THEREFORSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/003635STRUCTURE AND METHOD FOR FORMING CAPACITORS FOR  THREE-DIMENSIONAL NANDYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/007767INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICESYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/022416CAPACITOR AND MANUFACTURING METHOD THEREFORSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/022566SECURITY CHIP, PREPARATION METHOD FOR SECURITY CHIP, AND  ELECTRONIC DEVICESHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/026865CHIP INTERCONNECTION STRUCTURE, CHIPS AND CHIP INTERCONNECTION  METHODSHENZHEN GOODIX TECHNOLOGY CO.,LTD.
WO/2021/035572SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOFYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/042377INTEGRATED DEVICE AND MANUFACTURING METHOD THEREFORSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/046818ELECTRONIC COMPONENT COMPRISING SUBSTRATE WITH THERMAL  INDICATORYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/051285CAPACITOR AND MANUFACTURING METHOD THEREFORSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/056181ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREFORHONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
WO/2021/022642BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR AND  DISPLAY PANELWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/056592SEMICONDUCTOR APPARATUS, DEVICE FOR POWER CONVERSION, AND  METHOD FOR PROVIDING SEMICONDUCTOR APPARATUSRETHINK ROBOTICS GMBH
WO/2021/056603POWER TYPE SEMICONDUCTOR DEVICE PACKAGING STRUCTUREGLOBAL ENERGY INTERCONNECTION RESEARCH INSTITUTE CO., LTD.
WO/2021/056604PREPARATION PROCESS OF POWER TYPE SEMICONDUCTOR DEVICE PACKAGE  STRUCTUREGLOBAL ENERGY INTERCONNECTION RESEARCH INSTITUTE CO., LTD.
WO/2021/072670CHIP AND INTEGRATED CHIPHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/081728SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFORHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/081855CHIP PACKAGE ON PACKAGE STRUCTURE AND PACKAGING METHOD  THEREFOR, AND ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/081906SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR, AND  BACKPLANEBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/081943CHIP STACK PACKAGING STRUCTURE, PACKAGING METHOD THEREOF AND  ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/017239BUFFER STRUCTURE, DISPLAY PANEL, AND MANUFACTURING METHOD FOR  BUFFER STRUCTUREWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/087720SEMICONDUCTOR DEVICES HAVING ADJOINED VIA STRUCTURES FORMED BY  BONDING AND METHODS FOR FORMING THE SAMEYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/087735METHOD AND STRUCTURE FOR FORMING STAIRS IN THREE-DIMENSIONAL  MEMORY DEVICESYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/056704INTEGRATED FLEXIBLE SUBSTRATE WITH GOOD STRETCHABILITY,  FLEXIBLE CIRCUIT, AND METHOD FOR MANUFACTURING SAMETSINGHUA UNIVERSITY
WO/2021/062919CHIP-ON FILM AND DISPLAY DEVICETCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/092779CHIP PACKAGE ON PACKAGE STRUCTURE AND ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/027147TIMING CONTROL BOARD AND DISPLAY DEVICETCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/097730MULTI-CHIP STACK PACKAGE AND MANUFACTURING METHODHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/036027CHIP REWIRING STRUCTURE AND PREPARATION METHOD THEREFORCHIPMORE TECHNOLOGY CORPORATION LIMITED
WO/2021/097814CHIP PACKAGE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING  CHIP PACKAGEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/102876CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/102940INTEGRATED CIRCUITHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/108965ENCAPSULATION SUBSTRATE INTEGRATED WITH INDUCTOR, AND  ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/068388RECESSED STRUCTURE CAPABLE OF BEING CONVENIENTLY MONITORED  ONLINE, AND MANUFACTURING METHOD THEREOFSHANGHAI IC R & D CENTER CO., LTD.
WO/2021/103110CHIP PACKAGE STRUCTURE AND PACKAGING METHODCHINA WAFER LEVEL CSP CO., LTD.
WO/2021/088187PRESS-FIT POWER MODULE INSPECTION SYSTEM AND INSPECTION METHODSHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS
WO/2021/088197PACKAGING STRUCTURE OF AND MANUFACTURING METHOD FOR SILICON  CARBIDE MOSFET MODULEBEIJING UNIVERSITY OF TECHNOLOGY
WO/2021/103145GOA CIRCUIT AND DISPLAY PANEL COMPRISING THE GOA CIRCUITSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/114202SEMICONDUCTOR DEVICE PACKAGING STRUCTURE AND PREPARATION  METHOD THEREFORXIDIAN UNIVERSITY
WO/2021/114213CHIP PACKAGING STRUCTURESHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/022748SEMICONDUCTOR CHIP AND SMART POWER MODULEGUANGDONG MIDEA WHITE HOME APPLIANCE TECHNOLOGY INNOVATION  CENTER CO. LTD.
WO/2021/114281ELECTRONIC COMPONENT, CIRCUIT BOARD HAVING SAME, AND  ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/119924CHIP STACK STRUCTURE AND MANUFACTURING METHOD THEREFORHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/119930CHIP PACKAGE AND FABRICATION METHOD THEREFORHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/0568592.5-D MULTI-CHIP PACKAGING STRUCTURE FOR INTEGRATED ANTENNA  STRUCTURE, AND MANUFACTURING METHODSHANGHAI XIANFANG SEMICONDUCTOR CO., LTD
WO/2021/114326ARRAY SUBSTRATE AND DISPLAY PANELSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/114410PACKAGE STRUCTURE FACILITATING SYSTEM HEAT DISSIPATION, AND  PACKAGING PROCESS THEREOFSHANGHAI XIANFANG SEMICONDUCTOR CO., LTD
WO/2021/128366ELECTRONIC ELEMENT PACKAGING STRUCTUREAAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
WO/2021/082269SENSOR PACKAGING STRUCTURE AND ELECTRONIC DEVICEWEIFANG GOERTEK MICROELECTRONICS CO., LTD.
WO/2021/031507FORMATION OF FINE PITCH TRACES USING ULTRA-THIN PAA MODIFIED  FULLY ADDITIVE PROCESSCOMPASS TECHNOLOGY COMPANY LIMITED
WO/2021/012641ENCAPSULATION STRUCTURE WITH EXPOSED HIGH-DENSITY MULTI-SIDED  PINS AND PRODUCTION METHOD THEREFORGUANGDONG CHIPPACKING TECHNOLOGY CO., LTD.
WO/2021/142599CHIP PACKAGING STRUCTURE AND PACKAGING METHODSZ DJI TECHNOLOGY CO., LTD.
WO/2021/146855RADIO FREQUENCY FILTEREPICMEMS(XIAMEN) CO., LTD.
WO/2021/146901INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICESYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/155522HYBRID BONDING BASED INTEGRATED CIRCUIT DEVICE AND METHOD OF  MANUFACTURING THE SAMEALIBABA GROUP HOLDING LIMITED
WO/2021/155537COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PADTEXAS INSTRUMENTS INCORPORATED
WO/2021/159306PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR, AND  ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/128562CRIMPING-TYPE IGBT MODULE AND POWER SEMICONDUCTOR DEVICEZHUZHOU CRRC TIMES SEMICONDUCTOR CO., LTD.
WO/2021/168837DATA PROCESSING DEVICE AND METHODHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/174415PROTECTION STRUCTURES IN SEMICONDUCTOR CHIPS AND METHODS FOR  FORMING THE SAMEYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/174470CIRCUIT STRUCTURE AND ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/184166ELECTRONIC APPARATUS, CHIP PACKAGING STRUCTURE, AND  MANUFACTURING METHOD FOR SAMEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/022811SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFORFUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
WO/2021/184190CIRCUIT BOARD STRUCTURE, ELECTRONIC PRODUCT, AND MANUFACTURING  METHOD AND REPAIR METHOD FOR CIRCUIT BOARD STRUCTURESZ DJI TECHNOLOGY CO., LTD.
WO/2021/159588BONDING STRUCTURE AND MANUFACTURING METHOD THEREFORWUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
WO/2021/189232DISPLAY SUBSTRATE AND DISPLAY DEVICEBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/189292CHIP STRUCTURE AND CHIP PREPARATION METHODHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/189300MEMORY CHIP STACKED PACKAGE AND ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/179352HIGH-POWER IPM STRUCTURE BASED ON GRAPHENE-BASED PACKAGING  SUBSTRATE, AND PROCESSING TECHNOLOGYHUANGSHAN UNIVERSITY
WO/2021/189486DISPLAY PANEL AND DISPLAY DEVICEBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/195871EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC  DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/195942PHOTOELECTRIC CO-PACKAGING INTEGRATED DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/196012CHIP PACKAGE AND PREPARATION METHOD THEREFORSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/196016CAPACITOR, CAPACITOR STRUCTURE, AND METHOD FOR FABRICATING  CAPACITORSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/196018CAPACITOR AND MANUFACTURING METHOD THEREFORSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/196039SECURITY CHIP, METHOD FOR MANUFACTURING SECURITY CHIP, AND  ELECTRONIC DEVICESHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/203407SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAMEINNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
WO/2021/208006PACKAGING STRUCTURE, ELECTRIC VEHICLE AND ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/208066ELECTRONIC DEVICE, SEMICONDUCTOR WAFER, AND CHIP PACKAGE  STRUCTURE AND METHOD FOR MANUFACTURING SAMEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/208078SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/139040GALLIUM OXIDE FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD  THEREFORTHE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY  GROUP CORPORATION
WO/2021/217319PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND CHIP PACKAGING  METHODHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/217359THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE  SAMEYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/217361CHIP PACKAGE, ELECTRONIC DEVICE, AND PREPARATION METHOD FOR  CHIP PACKAGEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/223080DISPLAY SUBSTRATE AND DISPLAY DEVICEBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/226744DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY  APPARATUS AND MANUFACTURING METHOD THEREFORBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/226799PACKAGE STRUCTURE, MANUFACTURING METHOD THEREFOR, AND  COMMUNICATION APPARATUSHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/196351EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREFORZHUHAI ACCESS SEMICONDUCTOR CO., LTD
WO/2021/227045SEMICONDUCTOR PACKAGING METHOD AND PACKAGING STRUCTURE THEREOFSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/196359PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFORMONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
WO/2021/143000PACKAGE STRUCTURE AND FORMING METHOD THEREFORJCET GROUP CO., LTD.
WO/2021/093304PACKAGING STRUCTURE AND PACKAGING METHOD FOR CAVITY DEVICE  GROUPJCET GROUP CO., LTD.
WO/2021/237714CHIP ENCAPSULATION STRUCTURE AND METHOD, AND CHIP MODULESHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/196394SYSTEM-ON-CHIP INTEGRATED PACKAGING STRUCTURE, MANUFACTURING  METHOD THEREFOR AND THREE-DIMENSIONAL STACKED DEVICEHUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
WO/2021/232510GROUND REFERENCE SHAPE FOR HIGH SPEED INTERCONNECTINNOGRIT TECHNOLOGIES CO., LTD.
WO/2021/109527PLASTIC ENCAPSULATION STRUCTURE USED FOR THREE DIMENSIONAL  FAN-OUT ENCAPSULATIONSHANGHAI XIANFANG SEMICONDUCTOR CO., LTD
WO/2021/109528MULTI-CHANNEL AIP ENCAPSULATION STRUCTURE AND MANUFACTURING  METHOD THEREFORSHANGHAI XIANFANG SEMICONDUCTOR CO., LTD
WO/2021/047225HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION SYSTEMSOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA.
