博文
2021年半导体组件与集成电路领域的PCT专利申请状况——中国占54%，美国占12%，日本占15%，欧洲占5%
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█武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖
附录2 2021年PCT国际专利申请统计分析报告
附录2.7 各技术领域的PCT专利申请状况
附录2.7.41 半导体组件与集成电路领域的PCT专利申请状况
第41个技术领域是半导体组件与集成电路。2021年，该领域的PCT专利申请总计2859项（增长率为3%），占总申请量的1.1%，是申请量第40多的领域。
2021年，中国局在半导体组件与集成电路领域上申请PCT专利1530项，占该领域申请量的53.5%。美国局在该领域上申请专利337项，份额为11.8%。日本局申请专利434项，份额为15.2%。欧洲局申请专利136项，份额为4.8%。
附表2.7.41-1 2021年半导体组件与集成电路领域各专利局的PCT专利申请数量
专利局 | 申请数量 | 占本局比例 | 占领域比例 | |
1 | 中国 | 1530 | 2.3% | 53.5% |
2 | 美国 | 337 | 0.6% | 11.8% |
3 | 日本 | 434 | 0.9% | 15.2% |
4 | 欧洲 | 136 | 0.4% | 4.8% |
5 | 韩国 | 319 | 1.7% | 11.2% |
6 | 国际 | 49 | 0.4% | 1.7% |
7 | 英国 | 14 | 0.4% | 0.5% |
8 | 法国 | 8 | 0.3% | 0.3% |
9 | 加拿大 | 3 | 0.2% | 0.1% |
10 | 澳大利亚 | 1 | 0.1% | 0.0% |
11 | 土耳其 | 0 | 0.0% | 0.0% |
12 | 德国 | 4 | 0.3% | 0.1% |
13 | 以色列 | 0 | 0.0% | 0.0% |
14 | 瑞典 | 1 | 0.1% | 0.0% |
15 | 其他 | 23 | -- | 0.8% |
小计 | 2859 | -- | 100% |
附图2.7.41-1 2021年半导体组件与集成电路领域各专利局的PCT专利申请数量对比
2021年，在半导体组件与集成电路领域上PCT专利申请最多的机构是京东方科技集团公司、武汉华星光电半导体显示技术有限公司、深圳市华星光电半导体显示技术有限公司。
附表2.7.41-2 2021年半导体组件与集成电路领域的PCT国际专利申请前10机构
机构名称 | 国家 | 机构英文名称 | 2021 | |
1 | 京东方科技集团公司 | 中国 | BOE TECHNOLOGY GROUP CO., LTD. | 466 |
2 | 武汉华星光电半导体显示技术有限公司 | 中国 | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. | 242 |
3 | 深圳市华星光电半导体显示技术有限公司 | 中国 | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. | 143 |
4 | 索尼半导体解决方案公司 | 日本 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | 126 |
5 | 长江存储科技有限责任公司 | 中国 | YANGTZE MEMORY TECHNOLOGIES CO., LTD. | 105 |
6 | 三星电子公司 | 韩国 | SAMSUNG ELECTRONICS CO., LTD. | 68 |
7 | 三星显示公司 | 韩国 | SAMSUNG DISPLAY CO., LTD. | 68 |
8 | 华为技术公司 | 中国 | HUAWEI TECHNOLOGIES CO., LTD. | 63 |
9 | 美光科技公司 | 美国 | MICRON TECHNOLOGY, INC | 62 |
10 | LG电子公司 | 韩国 | LG ELECTRONICS INC | 60 |
注：本表数据按照第一申请人进行统计。
附图2.7.41-2 2021年半导体组件与集成电路领域的PCT国际专利申请前10机构
致谢
感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时，向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。
如需要中美欧日韩五局及PCT专利数据、专利报告，以及咨询相关专利问题请添加微信号。
附表 2021年该领域PCT国际专利申请
| ID | Title | Applicant |
| WO/2021/151132 | PERMEABLE ELEMENT | UNIVERSITÄT LINZ |
| WO/2021/097534 | ELECTRONICS CIRCUIT BOARD DESIGN TOOL | SLIM CIRCUITS PTY LTD |
| WO/2021/119800 | CIRCUIT BOARD AND METHODS FOR FABRICATING A CIRCUIT BOARD | THE UNIVERSITY OF BRITISH COLUMBIA |
| WO/2021/102558 | METHOD OF ASSESSING INK DEPOSITION ACCURACY IN AN ELECTRONIC DEVICE PRINTING PROCESS | SOCOVAR SOCIETE EN COMMANDITE |
| WO/2021/119828 | METHOD OF MANUFACTURING TEXTILE WITH CONDUCTIVE YARNS AND INTEGRATED ELECTRONICS | MYANT INC. |
| WO/2021/003591 | DISPLAY PANEL, ELECTRONIC APPARATUS, AND PREPARATION METHOD FOR DISPLAY PANEL | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/003600 | DISPLAY SUBSTRATE, DISPLAY APPARATUS, AND METHOD OF FABRICATING DISPLAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/003638 | THREE-DIMENSIONAL MEMORY DEVICES WITH DEEP ISOLATION STRUCTURES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/003668 | PREPARATION METHOD FOR ELASTIC SUBSTRATE | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/007712 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/007720 | DISPLAY PANEL AND MANUFACTURING METHOD | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/007781 | SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/003767 | MANUFACTURING METHOD FOR THIN FILM TRANSISTOR SUBSTRATE, AND THIN FILM TRANSISTOR SUBSTRATE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012071 | IMAGE SENSOR, RELATED CHIP, AND ELECTRONIC APPARATUS | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/012094 | DISPLAY PANEL AND ELECTRONIC APPARATUS | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/012095 | DISPLAY PANEL AND ELECTRONIC DEVICE | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/012158 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/012161 | ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/012207 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/012228 | ELECTRONIC PACKAGING ASSEMBLY, CAMERA, MOVABLE PLATFORM, AND PREPARATION METHOD FOR ELECTRONIC PACKAGING ASSEMBLY | SZ DJI TECHNOLOGY CO., LTD. |
| WO/2021/016764 | CAPACITANCE DEVICE AND MANUFACTURING METHOD THEREFOR | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/016791 | STORAGE UNIT AND MANUFACTURING METHOD THEREFOR AND THREE-DIMENSIONAL MEMORY | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/016804 | THREE-DIMENSIONAL MEMORY AND MANUFACTURING METHOD THEREFOR | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/016811 | DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/016821 | DISPLAY PANEL, DISPLAY SCREEN AND ELECTRONIC DEVICE | BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. NANJING BRANCH |
| WO/2021/016838 | IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR, CHIP, AND HANDHELD APPARATUS | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/016839 | IMAGE SENSOR AND METHOD FOR MANUFACTURING SAME, CHIP, AND HANDHELD APPARATUS | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/016848 | DISPLAY APPARATUS AND DISPLAY MODULE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/016922 | L-SHAPED STEPPED WORD LINE STRUCTURE AND FABRICATION METHOD THEREFOR, AND THREE-DIMENSIONAL MEMORY | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/016926 | A FULL-PANEL DISPLAY FOR DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/016927 | ARRAY SUBSTRATE, DISPLAY APPARATUS, AND METHOD OF FABRICATING ARRAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/016939 | IMAGING DEVICE, METHOD FOR SUPPLYING POWER TO IMAGING DEVICE, AND RELATED DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/016945 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/016946 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/016947 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/016956 | ELECTROLUMINESCENT DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/016961 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | SHENNAN CIRCUITS CO.,LTD. |
| WO/2021/016962 | ELECTROLUMINESCENT DISPLAY PANEL AND A DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/000372 | MRAM DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE COMPRISING MRAM | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/017011 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017012 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/022401 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/022402 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/022403 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/012312 | OLED DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/007890 | OLED DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/022490 | FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND FLEXIBLE DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/022495 | DISPLAY PLATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/000375 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/026721 | DISPLAY APPARATUS AND METHOD OF FABRICATING DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/026730 | ELECTRONIC COMPONENT AND PREPARATION METHOD FOR ELECTRONIC COMPONENT | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/026755 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/026756 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/026759 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/026819 | VERTICAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/003801 | DISPLAY PANEL AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/030927 | DISPLAY BACKPLANE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/000382 | LIGHT-EMITTING DIODE DISPLAY PANEL AND DISPLAY DEVICE | SHENZHEN SITAN TECHNOLOGY CO., LTD. |
| WO/2021/000383 | LIGHT-EMITTING DEVICE, METHOD FOR PREPARING LIGHT-EMITTING DEVICE, AND DISPLAY APPARATUS | SHENZHEN SITAN TECHNOLOGY CO., LTD. |
| WO/2021/012333 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/030971 | DISPLAY APPARATUS AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/031007 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/000386 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012337 | DISPLAY DEVICE BONDING METHOD AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/022583 | FLEXIBLE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017046 | DISPLAY PANEL AND ELECTRONIC DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031117 | ARRAY SUBSTRATE, DISPLAY APPARATUS, AND METHOD OF FABRICATING ARRAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/031125 | CIRCUIT-EMBEDDED SUBSTRATE, CHIP ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD FOR SUBSTRATE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/031183 | TRANSPARENT CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD. |
| WO/2021/012343 | ORGANIC LIGHT-EMITTING DEVICE AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012344 | TFT DRIVING BACKBOARD AND MICRO-LED DISPLAY | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031188 | STRETCHABLE DISPLAY PANEL, DISPLAY APPARATUS, AND METHOD OF FABRICATING STRETCHABLE DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035401 | LIGHT-EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035403 | LIGHT-EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035405 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR, AND DRIVING SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035408 | NON-VOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/035413 | VERTICAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/035415 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035420 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035431 | VERTICAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/035516 | SEMICONDUCTOR STRUCTURE OF IMAGE SENSOR, AND CHIP AND ELECTRONIC APPARATUS | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/035529 | ELECTRONIC DEVICE SUBSTRATE AND METHOD FOR MANUFACTURE AND ELECTRONIC DEVICE THEREOF | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035537 | ORGANIC LIGHT EMITTING DIODE DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035545 | DISPLAY SUBSTRATE, DISPLAY PANEL, AND MANUFACTURING METHOD OF DISPLAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035546 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035547 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035549 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035550 | MANUFACTURING METHOD OF COLOR FILTER LAYER, AND DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035601 | NOVEL 3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/035603 | THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/022594 | ARRAY SUBSTRATE, DISPLAY PANEL, AND MANUFACTURING METHOD OF ARRAY SUBSTRATE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/000413 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/035738 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACTS CONNECTED BY ADHESION LAYER AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/035739 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACTS CONNECTED BY ADHESION LAYER AND FORMING METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/035754 | POSITIONING JIG FOR ASSEMBLING FLEXIBLE CIRCUIT BOARD OF MOBILE PHONE | JIANGXI HONGYAODA COMMUNICATION CO., LTD |
| WO/2021/035762 | CIRCUIT BOARD HAVING HEAT-DISSIPATION STRUCTURE AND PREPARATION METHOD THEREFOR | QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD |
| WO/2021/017094 | ARRAY SUBSTRATE AND OLED DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042264 | NON-VOLATILE MEMORY DEVICE UTILIZING DUMMY MEMORY BLOCK AS POOL CAPACITOR | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/042290 | IMAGE SENSOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/035782 | SPECIAL LIGHT SOURCE AND LIGHT FIXTURE SUITABLE FOR DIABETIC RETINOPATHY | INTELLIGENT MANUFACTURING INSTITUTE OF HEFEI UNIVERSITY OF TECHNOLOGY |
| WO/2021/022605 | METHOD FOR PREPARING OXIDE THIN FILM TRANSISTOR, AND ARRAY SUBSTRATE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031245 | ARRAY SUBSTRATE AND OLED DISPLAY DEVICE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/042390 | ELECTRONIC ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND MOLD AND MANUFACTURING METHOD THEREFOR | SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. |
| WO/2021/046717 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017106 | ARRAY SUBSTRATE, PREPARATION METHOD USING ARRAY SUBSTRATE, AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/046730 | PIXEL STRUCTURE AND METHOD FOR MANUFACTURING SAME | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/017108 | FOLDABLE DISPLAY PANEL, FABRICATION METHOD THEREFOR AND DISPLAY MODULE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/007942 | LIGHT EMITTING SUBSTRATE AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/046744 | BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/007945 | DISPLAY PANEL, DISPLAY APPARATUS, AND METHOD FOR MANUFACTURING DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051225 | SPLICED CIRCUIT BOARD | SHENZHEN YAXINHONGDA ELECTRONIC TECHNOLOGY CO., LTD. |
| WO/2021/017117 | FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/035832 | OLED DISPLAY PANEL, PREPARATION METHOD FOR OLED DISPLAY PANEL, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031266 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/035841 | DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027015 | ARRAY SUBSTRATE AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027017 | DISPLAY PANEL AND FABRICATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/007949 | PROCESS METHOD FOR IMPROVING WELDING STRENGTH OF IGBT MODULE TERMINALS | YANTAI TAIXIN ELECTRONICS TECHNOLOGY CO., LTD |
| WO/2021/051371 | THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/012374 | DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051381 | THREE-DIMENSIONAL MEMORY DEVICE HAVING MULTI-DECK STRUCTURE AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/051383 | THREE-DIMENSIONAL MEMORY DEVICE HAVING MULTI-DECK STRUCTURE AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/027021 | FLEXIBLE INTEGRATED DISPLAY SCREEN MODULE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/022635 | DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027024 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/035848 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/022638 | OLED DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056261 | DISPLAY SUBSTRATE, DISPLAY APPARATUS, AND METHOD OF FABRICATING DISPLAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/056299 | MEMORY, MEMORY ARRAY, AND DATA READ-WRITE METHOD FOR MEMORY | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/056325 | THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/051446 | PRINTED CIRCUIT BOARD AND ELECTRONIC PRODUCT | INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD |
| WO/2021/056422 | ARRAY SUBSTRATE, DISPLAY APPARATUS, METHOD OF FABRICATING ARRAY SUBSTRATE, AND PIXEL DRIVING CIRCUIT | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/056427 | INTERPOSER, MANUFACTURING METHOD THEREFOR, AND CIRCUIT BOARD ASSEMBLY | QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD |
| WO/2021/017148 | DISPLAY PANEL, PREPARATION METHOD THEREFOR AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056513 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/056514 | THREE-DIMENSIONAL MEMORY DEVICES AND FORMING METHODS | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/056515 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/056520 | THREE-DIMENSIONAL MEMORY DEVICE HAVING EPITAXIALLY-GROWN SEMICONDUCTOR CHANNEL AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/051450 | METHOD AND SYSTEM FOR FORMING COF FINE CIRCUIT, COF, AND MACHINING METHOD THEREFOR | ANYUANDA (SHENZHEN) ELECTRONICS CO., LTD |
| WO/2021/042438 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/062588 | DISPLAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/027040 | ARRAY SUBSTRATE AND FABRICATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031302 | SUB-PIXEL STRUCTURE, AND ORGANIC LIGHT-EMITTING DIODE DISPLAY SCREEN AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/062661 | IMAGE SENSOR, CAMERA ASSEMBLY, AND MOBILE TERMINAL | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/062662 | IMAGE SENSOR, CAMERA ASSEMBLY, AND MOBILE TERMINAL | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/062663 | IMAGE SENSOR, CAMERA ASSEMBLY AND MOBILE TERMINAL | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/062742 | STACKED CHIP PACKAGE AND TERMINAL DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/022658 | FLEXIBLE ARRAY SUBSTRATE AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012399 | DISPLAY PANEL, DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/068165 | METHOD FOR MANUFACTURING DISPLAY SUBSTRATE MOTHERBOARD, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035886 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/000442 | DISPLAY PANEL AND FABRICATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/042443 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031312 | ORGANIC LIGHT-EMITTING DISPLAY PANEL AND PREPARATION METHOD THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/068220 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/068221 | SEMICONDUCTOR DEVICES HAVING INTERPOSER STRUCTURE AND METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/068229 | THREE-DIMENSIONAL MEMORY DEVICES HAVING HYDROGEN BLOCKING LAYER AND FABRICATION METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/012408 | ARRAY SUBSTRATE, DISPLAY PANEL AND PREPARATION METHOD FOR ARRAY SUBSTRATE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/068233 | DISPLAY SUBSTRATE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/072575 | THREE-DIMENSIONAL PHASE-CHANGE MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/072576 | METHODS FOR FORMING THREE-DIMENSIONAL PHASE-CHANGE MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/072588 | STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR THREE-DIMENSIONAL NAND | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/051462 | FABRICATION METHOD FOR DISPLAY DEVICE AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/072600 | ARRAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/072604 | DETECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND FLAT PANEL DETECTOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/022670 | NOVEL TIMER MODULE | NINGBO HAPPY ELECTRICAL CO., LTD. |
| WO/2021/027048 | ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012413 | OLED DISPLAY SCREEN, FABRICATION METHOD THEREFOR, AND OLED DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/072671 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/031318 | TRANSPARENT DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027053 | TFT ARRAY SUBSTRATE AND DISPLAY PANEL COMPRISING SAME | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/003873 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/072700 | THREE-DIMENSIONAL MEMORY DEVICES WITH BACKSIDE ISOLATION STRUCTURES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/003874 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/000454 | PIXEL UNIT, PIXEL STRUCTURE, AND MANUFACTURING METHOD FOR PIXEL STRUCTURE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012425 | TFT ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR AND DISPLAY PANEL THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/072737 | DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017196 | ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012429 | ARRAY SUBSTRATE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/000457 | DISPLAY PANEL AND FABRICATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/003880 | FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/072781 | DISPLAY PANEL | AU OPTRONICS (KUNSHAN) CO., LTD. |
| WO/2021/003883 | LIGHT EMITTING PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/007975 | DISPLAY PANEL AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027060 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077278 | THREE-DIMENSIONAL MEMORY DEVICE HAVING POCKET STRUCTURE IN MEMORY STRING AND METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/017198 | FLEXIBLE LIGHT-EMITTING PANEL, MANUFACTURING METHOD FOR FLEXIBLE LIGHT-EMITTING PANEL, AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077280 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURE THEREOF, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/007980 | TFT ARRAY SUBSTRATE AND DISPLAY PANEL THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077294 | MASK PLATE AND MANUFACTURING METHOD THEREFOR, AND ORGANIC LIGHT-EMITTING DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/077331 | DISPLAY SUBSTRATE, DISPLAY APPARATUS, AND DETECTION METHOD USING DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/077332 | DISPLAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/077334 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035914 | MANUFACTURING METHOD FOR MULTI-LAYER FLEXIBLE CIRCUIT BOARD, AND PRODUCT THEREOF | LI, LongKai |
| WO/2021/035915 | METHOD FOR MANUFACTURING MULTILAYER DOUBLE-SIDED RIGID-FLEX BOARD AND PRODUCT THEREOF | LI, LongKai |
| WO/2021/035916 | METHOD FOR COATING AND MOLDING NOVEL MATERIAL LAYER STRUCTURE OF HIGH-FREQUENCY CIRCUIT BOARD AND PRODUCT THEREOF | LI, LongKai |
| WO/2021/035917 | METHOD FOR COMPRESSION FORMING HIGH-FREQUENCY CIRCUIT BOARD MATERIAL LAYER STRUCTURE, AND PRODUCT THEREOF | LI, LongKai |
| WO/2021/035918 | HIGH-FREQUENCY CIRCUIT BOARD LAYER STRUCTURE AND METHOD FOR PREPARING SAME | LI, LongKai |
| WO/2021/035919 | METHOD FOR PREPARING CIRCUIT BOARD MATERIAL LAYER STRUCTURE, AND PRODUCT THEREOF | LI, Longkai |
| WO/2021/035920 | COLOR FILTER STRUCTURE AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077355 | ARRAY SUBSTRATE, METHOD FOR MANUFACTURE AND CONTROL THEREOF, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/027066 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077389 | MEMORY ELEMENT ARRAY | JIANGSU ADVANCED MEMORY TECHNOLOGY CO., LTD. |
| WO/2021/077429 | DISPLAY SCREEN, DISPLAY ASSEMBLY, AND ELECTRONIC DEVICE | NANCHANG O-FILM BIO-IDENTIFICATION TECHNOLOGY CO.,LTD. |
| WO/2021/003891 | CHEMICAL-FEEDING DEVICE FOR CIRCUIT BOARD PRODUCTION | NANJING TANG YI INFORMATION TECHNOLOGY CO., LTD. |
| WO/2021/027074 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/081753 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DRIVING METHOD, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/081765 | DISPLAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017225 | QUANTUM DOT COLOR FILTER, DISPLAY PANEL, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017226 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027081 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/081867 | THIN CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | AVARY HOLDING (SHENZHEN) CO., LIMITED. |
| WO/2021/000472 | MINI LED BACKLIGHT PANEL AND BACKLIGHT MODULE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/003900 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/081925 | ORGANIC LIGHT-EMITTING DIODE DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/056682 | SRAM CELL, AND MEMORY AND ELECTRONIC DEVICE INCLUDING SRAM CELL | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/042478 | FLEXIBLE DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/081987 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/081990 | DISPLAY SUBSTRATE, DISPLAY DEVICE, AND DISPLAY DRIVING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/082015 | CHIP PAD WINDOWING METHOD, AND CHIP | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/042485 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/022688 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/087667 | DISPLAY SUBSTRATE, DISPLAY APPARATUS, AND METHOD OF FABRICATING DISPLAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/035944 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012456 | ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012458 | SEAMLESSLY JOINED SCREEN | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012461 | ARRAY SUBSTRATE, OLED DISPLAY PANEL, AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/035947 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051493 | DISPLAY PANEL AND FABRICATION METHOD FOR DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/035948 | DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/000478 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017245 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017246 | DISPLAY PANEL MAKING SOUND BY MEANS OF VIBRATION | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/035949 | FLEXIBLE ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL AND BENDABLE DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031364 | DISPLAY PANEL AND FABRICATION METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051494 | COLOR FILM SUBSTRATE, DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/087753 | BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/087762 | BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/087763 | BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/017251 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031367 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031368 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND TERMINAL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/072836 | THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR PREPARING SAME | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027101 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051495 | ARRAY SUBSTRATE, MANUFACTURING METHOD, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/031369 | ARRAY SUBSTRATE, METHOD FOR MANUFACTURING ARRAY SUBSTRATE, AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031370 | DISPLAY PANEL, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042498 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/087803 | ORGANIC LIGHT-EMITTING DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/027103 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/062917 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/027107 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042500 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027108 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042501 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/027110 | DISPLAY PANEL AND ELECTRONIC APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/035958 | DISPLAY PANEL AND BENDING METHOD THEREFOR AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027111 | DISPLAY PANEL AND ELECTRONIC DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027112 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082042 | DISPLAY PANEL AND FABRICATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031381 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREOF | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/031382 | MANUFACTURING METHOD OF DISPLAY PANEL, ELECTRONIC APPARATUS, AND STORAGE MEDIUM | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/035964 | OLED DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051509 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027121 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017270 | BACKLIGHT MODULE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/082058 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031389 | FLEXIBLE MICRO LIGHT-EMITTING DIODE DISPLAY PANEL AND MICRO LIGHT-EMITTING DIODE DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082064 | METHOD FOR MANUFACTURING DISPLAY PANEL, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082065 | FLEXIBLE DISPLAY DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/008027 | ELECTROLUMINESCENT DISPLAY AND ILLUMINATION APPARATUS AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042520 | DISPLAY PANEL AND ELECTRONIC DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051528 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017276 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/027129 | DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077475 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/077477 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/027131 | DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042523 | DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027140 | ARRAY SUBSTRATE AND FABRICATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/092752 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/056730 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/072857 | DISPLAY SUBSTRATE WITH TRANSPARENT ELECTRODE, AND PREPARATION METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/072858 | DISPLAY PANEL AND MANUFACTURING METHOD AND DETECTION METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/072859 | ARRAY SUBSTRATE AND METHOD FOR FABRICATION THEREOF AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/035973 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/092777 | STACKED CHIP, MANUFACTURING METHOD, IMAGE SENSOR, AND ELECTRONIC DEVICE | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/068337 | DISPLAY PANEL AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077488 | FIXING DEVICE AND METHOD FOR MANUFACTURING DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/017312 | DISPLAY PANEL AND DISPLAY DEVICE COMPRISING SAME | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077494 | FLEXIBLE THIN FILM SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056753 | ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/017315 | TOUCH DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027160 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051616 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/092854 | CIRCUIT BOARD, CAMERA MODULE, AND MOBILE TERMINAL | NANCHANG OFILM OPTICAL-ELECTRONIC TECH CO., LTD. |