WO/2021/103489SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/103490SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/232521SUPPORTING PLATE, DISPLAY MODULE, AND ELECTRONIC DEVICEWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/253225CHIP PACKAGING STRUCTURE AND METHODINSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
WO/2021/223294CHIP ON FILMWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/088380SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/109540SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/036445POWER SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORGREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
WO/2021/232529BINDING REGION CIRCUITWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/253512THREE-DIMENSIONAL CAPACITOR/INDUCTOR BASED ON  HIGH-FUNCTIONAL-DENSITY THROUGH-SILICON VIA STRUCTURE, AND PREPARATION METHODFUDAN UNIVERSITY
WO/2021/082510SEMICONDUCTOR PACKAGE STRUCTURE HAVING MICRO-ISOLATION CAVITYZHEJIANG UNIVERSITY
WO/2021/227240THREE-DIMENSIONAL PACKAGING HOUSING STRUCTURE OF RADIO  FREQUENCY MICROSYSTEM AND MANUFACTURING METHODCHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.55 RESEARCH  INSTITUTE
WO/2021/109580SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/017896PACKAGING STRUCTURE AND FABRICATION METHOD THEREOFTONGFU MICROELECTRONICS CO., LTD.
WO/2021/017898PACKAGING STRUCTURE ANDFORMATION METHOD THEREOFNANTONG TONGFU MICROELECTRONICS CO., LTD
WO/2021/017961CHIP AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/018014TSV-BASED MULTI-CHIP PACKAGE STRUCTURE AND METHOD FOR  MANUFACTURING SAMESHANGHAI XIANFANG SEMICONDUCTOR CO., LTD.
WO/2021/253572CAPACITOR AND INDUCTOR EMBEDDED STRUCTURE AND MANUFACTURING  METHOD THEREFOR, AND SUBSTRATEZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
WO/2021/253573HEAT DISSIPATION AND ELECTROMAGNETIC SHIELDING EMBEDDED  ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUBSTRATEZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
WO/2021/018156PACKAGING DEVICE AND MANUFACTURING METHOD THEREFOR, AND  ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/036700MAGNETIC FLUID PUMP DEVICE FOR IGBT HEAT DISSIPATION AND TEST  METHODDALIAN UNIVERSITY OF TECHNOLOGY
WO/2021/135230CONTROL CHIP MOUNTING BASE OF CONTROL SYSTEMPAGEMAN TECHNOLOGY (TAICANG) CO., LTD.
WO/2021/027718HEAT SINK FOR IC COMPONENT AND IC HEAT SINK ASSEMBLYHARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
WO/2021/023306THREE-DIMENSIONAL PACKAGING STRUCTURE AND METHOD FOR BONDING  WALL FAN-OUT DEVICEXIAMEN SKY SEMICONDUCTOR TECHNOLOGY CO. LTD.
WO/2021/036786ELECTRONIC ASSEMBLY, AND ELECTRONIC APPARATUSHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/068657ENCAPSULATION STRUCTURE AND ELECTRONIC APPARATUSHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/208322MULTI-CHIP HEAT-DISSIPATING PACKAGING STRUCTURE AND PACKAGING  METHODFIBERHOME TELECOMMUNICATION TECHNOLOGIES CO., LTD
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WO/2021/037233PACKAGE BODY AND PREPARATION METHOD THEREFORSKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
WO/2021/057415LOW-EMI DEEP TRENCH ISOLATION TRENCH TYPE POWER SEMICONDUCTOR  DEVICE AND PREPARATION METHOD THEREFORNANJING MARCHING POWER TECHNOLOGY CO., LTD
WO/2021/135356ELECTRONIC MODULE AND ELECTRONIC APPARATUSHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/077937EMI SHIELDING MATERIAL, EMI SHIELDING PROCESS, AND  COMMUNICATION MODULE PRODUCTHANGZHOU JWL TECHNOLOGY INC.
WO/2021/128958ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR DIGITAL  CIRCUITTHE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY  GROUP CORPORATION
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WO/2021/073401CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTUREHANGZHOU JWL TECHNOLOGY INC.
WO/2021/063253MOLD, AND ENCAPSULATION METHOD FOR DISPLAY PANELBOE TECHNOLOGY GROUP CO., LTD.
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WO/2021/120774WAFER AND PROBING BOARD CARDHUAWEI TECHNOLOGIES CO., LTD.
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WO/2021/164596FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND  DISPLAY MODULEBOE TECHNOLOGY GROUP CO., LTD.
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WO/2021/227584ELECTROSTATIC PROTECTION CIRCUITCHANGXIN MEMORY TECHNOLOGIES, INC.
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WO/2021/179989POWER HEAT DISSIPATION DEVICEINVENTCHIP TECHNOLOGY CO., LTD.
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WO/2021/185108DOUBLE-SIDED CAPACITOR STRUCTURE AND FORMING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/203889PID TEST STRUCTURE AND SEMICONDUCTOR TEST STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/196988TEST CIRCUIT AND SEMICONDUCTOR TESTING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
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WO/2021/180122SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREFOR, AND  FUSING METHOD FOR LASER FUSECHANGXIN MEMORY TECHNOLOGIES, INC.
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WO/2021/203969ANTIFUSE DEVICE AND ANTIFUSE UNITCHANGXIN MEMORY TECHNOLOGIES, INC.
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WO/2021/204047SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR PREPARING SAMECHANGXIN MEMORY TECHNOLOGIES, INC.
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WO/2021/218963THYRISTOR ELEMENT, THYRISTOR ELEMENT ASSEMBLY STRUCTURE AND  SOFT STARTERZHUZHOU CRRC TIMES SEMICONDUCTOR CO., LTD.
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WO/2021/219008STIFFENER RING AND SURFACE PACKAGING ASSEMBLYHUAWEI TECHNOLOGIES CO., LTD.
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WO/2021/254040DISPLAY SUBSTRATE, AND DISPLAY PANEL AND METHOD FOR PREPARING  SAMEBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/238696WORD LINE LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
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WO/2021/259016DISPLAY SUBSTRATE, TESTING METHOD THEREFOR AND PREPARATION  METHOD THEREFOR, AND DISPLAY PANELBOE TECHNOLOGY GROUP CO., LTD.
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WO/2021/148140A HEATSINK WITH INCREASED AIR FLOWHUAWEI TECHNOLOGIES CO., LTD.
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WO/2021/185616MULTI-METAL HOOK-AND-LOOP WELDINGNANOWIRED GMBH
WO/2021/185617COMPOSITE CONNECTION OF TWO COMPONENTSNANOWIRED GMBH
WO/2021/185618CONNECTION OF COMPONENTSNANOWIRED GMBH
WO/2021/180660POWER MODULEDANFOSS SILICON POWER GMBH
WO/2021/186085ELECTRONIC PACKAGE AND ELECTRONIC DEVICE COMPRISING THE SAMEAMPLEON NETHERLANDS B.V.
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WO/2021/249680ELECTRICAL POWER MODULEMAGNA POWERTRAIN GMBH & CO KG
WO/2021/254679POWER SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE POWER  SEMICONDUCTOR ELEMENTSIEMENS AKTIENGESELLSCHAFT
WO/2021/259555COOLING GEOMETRY FOR POWER ELECTRONICSZF FRIEDRICHSHAFEN AG
WO/2021/234118ELECTRIC CIRCUIT FOR AN ELECTRONIC CHIP CARD MODULE WITH  COLOURED CONTACTS AND METHOD FOR PRODUCING SAMELINXENS HOLDING
WO/2021/254922THERMALLY STABLE BOND BETWEEN A STRANDED WIRE AND A CONTACT  PAD AND THE METHOD FOR PRODUCING ITHERAEUS NEXENSOS GMBH
WO/2021/165577AIRBRIDGE FOR MAKING CONNECTIONS ON SUPERCONDUCTING CHIP, AND  METHOD FOR PRODUCING SUPERCONDUCTING CHIPS WITH AIRBRIDGESIQM FINLAND OY
WO/2021/099719CONDUCTIVE METAL FRAME FOR A POWER ELECTRONIC MODULE AND  ASSOCIATED MANUFACTURING PROCESSSAFRAN
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WO/2021/019199BOARD ASSEMBLY WITH CHEMICAL VAPOR DEPOSITION DIAMOND (CVDD)  WINDOWS FOR THERMAL TRANSPORTMICROSEMI SEMICONDUCTOR LIMITED
WO/2021/094714SYSTEM-IN-PACKAGE ARCHITECTURE WITH WIRELESS BUS INTERCONNECTARM LIMITED
WO/2021/105676SENSOR SEMICONDUCTOR PACKAGE, ARTICLE COMPRISING THE SAME AND  MANUFACTURING METHOD THEREOFPREVAYL LIMITED
WO/2021/001757METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT  COMPONENTLANDA LABS (2012) LTD.
WO/2021/005585THREE-DIMENSIONAL INTEGRATED CIRCUITGOŁOFIT, Krzysztof
WO/2021/028800OPTO-ELECTRONIC DEVICE INCLUDING AN AUXILIARY ELECTRODE AND A  PARTITIONOTI LUMIONICS INC.
WO/2021/059052INTERCONNECTION WITH SIDE CONNECTION TO SUBSTRATEINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/064486ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLYINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/079209FORMING OF BUMP STRUCTUREINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/079333HEAT SINKS WITH VIBRATION ENHANCED HEAT TRANSFER FOR  NON-LIQUID HEAT SOURCESUNITED ARAB EMIRATES UNIVERSITY
WO/2021/111296PATTERNED DESIGN FOR THERMAL MANAGEMENT OF TWO-PHASE IMMERSION  COOLING SYSTEM FOR ELECTRONICS3M INNOVATIVE PROPERTIES COMPANY
WO/2021/116911SINGLE LAYER LC OSCILLATORWILIOT, LTD.
WO/2021/156688INTERCONNECT STRUCTURES WITH COBALT-INFUSED RUTHENIUM LINER  AND A COBALT CAPINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/148977THROUGH-INTERPOSER GROUNDING USING BLIND VIASMURATA MANUFACTURING CO., LTD.
WO/2021/149009ELECTRICAL CONNECTIONS TO EMBEDDED ELECTRONIC COMPONENTS3M INNOVATIVE PROPERTIES COMPANY
WO/2021/165801SEMICONDUCTOR STRUCTURE WITH CRACK-BLOCKING THREE-DIMENSIONAL  STRUCTUREMURATA MANUFACTURING CO., LTD.
WO/2021/186269INTERCONNECTION FABRIC FOR BURIED POWER DISTRIBUTIONINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/245467HIGH-RESOLUTION SOLDERINGORBOTECH LTD.
WO/2021/205247ELECTRIC ASSEMBLY INCLUDING HEAT SPREADING LAYER3M INNOVATIVE PROPERTIES COMPANY
WO/2021/209839THERMAL INTERFACE MATERIAL STRUCTURES FOR DIRECTING HEAT IN A  THREE-DIMENSIONAL SPACEINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/220071SECURE CHIP IDENTIFICATION USING RESISTIVE PROCESSING UNIT AS  A PHYSICALLY UNCLONABLE FUNCTIONINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/191781HEAT DISSIPATION MECHANISM, GATEWAY, AND LITE-GATEWAYTDK CORPORATION
WO/2021/234478MULTILAYER TAPE INCLUDING PLURALITY OF MAGNETIC METAL  PARTICLES AND ELECTRONIC ASSEMBLY INCLUDING THE SAME3M INNOVATIVE PROPERTIES COMPANY
WO/2021/229553NUCLEATION-INHIBITING COATING CONTAINING RARE EARTH COMPOUNDS  AND DEVICES INCORPORATING SAMEOTI LUMIONICS INC.
WO/2021/240305METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND  CORRESPONDING SEMICONDUCTOR DEVICESTMICROELECTRONICS S.R.L.
WO/2021/074916INTEGRATED ELECTRONIC STRUCTURE AND DATA COMMUNICATION BETWEEN  COMPONENTS OF THE STRUCTUREOEC SA
WO/2021/001924POWER MODULE AND MANUFACTURING METHOD THEREFORMITSUBISHI ELECTRIC CORPORATION
WO/2021/001927SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR  DEVICE, AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/002006SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND  MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/005650SERVO AMPMITSUBISHI ELECTRIC CORPORATION
WO/2021/005797SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/019594SEMICONDUCTOR MODULEMITSUBISHI ELECTRIC CORPORATION
WO/2021/019614SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND  MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/019697METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND  ELECTRONIC COMPONENT DEVICESHOWA DENKO MATERIALS CO., LTD.
WO/2021/028965SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/033269SEMICONDUCTOR PACKAGEMITSUBISHI ELECTRIC CORPORATION
WO/2021/033270SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERTER AND MOVING BODYMITSUBISHI ELECTRIC CORPORATION
WO/2021/038688POWER SEMICONDUCTOR DEVICE, PRODUCTION METHOD FOR POWER  SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/038796POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMEMITSUBISHI ELECTRIC CORPORATION
WO/2021/044550HEAT SINK AND SEMICONDUCTOR MODULEMITSUBISHI ELECTRIC CORPORATION
WO/2021/070358SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND  MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/074978SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/074980POWER MODULEMITSUBISHI ELECTRIC CORPORATION
WO/2021/075030VEHICLE-MOUNTED CHARGER AND MANUFACTURING METHODMITSUBISHI ELECTRIC CORPORATION
WO/2021/075035OPTICAL COMMUNICATION COMPONENTNIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/079427SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/084638HERMETICALLY SEALED SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/084749HEAT DISSIPATION SUBSTRATE AND PRODUCTION METHOD THEREFORMEIKO ELECTRONICS CO., LTD.
WO/2021/084750INTERPOSER MOUNTED SUBSTRATEMEIKO ELECTRONICS CO., LTD.
WO/2021/095146SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/100199SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SAME, AND ELECTRIC  POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/106114SEMICONDUCTOR MODULEMITSUBISHI ELECTRIC CORPORATION
WO/2021/111517COMPONENT MODULE AND MANUFACTURING METHOD THEREFORTAIYO YUDEN CO., LTD.
WO/2021/111534OPTICAL TRANSMISSION MODULEMITSUBISHI ELECTRIC CORPORATION
WO/2021/111563SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR  MANUFACTURING SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/111575ELEMENT MODULETOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
WO/2021/117191COMPONENT MODULE AND PRODUCTION METHOD FOR SAMETAIYO YUDEN CO., LTD.
WO/2021/124518POWER CONVERSION DEVICE AND METHOD FOR MANUFACTURING SAMETOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
WO/2021/130989POWER MODULE AND POWER CONVERTING DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/131044COMPONENT MODULETAIYO YUDEN CO., LTD.
WO/2021/140547ELECTRIC POWER CONVERSION UNITTOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
WO/2021/140572SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/140586SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/140664WIRING BOARD AND PRODUCTION METHOD FOR SAMENEC CORPORATION
WO/2021/144925SEMICONDUCTOR MODULESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/144980POWER MODULE AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/149161HEAT DISSIPATION MEMBER AND HEAT SINKMITSUBISHI ELECTRIC CORPORATION
WO/2021/053844SERVO DRIVEROMRON CORPORATION
WO/2021/157024SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/157045SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/059549DRIVERMITSUBA CORPORATION
WO/2021/161498COMPONENT MODULETAIYO YUDEN CO., LTD.
WO/2021/171336METHOD FOR MANUFACTURING SEMICONDUCTOR MODULETAIYO YUDEN CO., LTD.
WO/2021/171425DC POWER SUPPLY DEVICE, REFRIGERANT CYCLE DEVICE, AIR  CONDITIONER, AND REFRIGERATORMITSUBISHI ELECTRIC CORPORATION
WO/2021/181468SEMICONDUCTOR MODULETAIYO YUDEN CO., LTD.
WO/2021/181649SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAMETAIYO YUDEN CO., LTD.
WO/2021/014681ELECTRONIC CIRCUIT MODULEALPS ALPINE CO., LTD.
WO/2021/186519ELECTRONIC MODULE, METHOD FOR MANUFACTURING ELECTRONIC MODULE,  AND ENDOSCOPEOLYMPUS CORPORATION
WO/2021/186657SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/009970SEMICONDUCTOR MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/191946POWER MODULETAIYO YUDEN CO., LTD.
WO/2021/029105METAL FIXTURE AND ELECTRONIC COMPONENT UNITKYB CORPORATION
WO/2021/192245HIGH HEAT-DISSIPATION MODULE STRUCTURETAIYO YUDEN CO., LTD.
WO/2021/095282LIGHT-EMITTING DEVICENUVOTON TECHNOLOGY CORPORATION JAPAN
WO/2021/199384SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/199421CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICEFUJI CORPORATION
WO/2021/199447MEMORY UNIT, SEMICONDUCTOR MODULE, DIMM MODULE, AND  MANUFACTURING METHOD FOR SAMEULTRAMEMORY INC.
WO/2021/205634POWER SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/038951WIRING SUBSTRATENGK SPARK PLUG CO., LTD.
WO/2021/044663PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAMEMURATA MANUFACTURING CO., LTD.
WO/2021/038954ELECTRICAL DEVICE AND ELECTRONIC CONTROL DEVICEHITACHI AUTOMOTIVE SYSTEMS, LTD.
WO/2021/220357SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/220373SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/224996IMAGING MODULE, ENDOSCOPIC SYSTEM, AND METHOD FOR  MANUFACTURING IMAGING MODULEOLYMPUS CORPORATION
WO/2021/059576PIEZOELECTRIC OSCILLATORMURATA MANUFACTURING CO., LTD.
WO/2021/229673POWER SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/229733SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAMEMITSUBISHI ELECTRIC CORPORATION
WO/2021/234803SEMICONDUCTOR MODULEMITSUBISHI ELECTRIC CORPORATION
WO/2021/234849SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORNIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/234892SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, MOVING BODY,  AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/019877METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, AND  ELECTRONIC COMPONENT DEVICESHOWA DENKO MATERIALS CO., LTD.
WO/2021/038986METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND  ELECTRONIC COMPONENT DEVICESHOWA DENKO MATERIALS CO., LTD.
WO/2021/014732SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR  MANUFACTURE OF SEMICONDUCTOR PACKAGESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/234969SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/038989ELECTRONIC APPARATUS COOLING DEVICE, WATER-COOLED INFORMATION  PROCESSING DEVICE, COOLING MODULE, AND ELECTRONIC APPARATUS COOLING METHODNEC CORPORATION
WO/2021/240764COOLER AND SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/005915SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/005916SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICEDENSO CORPORATION
WO/2021/002132SEMICONDUCTOR MODULE CIRCUIT STRUCTUREFUJI ELECTRIC CO., LTD.
WO/2021/245907PHOTOELECTRON INTEGRATION MODULENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/245915POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND  POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/049111TERMINAL STRUCTURE, PACKAGE, AND METHOD FOR MANUFACTURING  TERMINAL STRUCTURENGK ELECTRONICS DEVICES, INC.
WO/2021/044691HIGH FREQUENCY MODULE AND COMMUNICATION DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/005972MULTILAYERED SUBSTRATEMURATA MANUFACTURING CO., LTD.
WO/2021/044698SEMICONDUCTOR LASER DEVICEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/095294PIEZOELECTRIC VIBRATOR AND METHOD FOR MANUFACTURING SAMEMURATA MANUFACTURING CO., LTD.
WO/2021/255829HEAT-RADIATING MEMBER AND HEAT-RADIATING SUBSTRATE USING SAMEMEIKO ELECTRONICS CO., LTD.
WO/2021/010079ELECTRONIC COMPONENT MOUNTING STRUCTURE, ELECTRONIC COMPONENT  MOUNTING METHOD, AND LED DISPLAY PANELV TECHNOLOGY CO., LTD.
WO/2021/044703SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR  MANUFACTURING SEMICONDUCTOR PACKAGESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/033418HIGH-FREQUENCY MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/024636SEMICONDUCTOR MODULEFUJI ELECTRIC CO., LTD.
WO/2021/039076HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/019982HEAT-CONDUCTING SHEET AND METHOD FOR MANUFACTURING SAMEAWA PAPER & TECHNOLOGICAL COMPANY, INC.
WO/2021/006076MULTILAYERED SUBSTRATEMURATA MANUFACTURING CO., LTD.
WO/2021/029150SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/010153SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAMESTANLEY ELECTRIC CO., LTD.
WO/2021/014904LID MATERIAL FOR LIGHT-EMITTING DEVICE, METHOD FOR  MANUFACTURING LID MATERIAL, AND LIGHT-EMITTING DEVICEDAISHINKU CORPORATION
WO/2021/059647HEAT DISSIPATION SHEETFUJIFILM CORPORATION
WO/2021/059648HEAT DISSIPATION SHEETFUJIFILM CORPORATION
WO/2021/002375SEALANT FOR ORGANIC EL DISPLAY ELEMENTSEKISUI CHEMICAL CO., LTD.
WO/2021/002379SEALING AGENT SET FOR ORGANIC EL DISPLAY ELEMENT AND ORGANIC  EL DISPLAY ELEMENTSEKISUI CHEMICAL CO., LTD.
WO/2021/006141MODULE AND METHOD FOR MANUFACTURING SAMEMURATA MANUFACTURING CO., LTD.
WO/2021/010164ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURE OF ELECTRONIC  COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/002387STORAGE DEVICE UNITPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/010173WIRING MODULE AND IMAGING DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/020019TRANSMISSION LINE SUBSTRATE AND ELECTRONIC DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/014925LID MATERIAL FOR LIGHT-EMITTING DEVICE AND METHOD FOR  MANUFACTURING LID MATERIALDAISHINKU CORPORATION
WO/2021/010204RESIN SHEET FOR SEALINGNITTO DENKO CORPORATION
WO/2021/010205SEALING RESIN SHEETNITTO DENKO CORPORATION
WO/2021/010206RESIN SHEET FOR SEALINGNITTO DENKO CORPORATION
WO/2021/010207RESIN SHEET FOR SEALINGNITTO DENKO CORPORATION
WO/2021/010208MULTILAYER RESIN SHEET FOR SEALINGNITTO DENKO CORPORATION
WO/2021/010209SEALING RESIN SHEETNITTO DENKO CORPORATION
WO/2021/010210SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/006297SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR  MANUFACTURING SEMICONDUCTOR PACKAGEDENSO CORPORATION
WO/2021/015006ELECTRIC DEVICE UNITHITACHI ZOSEN CORPORATION
WO/2021/015007HEAT DISSIPATION PLATE AND METHOD FOR MANUFACTURING HEAT  DISSIPATION PLATEHITACHI METALS,LTD.
WO/2021/015008ELECTRONIC COMPONENT-EMBEDDED SUBSTRATETDK CORPORATION
WO/2021/225006SEMICONDUCTOR DEVICEAOI ELECTRONICS CO.,LTD.
WO/2021/020193PACKAGE FOR MOUNTING ELECTRONIC COMPONENT, ELECTRONIC DEVICE,  AND ELECTRONIC MODULEKYOCERA CORPORATION
WO/2021/039202THERMALLY CONDUCTIVE RESIN AND HEAT-DISSIPATING STRUCTUREIBIDEN CO., LTD.
WO/2021/020331MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/020332MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/192341PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGESSHOWA DENKO MATERIALS CO., LTD.