| WO/2021/077500 | ORGANIC LIGHT-EMITTING DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012529 | METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/092875 | ARRAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/027166 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082092 | DISPLAY PANEL, MANUFACTURING METHOD, AND TILED DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/035991 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/082093 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036007 | DISPLAY PANEL, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027169 | TFT ARRAY SUBSTRATE AND DISPLAY PANEL THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082095 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017320 | ORGANIC LIGHT-EMITTING DEVICE, DISPLAY APPARATUS, AND MANUFACTURING METHOD OF ORGANIC LIGHT-EMITTING DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082099 | QUANTUM DOT COLOR FILM SUBSTRATE, MANUFACTURING METHOD, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077507 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042573 | FLEXIBLE LIGHT-EMITTING PANEL, MANUFACTURING METHOD FOR THE FLEXIBLE LIGHT-EMITTING PANEL, AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036016 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042574 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017322 | ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036017 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027170 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056771 | ARRAY SUBSTRATE AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077511 | OLED DISPLAY PANEL, PREPARATION METHOD THEREFOR AND DISPLAY DEVICE COMPRISING SAME | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031419 | FIRST WAFER AND FORMATION METHOD THEREFOR, AND WAFER STACK STRUCTURE | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/027171 | FLEXIBLE DISPLAY PANEL AND PREPARATION METHOD THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031420 | TOUCH PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/097690 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/088129 | OLED DISPLAY PANEL, DISPLAY APPARATUS, AND PREPARATION METHOD | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088130 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/097725 | ENCAPSULATION STRUCTURE, ENCAPSULATION ASSEMBLY AND ELECTRONIC PRODUCT | SZ DJI TECHNOLOGY CO., LTD. |
| WO/2021/092988 | DISPLAY PANEL AND DISPLAY TERMINAL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/097754 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/051641 | DISPLAY PANEL AND DISPLAY DEVICE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/072908 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/097796 | CONTACT STRUCTURES HAVING CONDUCTIVE PORTIONS IN SUBSTRATE IN THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/097797 | CONTACT STRUCTURES HAVING CONDUCTIVE PORTIONS IN SUBSTRATE IN THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/097798 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/088144 | OLED BACKPLATE PREPARATION METHOD AND OLED BACKPLATE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/097812 | MEMORY DEVICE AND HYBRID SPACER THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/036036 | ORGANIC LIGHT-EMITTING DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/093010 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/036044 | LIGHT-EMITTING PANEL, MANUFACTURING METHOD FOR LIGHT-EMITTING PANEL, AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082132 | DISPLAY PANEL AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/102626 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/093015 | DISPLAY DEVICE, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088148 | QUANTUM DOT DISPLAY PANEL FILTER | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/102660 | LIGHT-EMITTING DIODE ASSEMBLY AND PREPARATION METHOD THEREFOR, AND DISPLAY PREPARATION METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/102661 | ISOLATION STRUCTURE OF PHOTORESIST STRIPPING LIQUID, TFT ARRAY AND PREPARATION METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/047061 | DISPLAY PANEL AND TERMINAL DEVICE | BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. |
| WO/2021/102663 | DISPLAY ASSEMBLY, METHOD FOR MANUFACTURING DISPLAY ASSEMBLY, AND ELECTRONIC DEVICE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD |
| WO/2021/102664 | DISPLAY ASSEMBLY AND ELECTRONIC DEVICE USING DISPLAY ASSEMBLY | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD |
| WO/2021/017344 | METHOD AND SYSTEM FOR REDUCING INFLUENCE OF REMOTE REFERENCE POWER NOISE ON SIGNAL QUALITY | INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD |
| WO/2021/088153 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056802 | METHOD FOR CONTROLLING AMPLITUDE CONSISTENCY OF 5G ANTENNA PCB | HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO., LTD |
| WO/2021/056803 | FORMING AND PROCESSING METHOD FOR ULTRA-LONG SLOT PCB | HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO., LTD |
| WO/2021/102740 | HIGH-FREQUENCY TRANSMISSION CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD |
| WO/2021/093028 | COLOR FILM SUBSTRATE AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/102773 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/072924 | DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/102789 | LOCAL WORD LINE DRIVER DEVICE, MEMORY DEVICE, AND FABRICATION METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/102791 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/102801 | FLEXIBLE DISPLAY PANEL AND FABRICATION METHOD THEREOF | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/102810 | DISPLAY SUBSTRATE, DISPLAY PANEL, AND SPLICED SCREEN | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/102836 | PHOTOSENSITIVE DEVICE AND MANUFACTURING METHOD AND APPARATUS THEREFOR, SILICON SUBSTRATE AND MANUFACTURING METHOD AND APPARATUS THEREFOR | SZ DJI TECHNOLOGY CO., LTD. |
| WO/2021/102898 | MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHOD FOR SAME | AVARY HOLDING (SHENZHEN) CO., LIMITED. |
| WO/2021/102904 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/102988 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/102989 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/102996 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/103003 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/103007 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/103010 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/103015 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/097904 | <u>DISPLAY DEVICE</u> | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/022733 | <u>DISPLAY PANEL, AND MANUFACTURING METHOD AND REPAIRING METHOD THEREFOR</u> | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/072934 | ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012567 | ARRAY SUBSTRATE AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/109008 | LIGHT EMITTING DIODE DISPLAY MODULE, REPAIRING METHOD THEREFOR, AND DISPLAY DEVICE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD |
| WO/2021/082170 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088175 | AUTOMATIC PIN INSERTION DEVICE | HUIZHOU CHENGTAI AUTOMATION TECHNOLOGY CO., LTD. |
| WO/2021/036080 | PCB EDGE PLATING MACHINE | HUIZHOU CHENGTAI AUTOMATION TECHNOLOGY CO. LTD. |
| WO/2021/027191 | SIDE BONDING STRUCTURE OF DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042606 | ARRAY SUBSTRATE AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082178 | STRETCHABLE ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103094 | SUPER JUNCTION POWER DEVICE | SUZHOU ORIENTAL SEMICONDUCTOR CO., LTD. |
| WO/2021/103103 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/097941 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056826 | SYSTEM-IN-PACKAGE STRUCTURE AND ELECTRONIC DEVICE | WEIFANG GOERTEK MICROELECTRONICS CO., LTD. |
| WO/2021/056827 | SYSTEM-IN-PACKAGE STRUCTURE AND ELECTRONIC EQUIPMENT | GOERTEKMICROELECTRONICS CO., LTD |
| WO/2021/103109 | PACKAGING STRUCTURE FOR BIOMETRIC IDENTIFICATION CHIP | CHINA WAFER LEVEL CSP CO., LTD. |
| WO/2021/097947 | RAPID DRYING DEVICE FOR PCB BROWNING PRODUCTION | HUI ZHOU SHI XING SHUN HE ELECTRONICS CO., LTD |
| WO/2021/047078 | CRIMP-TYPE POWER SWITCH MODULE AND MANUFACTURING METHOD THEREFOR | SHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS |
| WO/2021/068398 | SILICON CARBIDE CMOS TRANSISTOR AND STRUCTURE MANUFACTURING METHOD THEREFOR | SHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS |
| WO/2021/068399 | STACKED CRIMP-TYPE POWER MODULE AND METHOD FOR MANUFACTURE THEREOF | SHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS |
| WO/2021/097957 | PACKAGE STRUCTURE OF IMAGE SENSOR CHIP | CHINA WAFER LEVEL CSP CO., LTD. |
| WO/2021/031463 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114028 | TRANSFER UNIT OF MINIATURE LIGHT-EMITTING DIODE, DISPLAY MODULE AND DISPLAY DEVICE | CHONGQING KONKA PHOTOELECTRIC TRCHNOLOGY RESEARCH INSTITUTE CO., LTD |
| WO/2021/068400 | METHOD FOR MANUFACTURING ULTRA-LONG MULTILAYER BOARD BY DRILLING AND POSITIONING | HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO., LTD |
| WO/2021/103131 | THREE-DIMENSIONAL STATIC RANDOM-ACCESS MEMORY AND PREPARATION METHOD THEREFOR | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/056840 | METHOD FOR TRANSFERRING MICRO LIGHT-EMITTING DIODE, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051668 | MULTILAYER MULTIFUNCTIONAL CIRCUIT BOARD | YE, Zhihang |
| WO/2021/051669 | ANTI-STATIC PRINTED CIRCUIT BOARD | YE, Zhihang |
| WO/2021/051670 | MULTI-LAYER FLEXIBLE PRINTED CIRCUIT BOARD | YE, Zhihang |
| WO/2021/062942 | CIRCUIT BOARD HAVING DAMPPROOF STRUCTURE | YE, Zhihang |
| WO/2021/103139 | OLED DISPLAY DEVICE AND METHOD FOR FORMATION THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088195 | OLED DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103142 | DISPLAY PANEL, FABRICATION METHOD THEREFOR AND ELECTRONIC DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114128 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/103148 | FLEXIBLE PRINTED CIRCUIT BOARD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/027201 | OLED DISPLAY PANEL AND ELECTRONIC APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036094 | CHIP AND ELECTRONIC APPARATUS | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/068402 | CRACK DETECTION CIRCUIT AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042618 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114178 | DUMMY WORDLINE CONTACTS TO IMPROVE ETCH MARGIN OF SEMI‐ISOLATED WORDLINES IN STAIRCASE STRUCTURES | INTEL CORPORATION |
| WO/2021/109202 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/103162 | DOUBLE-SIDED OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103177 | ORGANIC LIGHT EMITTING DIODE DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103184 | DISPLAY PANEL AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114308 | FLEXIBLE CIRCUIT BOARD AND SOUND PRODUCING DEVICE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/119897 | TRANSMISSION LINE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/119898 | TRANSMISSION LINE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/103194 | PIXEL UNIT, MANUFACTURING METHOD AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/109235 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/004011 | CIRCUIT BOARD FOR HIGH FREQUENCY TRANSMISSION AND SHIELDING METHOD | GUANGZHOU FANGBANG ELECTRONICS CO., LTD |
| WO/2021/047093 | CIRCUIT BOARD AND ELECTRONIC DEVICE | GUANGZHOU FANGBANG ELECTRONICS CO., LTD |
| WO/2021/119990 | FLEXIBLE CIRCUIT BOARD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/109242 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/097975 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103203 | DISPLAY PANEL AND ELECTRONIC DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103204 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114327 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/097982 | ARRAY SUBSTRATE, DISPLAY PANEL, AND MANUFACTURING METHOD OF ARRAY SUBSTRATE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120075 | TFT STRUCTURE, LIGHT-EMITTING MEMBER, DISPLAY DEVICE, AND PREPARATION METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/042625 | ARRAY SUBSTRATE, METHOD FOR REPAIRING DATA LINE BREAKPOINT THEREOF, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120096 | AN FPC STRUCTURE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/042628 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120112 | DOUBLE-SIDED TFT PANEL, FABRICATION METHOD THEREFOR, AND DISPLAY DEVICE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/120117 | SUBSTRATE PLATE HAVING DIFFERENT COPPER FOILS ON TWO SURFACES THEREOF | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/051691 | ARRAY SUBSTRATE AND FLEXIBLE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/062951 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114368 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036118 | FOLDABLE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114370 | WHITE OLED DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/097995 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120166 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/114377 | TFT ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/068413 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056876 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120196 | TRANSMISSION LINE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION LINE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/120207 | DISPLAY DEVICE, DISPLAY PANEL, AND FABRICATION METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/120216 | DISPLAY PANEL, FABRICATION METHOD THEREFOR, AND ALIGNMENT METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/082235 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/127845 | FLEXIBLE PRINTED CIRCUIT BOARD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/114385 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/114389 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/127974 | 3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/120241 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/127980 | THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/114398 | MANUFACTURING METHOD FOR DISPLAY PANELDISPLAY PANEL, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/128030 | DISPLAY SUBSTRATE, MANUFACTURING METHOD AND RELEVANT TRANSFER METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/077605 | TFT ARRAY SUBSTRATE AND OLED PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088232 | SILICON CARBIDE MOSFET DEVICE AND CELL STRUCTURE THEREOF | ZHUZHOU CRRC TIMES SEMICONDUCTOR CO., LTD. |