WO/2021/020447ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE,  ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MOUNTING  SUBSTRATEKYOCERA CORPORATION
WO/2021/020456SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/020471CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME, COMPOSITE  SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND CIRCUIT SUBSTRATE AND METHOD  FOR MANUFACTURING SAMEDENKA COMPANY LIMITED
WO/2021/020480ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/020530ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/053975POWER CONVERTER AND MOTOR-INTEGRATED POWER CONVERTERHITACHI AUTOMOTIVE SYSTEMS, LTD.
WO/2021/033538ELECTRONIC SUBSTRATE, METHOD FOR MANUFACTURING ELECTRONIC  SUBSTRATE, AND ELECTRONIC INSTRUMENTAGC INC.
WO/2021/025045HEAT SINKMITSUBISHI MATERIALS CORPORATION
WO/2021/039325MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/025073MULTILAYER SUBSTRATE MANUFACTURING METHOD AND MULTILAYER  SUBSTRATEMURATA MANUFACTURING CO., LTD.
WO/2021/029371PACKAGE FOR MOUNTING OPTICAL ELEMENT, ELECTRONIC DEVICE, AND  ELECTRONIC MODULEKYOCERA CORPORATION
WO/2021/039376ELECTRICAL JUNCTION BOXAUTONETWORKS TECHNOLOGIES, LTD.
WO/2021/029416PRINTED CIRCUIT BOARDITABASHI SEIKI CO,. LTD.
WO/2021/044816SEMICONDUCTOR LASER DRIVING DEVICE, ELECTRONIC EQUIPMENT, AND  METHOD OF MANUFACTURING SEMICONDUCTOR LASER DRIVING DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/049237CONTACT PROBE AND INSPECTION SOCKET COMPRISING SAMEYAMAICHI ELECTRONICS CO., LTD.
WO/2021/049242WIRING CIRCUIT BOARDNITTO DENKO CORPORATION
WO/2021/054008ELECTRICAL CIRCUIT BODY, POWER CONVERSION DEVICE, AND  ELECTRICAL CIRCUIT BODY MANUFACTURING METHODHITACHI AUTOMOTIVE SYSTEMS, LTD.
WO/2021/054017MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/039500HEAT-RADIATING SHEET AND METHOD OF PRODUCING HEAT-RADIATING  SHEETDENKA COMPANY LIMITED
WO/2021/084848HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/100273METHOD AND SYSTEM FOR INTERCONNECTING POWER DEVICE EMBEDDED IN  SUBSTRATE USING CONDUCTING PASTE INTO CAVITIEMITSUBISHI ELECTRIC CORPORATION
WO/2021/145015SUBSTRATE AND ANTENNA MODULEFUJIKURA LTD.
WO/2021/039732COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL,  HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH  HEAT-CONDUCTING LAYERFUJIFILM CORPORATION
WO/2021/039809SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION, AND  SEMICONDUCTOR DEVICESUMITOMO BAKELITE CO., LTD.
WO/2021/039816ELECTRIC CIRCUIT BOARD AND POWER MODULEKYOCERA CORPORATION
WO/2021/065259SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/059851ELECTRONIC COMPONENT, MANUFACTURING METHOD OF ELECTRONIC  COMPONENT, MOUNTING STRUCTURE, AND MANUFACTURING METHOD OF MOUNTING STRUCTUREPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/039963MOUNT BOARD AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/039969ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/065272PHOTODETECTORHAMAMATSU PHOTONICS K.K.
WO/2021/049400ELECTRONIC COMPONENT MODULE AND PRODUCTION METHOD FOR  ELECTRONIC COMPONENT MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/059914ELECTRONIC CIRCUIT DEVICEHITACHI ASTEMO, LTD.
WO/2021/054143SUBSTRATE FOR SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING  SUBSTRATE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIRELESS  COMMUNICATION DEVICETORAY INDUSTRIES, INC.
WO/2021/045211VAPOR CHAMBER, ELECTRONIC APPARATUS, VAPOR CHAMBER SHEET,  SHEET HAVING MULTIPLE FACES OF VAPOR CHAMBER INTERMEDIARY BODY, ROLL HAVING  MULTIPLE FACES OF VAPOR CHAMBER INTERMEDIARY BODY WOUND THEREON, AND VAPOR  CHAMBER INTERMEDIARY BODYDAI NIPPON PRINTING CO., LTD.
WO/2021/059936THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD  THEREOF, AND SEMICONDUCTOR DEVICESHIN-ETSU CHEMICAL CO., LTD.
WO/2021/059947SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/049521MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/152899ELECTRONIC CONTROL DEVICEHITACHI ASTEMO, LTD.
WO/2021/131175COOLING STRUCTURE AND HEATSINKMEIDENSHA CORPORATION
WO/2021/049578SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND  SEMICONDUCTOR DEVICESHOWA DENKO MATERIALS CO., LTD.
WO/2021/049645ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC  PART AND DEVICESHOWA DENKO MATERIALS CO., LTD.
WO/2021/070569ELECTRONIC DEVICEDENSO CORPORATION
WO/2021/054316CIRCUIT BOARD AND MODULE COMPRISING SAMEDENKA COMPANY LIMITED
WO/2021/054332MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/065529AIRTIGHT CONNECTION UNIT, AIRTIGHT CONNECTION ASSEMBLY,  AIRTIGHT CONTAINER AND VAPORIZER, AS WELL AS METHOD FOR MANUFACTURING  AIRTIGHT CONNECTION ASSEMBLYHITACHI METALS, LTD.
WO/2021/117310SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/060161MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/060163MODULE AND METHOD FOR MANUFACTURING SAMEMURATA MANUFACTURING CO., LTD.
WO/2021/060164ELECTRONIC COMPONENT MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/054435CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULEKYOCERA CORPORATION
WO/2021/065601WIRING SUBSTRATEKYOCERA CORPORATION
WO/2021/060318HEAT-DISSIPATING SHEET, HEAT-DISSIPATING SHEET LAMINATE,  STRUCTURE, AND  HEAT-GENERATING ELEMENT  HEAT DISSIPATION TREATMENT METHODDENKA COMPANY LIMITED
WO/2021/060319HEAT DISSIPATION SHEET, HEAT DISSIPATION SHEET LAYERED BODY,  STRUCTURE, AND METHOD FOR DISSIPATING HEAT FROM HEAT-GENERATING ELEMENTDENKA COMPANY LIMITED
WO/2021/060320HEAT-DISSIPATING SHEETDENKA COMPANY LIMITED
WO/2021/060321HEAT DISSIPATION SHEETDENKA COMPANY LIMITED
WO/2021/079677RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/065672LID FOR ELECTRONIC DEVICE, PACKAGE, ELECTRONIC DEVICE, AND  ELECTRONIC MODULEKYOCERA CORPORATION
WO/2021/131192WIRING STRUCTURENGK ELECTRONICS DEVICES, INC.
WO/2021/060475ELECTRONIC COMPONENT MOUNTING BASE AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/060547ELECTRONIC DEVICEDENSO CORPORATION
WO/2021/171671IC MODULE AND METHOD FOR MANUFACTURING IC MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/085006POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER  SEMICONDUCTOR DEVICEHITACHI ASTEMO, LTD.
WO/2021/065899THERMALLY CONDUCTIVE RESIN SHEETSEKISUI CHEMICAL CO., LTD.
WO/2021/065907SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC  COMPONENT PRODUCTION METHODROHM CO., LTD.
WO/2021/065974RESIN COMPOSITION AND RESIN SHEETAJINOMOTO CO., INC.
WO/2021/070702SEMICONDUCTOR DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/111715IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/111716IMAGING DEVICE AND MANUFACTURING METHOD FOR IMAGING DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/066024LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND  ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/079735SEMICONDUCTOR DEVICE, RECTIFYING ELEMENT USING SAME, AND  ALTERNATORHITACHI POWER SEMICONDUCTOR DEVICE, LTD.
WO/2021/095401CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARDMURATA MANUFACTURING CO., LTD.
WO/2021/124653SEMICONDUCTOR DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/111731LIGHT-EMITTING DEVICE AND DISPLAY DEVICEJAPAN DISPLAY INC.
WO/2021/075360ELECTRONIC CONTROL DEVICEHITACHI ASTEMO, LTD.
WO/2021/079782INSULATED TRANSMISSION DEVICEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/100366ELECTRONIC DEVICE, SULFIDATION INHIBITOR, AND SEALANTKONICA MINOLTA, INC.
WO/2021/085180ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING  ELECTRONIC COMPONENT MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/079846SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/085216SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND  METHOD FOR PRODUCING SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/079851CIRCUIT MODULE AND METHOD FOR PRODUCING SAMEMURATA MANUFACTURING CO., LTD.
WO/2021/085234SEMICONDUCTOR MODULE, POWER CONVERSION APPARATUS, METHOD FOR  MANUFACTURING SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING POWER  CONVERSION APPARATUSMITSUBISHI ELECTRIC CORPORATION
WO/2021/079913SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/079918COMPOSITE SHEET AND METHOD FOR MANUFACTURING SAME, AND  LAMINATE AND METHOD FOR MANUFACTURING SAMEDENKA COMPANY LIMITED
WO/2021/090694MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/085303RESIN MOLDED BODY FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL  SEMICONDUCTOR DEVICEDAICEL CORPORATION
WO/2021/186782CIRCUIT BOARD MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/079995ELECTRONIC COMPONENT MOUNTING PACKAGE, ELECTRONIC DEVICE, AND  ELECTRONIC MODULEKYOCERA CORPORATION
WO/2021/085378LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND  ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/085383THERMALLY CONDUCTIVE SHEET AND PRODUCTION METHOD FOR SAMESEKISUI POLYMATECH CO., LTD.
WO/2021/085413MOUNT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULEKYOCERA CORPORATION
WO/2021/095515HEAT DISSIPATION SHEETTATSUTA ELECTRIC WIRE & CABLE CO., LTD.
WO/2021/106471RADAR DEVICEDENSO CORPORATION
WO/2021/192384SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/085458LIGHT-EMITTING ELEMENT MOUNTING PACKAGE AND LIGHT-EMITTING  DEVICEKYOCERA CORPORATION
WO/2021/124691HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/085490CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME, COMPOSITE  SUBSTRATE AND METHOD FOR PRODUCING SAME, AND CIRCUIT BOARD AND METHOD FOR  PRODUCING SAMEDENKA COMPANY LIMITED
WO/2021/124704SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/090759GRAPHENE-CONTAINING CARBONACEOUS MEMBER/CERAMIC ASSEMBLY AND  COPPER/GRAPHENE-CONTAINING CARBONACEOUS MEMBER/CERAMIC ASSEMBLYMITSUBISHI MATERIALS CORPORATION
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WO/2021/095568COOLING SYSTEM AND ELECTRONIC DEVICENEC PLATFORMS, LTD.
WO/2021/095569COOLING SYSTEM AND ELECTRONIC APPARATUSNEC PLATFORMS, LTD.
WO/2021/095572COOLING SYSTEM AND ELECTRONIC APPARATUSNEC PLATFORMS, LTD.
WO/2021/090780THERMALLY CONDUCTIVE SILICONE COMPOSITION AND THERMALLY  CONDUCTIVE SILICONE MATERIALPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/090785ELECTRONIC DEVICEELEPHANTECH INC.
WO/2021/111791HEAT SINK AND HEAT SINK MANUFACTURING METHODMITSUBISHI ELECTRIC CORPORATION
WO/2021/090840VAPOR CHAMBERFURUKAWA ELECTRIC CO., LTD.
WO/2021/090867LAMINATE FOR SEMICONDUCTOR PROCESSING, ADHESIVE TAPE FOR  SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICESEKISUI CHEMICAL CO., LTD.
WO/2021/095658SENSOR DEVICE AND SENSORPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/100504ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURE OF ELECTRONIC  COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/100505ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC  COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/100506ELECTRONIC COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/117392MULTILAYER SUBSTRATE, CIRCUIT DEVICE, AND FILTER CIRCUIT BOARDMURATA MANUFACTURING CO., LTD.
WO/2021/117400SEMICONDUCTOR DEVICENUVOTON TECHNOLOGY CORPORATION JAPAN
WO/2021/095792METHOD FOR MANUFACTURING SEALING SHEETAJINOMOTO CO., INC.
WO/2021/111845ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC  COMPONENTSONY GROUP CORPORATION
WO/2021/106620HEAT DISSIPATION CHIPROHM CO., LTD.
WO/2021/111846POWER SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAMEMITSUBISHI ELECTRIC CORPORATION
WO/2021/106655PACKAGE FOR HOUSING ELECTRONIC COMPONENT, ELECTRONIC DEVICE,  AND ELECTRONIC MODULEKYOCERA CORPORATION
WO/2021/181756HIGH FREQUENCY CIRCUIT AND COMMUNICATION DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/100674WINDOW AND WINDOW SPACER MEMBERLINTEC CORPORATION
WO/2021/100761CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING CURABLE RESIN  COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND  SEMICONDUCTOR DEVICEFUJIFILM CORPORATION
WO/2021/131423NON-CONTACT COMMUNICATION MEDIUMKYOCERA CORPORATION
WO/2021/192409SEMICONDUCTOR DEVICESANSHA ELECTRIC MANUFACTURING CO.,LTD.
WO/2021/124805ELECTRONIC COMPONENT MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/124806ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING  ELECTRONIC COMPONENT MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/186797CIRCUIT BOARD MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/106904GRAPHENE BONDED BODYMITSUBISHI MATERIALS CORPORATION
WO/2021/140765SEMICONDUCTOR DEVICE AND VEHICLEFUJI ELECTRIC CO., LTD.
WO/2021/111960THREE-DIMENSIONAL LAMINATED INTEGRATED CIRCUIT IN WHICH IS  USED LIQUID IMMERSION COOLING METHOD PERFORMED USING SEMICONDUCTOR PACKAGE  AND PERFORATED INTERPOSERSOFTBANK CORP.
WO/2021/140771SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/124832POWER MODULE, POWER CONVERSION DEVICE, AND METHOD FOR  MANUFACTURING POWER MODULEHITACHI ASTEMO, LTD.
WO/2021/124833POWER MODULEHITACHI ASTEMO, LTD.
WO/2021/149352POWER CONVERSION DEVICEDENSO CORPORATION
WO/2021/107114WIRING BASE, PACKAGE FOR STORING SEMICONDUCTOR ELEMENT, AND  SEMICONDUCTOR DEVICEKYOCERA CORPORATION
WO/2021/107145DISPLAY DEVICEKYOCERA CORPORATION
WO/2021/210214PIEZOELECTRIC VIBRATOR AND METHOD FOR MANUFACTURING SAMEMURATA MANUFACTURING CO., LTD.
WO/2021/220542PIEZOELECTRIC VIBRATORMURATA MANUFACTURING CO., LTD.
WO/2021/112073ELECTRONIC COMPONENT MOUNTING BASE, ELECTRONIC COMPONENT  PACKAGE AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC INSTRUMENTSONY GROUP CORPORATION
WO/2021/117548SEMICONDUCTOR DEVICE PRODUCTION METHOD, SEMICONDUCTOR DEVICE,  AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/131540LIGHT-EMITTING ELEMENT PACKAGE AND PRODUCTION METHOD FOR SAMEAJINOMOTO CO., INC.
WO/2021/145082SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/124922ELECTRIC POWER CONVERSION DEVICEHITACHI ASTEMO, LTD.
WO/2021/112238MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE WITH  ELECTROMAGNETIC SHIELD FILM, AND TERMINAL PROTECTION TAPELINTEC CORPORATION
WO/2021/145096ELECTRONIC DEVICEDENSO CORPORATION
WO/2021/192429HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/131663MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/153016WIRING BOARDKYOCERA CORPORATION
WO/2021/153023SUBSTRATE AND SEMICONDUCTOR PACKAGESONY GROUP CORPORATION
WO/2021/131718THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING SAME, AND  METHOD FOR MOUNTING THERMALLY CONDUCTIVE SHEETDEXERIALS CORPORATION
WO/2021/131775MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/149393ELECTRONIC CONTROL DEVICEHITACHI ASTEMO, LTD.
WO/2021/157199POWER CONVERTERDENSO CORPORATION
WO/2021/149404IMAGING DEVICEHITACHI ASTEMO, LTD.
WO/2021/140850MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/181789POWER CONVERSION UNIT AND POWER CONVERSION DEVICEHITACHI, LTD.
WO/2021/153061INSPECTION SOCKETYOKOWO CO., LTD.
WO/2021/255963WIRELESS MODULEFUJIKURA LTD.
WO/2021/132144SEMICONDUCTOR DEVICETAMURA CORPORATION
WO/2021/132177HEATSINK AND COOLING DEVICENIDEC CORPORATION
WO/2021/132182HEATSINK AND COOLING DEVICENIDEC CORPORATION
WO/2021/149452SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/153121SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR  MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICEROHM CO., LTD.
WO/2021/166447ELECTRONIC CONTROL DEVICEHITACHI ASTEMO, LTD.
WO/2021/181831ELECTRICAL CIRCUIT BODY, POWER CONVERSION DEVICE, AND  ELECTRICAL CIRCUIT BODY MANUFACTURING METHODHITACHI ASTEMO, LTD.
WO/2021/140962MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, RESIN SEALING  MEMBER, SEMICONDUCTOR DEVICE, AND POWER CONVERTERMITSUBISHI ELECTRIC CORPORATION
WO/2021/132678SEMICONDUCTOR CHIP PRODUCTION METHODLINTEC CORPORATION
WO/2021/161681SEMICONDUCTOR CIRCUIT DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/199553POWER MODULE ASSEMBLY, PROCESS FOR MANUFACTURING POWER MODULE  ASSEMBLY, AND POWER MODULEMITSUBISHI ELECTRIC CORPORATION
WO/2021/149491WIRING SUBSTRATE AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/145250SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/141045CIRCUIT BOARDTOPPAN PRINTING CO., LTD.
WO/2021/141110VAPOR CHAMBER WICK SHEET, VAPOR CHAMBER, AND ELECTRONIC  APPARATUSDAI NIPPON PRINTING CO., LTD.
WO/2021/166498WIRING SUBSTRATE AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/166511SEMICONDUCTOR LASER DEVICEPANASONIC CORPORATION
WO/2021/149637ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC  DEVICEROHM CO., LTD.
WO/2021/181895POWER CONVERSION UNIT, POWER CONVERSION DEVICE, AND MOBILE  BODYHITACHI, LTD.
WO/2021/149690THERMALLY CONDUCTIVE SHEET, LAMINATE, AND SEMICONDUCTOR DEVICESEKISUI CHEMICAL CO., LTD.
WO/2021/149727SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND  METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICESHOWA DENKO MATERIALS CO., LTD.
WO/2021/149728METHOD FOR MANUFACTURING TEST PIECE FOR ADHESION EVALUATION  TEST, AND ADHESION EVALUATION METHODMITSUBISHI ELECTRIC CORPORATION
WO/2021/157368MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/176871MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/186891SEMICONDUCTOR MODULEFUJI ELECTRIC CO.,LTD.
WO/2021/235002POWER MODULEHITACHI ASTEMO, LTD.
WO/2021/229859SEMICONDUCTOR DEVICE, BUSBAR, AND POWER CONVERSION DEVICEHITACHI ASTEMO, LTD.
WO/2021/166548SUBSTRATE WITH BUILT-IN COMPONENT AND POWER SUPPLY DEVICEOMRON CORPORATION
WO/2021/153444VAPOR CHAMBERFURUKAWA ELECTRIC CO., LTD.
WO/2021/153447SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/153450ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/149802COPPER/GRAPHENE JOINED BODY AND METHOD FOR MANUFACTURING SAME,  AND COPPER/GRAPHENE JOINED STRUCTUREMITSUBISHI MATERIALS CORPORATION
WO/2021/240877CRYSTAL OSCILLATORNIHON DEMPA KOGYO CO., LTD.
WO/2021/235005PRODUCTION METHOD FOR SEMICONDUCTOR DEVICELINTEC CORPORATION
WO/2021/171881PACKAGENGK ELECTRONICS DEVICES, INC.
WO/2021/149836SEMICONDUCTOR APPARATUS, AND INSPECTION DEVICE FOR SAMEKIMOTO Gunsei
WO/2021/199635SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/157467MOISTURE-CURABLE HOT MELT COMPOSITION FOR  ELECTRICAL/ELECTRONIC COMPONENTS, BONDING AGENT, AND COATING AGENTSEKISUI FULLER COMPANY, LTD.
WO/2021/153683SILSESQUIOXANE DERIVATIVE AND USE THEREFORTOAGOSEI CO., LTD.
WO/2021/157469ELECTRONIC CIRCUIT DEVICEHITACHI, LTD.
WO/2021/157472SIDE FILLING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND  METHOD FOR REMOVING SIDE FILLING MATERIALPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/166611POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/220570ELECTRONIC CONTROL DEVICEHITACHI ASTEMO, LTD.
WO/2021/186935POWER CONVERSION DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/153802SEMICONDUCTOR APPARATUSKIMOTO, Gunsei
WO/2021/245983VEHICLE-MOUNTED ELECTRONIC CONTROL DEVICEHITACHI ASTEMO, LTD.
WO/2021/255987POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULEHITACHI ASTEMO, LTD.
WO/2021/157720SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICEFLOSFIA INC.
WO/2021/261001PROCESSING DEVICEHITACHI ASTEMO, LTD.
WO/2021/172012SEMICONDUCTOR LASER APPARATUSPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/176978LASER MODULEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/172015SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/182016SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/192715SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/182022ELECTRONIC DEVICEROHM CO., LTD.
WO/2021/162127SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/177034SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/182047SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/172178ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/192755CIRCUIT BOARDSUMITOMO BAKELITE CO., LTD.
WO/2021/172202SEALING STRUCTURE AND METHOD FOR PRODUCING SAMENATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND  TECHNOLOGY
WO/2021/182078HEAT SINK INTEGRATED INSULATING CIRCUIT BOARDMITSUBISHI MATERIALS CORPORATION
WO/2021/187018SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/177093HEAT-DISSIPATING STRUCTURE AND ELECTRONIC APPARATUSMURATA MANUFACTURING CO., LTD.
WO/2021/192788SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/172355SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEMFLOSFIA INC.
WO/2021/215108HIGH FREQUENCY MODULE AND COMMUNICATION DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/172479HEAT DISSIPATION MEMBERKYOCERA CORPORATION
WO/2021/261013ELECTRONIC CONTROL DEVICE AND METHOD FOR MANUFACTURING  ELECTRONIC CONTROL DEVICEHITACHI ASTEMO, LTD.
WO/2021/250947SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEHITACHI ASTEMO, LTD.
WO/2021/177207LOW VOLTAGE VARISTOR, CIRCUIT BOARD, SEMICONDUCTOR COMPONENT  PACKAGE AND INTERPOSERNAMICS CORPORATION
WO/2021/205792SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICESONY GROUP CORPORATION
WO/2021/187187SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR  DEVICE, AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/182550THERMALLY CONDUCTIVE PASTESUMITOMO METAL MINING CO., LTD.
WO/2021/182554PROTECTIVE FILM-FORMING SHEETLINTEC CORPORATION
WO/2021/193090POWER CONVERSION DEVICEHITACHI, LTD.