| WO/2021/088233 | FOLDABLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120273 | ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/128160 | FLEXIBLE CIRCUIT BOARD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/114421 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120298 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120307 | DISPLAY PANEL AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120311 | ARRAY SUBSTRATE, DISPLAY PANEL, AND MANUFACTURING METHOD FOR ARRAY SUBSTRATE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/128300 | PRE-FABRICATED SUBSTRATE AND PRINTED CIRCUIT BOARD | SHENNAN CIRCUITS CO., LTD. |
| WO/2021/128367 | FLEXIBLE CIRCUIT BOARD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/082266 | ARRAY SUBSTRATE, MANUFACTURING METHOD FOR SAME, AND DISPLAY PANEL THEREOF | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/120323 | DISPLAY PANEL AND TESTING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120324 | DISPLAY PANEL AND PREPARATION METHOD THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/134261 | FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/082268 | SCREEN MODULE AND ELECTRONIC DEVICE | BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. |
| WO/2021/120325 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/134402 | CONDUCTIVE CONNECTOR | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/134405 | ELECTRICALLY CONDUCTIVE MEMBER | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/134487 | LIGHT-EMITTING DIODE DISPLAY MODULE AND REPAIR METHOD THEREFOR, AND DISPLAY DEVICE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD |
| WO/2021/134510 | COMPOSITE DUAL-WAVELENGTH LED CHIP AND MANUFACTURING METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/128435 | NOVEL PRINCIPLES AND TECHNOLOGY FOR SEMICONDUCTOR ELECTRONICS, AND DEVICE | WANG, Keming |
| WO/2021/103285 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/128447 | STORAGE DEVICE, MEMOERY AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE, AND CHIP | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/120341 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/128453 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/128462 | TFT ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/128463 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/128467 | METHOD FOR MANUFACTURING CMOS INVERTER | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/082281 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031512 | ARRAY SUBSTRATE AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036163 | FLEXIBLE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051728 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031514 | FLEXIBLE CIRCUIT BOARD ASSEMBLY AND FLEXIBLE DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120351 | DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/022786 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/004051 | DISPLAY MODULE, DISPLAY APPARATUS AND PREPARATION METHOD | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056930 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051729 | ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL AND ORGANIC LIGHT-EMITTING DIODE DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036168 | ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/134822 | DISPLAY PANEL AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/138920 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/142558 | MICRO-LED PIXEL ARRANGEMENT STRUCTURE, ARRANGEMENT METHOD, AND DISPLAY PANEL | KONKA GROUP CO., LTD. |
| WO/2021/128508 | TFT ARRAY SUBSTRATE AND FABRICATION METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/036176 | ARRAY SUBSTRATE AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/042659 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND OLED DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031524 | FOLDABLE OLED DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031525 | FLEXIBLE COVER PLATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036179 | DISPLAY PANEL AND MASK PLATE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082286 | MANUFACTURING METHOD FOR FLEXIBLE DISPLAY | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/142602 | CHANNEL STRUCTURE HAVING TUNNELING LAYER WITH ADJUSTED NITROGEN WEIGHT PERCENT AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/128513 | ORGANIC LIGHT-EMITTING DISPLAY PANEL, PREPARATION METHOD THEREFOR AND ORGANIC LIGHT-EMITTING DISPLAY | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/068437 | 5G-ANTENNA INTEGRATED NETWORK APPARATUS | MOBI ANTENNA TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/047138 | OPTICAL SENSOR, OPTICAL SENSING SYSTEM, AND MANUFACTURING METHOD FOR OPTICAL SENSOR | EGIS TECHNOLOGY INC. |
| WO/2021/142644 | CIRCUIT BOARD, AND CIRCUIT BOARD FABRICATION METHOD | AVARY HOLDING (SHENZHEN) CO., LIMITED. |
| WO/2021/134838 | UNIFORM LIQUID DISTRIBUTION PROCESSING DEVICE FOR PRINTED CIRCUIT BOARD | UNIVERSAL CIRCUIT BOARD EQUIPMENT CO., LTD. |
| WO/2021/082287 | SUPPORT STRUCTURE AND FLEXIBLE PRINTED CIRCUIT BOARD | NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY CO., LTD. |
| WO/2021/138929 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/138930 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/138931 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031532 | TOUCH ARRAY SUBSTRATE AND PREPARATION METHOD THEREOF | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/042662 | OLED DISPLAY DEVICE AND PREPARATION METHOD THEREOF | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/142746 | LPDDR SUBSTRATE DESIGN METHOD, LPDDR SUBSTRATE AND ELECTRONIC DEVICE | SHENZHEN TECHWINSEMI TECHNOLOGY COMPANY LIMITED |
| WO/2021/142747 | DUAL DECK THREE-DIMENSIONAL NAND MEMORY AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/142817 | MAGNETIC MEMORY | BEIHANG UNIVERSITY |
| WO/2021/146827 | LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/047140 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/146842 | ARRAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/146878 | THREE-DIMENSIONAL MEMORY DEVICES WITH ENLARGED JOINT CRITICAL DIMENSION AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/146889 | THREE-DIMENSIONAL MEMORY DEVICE HAVING ADJOINED SOURCE CONTACT STRUCTURES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/146894 | ELECTRONIC COMPONENT-EMBEDDED CIRCUIT BOARD, AND MANUFACTURING METHOD | AVARY HOLDING (SHENZHEN) CO., LIMITED. |
| WO/2021/146931 | LIGHT EMITTING PLATE, CIRCUIT BOARD, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147033 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147038 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147039 | DRIVE BACKPLANE AND PREPARATION METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147059 | DISPLAY PANEL, FABRICATION METHOD THEREFOR AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147064 | DISPLAY SUBSTRATE AND PRODUCING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147081 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147082 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147101 | CHIP DEVICE AND WIRELESS COMMUNICATION DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/151219 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/151220 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/151221 | VERTICAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/151222 | VERTICAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/155530 | PRINTED CIRCUIT BOARD | TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
| WO/2021/155557 | VARYING CHANNEL WIDTH IN THREE-DIMENSIONAL MEMORY ARRAY | INTEL CORPORATION |
| WO/2021/155559 | LIGHT SENSOR DEVICE, METHOD FOR FABRICATING LIGHT SENSOR DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/155611 | BLOCK-TO-BLOCK ISOLATION AND DEEP CONTACT USING PILLARS IN MEMORY ARRAY | INTEL CORPORATION |
| WO/2021/159228 | SEMICONDUCTOR PLUG HAVING ETCH-RESISTANT LAYER IN THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/159243 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/159293 | DISPLAY PANEL, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/056948 | ARRAY SUBSTRATE, OLED DISPLAY PANEL, AND MASK | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114471 | ARRAY SUBSTRATE AND FABRICATING METHOD THEREFOR, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/159342 | DETECTION SUBSTRATE, FABRICATION METHOD THEREFOR AND FLAT PANEL DETECTOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/142868 | DISPLAY PANEL AND ELECTRONIC DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056950 | METHOD FOR MANUFACTURING FILTER ON IMAGE SENSOR WAFER | EGIS TECHNOLOGY INC. |
| WO/2021/159379 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/114473 | ARRAY SUBSTRATE AND FLEXIBLE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114474 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/142869 | DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/138958 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/163820 | MULTI-DIVISION STAIRCASE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/138962 | ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE AND FABRICATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/163831 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATION METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/163841 | METHODS FOR FORMING CHANNEL STRUCTURES IN THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/031535 | TFT ARRAY SUBSTRATE AND OLED PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/163876 | STAIRCASE STRUCTURE FOR THREE-DIMENSIONAL MEMORY | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/042678 | DISPLAY STRUCTURE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120378 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/163927 | IMAGE SENSOR AND ELECTRONIC APPARATUS | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/163940 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/163944 | DRAM MEMORY DEVICE WITH XTACKING ARCHITECTURE | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/098067 | DISPLAY PANEL AND MANUFACTURING METHOD FOR DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/142879 | PRINTED CIRCUIT BOARD PROCESSING METHOD AND PRINTED CIRCUIT BOARD | HUIZHOU TCL MOBILE COMMUNICATION CO., LTD |
| WO/2021/163963 | FERROELECTRIC MEMORY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/128551 | PCB AND TERMINAL DEVICE USING SAME | HUIZHOU TCL MOBILE COMMUNICATION CO., LTD |
| WO/2021/134869 | CIRCUIT BOARD AND TERMINAL DEVICE | HUIZHOU TCL MOBILE COMMUNICATION CO., LTD |
| WO/2021/168637 | 3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/142886 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/168681 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/168728 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/168730 | MOTHERBOARD AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/168731 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/138985 | SIDE EDGE BONDING STRUCTURE FOR DISPLAY PANEL, AND MANUFACTURING METHOD FOR DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/159564 | MICRO LIGHT EMITTING DIODE DISPLAY PANEL AND TRANSFER PRINTING METHOD FOR MICRO LIGHT EMITTING DIODE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/168828 | FLEXIBLE DISPLAY PANEL, DISPLAY APPARATUS AND PREPARATION METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/168843 | DETECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND FLAT PANEL DETECTOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/159566 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/174381 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/134904 | FABRICATION METHOD FOR PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD | SHENNAN CIRCUITS CO., LTD. |
| WO/2021/174488 | DISPLAY BACKPLATE AND MANUFACTURING METHOD THEREFOR, DISPLAY MOTHERBOARD, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/042688 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/098084 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/155618 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/027277 | ARRAY SUBSTRATE AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/168904 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/179194 | NEW CHIP VARIABLE CAPACITOR | SHENZHEN CHITAI ELECTRONIC TECHNOLOGY CO., LTD |
| WO/2021/179197 | THREE-DIMENSIONAL MEMORY DEVICES HAVING TWO-DIMENSIONAL MATERIALS | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/179271 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/159574 | FLEXIBLE DISPLAY PANEL, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/142908 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/168918 | FLEXIBLE CIRCUIT BOARD FABRICATION METHOD AND PUNCHING TEMPLATE ARRANGEMENT METHOD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/164077 | REINFORCEMENT MANUFACTURING AND BONDING METHOD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/164078 | LIQUID CRYSTAL POLYMER COMPOSITE LAYER STRUCTURE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/164079 | MULTILAYER CIRCUIT BOARD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/184148 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/159576 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103349 | OLED DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184171 | MANUFACTURING METHOD FOR MULTILAYER FILM AND MULTILAYER FILM | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/128605 | COLOR FILTER STRUCTURE AND OLED DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103352 | DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184176 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/109357 | DISPLAY PANEL, MANUFACTURING METHOD, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/159578 | DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/098094 | MANUFACTURING METHOD FOR MICRO-LED DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056984 | ELECTRICAL CONTACT STRUCTURE, CONTACT PAD LAYOUT AND STRUCTURE, MASK PLATE COMBINATION, AND MANUFACTURING METHOD | FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD. |
| WO/2021/056985 | ELECTRICAL CONTACT STRUCTURE, MASK PLATE COMBINATION, CONTACT PLUG MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE | FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD. |
| WO/2021/128606 | OLED DISPLAY PANEL AND MANUFACTURING METHOD | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031557 | IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR | IGISTEC CO., LTD. |
| WO/2021/114505 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREOF, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114506 | DISPLAY PANEL AND DISPLAY DEVICE HAVING SAME | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184189 | CIRCUIT BOARD STRUCTURE, ELECTRONIC PRODUCT, AND PREPARATION METHOD FOR CIRCUIT BOARD STRUCTURE | SZ DJI TECHNOLOGY CO., LTD. |
| WO/2021/184191 | OPTICAL SENSOR AND TIME OF FLIGHT-BASED DISTANCE MEASUREMENT SYSTEM | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/128607 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120428 | ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/168929 | DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120429 | BACK PLATE AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/155627 | OLED DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184231 | LOW-COST AND HIGH-PROCESS-CAPABILITY PRINTED CIRCUIT BOARD MANUFACTURING METHOD | PLOTECH TECHNOLOGY (KUNSHAN) CO., LTD |