WO/2021/200011ELEMENT-MOUNTED BOARD AND METHOD FOR  MANUFACTURINGELEMENT-MOUNTED BOARDDENKA COMPANY LIMITED
WO/2021/182569SEMICONDUCTOR DEVICESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/220641SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEDENSO CORPORATION
WO/2021/200057DEVICE AND METHOD FOR INCREASING THE RELIABILITY OF A POWER  MODULEMITSUBISHI ELECTRIC CORPORATION
WO/2021/187409SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/215140METAL PLATE, METAL-RESIN COMPOSITE, AND SEMICONDUCTOR DEVICEJX NIPPON MINING & METALS CORPORATION
WO/2021/200094SEMICONDUCTOR DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/187464INSULATED CIRCUIT BOARDMITSUBISHI MATERIALS CORPORATION
WO/2021/200138SEMICONDUCTOR DEVICESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/200166SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/200211SEMICONDUCTOR MODULEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/210344SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULEDENSO CORPORATION
WO/2021/200280ELECTRONIC COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/200336ELECTRONIC DEVICEROHM CO., LTD.
WO/2021/193528METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR  MANUFACTURING INSULATED CIRCUIT BOARDMITSUBISHI MATERIALS CORPORATION
WO/2021/193587SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR  MANUFACTURING SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/193607ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICEKYOCERA CORPORATION
WO/2021/200406SEMICONDUCTOR DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/193701INSULATED CIRCUIT BOARD MANUFACTURING METHODMITSUBISHI MATERIALS CORPORATION
WO/2021/205891LEAD FRAME PRODUCTION METHOD, LEAD FRAME, AND POWER SOURCE  DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/193810CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND  ALUMINUM-DIAMOND COMPLEXDENKA COMPANY LIMITED
WO/2021/193823SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORMITSUBISHI ELECTRIC CORPORATION
WO/2021/220684INSULATING FILM, METAL-CLAD MULTILAYER MEMBER AND REWIRING  LAYERPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/215187ELECTRONIC DEVICEDENSO CORPORATION
WO/2021/193877RELEASE FILM FOR USE IN SEMICONDUCTOR SEALING, MARKING FILM  FOR USE IN SEMICONDUCTOR SEALING, SEMICONDUCTOR PACKAGE, AND METHOD FOR  MANUFACTURING SEMICONDUCTOR PACKAGESHOWA DENKO MATERIALS CO., LTD.
WO/2021/193880HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUSSONY INTERACTIVE ENTERTAINMENT INC.
WO/2021/200724BORON NITRIDE SINTERED BODY, COMPOSITE BODY, METHOD FOR  PRODUCING SAID BORON NITRIDE SINTERED BODY, METHOD FOR PRODUCING SAID  COMPOSITE BODY, AND HEAT DISSIPATION MEMBERDENKA COMPANY LIMITED
WO/2021/200792COPPER BASE SUBSTRATEMITSUBISHI MATERIALS CORPORATION
WO/2021/200801CERAMIC CIRCUIT BOARD, ELECTRONIC DEVICE, METAL MEMBER, AND  PRODUCTION METHOD FOR CERAMIC CIRCUIT BOARDDENKA COMPANY LIMITED
WO/2021/200809CERAMIC CIRCUIT BOARD, ELECTRONIC DEVICE, AND METAL MEMBERDENKA COMPANY LIMITED
WO/2021/200813CERAMIC CIRCUIT BOARD, ELECTRONIC DEVICE, AND METAL MEMBERDENKA COMPANY LIMITED
WO/2021/240982SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND  ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/205926SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/205930MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/200971BORON NITRIDE SINTERED BODY, COMPLEX, METHOD FOR MANUFACTURING  THESE, AND HEAT DISSIPATION MEMBERDENKA COMPANY LIMITED
WO/2021/201019COOLING DEVICEMARELLI CORPORATION
WO/2021/210402SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/201119METAL BASE SUBSTRATEMITSUBISHI MATERIALS CORPORATION
WO/2021/206058TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION  MOLDING, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATION  MOLDED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGESHOWA DENKO MATERIALS CO., LTD.
WO/2021/206122ELECTRONIC DEVICEDENSO CORPORATION
WO/2021/261056POWER MODULEHITACHI POWER SEMICONDUCTOR DEVICE, LTD.
WO/2021/241053SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/229995SEMICONDUCTOR APPARATUS, TEMPERATURE CORRECTING SYSTEM, AND  ALARM SYSTEMSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/241064HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICEMURATA MANUFACTURING CO., LTD.
WO/2021/215463ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR  MANUFACTURING ELECTRONIC COMPONENTKYOCERA CORPORATION
WO/2021/215472SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/256083COOLING DEVICE AND SEMICONDUCTOR MODULEFUJI ELECTRIC CO., LTD.
WO/2021/230047THERMALLY CONDUCTIVE SHEET, AND METHOD FOR MANUFACTURING  THERMALLY CONDUCTIVE SHEETDEXERIALS CORPORATION
WO/2021/256092SEMICONDUCTOR MODULEFUJI ELECTRIC CO., LTD.
WO/2021/221042SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/225116CIRCUIT MODULE AND COMMUNICATION DEVICESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/241161HEAT RADIATION STRUCTURE, AND BATTERY PROVIDED WITH SAMESHIN-ETSU POLYMER CO., LTD.
WO/2021/235259THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD  FOR SAME, AND SEMICONDUCTOR DEVICESHIN-ETSU CHEMICAL CO., LTD.
WO/2021/246117MODULE AND METHOD FOR MANUFACTURING SAMEMURATA MANUFACTURING CO., LTD.
WO/2021/251045MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/230289TRANSMISSION COMPONENT AND SEMICONDUCTOR DEVICESUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
WO/2021/241249THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING SAME,  HEAT-DISSIPATING STRUCTURE, AND ELECTRONIC APPARATUSDEXERIALS CORPORATION
WO/2021/246136CIRCUIT BOARDSUMITOMO BAKELITE CO., LTD.
WO/2021/241298THERMALLY CONDUCTIVE SHEET WITH METAL PLATE AND METHOD FOR  PODUCING THERMALLY CONDUCTIVE SHEETSUMITOMO BAKELITE CO., LTD.
WO/2021/241304MOUNTING STRUCTURE FOR SEMICONDUCTOR MODULEROHM CO., LTD.
WO/2021/261117CIRCUIT SUBSTRATE HAVING CAVITY AND METHOD FOR MANUFACTURING  SAMETDK CORPORATION
WO/2021/235483VERTICAL CONTACT-TYPE PROBE, PROBE CARD, AND SOCKETSHIN-ETSU POLYMER CO., LTD.
WO/2021/241447SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/261136POWER MODULE AND POWER CONVERSION DEVICE USING SAID POWER  MODULEHITACHI, LTD.
WO/2021/246204SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR  MANUFACTURING SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/251112METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN  COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTIONSHOWA DENKO MATERIALS CO., LTD.
WO/2021/251126SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/241642TEMPERATURE ADJUSTMENT UNIT AND METHOD FOR MANUFACTURING  TEMPERATURE ADJUSTMENT UNITTOMOEGAWA CO., LTD.
WO/2021/241643TEMPERATURE ADJUSTMENT UNITTOMOEGAWA CO., LTD.
WO/2021/241691DIAMOND COMPOSITE AND PRODUCTION METHOD THEREFORNATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND  TECHNOLOGY
WO/2021/251160MODULE AND COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/256220THERMAL CONDUCTOR AND METHOD FOR MANUFACTURING THERMAL  CONDUCTORSHOWA MARUTSUTSU COMPANY, LTD.
WO/2021/246369METHOD FOR MANUFACTURING INSULATED RESIN CIRCUIT BOARDMITSUBISHI MATERIALS CORPORATION
WO/2021/261179CIRCUIT BOARDSUMITOMO BAKELITE CO., LTD.
WO/2021/246397TWO-PACK CURABLE HEAT CONDUCTIVE GREASE COMPOSITION, HEAT  CONDUCTIVE GREASE AND ELECTRONIC DEVICEDENKA COMPANY LIMITED
WO/2021/251218MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/251219MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/256299MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/256300MODULEMURATA MANUFACTURING CO., LTD.
WO/2021/246519VAPOR CHAMBER AND MANUFACTURING METHOD FOR VAPOR CHAMBERFURUKAWA ELECTRIC CO., LTD.
WO/2021/261270ELECTRONIC COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/261273ELECTRONIC COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/256426ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFORELEPHANTECH INC.
WO/2021/256501ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC  COMPONENTMURATA MANUFACTURING CO., LTD.
WO/2021/261356METHOD FOR PRODUCING COVER MEMBERNIPPON ELECTRIC GLASS CO., LTD.
WO/2021/261441ALUMINUM NITRIDE SINTERED BODY, CIRCUIT SUBSTRATE AND JUNCTION  SUBSTRATEDENKA COMPANY LIMITED
WO/2021/261508SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/261520SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAMEDENSO CORPORATION
WO/2021/261525WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND  SEMICONDUCTOR PACKAGESHOWA DENKO MATERIALS CO., LTD.
WO/2021/261552EVAPORATOR AND LOOP HEAT PIPEKAWASAKI JUKOGYO KABUSHIKI KAISHA
WO/2021/010521MODULE FOR REMOVING MIS-ASSEMBLED SEMICONDUCTOR LIGHT-EMITTING  ELEMENT AND METHOD FOR REMOVING MIS-ASSEMBLED SEMICONDUCTOR LIGHT-EMITTING  ELEMENT BY USING SAMELG ELECTRONICS INC.
WO/2021/100947METHOD FOR MANUFACTURING DISPLAY DEVICE USING SEMICONDUCTOR  LIGHT-EMITTING ELEMENTS AND SELF-ASSEMBLY DEVICE USED THEREFORLG ELECTRONICS INC.
WO/2021/075639SEMICONDUCTOR DEVICE PACKAGE COMPRISING THERMAL INTERFACE  LAYER AND METHOD FOR MANUFACTURING SAMEINDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY  ERICA CAMPUS
WO/2021/117984HEAT REGULATING DEVICE USING SHAPE MEMORY ALLOY, POWER  ELECTRONIC SYSTEM PROVIDED WITH SAME, AND SHAPE MEMORY ALLOY STRUCTURE  THEREOFLS ELECTRIC CO., LTD.
WO/2021/040178PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAMESKC CO., LTD.
WO/2021/210712SEMICONDUCTOR LEAD FRAME STAMPING DIE WITH IMPROVED PRODUCTION  EFFICIENCYDONG HO A-TEC CO., LTD.
WO/2021/230390POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULELG ELECTRONICS INC.
WO/2021/006479ELECTRONIC DEVICE INCLUDING INTERPOSERSAMSUNG ELECTRONICS CO., LTD.
WO/2021/230413CONDUCTOR BONDING METHODAN, Seong Ryong
WO/2021/201336FLIP CHIP BONDING-BASED SEMICONDUCTOR DEVICE PACKAGEKOSTEC SYS. CO., LTD
WO/2021/015466CHIP DEVICEMODA-INNOCHIPS CO., LTD.
WO/2021/015503INTERPOSER AND ELECTRONIC DEVICE INCLUDING THE SAMESAMSUNG ELECTRONICS CO., LTD.
WO/2021/049805SEALING SHEET, AND SEMICONDUCTOR DEVICE INCLUDING SAMEDOOSAN CORPORATION
WO/2021/096178ANTENNA PACKAGEDONGWOO FINE-CHEM CO., LTD.
WO/2021/101151ELECTRONIC DEVICE INCLUDING CONNECTION MEMBERSAMSUNG ELECTRONICS CO., LTD.