| WO/2021/056988 | INTEGRATED OPTICAL SENSOR AND MANUFACTURING METHOD THEREFOR | EGIS TECHNOLOGY INC. |
| WO/2021/164086 | ARRAY SUBSTRATE AND MANUFACTURING METHOD FOR PHOTOLITHOGRAPHY COMPENSATION STRUCTURE THEREOF, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/139003 | ACTIVE MATRIX ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/134923 | ORGANIC LIGHT EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184257 | LED DISPLAY CONVENIENT TO REPAIR, AND REPAIR METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/004088 | PIXEL ARRANGEMENT STRUCTURE, DISPLAY PANEL, AND DISPLAY DEVICE | CHENGDU VISTAR OPTEOLECTRONICS CO., LTD. |
| WO/2021/184275 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184287 | METHOD FOR FORMING CONTACT STRUCTURES IN THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/147160 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/008157 | PIXEL ARRANGEMENT STRUCTURE AND DISPLAY PANEL | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/047163 | DISPLAY PANEL, DISPLAY MODULE, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184305 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184306 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184307 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184328 | THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/184329 | THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/184357 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/184372 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/168948 | BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/017493 | LIGHT EMITTING DIODE CHIP ARRAY AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | CHENGDU VISTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/189188 | STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/189189 | STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/189190 | STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/004090 | COLOR CONVERSION ASSEMBLY, DISPLAY PANEL AND MANUFACTURING METHOD | CHENGDU VISTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/077674 | METHOD FOR MANUFACTURING ARRAY SUBSTRATE, AND ARRAY SUBSTRATE | CHENGDU CEC PANDA DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/174604 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/168953 | BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/012695 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/189247 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017497 | DISPLAY PANEL, DISPLAY DEVICE AND MANUFACTURING METHOD FOR DISPLAY PANEL | CHENGDU VISTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/017498 | DISPLAY PANEL, DISPLAY DEVICE, AND METHOD FOR PREPARING DISPLAY PANEL | CHENGDU VISTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/017499 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | CHENGDU VISTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/159589 | FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189271 | DISPLAY MEANS AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189276 | FLEXIBLE DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREFOR AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189286 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/189288 | DISPLAY DEVICE AND DISPLAY EQUIPMENT | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/159590 | FLEXIBLE DISPLAY MODULE AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189304 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189305 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189323 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189329 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/012699 | DISPLAY PANEL AND DISPLAY DEVICE | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/008164 | PIXEL ARRANGEMENT STRUCTURE, DISPLAY PANEL, AND DISPLAY APPARATUS | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/189331 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017501 | DISPLAY PANEL, PREPARATION METHOD THEREFOR AND DISPLAY APPARATUS | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/174615 | QUANTUM DOT DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/168964 | PIXEL STRUCTURE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189411 | COVERING FILM, AND CIRCUIT BOARD AND MANUFACTURING METHOD | AVARY HOLDING (SHENZHEN) CO., LIMITED. |
| WO/2021/168976 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/168977 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/168979 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189473 | DISPLAY PANEL, METHOD FOR MANUFACTURING SAME AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189475 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189480 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189482 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189483 | DISPLAY SUBSTRATE AND METHOD FOR PREPARING SAME, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189487 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189491 | DISPLAY MODULE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189493 | DISPLAY MODULE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189495 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189498 | DISPLAY DEVICE, AND DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/068462 | TVS DEVICE USING VERTICAL TRIODE TO TRIGGER SURFACE SILICON CONTROLLED RECTIFIER STRUCTURE | SHANGHAI WAYON SEMICONDUCTOR CO., LTD. |
| WO/2021/168980 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/195903 | SYSTEM IN PACKAGE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/103369 | FLEXIBLE DISPLAY PANEL, FLEXIBLE DISPLAY DEVICE, AND MANUFACTURING METHOD FOR FLEXIBLE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/174622 | DISPLAY PANEL AND MANUFACTURING METHOD FOR DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/195972 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/195997 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/031570 | ANTI-DISASSEMBLY APPARATUS OF SECURITY CHIP AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/179365 | ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/139010 | DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/174623 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/147175 | TOUCH DISPLAY PANEL AND ELECTRONIC APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184425 | PIXEL ARRANGEMENT STRUCTURE, DISPLAY PANEL AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/196082 | TOUCH STRUCTURE, TOUCH DISPLAY PANEL, AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164106 | FLEXIBLE DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189524 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND OLED DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184438 | DISPLAY SUBSTRATE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/077686 | FLEXIBLE CIRCUIT BOARD SUBSTRATE BASED ON QUANTUM CARBON-BASED FILM AND PREPARATION METHOD THEREFOR | SHENZHEN DANBOND TECHNOLOGY CO., LTD |
| WO/2021/073051 | DUAL-WAVELENGTH SOLDER MASK DEVICE | ZHONGSHAN AISCENT TECHNOLOGIES., LTD |
| WO/2021/184441 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184446 | MICRO-DISPLAY PANEL, FABRICATION METHOD, AND JOINING DISPLAY PANELS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/203257 | GENERATING DYNAMIC VIRTUAL MASK LAYERS FOR CUTOUT REGIONS OF DISPLAY PANELS | QUALCOMM INCORPORATED |
| WO/2021/203320 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/203327 | EMBEDDED CIRCUIT BOARD AND FABRICATION METHOD THEREFOR | SHENNAN CIRCUITS CO., LTD. |
| WO/2021/203328 | EMBEDDED CIRCUIT BOARD AND FABRICATION METHOD THEREFOR | SHENNAN CIRCUITS CO., LTD. |
| WO/2021/184457 | METHOD FOR MANUFACTURING FLEXIBLE DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/179390 | DISPLAY PANEL AND MANUFACTURING METHOD FOR DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189534 | FPC SOLDER PRINTING FIXTURE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/203351 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, HOLE FORMATION PRECISION MEASUREMENT METHOD, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/203360 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189537 | PIXEL STRUCTURE AND FOLDABLE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189538 | OLED DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184459 | ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189549 | COLOR CONVERSION LAYER AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189550 | FLEXIBLE DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/203415 | DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189556 | MANUFACTURING METHOD OF DISPLAY PANEL, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/174644 | ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189562 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND MASK | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/207910 | THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/207912 | METHOD FOR FORMING THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/189565 | DISPLAY PANEL, DISPLAY MODULE AND ELECTRONIC DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/207930 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/000625 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/207969 | DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/196292 | PIXEL ARRANGEMENT STRUCTURE, ORGANIC ELECTROLUMINESCENT DEVICE, AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/098133 | DISPLAY APPARATUS AND DISPLAY PANEL | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/159601 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/036285 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/017531 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/077695 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/203455 | ARRAY SUBSTRATE AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/208063 | FLAT PANEL DETECTOR SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND FLAT PANEL DETECTOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/142964 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/203469 | DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/004117 | MANUFACTURING PROCESS FOR ULTRASONIC ATOMIZATION SHEET | SHENZHEN SHANG JIN ELECTRONIC SCIENCE AND TECHNOLOGY CO., LTD |
| WO/2021/098137 | DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/212313 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/203482 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031595 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | CHENGDU VISTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/134985 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/082369 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/164120 | PIXEL BANK PREPARATION METHOD, PIXEL BANK STRUCTURE, PIXEL STRUCTURE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184486 | DISPLAY PANEL AND MANUFACTURING METHOD | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/169013 | STRUCTURE AND METHOD FOR OPTIMIZING INK-JET PRINTING ENCAPSULATION PROCESS, AND DISPLAY SCREEN | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184488 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/212421 | ANTI-CORROSION CIRCUIT, ARRAY SUBSTRATE, AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/212426 | STACKED CIRCUIT BOARDS | HONGFUJIN PRECISION INDUSTRY（WUHAN）CO., LTD. |
| WO/2021/212434 | PLATE-TO-PLATE CONNECTION STRUCTURE AND FABRICATION METHOD THEREFOR | HONGQISHENG PRECISION ELECTRONICS(QINHUANGDAO) CO., LTD. |
| WO/2021/212446 | THREE-DIMENSIONAL MEMORY DEVICES WITH DRAIN-SELECT-GATE CUT STRUCTURES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/196321 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/212457 | MASS TRANSFER METHOD FOR MICRO LED CHIPS AND DISPLAY BACK PLATE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/212480 | RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD |
| WO/2021/212490 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD. |
| WO/2021/022840 | PIXEL ARRANGEMENT STRUCTURE AND DISPLAY PANEL | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/217295 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217296 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217326 | EMBEDDED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME | HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD. |
| WO/2021/217358 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/217400 | ELECTRONIC DEVICE AND ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT | INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD. |
| WO/2021/155643 | OLED DISPLAY PANEL AND OLED DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217418 | LIGHT-EMITTING MODULE AND AR GLASSES | NANCHAGN OFILM DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/062999 | OPTICAL SENSOR, OPTICAL SENSING SYSTEM, AND METHOD FOR MANUFACTURING OPTICAL SENSOR | EGIS TECHNOLOGY INC. |
| WO/2021/179417 | ARRAY SUBSTRATE, DISPLAY PANEL, AND MANUFACTURING METHOD OF DISPLAY PANEL. | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217482 | TRANSIENT VOLTAGE SUPPRESSION PROTECTION DEVICE, MANUFACTURING PROCESS, AND ELECTRONIC PRODUCT | WILL SEMICONDUCTOR (SHANGHAI) CO. LTD |
| WO/2021/155644 | OLED DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND MICRO LENS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088336 | FABRICATION METHOD FOR PCB HAVING INTERNALLY EMBEDDED CERAMIC PIECE, AND PCB THEREOF | KINWONG ELECTRONIC TECHNOLOGY (LONGCHUAN) CO., LTD. |
| WO/2021/217493 | THREE-DIMENSIONAL FERROELECTRIC MEMORY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/120491 | FIXTURE, TRANSPORT UNIT COMPRISING FIXTURE, AND PRINTING INK-SPRAYING DEVICE | JOINT STARS TECHNOLOGY CO., LTD |
| WO/2021/169027 | JET PRINTING MACHINE | JOINT STARS TECHNOLOGY CO., LTD |
| WO/2021/217525 | ORGANIC LIGHT-EMITTING DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217526 | ORGANIC LIGHT-EMITTING DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/004141 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | KUNSHAN FANTAVIEW ELECTRONIC TECHNOLOGY CO., LTD |
| WO/2021/098154 | SILICON-BASED MICRO DISPLAY SCREEN AND PREPARATION METHOD THEREFOR | KUNSHAN FANTAVIEW ELECTRONIC TECHNOLOGY CO., LTD |
| WO/2021/196336 | DISPLAY PANEL AND FABRICATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217582 | INTEGRATED CIRCUIT | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/217593 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/142980 | THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/217614 | TOUCH MODULE, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189601 | DEFORMABLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/223086 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, DISPLAY DEVICE AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/135013 | SEMICONDUCTOR STRUCTURE HAVING STACKED UNITS AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | ROFS MICROSYSTEM (TIANJIN) CO, .LTD. |