WO/2021/096318CARRIER SUBSTRATE AND ELEMENT TRANSFER METHOD USING SAMECENTER FOR ADVANCED META-MATERIALS
WO/2021/112498FINGERPRINT RECOGNITION MODULE AND ELECTRONIC DEVICE  COMPRISING SAMELG INNOTEK CO., LTD.
WO/2021/112627UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR  MANUFACTURING SEMICONDUCTOR PACKAGE USING SAMEDOOSAN CORPORATION
WO/2021/137469SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTION MEMBER  FORMED USING PHOTOSENSITIVE ANISOTROPIC CONDUCTIVE LAYER, AND METHOD FOR  PRODUCING SAMEKOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
WO/2021/125761SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFORAMOSENSE CO.,LTD
WO/2021/137549LIGHT-EMITTING ELEMENT FLAT BONDING METHOD AND FLAT BONDING  DEVICESEOUL VIOSYS CO., LTD.
WO/2021/162369POWER MODULE AND METHOD FOR MANUFACTURING SAMEAMOGREENTECH CO., LTD.
WO/2021/187772LED CHIP TRANSFER METHOD AND APPARATUS USING FOAM AND  PHOTOSENSITIVE RESIN, AND METHOD FOR MANUFACTURING DISPLAY DEVICE BY USING  SAMELIGHTIZER CO., LTD.
WO/2021/230615POWER MODULE AND METHOD FOR MANUFACTURING SAMEAMOSENSE CO., LTD.
WO/2021/230617POWER MODULEAMOSENSE CO., LTD.
WO/2021/230620POWER MODULEAMOSENSE CO., LTD.
WO/2021/230621POWER MODULEAMOSENSE CO., LTD.
WO/2021/230623POWER MODULEAMOSENSE CO., LTD.
WO/2021/241950POWER MODULEAMOSENSE CO., LTD.
WO/2021/241951POWER MODULEAMOSENSE CO., LTD.
WO/2021/242013PACKAGE SUBSTRATELG INNOTEK CO., LTD.
WO/2021/261940STACKED PACKAGE USING STEPPED CAVITY SUBSTRATE AND METHOD FOR  MANUFACTURING SAMESIMMTECH CO., LTD.
WO/2021/261955STACKED PACKAGE HAVING CHIP MOUNTED IN CAVITY AND METHOD FOR  FABRICATING SAMESIMMTECH CO., LTD.
WO/2021/049995METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A  SEPARATE SUBSTRATERIBET, Frederico
WO/2021/158158ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING  CAPACITOR COUPLED TO COMPONENT PADSSMOLTEK AB
WO/2021/177874HIGH-CURRENT SEMICONDUCTOR COMPONENTS AND SYSTEMSPOWONICS AB
WO/2021/262086HEAT SINK ARRAY AND METHOD OF USENATIONAL UNIVERSITY OF SINGAPORE
WO/2021/025688DIELECTRIC PASSIVATION FOR LAYERED III-NITRIDE STRUCTURESIQE PLC
WO/2021/025724METAL-INSULATOR-METAL (MIM) CAPACITORMICROCHIP TECHNOLOGY INCORPORATED
WO/2021/167596ELECTRIC POWER MODULEPIERBURG GMBH
WO/2021/167618HEAT DISSIPATERS FOR VOLTAGE REGULATORSHEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
WO/2021/177958PROTECTIVE MESH ARRAY FOR USE WITHIN AN ELECTRICAL NETWORKLYNN, David
WO/2021/096552BONDED ASSEMBLY CONTAINING A DIELECTRIC BONDING PATTERN  DEFINITION LAYER AND METHODS OF FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/145908TECHNIQUES FOR FORMING INTEGRATED INDUCTOR-CAPACITOR  OSCILLATORS AND RELATED METHODS, OSCILLATORS, SEMICONDUCTOR DEVICES,  SYSTEMS-ON-CHIPS, AND OTHER SYSTEMSMICROCHIP TECHNOLOGY INCORPORATED
WO/2021/188128DEFORMED MESH THERMAL GROUND PLANEKELVIN THERMAL TECHNOLOGIES, INC.
WO/2021/154326BONDED ASSEMBLY CONTAINING METAL-ORGANIC FRAMEWORK BONDING  DIELECTRIC AND METHODS OF FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/188133SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING  PADS AND METHODS OF FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/055030GLASS DIELECTRIC LAYER WITH PATTERNINGINTEL CORPORATION
WO/2021/061208ELECTROSTATIC DISCHARGE PROTECTION FOR STACKED-DIE SYSTEMINTEL CORPORATION
WO/2021/040877MOLDED SILICON INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT  PACKAGESINTEL CORPORATION
WO/2021/061246MOLDED INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT  PACKAGESINTEL CORPORATION
WO/2021/141631THERMAL MANAGEMENT PACKAGE AND METHODMICROCHIP TECHNOLOGY INC.
WO/2021/016378THERMAL MANAGEMENT OF HIGH HEAT FLUX MULTICOMPONENT ASSEMBLYHENKEL IP & HOLDING GMBH
WO/2021/016399THERMAL MANAGEMENT DEVICE AND SYSTEMMONAZAMI, Reza
WO/2021/016408OVERLAY MEASUREMENT TARGETS DESIGNKLA CORPORATION
WO/2021/016547WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED  CIRCUIT DIESAMTEC, INC.
WO/2021/040955MONOLITHIC DIE WITH ACOUSTIC WAVE RESONATORS AND ACTIVE  CIRCUITRYINTEL CORPORATION
WO/2021/030072ELECTRONIC MODULE FOR MOTHERBOARDRAYTHEON COMPANY
WO/2021/026342ELECTRONICS ASSEMBLIES AND METHODS OF MANUFACTURING  ELECTRONICS ASSEMBLIES WITH IMPROVED THERMAL PERFORMANCEINTELLIGENT PLATFORMS, LLC
WO/2021/133434SKIP LEVEL VIAS IN METALLIZATION LAYERS FOR INTEGRATED CIRCUIT  DEVICESINTEL CORPORATION
WO/2021/091609POWER DELIVERY NETWORK FOR ACTIVE-ON-ACTIVE STACKED INTEGRATED  CIRCUITSXILINX, INC.
WO/2021/041044METAL LAYER PATTERNING FOR MINIMIZING MECHANICAL STRESS IN  INTEGRATED CIRCUIT PACKAGESCIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
WO/2021/034624ATOMIC FORCE MICROSCOPY TIPS FOR INTERCONNECTIONFACEBOOK TECHNOLOGIES, LLC
WO/2021/034818METHODS AND APPARATUS FOR CONTACTLESS SUBSTRATE WARPAGE  CORRECTIONAPPLIED MATERIALS, INC.
WO/2021/041147METHOD AND SYSTEM OF STRETCHING AN ACCEPTOR SUBSTRATE TO  ADJUST PLACEMENT OF A COMPONENTSELFARRAY, INC.
WO/2021/126319THERMALLY CONDUCTIVE SLUGS/ACTIVE DIES TO IMPROVE COOLING OF  STACKED BOTTOM DIESINTEL CORPORATION
WO/2021/066981PACKAGE COMPRISING A SOLDER RESIST LAYER CONFIGURED AS A  SEATING PLANE FOR A DEVICEQUALCOMM INCORPORATED
WO/2021/066982PACKAGE COMPRISING A DIE AND DIE SIDE REDISTRIBUTION LAYERS  (RDL)QUALCOMM INCORPORATED
WO/2021/066983ULTRA-LOW PROFILE STACKED RDL SEMICONDUCTOR PACKAGEQUALCOMM INCORPORATED
WO/2021/050514SYSTEMS AND METHODS FOR REDUCING VIA FORMATION IMPACT ON  ELECTRONIC DEVICE FORMATIONCORNING INCORPORATED
WO/2021/061481VIAS INCLUDING CIRCUMFERENTIAL TRENCHES, INTERPOSER INCLUDING  THE VIAS, AND METHOD FOR FABRICATING THE VIASCORNING INCORPORATED
WO/2021/118672ELECTRONIC DEVICE INCLUDING HERMETIC MICRO-CAVITY AND METHODS  OF PREPARING THE SAMERAYTHEON COMPANY
WO/2021/076284CONFORMAL SHIELD FOR BLOCKING LIGHT IN AN INTEGRATED CIRCUIT  PACKAGECIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
WO/2021/096597PACKAGE SPARK GAP STRUCTUREINTEL CORPORATION
WO/2021/067330ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAMESAMTEC, INC.
WO/2021/162752PROCESS TO YIELD ULTRA-LARGE INTEGRATED CIRCUITS AND  ASSOCIATED INTEGRATED CIRCUITSRAYTHEON COMPANY
WO/2021/067908EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN  1C CIRCUITSTEXAS INSTRUMENTS INCORPORATED
WO/2021/076355HIGH TEMPERATURE PRINTED CIRCUIT BOARD SUBSTRATE3D GLASS SOLUTIONS, INC.
WO/2021/072010THERMOELECTRIC COOLERS FOR ELECTRONICS COOLINGBAE SYSTEMS CONTROLS INC.
WO/2021/076408COMBINED HEAT EXCHANGER AND RF SHIELDMICROSOFT TECHNOLOGY LICENSING, LLC
WO/2021/108037INDUCTOR DESIGN IN ACTIVE 3D STACKING TECHNOLOGYXILINX, INC.
WO/2021/076726PROCESS FOR CONFORMAL COATING OF MULTI-ROW SURFACE-MOUNT  COMPONENTS IN A LIDLESS BGA PACKAGE AND PRODUCT MADE THEREBYADVANCED MICRO DEVICES, INC.
WO/2021/076872FLIP-CHIP DEVICEQUALCOMM INCORPORATED
WO/2021/091684METHODS AND APPARATUS FOR PROCESSING A SUBSTRATEAPPLIED MATERIALS, INC.
WO/2021/183190COMPOSITE SPRING HEAT SPREADERRAYTHEON COMPANY
WO/2021/154351GUIDING ELECTRONS IN GRAPHENE WITH A CARBON NANOTUBEPRESIDENT AND FELLOWS OF HARVARD COLLEGE
WO/2021/112969METHODS AND APPARATUS FOR PROCESSING A SUBSTRATEAPPLIED MATERIALS, INC.
WO/2021/108064PACKAGE CORE ASSEMBLY AND FABRICATION METHODSAPPLIED MATERIALS, INC.
WO/2021/108065PACKAGE CORE ASSEMBLY AND FABRICATION METHODSAPPLIED MATERIALS, INC.
WO/2021/112978PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS  A SHIELDQUALCOMM INCORPORATED
WO/2021/112979INTEGRATED DEVICE WITH ELECTROMAGNETIC SHIELDQUALCOMM INCORPORATED
WO/2021/087285CONFIGURABLE CAPACITOREMPOWER SEMICONDUCTOR, INC.
WO/2021/137929THERMAL COMPRESSION FLIP CHIP BUMPQUALCOMM INCORPORATED
WO/2021/145940MULTI-CHIP STACKED DEVICESXILINX, INC.
WO/2021/141660STRUCTURE FOR BONDING AND ELECTRICAL CONTACT FOR DIRECT BOND  HYBRIDIZATIONRAYTHEON COMPANY
WO/2021/113076SEMICONDUCTORS HAVING DIE PADS WITH ENVIRONMENTAL PROTECTION  AND PROCESS OF MAKING SEMICONDUCTORS HAVING DIE PADS WITH ENVIRONMENTAL  PROTECTIONCREE, INC.