| WO/2021/223189 | ARRAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217700 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR AND DISPLAY TERMINAL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/226743 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217703 | TRANSPARENT DISPLAY PANEL AND TRANSPARENT DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217710 | CONDUCTIVE ASSEMBLY AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/226785 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/226787 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/226788 | DISPLAY PANEL, MASK, MASK ASSEMBLY, AND METHOD FOR MANUFACTURING MASK ASSEMBLY | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/226807 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169047 | DISPLAY PANEL WITH HIGH APERTURE RATIO AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/226817 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217718 | ARRAY SUBSTRATE, FABRICATION METHOD THEREFOR AND DISPLAY APPARATUS | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/226879 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/223256 | FLEXIBLE CIRCUIT BOARD TOOLING STRUCTURE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/189618 | DISPLAY SUPPORT, DISPLAY ASSEMBLY, AND METHOD FOR MANUFACTURING DISPLAY SUPPORT | SHENZHEN LEYARD OPTOELECTRONIC CO., LTD. |
| WO/2021/051836 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/226979 | THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/159625 | OLED APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189619 | PHOTOELECTRIC SENSOR, RANDOM-READABLE ACTIVE PIXEL CIRCUIT, IMAGE SENSOR AND CAMERA DEVICE | SUN YAT-SEN UNIVERSITY |
| WO/2021/217737 | DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/227027 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227029 | DISPLAY SUBSTRATE AND PRODUCING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227031 | DISPLAY PANEL, DRIVE METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217739 | SENSOR AND MANUFACTURING METHOD THEREFOR, AND PHOTOELECTRIC CONVERSION APPARATUS | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/082400 | CVD PREPARATION METHOD FOR REDUCING SPOT DEFECTS OF CAMERA MODULE AND PRODUCT THEREOF | HANGZHOU MDK OPTO ELECTRONICS CO., LTD |
| WO/2021/227040 | DISPLAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227062 | DISPLAY PANEL AND ELECTRONIC APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227064 | PIXEL DRIVE CIRCUIT, DISPLAY PANEL, AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227065 | DISPLAY PANEL AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217746 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184522 | BACKLIGHT MODULE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/208179 | BACKPLANE UNIT AND FABRICATING METHOD THEREFOR, AND DISPLAY DEVICE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/232224 | ORGANIC SPACER FOR INTEGRATED CIRCUITS | INTEL CORPORATION |
| WO/2021/232238 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFORE, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/212586 | DISPLAY PANEL AND PREPARATION METHOD FOR DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/232259 | 3D NAND FLASH MEMORY DEVICE AND INTEGRATION METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/008228 | SIP ENCAPSULATION STRUCTURE | JCET GROUP CO., LTD. |
| WO/2021/227106 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/051846 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD |
| WO/2021/232322 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | AVARY HOLDING (SHENZHEN) CO., LIMITED. |
| WO/2021/227119 | METHOD FOR MANUFACTURING DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/232370 | IMAGE SENSOR DISPLAY AND METHOD OF OPERATION THEREOF | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/212587 | OLED DISPLAY PANEL AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088353 | LOW-DIELECTRIC POLYIMIDE CIRCUIT BOARD | NANJING ZHONGHONG RUNNING ADVANCED MATERIAL TECHNOLOGY CO., LTD. |
| WO/2021/232409 | MEMORY DEVICE AND FORMATION METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/208185 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/057055 | INTEGRATED PACKAGE STRUCTURE | JCET GROUP CO., LTD. |
| WO/2021/237403 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/237407 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/196372 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/008239 | DISPLAY SUBSTRATE, DISPLAY APPARATUS AND PREPARATION METHOD FOR DISPLAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/196375 | OLED DISPLAY APPARATUS AND PREPARATION METHOD | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184542 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/196377 | DISPLAY PANEL AND MANUFACTURING METHOD | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/196380 | DISPLAY PANEL AND FLEXIBLE DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/237488 | THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/237489 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/237491 | THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/237492 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/208193 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/208194 | THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/208195 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/022873 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/212600 | OLED DISPLAY PANEL AND OLED DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/237530 | DISPLAY DEVICE AND PREPARATION METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/237559 | INTERMEDIATE SUBSTRATE, AND DISPLAY PANEL MANUFACTURING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/237606 | LED LIGHT-EMITTING BACKPLATE AND PRODUCTION METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/217770 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/237629 | THREE-DIMENSIONAL NAND MEMORY DEVICE AND FORMING METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/237643 | VERTICAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/036379 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND MANUFACTURING METHOD FOR CIRCUIT BOARD ASSEMBLY | AVARY HOLDING (SHENZHEN) CO., LIMITED. |
| WO/2021/237720 | DISPLAY PANEL, TOUCH-CONTROL STRUCTURE, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/237730 | THREE-DIMENSIONAL FERROELECTRIC MEMORY AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/243484 | FERROELECTRIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/057066 | DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/243553 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227147 | DISPLAY DEVICE AND ELECTRONIC DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/227149 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/227153 | DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/243638 | DISPLAY SUBSTRATE, MANUFACTURING METHOD, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/237772 | CIRCUIT BOARD, TRANSMISSION LINE AND ELECTRONIC DEVICE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/077756 | MANUFACTURING METHOD INCLUDING MRAM BOTTOM ELECTRODE MANUFACTURING PROCESS, AND MRAM DEVICE | ZHEJIANG HIKSTOR TECHNOLOGY CO., LTD. |
| WO/2021/243686 | CONTACT PAD STRUCTURE AND METHOD OF FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/243698 | STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/243703 | STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/208215 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/243737 | SCREEN PRINTING METHOD AND MANUFACTURING METHOD FOR FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/223286 | TRANSPARENT LED CIRCUIT BOARD, AND METHOD FOR PREPARING TRANSPARENT LED DISPLAY SCREEN | SHENZHEN NEXNOVO TECHNOLOGY CO., LTD. |
| WO/2021/047224 | DISPLAY PANEL AND DISPLAY APPARATUS | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/248375 | DISPLAY BACK PLATE AND MANUFACTURING METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/217793 | ORGANIC LIGHT EMITTING DISPLAY AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/063025 | TRANSPARENT DISPLAY PANEL, AND DISPLAY DEVICE AND DISPLAY PANEL THEREOF | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/057095 | TRANSPARENT DISPLAY SUBSTRATE, TRANSPARENT DISPLAY PANEL, AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/036411 | DISPLAY PANEL, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY PANEL | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/248425 | THREE-DIMENSIONAL MEMORY DEVICES WITH DRAIN SELECT GATE CUT AND METHODS FOR FORMING AND OPERATING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/248426 | THREE-DIMENSIONAL MEMORY DEVICES WITH DRAIN SELECT GATE CUT AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/128758 | LOW-VOLTAGE, LOW-POWER COMPLEMENTARY CIRCUIT, INVERTER, AND NAND DEVICE | SUZHOU UNIVERSITY |
| WO/2021/217799 | OLED DISPLAY PANEL AND PREPARATION METHOD, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/227173 | ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/217800 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/248453 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217802 | FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/248489 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217806 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217809 | OLED DISPLAY SCREEN AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217811 | OLED DISPLAY SCREEN AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/203552 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/217815 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/237823 | MINI LIGHT EMITTING DIODE BACKLIGHT MODULE AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/227191 | ORGANIC INSULATING FILM AND DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/227192 | DISPLAY PANEL AND TILED SCREEN | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/243753 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217820 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253340 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/248542 | OLED DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/243762 | MICRO LIGHT EMITTING DIODE DISPLAY APPARATUS AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/248545 | OLED DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND OLED DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/227197 | UNDER-SCREEN CAMERA DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/248547 | OLED DISPLAY PANEL AND OLED DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103504 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/082473 | FLEXIBLE DISPLAY SCREEN MANUFACTURING METHOD AND FLEXIBLE DISPLAY SCREEN ON TEMPORARY SUBSTRATE TO BE PEELED | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/237839 | FULL-SPECTRUM LED LIGHT SOURCE AND MANUFACTURING METHOD THEREFOR | ZHONGSHAN MULINSEN ELECTRONICS CO., LTD. |
| WO/2021/248553 | ARRAY SUBSTRATE AND OLED DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217836 | DISPLAY PANEL AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217838 | DISPLAY APPARATUS AND PREPARATION METHOD THEREFOR, AND TERMINAL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/258257 | RESISTIVE RANDOM ACCESS MEMORY AND PREPARATION METHOD THEREFOR | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/223298 | OLED PIXEL ARRANGEMENT STRUCTURE, OLED DISPLAY PANEL, AND MANUFACTURING METHOD FOR DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/223299 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/248555 | THIN FILM TRANSISTOR, AND ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/258269 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258270 | CIRCUIT BOARD, ELECTRONIC DEVICE, AND PROCESSING METHOD FOR CIRCUIT BOARD | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/223300 | OLED DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/223302 | DISPLAY PANEL AND METHOD FOR PREPARING SAME | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217839 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217840 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217841 | FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/232532 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/258318 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227209 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253472 | WATERPROOF ELECTRONIC CORE PCB | KUNSHAN DAKATE ELECTRONICS CO., LTD. |
| WO/2021/253473 | HIGH-STRENGTH DOUBLE-LAYER PCB | KUNSHAN DAKATE ELECTRONICS CO., LTD. |
| WO/2021/237856 | ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/237859 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/248568 | DISPLAY PANEL DRIVING CIRCUIT, AND ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/082485 | METHOD FOR DESIGNING PCB PADS, DEVICE AND MEDIUM | INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD |
| WO/2021/017711 | LIGHT-EMITTING DEVICE PACKAGING MEMBER AND DISPLAY DEVICE | QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD. |
| WO/2021/051925 | LIGHT EMITTING DIODE PACKAGING ASSEMBLY | QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD. |
| WO/2021/077789 | ORGANIC LIGHT EMITTING BACKPLANE AND MANUFACTURING METHOD THEREFOR, TOUCH DISPLAY SCREEN, AND TOUCH DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017716 | PEROVSKITE MATERIAL-BASED X-RAY DIGITAL IMAGE DETECTOR | SHENZHEN UNIVERSITY |
| WO/2021/203559 | DISPLAY PANEL AND DISPLAY METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/000835 | DISPLAY DEVICE, DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017722 | DISPLAY PANEL, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/000842 | METHOD AND APPARATUS FOR TESTING PRINTED CIRCUIT BOARD (PCB) | ZTE CORPORATION |
| WO/2021/237867 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/000852 | VACUUM HOLE PLUGGING METHOD | SHENZHEN CAREST TECHNOLOGY CO., LTD. |
| WO/2021/237868 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/189696 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/243781 | DISPLAY PANEL, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/248586 | MANUFACTURING METHOD FOR LCP SUBSTRATE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/253493 | TOUCH SCREEN AND ELECTRONIC DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253494 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253496 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253500 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/098219 | METHOD FOR MANUFACTURING IMAGING MODULE | NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION |
| WO/2021/068571 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/017743 | MOLDED CIRCUIT BOARD AND CAMERA MODULE, AND MANUFACTURING METHOD THEREFOR AND ELECTRONIC DEVICE COMPRISING SAME | NINGBO SUNNY OPOTECH CO., LTD. |
| WO/2021/243786 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031710 | PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE, AND PREPARATION METHOD THEREFOR | NINGBO SUNNY OPOTECH CO., LTD. |
| WO/2021/253511 | DISPLAY SUBSTRATE MOTHERBOARD AND PREPARATION METHOD THEREFOR, AND DISPLAY SUBSTRATE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103535 | MEMORY, MEMORY SUBSTRATE STRUCTURE, AND PREPARATION METHOD FOR MEMORY SUBSTRATE STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/227219 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/217874 | PHOTOELECTRIC CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/237880 | THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/237881 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/237883 | THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/237884 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/208268 | THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE INTERCONNECT STRUCTURES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/004459 | EMBEDDED CIRCUIT BOARD AND FABRICATION METHOD THEREFOR | SHENNAN CIRCUITS CO., LTD. |
| WO/2021/223320 | CONTACT RESISTANCE MONITORING DEVICE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/004493 | PACKAGING STRUCTURE AND POWER AMPLIFIER | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/227227 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND MASK SET | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/248605 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/047272 | VEHICLE-MOUNTED CHARGER AND FIELD EFFECT TRANSISTOR INSTALLATION METHOD THEREFOR | SHENZHEN VMAX NEW ENERGY CO., LTD. |
| WO/2021/248612 | CIRCUIT SUBSTRATE PREPARATION METHOD AND CIRCUIT SUBSTRATE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| WO/2021/008457 | HIGH-VOLTAGE FLIP-CHIP LED LIGHT SOURCE, LARGE-AREA LED LIGHT SOURCE PACKAGING STRUCTURE AND PACKAGING METHOD | SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCES |
| WO/2021/232563 | PIXEL LAYOUT AND DISPLAY PANEL HAVING SAME | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103575 | POWER SUPPLY APPARATUS AND SINGLE BOARD | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/248617 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/243811 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/179504 | CIRCUIT BOARD STRUCTURE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/243812 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012994 | DISPLAY APPARATUS AND DISPLAY CONTROL METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/022982 | CIRCUIT ASSEMBLY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/114660 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/051983 | CIRCUIT ASSEMBLY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/008592 | CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD FOR CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/082534 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/077821 | DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/258454 | COLOR FILTER AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017922 | CONNECTION METHOD BETWEEN ELECTRONIC ELEMENT AND CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE | INTELLIMICRO MEDICAL CO., LTD. |
| WO/2021/258456 | DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/258458 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088414 | CRIMPING POWER MODULE AND METHOD FOR PREPARING SAME | SHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS |
| WO/2021/253558 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/258462 | DISPLAY PANEL AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253560 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/042889 | MAIN BOARD, DENOISING METHOD AND TERMINAL | ZTE CORPORATION |
| WO/2021/258467 | TOUCH DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253561 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/212676 | ARRAY SUBSTRATE AND FABRICATING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/017954 | MICROELECTRONIC DEVICE AND MANUFACTURING METHOD FOR MICROELECTRONIC DEVICE | XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD. |
| WO/2021/258474 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017980 | VIA STACKED-UP STRUCTURE AND HEAT DISSIPATION STRUCTURE OF PRINTED CIRCUIT BOARD, AND MANUFACTURING METHOD | ZTE CORPORATION |
| WO/2021/027516 | DISPLAY PANEL AND DISPLAY DEVICE | APPOTRONICS CORPORATION LIMITED |
| WO/2021/017986 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/114670 | DETECTION SUBSTRATE, FABRICATION METHOD THEREFOR AND FLAT PANEL DETECTOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/120621 | RESISTIVE RANDOM ACCESS MEMORY UNIT STRUCTURE AND PREPARATION METHOD | SHANGHAI IC R & D CENTER CO., LTD. |
| WO/2021/103601 | IMAGE SENSOR STRUCTURE AND FORMING METHOD | SHANGHAI IC R & D CENTER CO., LTD. |
| WO/2021/103604 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/093370 | UTBB-BASED PHOTOELECTRIC DETECTOR PIXEL UNIT, ARRAY, AND METHOD | PEKING UNIVERSITY |
| WO/2021/013253 | ELECTRONIC DEVICE AND IMAGING METHOD THEREOF | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/253574 | MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR | ZHUHAI ACCESS SEMICONDUCTOR CO., LTD. |
| WO/2021/082557 | DISPLAY APPARATUS AND TERMINAL DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/057236 | CIRCUIT BOARD AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/103616 | ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR AND DISPLAY PANEL | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/103620 | DISPLAY PANEL | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/109595 | MEMORY AND FORMING METHOD THEREFOR | FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD. |
| WO/2021/164203 | PREPARATION METHOD FOR HIGH-PRECISION COMMUNICATION OPTICAL MODULE PRINTED CIRCUIT BOARD | GUANGDONG KINGSHINE ELECTRONIC TECHNOLOGY CO. LTD. |
| WO/2021/143100 | METHOD FOR MANUFACTURING BLIND HOLE IN ARBITRARY-LAYER INTERCONNECTED HDI INNER-LAYER CORE BOARD | GUANGDONG KINGSHINE ELECTRONIC TECHNOLOGY CO. LTD. |
| WO/2021/143102 | THROUGH HOLE FILLING AND PLATING METHOD APPLIED TO OPTICAL MODULE HIGH DENSITY INTERCONNECT HDI BOARD | GUANGDONG KINGSHINE ELECTRONIC TECHNOLOGY CO., LTD. |
| WO/2021/179519 | PREPARATION METHOD FOR HIGH-PRECISION MULTI-STAGE PRINTED CIRCUIT BOARD OF INTELLIGENT UNMANNED AERIAL VEHICLE | GUANGDONG KINGSHINE ELECTRONIC TECHNOLOGY CO. LTD. |
| WO/2021/189744 | PREPARATION METHOD FOR 77 GHZ MILLIMETER WAVE RADAR CIRCUIT BOARD | GUANGDONG KINGSHINE ELECTRONIC TECHNOLOGY CO. LTD. |
| WO/2021/036676 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/023107 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/031829 | DISPLAY PANEL AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/018301 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/018303 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/018304 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/023147 | DISPLAY SUBSTRATE, PREPARATION METHOD THEREFOR AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/036696 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/027618 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258509 | CIRCUIT BOARD PROCESSING METHOD FOR DECREASING GALVANIC EFFECT | HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO., LTD |
| WO/2021/258510 | MACHINING METHOD CAPABLE OF PREVENTING BURRS OF METALLIZED HALF-HOLE | HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO., LTD |
| WO/2021/120638 | PROCESSING METHOD FOR SPRAYING CHARACTER ON SURFACE OF PCB SUBSTRATE | HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO., LTD |
| WO/2021/120639 | MACHINING METHOD FOR 5G SMALL-CELL BASE STATION POWER AMPLIFIER MODULE PCB HAVING STEPPED GROOVES | HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO., LTD |
| WO/2021/120640 | METHOD OF MANUFACTURING 5G SIGNAL SHIELDING PCB MODULE HAVING ENGAGEMENT TEETH | HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY CO., LTD |
| WO/2021/036723 | DISPLAY MODULE AND ELECTRONIC DEVICE | VIVO MOBILE COMMUNICATION CO., LTD. |
| WO/2021/057275 | BIDIRECTIONAL ESD PROTECTIVE DEVICE AND ELECTRONIC APPARATUS | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| WO/2021/103642 | CHIP COMBINATION AND CHIP | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/027726 | PIXEL STRUCTURE, DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/052060 | MANUFACTURING METHOD FOR PCB WITH THERMAL CONDUCTOR EMBEDDED THEREIN, AND PCB | SHENGYI ELECTRONICS CO., LTD. |
| WO/2021/052061 | MANUFACTURING METHOD FOR THERMALLY-CONDUCTIVE PCB AND PCB | SHENGYI ELECTRONICS CO., LTD. |
| WO/2021/103654 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/027811 | DISPLAY PANEL, PREPARATION METHOD THEREFOR AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/248676 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/027848 | PCB, BRACKET AND FLOW-THROUGH DEVICE | ZTE CORPORATION |
| WO/2021/143124 | FLEXIBLE PRINTED CIRCUIT BOARD MODULE MANUFACTURED USING MULTIPLE FILMS, AND MANUFACTURING METHOD | WANG, Dingfeng |
| WO/2021/057310 | DOUBLE-LAYER CIRCUIT BOARD MADE BY COMBINING SINGLE-LAYER CIRCUIT BOARD ONTO FLAT CABLE AND MANUFACTURING METHOD | WANG, Dingfeng |
| WO/2021/057311 | LIGHT STRIP HAVING DISCONTINUOUSLY LAYERED FLEXIBLE LAMINATED CIRCUIT BOARD, AND MANUFACTURING METHOD | WANG, Dingfeng |
| WO/2021/057321 | DISCONTINUOUSLY LAYERED FLEXIBLE LAMINATION LAMP STRIP CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | WANG, Dingfeng |
| WO/2021/036819 | NOVEL WIRE CIRCUIT BOARD OF ETCHED COPPER-CLAD ALUMINUM WIRE AND MANUFACTURING METHOD THEREOF | WANG, Dingfeng |
| WO/2021/077873 | ELECTROLUMINESCENT DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/036840 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/103665 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/073246 | FLEXIBLE DISPLAY MODULE AND FLEXIBLE DISPLAY DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/082645 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/082648 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/032169 | DISPLAY SUBSTRATE, PREPARATION METHOD AND REPAIR METHOD THEREFOR AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/047372 | PRINTED CIRCUIT BOARD, COMMUNICATION APPARATUS, AND MANUFACTURING METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/032189 | INTEGRATED PACKAGE ELECTRONIC DEVICE STRUCTURE | DYNAX SEMICONDUCTOR, INC. |
| WO/2021/036992 | DISPLAY PANEL, JIG, AND METHOD FOR MANUFACTURING DISPLAY PANEL USING SAME | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/088472 | DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/128908 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| WO/2021/073257 | MULTIPLEXER | TIANJIN UNIVERSITY |
| WO/2021/037213 | PIXEL ARRANGEMENT STRUCTURE AND DISPLAY PANEL | GUANGDONG JUHUA PRINTED DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/037217 | PIXEL ARRANGEMENT STRUCTURE AND DISPLAY PANEL COMPRISING SAME | GUANGDONG JUHUA PRINTED DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/073282 | FULL-COLOR μLED MICRO-DISPLAY DEVICE WITHOUT ELECTRICAL CONTACT, AND METHOD FOR MANUFACTURING SAME | FU ZHOU UNIVERSITY |
| WO/2021/073284 | LIGHT-EMITTING DISPLAY DEVICE BASED ON SPECIAL-SHAPED NANO LED CRYSTAL GRAINS | FU ZHOU UNIVERSITY |
| WO/2021/073285 | FULL-COLOR ΜLED DISPLAY DEVICE ELIMINATING ELECTRICAL CONTACT AND MASS TRANSFER | FU ZHOU UNIVERSITY |
| WO/2021/073287 | μLED LIGHT-EMITTING AND DISPLAY DEVICE WITHOUT ELECTRICAL CONTACT, EXTERNAL CARRIER INJECTION OR MASS TRANSFER, AND METHOD FOR PREPARING SAME | FU ZHOU UNIVERSITY |
| WO/2021/073288 | NANOWIRE-BASED μLED DISPLAY DESIGN METHOD | FU ZHOU UNIVERSITY |
| WO/2021/057396 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/103725 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/159690 | DISPLAY MODULE, ELECTRONIC DEVICE, AND CONTROL METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/043133 | IMAGE SENSOR, CAMERA MODULE AND ELECTRONIC DEVICE | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/043159 | FLEXIBLE DISPLAY SCREEN, PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/043161 | CIRCUIT BOARD AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/068688 | OXIDE THIN-FILM TRANSISTOR AND METHOD FOR DRIVING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/208337 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/189777 | LED DISPLAY PANEL AND LED DISPLAY | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/082734 | CIRCUIT BOARD DEVICE AND PROCESSING METHOD THEREOF, AND MOBILE TERMINAL | VIVO MOBILE COMMUNICATION CO., LTD. |
| WO/2021/135360 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL | SPREADTRUM COMMUNICATIONS (SHANGHAI) CO., LTD. |
| WO/2021/063162 | IMAGE SENSOR, CAMERA ASSEMBLY, AND MOBILE TERMINAL | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/093439 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217993 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184700 | EASY-REPAIR LED DISPLAY AND REPAIR METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/217994 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/243875 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/243876 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/243878 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/047638 | DISCRETE DIODE DEVICE, CIRCUIT HAVING BYPASS FUNCTION, AND CONVERTER | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/052327 | CIRCUIT BOARD | ZTE CORPORATION |
| WO/2021/258560 | MEMORY FORMING METHOD AND MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/057656 | ARRAY SUBSTRATE, LIQUID CRYSTAL DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/143186 | MODULATION METHOD FOR ASYMMETRICAL FERROELECTRIC TUNNEL JUNCTION MULTI-VALUE MEMORY CELL | HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| WO/2021/143187 | METHOD FOR FABRICATING ASYMMETRIC FERROELECTRIC FUNCTIONAL LAYER ARRAY AND FERROELECTRIC TUNNEL JUNCTION MULTI-VALUE STORAGE UNIT | HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| WO/2021/109682 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/057757 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/057766 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/068745 | ARRAY SUBSTRATE, ELECTRONIC DEVICE, AND ARRAY SUBSTRATE MANUFACTURING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/057814 | LIGHT CONVERSION DEVICE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS HAVING LIGHT CONVERSION DEVICE | NAJING TECHNOLOGY CORPORATION LIMITED |
| WO/2021/120761 | DISPLAY PANEL AND DRIVING METHOD THEREFOR, AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/057857 | CIRCUIT BOARD AND COMMUNICATION DEVICE | ZTE CORPORATION |
| WO/2021/057883 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/109689 | PIXEL ARRANGEMENT STRUCTURE AND DISPLAY PANEL | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/093479 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/093481 | ORGANIC LIGHT EMITTING DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218030 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/073445 | DISPLAY BACKPLANE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/078016 | FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING FLEXIBLE CIRCUIT BOARD | ZTE CORPORATION |