WO/2021/206760INTEGRATED CIRCUIT (IC) PACKAGE WITH INTEGRATED INDUCTOR  HAVING CORE MAGNETIC FIELD (B FIELD) EXTENDING PARALLEL TO DIE SUBSTRATEMICROCHIP TECHNOLOGY INCORPORATED
WO/2021/173204SPLIT SUBSTRATE INTERPOSERTOKYO ELECTRON LIMITED
WO/2021/173205SPLIT SUBSTRATE INTERPOSER WITH INTEGRATED PASSIVE DEVICETOKYO ELECTRON LIMITED
WO/2021/158282INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A THERMAL  CONDUCTIVE PACKAGE SUBSTRATE WITH DIE REGION SPLIT, AND RELATED FABRICATION  METHODSQUALCOMM INCORPORATED
WO/2021/126791MEMS-BASED COOLING SYSTEMS FOR CLOSED AND OPEN DEVICESFRORE SYSTEMS INC.
WO/2021/146027POWER MODULE PACKAGE AND PACKAGING TECHNIQUESALLEGRO MICROSYSTEMS, LLC
WO/2021/146028SYSTEMS AND METHODS FOR FABRICATING SUPERCONDUCTING INTEGRATED  CIRCUITSD-WAVE SYSTEMS INC.
WO/2021/127587THERMAL COOLING ELEMENT FOR MEMORY DEVICES OF A MEMORY  SUB-SYSTEMMICRON TECHNOLOGY, INC.
WO/2021/138177THERMAL MANAGEMENT USING VARIATION OF THERMAL RESISTANCE OF  THERMAL INTERFACEADVANCED MICRO DEVICES, INC.
WO/2021/236165SEMICONDUCTOR DIE CONTAINING DUMMY METALLIC PADS AND METHODS  OF FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/225639THREE-DIMENSIONAL MEMORY DEVICE WITH A DIELECTRIC ISOLATION  SPACER AND METHODS OF FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/201934SEMICONDUCTOR DIE INCLUDING EDGE RING STRUCTURES AND METHODS  FOR MAKING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/252021THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MULTI-TIER MOAT  ISOLATION STRUCTURES AND METHODS OF MAKING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/242322STACKED DIE ASSEMBLY INCLUDING DOUBLE-SIDED INTER-DIE BONDING  CONNECTIONS AND METHODS OF FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/042094STACKED DIE PACKAGE INCLUDING WIRE BONDING AND DIRECT CHIP  ATTACHMENT, AND RELATED METHODS, DEVICES AND APPARATUSESMICRON TECHNOLOGY, INC.
WO/2021/022292DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING  APPLICATIONSLAM RESEARCH CORPORATION
WO/2021/035235ELECTRONIC DEVICES COMPRISING OVERLAY MARKS, MEMORY DEVICES  COMPRISING OVERLAY MARKS, AND RELATED METHODSMICRON TECHNOLOGY, INC.
WO/2021/216143BACKSIDE INTERCONNECT FOR INTEGRATED CIRCUIT PACKAGE  INTERPOSERMICROCHIP TECHNOLOGY INCORPORATED
WO/2021/158339ELECTRICAL INTERCONNECT STRUCTURE FOR A SEMICONDUCTOR DEVICE  AND AN ASSEMBLY USING THE SAMEMICRON TECHNOLOGY, INC.
WO/2021/206776THERMAL MANAGEMENT STRUCTURES FOR NITRIDE-BASED HEAT  GENERATING SEMICONDUCTOR DEVICESRAYTHEON COMPANY
WO/2021/162816PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADERQUALCOMM INCORPORATED
WO/2021/230925PRINTED CIRCUIT BOARD CAVITY MODE SUPPRESSIONRAYTHEON COMPANY
WO/2021/162834PACKAGE COMPRISING A SUBSTRATE THAT INCLUDES A STRESS BUFFER  LAYERQUALCOMM INCORPORATED
WO/2021/158419HIGH DENSITY 3D INTERCONNECT CONFIGURATIONAPPLE INC.
WO/2021/155018JET IMPINGEMENT COOLING DEVICES, SYSTEMS, AND METHODSCOLORADO STATE UNIVERSITY RESEARCH FOUNDATION
WO/2021/247094INTEGRATED INDUCTOR WITH A STACKED METAL WIREMICROCHIP TECHNOLOGY INCORPORATED
WO/2021/158881SELECTIVE ALTERATION OF INTERCONNECT PADS FOR DIRECT BONDINGINVENSAS BONDING TECHNOLOGIES, INC.
WO/2021/188232MECHANISM FOR VARIABLE THERMAL CONDUCTANCENORTHROP GRUMMAN SYSTEMS CORPORATION
WO/2021/167822DEVICE CARRIER CONFIGURED FOR INTERCONNECTS, A PACKAGE  IMPLEMENTING A DEVICE CARRIER HAVING INTERCONNECTS, AND PROCESSES OF MAKING  THE SAMECREE, INC.
WO/2021/201990MULTIPLE CHIP MODULE WITH LID AND STIFFENER RINGAPPLE INC.
WO/2021/173817VOLTAGE REGULATION INTEGRATED CIRCUIT (IC) WITH CIRCUIT  COMPONENTS IN AN INTEGRATED THREE-DIMENSIONAL (3D) INDUCTOR CORE AND RELATED  METHODS OF FABRICATIONQUALCOMM INCORPORATED
WO/2021/194716HEAT EXCHANGE RIBBONARRIS ENTERPRISES LLC
WO/2021/178722COMPLIANT THERMAL MANAGEMENT DEVICES, SYSTEMS, AND METHODS OF  FABRICATION THEREOFTRANSPORT PHENOMENA TECHNOLOGIES, LLC
WO/2021/178870MAGNETIC SENSOR ARRAY DEVICE OPTIMIZATIONS AND HYBRID MAGNETIC  CAMERALEXMARK INTERNATIONAL, INC.
WO/2021/183506DEVICE COMPRISING CONTACT TO CONTACT COUPLING OF PACKAGESQUALCOMM INCORPORATED
WO/2021/202074MULTI LEVEL RADIO FREQUENCY (RF) INTEGRATED CIRCUIT COMPONENTS  INCLUDING PASSIVE DEVICESCREE, INC.
WO/2021/202075RF AMPLIFIER PACKAGECREE, INC.
WO/2021/230966METHODS OF FORMING CONDUCTIVE PIPES BETWEEN NEIGHBORING  FEATURES, AND INTEGRATED ASSEMBLIES HAVING CONDUCTIVE PIPES BETWEEN  NEIGHBORING FEATURESMICRON TECHNOLOGY, INC.
WO/2021/188784ON-BOARD INTEGRATED ENCLOSURE FOR ELECTROMAGNETIC  COMPATIBILITY SHIELDINGMARVELL ASIA PTE, LTD.
WO/2021/194858PATCH SUBSTRATE CONFIGURED AS A SHIELD LOCATED OVER A CAVITY  OF A BOARDQUALCOMM INCORPORATED
WO/2021/188846DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURESINVENSAS BONDING TECHNOLOGIES, INC.
WO/2021/194981INTEGRATED DEVICE COMPRISING TRANSISTOR COUPLED TO A DUMMY  GATE CONTACTQUALCOMM INCORPORATED
WO/2021/195013MULTI-CHIP PACKAGE WITH REINFORCED ISOLATIONTEXAS INSTRUMENTS INCORPORATED
WO/2021/202199GROUP III NITRIDE-BASED RADIO FREQUENCY AMPLIFIERS HAVING BACK  SIDE SOURCE, GATE AND/OR DRAIN TERMINALSCREE, INC.
WO/2021/202211METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT  AGAINST A SUPPORT STRUCTURE ON A WIRE BONDING MACHINE, AND RELATED METHODSKULICKE AND SOFFA INDUSTRIES, INC.
WO/2021/202267RELIABLE HYBRID BONDED APPARATUSINVENSAS BONDING TECHNOLOGIES, INC.
WO/2021/202454HYBRID PACKAGE APPARATUS AND METHOD OF FABRICATINGQUALCOMM INCORPORATED
WO/2021/202674RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURINGCREE, INC.
WO/2021/207101PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER  SOLDER RESIST LAYERQUALCOMM INCORPORATED
WO/2021/211744INTEGRATED DEVICE COMPRISING PERIPHERY STRUCTURE CONFIGURED AS  AN ELECTRICAL GUARD RING AND A CRACK STOPQUALCOMM INCORPORATED
WO/2021/231021HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERSQUALCOMM INCORPORATED
WO/2021/236275RADIO-FREQUENCY INTEGRATED CIRCUIT PACKAGE EMPLOYING AN  ELECTRO-MAGNETIC INTERFERENCE SHIELDING LAYER, AND RELATED FABRICATION  METHODSQUALCOMM INCORPORATED
WO/2021/216684LIGHT-EMITTING DIODE CHIP STRUCTURES WITH REFLECTIVE ELEMENTSJADE BIRD DISPLAY (SHANGHAI) LIMITED
WO/2021/216689LIGHT-EMITTING DIODE CHIP STRUCTURES WITH REFLECTIVE ELEMENTSJADE BIRD DISPLAY (SHANGHAI) LIMITED
WO/2021/242450PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN  ENCAPSULATION LAYER WITH UNDERCUTQUALCOMM INCORPORATED
WO/2021/222020MEMS HERMETIC SEAL APPARATUS AND METHODSELBIT SYSTEMS OF AMERICA, LLC
WO/2021/225846SUBSTRATE COMPRISING CAPACITOR CONFIGURED FOR POWER AMPLIFIER  OUTPUT MATCHQUALCOMM INCORPORATED
WO/2021/252100ADVANCED INTEGRATED PASSIVE DEVICE (IPD) WITH THIN-FILM HEAT  SPREADER (TF-HS) LAYER FOR HIGH POWER HANDLING FILTERS IN TRANSMIT (TX) PATHQUALCOMM INCORPORATED
WO/2021/247195DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUESINTEL CORPORATION
WO/2021/236361LATERALLY UNCONFINED STRUCTUREINVENSAS BONDING TECHNOLOGIES, INC.
WO/2021/236396HYBRID THERMAL INTERFACE MATERIAL AND LOW TEMPERATURE SOLDER  PATTERNS TO IMPROVE PACKAGE WARPAGE AND RELIABILITYAPPLE INC.
WO/2021/231620ELECTRONIC DEVICE COOLING SYSTEMS USING COOLED FLUID AND  CONTROL OF SAMEGEMATEG INC.
WO/2021/231636AN INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE  HAVING AN OPEN AREA THAT EXPOSES WIRE BOND PADS AT A SURFACE OF THE INNER  LAYERMICRON TECHNOLOGY, INC.
WO/2021/247261SPRING BAR LEADFRAMETEXAS INSTRUMENTS INCORPORATED
WO/2021/247317RF AMPLIFIERS HAVING SHIELDED TRANSMISSION LINE STRUCTURESCREE, INC.
WO/2021/243195MULTICORE SUBSTRATEQUALCOMM INCORPORATED
WO/2021/262412SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS  WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAMEMICRON TECHNOLOGY, INC.
WO/2021/257312SEMICONDUCTOR PACKAGE INCLUDING UNDERMOUNTED DIE WITH EXPOSED  BACKSIDE METALTEXAS INSTRUMENTS INCORPORATED
WO/2021/257748OVENS FOR EQUIPMENT SUCH AS DIE ATTACH SYSTEMS, FLIP CHIP  BONDING SYSTEMS, CLIP ATTACH SYSTEMS, AND RELATED METHODSKULICKE AND SOFFA INDUSTRIES, INC.
WO/2021/262538RADIO FREQUENCY TRANSISTOR AMPLIFIER PACKAGECREE, INC.
WO/2021/262920MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERSCREE, INC.

 

 




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