| WO/2021/073459 | LIGHT-EMITTING APPARATUS | NAJING TECHNOLOGY CORPORATION LIMITED |
| WO/2021/098406 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/078030 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/212766 | DUAL-PURPOSE WORKTABLE | NANJING TALIANG TECHNOLOGY CO., LTD |
| WO/2021/129049 | LIGHT-TRANSMISSIVE DISPLAY PANEL, DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/082894 | CHIP ON FILM BONDING STRUCTURE, DISPLAY MODULE AND TERMINAL DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/139296 | PACKAGING STRUCTURE AND PACKAGING METHOD | CHINA WAFER LEVEL CSP CO., LTD |
| WO/2021/227352 | LED DISPLAY MODULE, LED DISPLAY SCREEN, AND MANUFACTURING METHOD FOR LED DISPLAY MODULE | UNILUMIN GROUP CO., LTD. |
| WO/2021/078095 | BACKPLANE AND FABRICATION METHOD THEREFOR, CHIP BONDING METHOD AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/078104 | TRANSPARENT OLED DISPLAY PANEL, DISPLAY APPARATUS AND PREPARATION METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218059 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR, AND MEMORY AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/082989 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/082999 | DISPLAY APPARATUS AND ELECTRONIC DEVICE | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/078175 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/129092 | SYSTEM-IN-PACKAGE STRUCTURE, AND PACKAGING METHOD FOR SAME | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/088662 | SCREEN ASSEMBLY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/093552 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/083048 | DISPLAY BACKPLANE, MASK PLATE COMPONENT, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/083056 | CIRCUIT BOARD DEVICE AND ELECTRONIC APPARATUS | VIVO MOBILE COMMUNICATION CO., LTD. |
| WO/2021/078280 | SWITCHING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND SOLID-STATE PHASE SHIFTER | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/227372 | METHOD FOR INCREASING POWER SUPPLY CAPABILITY OF HARD MACRO OF CHIP | DONGKE SEMICONDUCTOR (ANHUI) CO., LTD. |
| WO/2021/227374 | CERMAIC ENCAPSULATING CASING AND ENCAPSULATING CASING MOUNTING STRUCTURE | THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION |
| WO/2021/114905 | ANISOTROPIC DEVICE, AND PREPARATION METHOD AND USE THEREOF | SHENZHEN HANGUANG TECHNOLOGY CO., LTD. |
| WO/2021/196575 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/083159 | BATTERY PROTECTION BOARD AND MANUFACTURING METHOD THEREFOR, AND MOBILE TERMINAL | SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD. |
| WO/2021/083226 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218081 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/083255 | DISPLAY DEVICE AND ELECTRONIC EQUIPMENT | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/120877 | CIRCUIT BOARD ASSEMBLY, ELECTRONIC DEVICE, AND METHOD FOR PROCESSING CIRCUIT BOARD ASSEMBLY | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/135590 | ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/098475 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/083298 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/093600 | ARRAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238060 | FLEXIBLE SUBSTRATE AND MECHANICAL STRIPPING METHOD THEREFOR | TRULY SEMICONDUCTORS LIMITED |
| WO/2021/083367 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | SHENNAN CIRCUITS CO., LTD. |
| WO/2021/088824 | ARRAY SUBSTRATE, DISPLAY APPARATUS AND ELECTROSTATIC PROTECTION UNIT | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/088832 | ELECTRONIC DEVICE, DISPLAY APPARATUS, DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/103963 | DISCHARGING MECHANISM FOR PCB ALUMINUM SHEET | HUIZHOU CHENGTAI AUTOMATION TECHNOLOGY CO. LTD. |
| WO/2021/103964 | ASSEMBLY LINE CAPABLE OF BEING OPENED AND CLOSED | HUIZHOU CHENGTAI AUTOMATION TECHNOLOGY CO. LTD. |
| WO/2021/103965 | SYNCHRONOUS PIN DETACHMENT MECHANISM | HUIZHOU CHENGTAI AUTOMATION TECHNOLOGY CO. LTD. |
| WO/2021/120907 | AUTOMATIC ADHESIVE COATING MECHANISM FOR PCBS | HUIZHOU CHENGTAI AUTOMATION TECHNOLOGY CO., LTD. |
| WO/2021/093657 | LED DISPLAY SCREEN | APPOTRONICS CORPORATION LIMITED |
| WO/2021/243950 | THIN FILM PROCESSING SYSTEM AND METHOD | SVG TECH GROUP CO., LTD |
| WO/2021/093666 | ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/135632 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR | GUANGDONG JUHUA PRINTED DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/114969 | LIGHT-EMITTING STRUCTURE, DISPLAY APPARATUS AND ILLUMINATING APPARATUS | SUZHOU XINGSHUO NANOTECH CO., LTD. |
| WO/2021/103979 | DISPLAY PANEL, FLEXIBLE DISPLAY SCREEN, ELECTRONIC APPARATUS, AND PREPARATION METHOD FOR DISPLAY PANEL | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/109794 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/088953 | DISPLAY PANEL AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/098531 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | SHENNAN CIRCUITS CO.,LTD. |
| WO/2021/093681 | DISPLAY BACKPLANE, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/159780 | OLED DISPLAY SCREEN MODULE AND TERMINAL DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/109805 | DISPLAY SCREEN ASSEMBLY AND ELECTRONIC DEVICE | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/109808 | MEMORY AND MANUFACTURING METHOD THEREFOR | ZHEJIANG HIKSTOR TECHNOLOGY CO., LTD. |
| WO/2021/258610 | ARRAY SUBSTRATE, DISPLAY PANEL, AND MANUFACTURING METHOD | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/093768 | MANUFACTURING METHOD OF DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218112 | SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREFOR, MEMORY AND FORMATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/253717 | MEMORY, AND FORMING METHOD THEREFOR AND CONTROL METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/109818 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC APPARATUS | HONOR DEVICE CO., LTD. |
| WO/2021/109825 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/169411 | MONOLITHIC OPTOELECTRONIC INTEGRATED CIRCUIT AND METHOD FOR FORMING SAME | NANJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS |
| WO/2021/093816 | PIXEL STRUCTURE AND IMAGE SENSOR | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/104049 | ORGANIC LIGHT-EMITTING DIODE DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/104050 | DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/098610 | DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/139403 | ARRAY SUBSTRATE, DISPLAY PANEL AND PREPARATION METHOD FOR ARRAY SUBSTRATE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/208418 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/189875 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/115042 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/104109 | DISPLAY MODULE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/115045 | SUBSTRATE FOR DISPLAY, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/104150 | DISPLAY SUBSTRATE, DISPLAY PANEL AND ELECTRONIC APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/253724 | DISPLAY SUBSTRATE MOTHERBOARD AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/104177 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/104295 | DISPLAY DEVICE AND OLED PANEL THEREOF, AND MANUFACTURING METHOD FOR OLED PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/189887 | SEMICONDUCTOR STRUCTURE AND PREHEATING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/115126 | OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND OLED DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/104364 | SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE COMPRISING SEMICONDUCTOR APPARATUS | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/115131 | DISPLAY SCREEN AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/104411 | INTEGRATED CIRCUIT AND ELECTRONIC APPARATUS | XIAMEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/104428 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/104481 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/208449 | PHOTOELECTRIC SENSOR | EGIS TECHNOLOGY INC. |
| WO/2021/139444 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/143366 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/232739 | DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/238129 | DISPLAY PANEL AND DISPLAY PANEL MANUFACTORING METHOD | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/143381 | METHOD FOR MANUFACTURING THREE-DIMENSIONAL CIRCUIT AND ELECTRONIC ELEMENT | RICHVIEW ELECTRONICS CO., LTD. |
| WO/2021/110042 | LED DISPLAY APPARATUS | YLX INCORPORATED |
| WO/2021/121063 | SATELLITE-BORNE STACK BODY AND STANDARDIZED MODULE THEREFOR | NATIONAL INNOVATION INSTITUTE OF DEFENSE TECHNOLOGY, PLA ACADEMY OF MILITARY SCIENCE |
| WO/2021/115249 | CIRCUIT BOARD APPARATUS AND ELECTRONIC DEVICE | VIVO MOBILE COMMUNICATION CO., LTD. |
| WO/2021/115309 | INTEGRATED CIRCUIT BOARD AND ELECTRONIC DEVICE | VIVO MOBILE COMMUNICATION CO., LTD. |
| WO/2021/129399 | SOLDER PASTE APPLICATION MOLD AND SOLDER PASTE PRINTING PROCESS | QINGDAO GOERTEK MICROELECTRONICS RESEARCH INSTITUTE CO., LTD |
| WO/2021/179713 | LED LIGHT SOURCE DEVICE | YLX INCORPORATED |
| WO/2021/238150 | OPTICAL SENSOR ENCAPSULATION STRUCTURE AND ELECTRONIC DEVICE | QINGDAO GOERTEK INTELLIGENT SENSOR CO., LTD |
| WO/2021/115416 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | ZTE CORPORATION |
| WO/2021/248862 | SEMICONDUCTOR PACKAGING STRUCTURE | SZ DJI TECHNOLOGY CO., LTD. |
| WO/2021/115472 | MICRO-LED CHIP AND MANUFACTURING METHOD THEREFOR | SHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS |
| WO/2021/121328 | LIGHT-EMITTING DIODE | SHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS |
| WO/2021/129542 | INTEGRATED CHIP AND MANUFACTURING METHOD THEREFOR, AND FULL-COLOR INTEGRATED CHIP AND DISPLAY PANEL | FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/196758 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| WO/2021/232780 | THREE-DIMENSIONAL RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD | SHANGHAI IC R & D CENTER CO., LTD. |
| WO/2021/203736 | RESISTIVE RANDOM ACCESS MEMORY UNIT AND PREPARATION METHOD | SHANGHAI IC R & D CENTER CO., LTD. |
| WO/2021/136031 | MULTI-LAYER CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MACHINING THE MULTI-LAYER CIRCUIT BOARD | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/129726 | MICRO LIGHT-EMITTING DIODE EPITAXIAL WAFER, DISPLAY ARRAY AND MANUFACTURING METHOD THEREFOR | HC SEMITEK(SUZHOU)CO., LTD. |
| WO/2021/164416 | X-RAY DETECTOR AND PREPARATION METHOD THEREFOR | SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES |
| WO/2021/136084 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/136135 | DISPLAY SCREEN AND ELECTRONIC DEVICE | VIVO MOBILE COMMUNICATION CO., LTD. |
| WO/2021/232796 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO., LTD |
| WO/2021/129863 | METHOD FOR MANUFACTURING TWO-DIMENSIONAL-MATERIAL-BASED FLEXIBLE FERROELECTRIC STORAGE UNIT | SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA. |
| WO/2021/184889 | DISPLAY PANEL, MANUFACTURING METHOD, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164423 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/190034 | DISPLAY SUBSTRATE AND METHOD FOR PREPARING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169561 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND MASK PLATE AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169568 | DISPLAY MOTHER BOARD AND PREPARATION METHOD THEREFOR, DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169571 | DISPLAY PANEL AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184907 | DISPLAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/136270 | FLEXIBLE DISPLAY DEVICE AND METHOD FOR PREPARING SAME | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184909 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/136276 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE, AND ELECTRONIC APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147629 | MULTIPLEXER AND MANUFACTURING METHOD THEREFOR | ROFS MICROSYSTEM (TIANJIN) CO, LTD. |
| WO/2021/136285 | DISPLAY DEVICE AND DISPLAY PANEL THEREOF, AND DISPLAY PANEL MANUFACTURING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/143523 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/174983 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/136341 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/232817 | CIRCUIT MANUFACTURING METHOD AND LDS ANTENNA | GUANGDONG GENIUS TECHNOLOGY CO., LTD. |
| WO/2021/244022 | FLEXIBLE MICRO-LED DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253795 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DEFECT REPAIRING METHOD FOR DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/190052 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL AND PREPARATION METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/136409 | DISPLAY SCREEN AND ELECTRONIC APPARATUS | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/190055 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/136446 | DRIVING BACKPLATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/136469 | IMAGE SENSOR, LIGHT SPLITTING COLOR FILTER DEVICE, AND IMAGE SENSOR FABRICATION METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/136487 | DISPLAY MODULE, DISPLAY PANEL THINNING METHOD, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/136515 | DISPLAY PANEL, DISPLAY DEVICE AND SUBSTRATE TO BE CUT | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/139600 | LAYOUT STRUCTURE FOR IMPROVING HIGH-FREQUENCY RELIABILITY OF MIM CAPACITOR AND IMPLEMENTATION METHOD THEREOF | SOUTH CHINA UNIVERSITY OF TECHNOLOGY |
| WO/2021/184930 | DISPLAY PANEL | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/169608 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/139626 | DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164446 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/139656 | ORGANIC ELECTROLUMINESCENT STRUCTURE, MANUFACTURING METHOD FOR SAME, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/139659 | DISPLAY PANEL, DRIVE METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/139660 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/139679 | LIGHT DETECTION MODULE, PREPARATION METHOD THEREFOR, AND LIGHT DETECTION SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147676 | ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/139693 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/196817 | INORGANIC LIGHT-EMITTING DIODE SUBSTRATE AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/139724 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/143643 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147696 | DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/196828 | IMPEDANCE OPTIMIZATION METHOD FOR CIRCUIT BOARD VIA HOLES, AND CIRCUIT BOARD | SUZHOU INSPUR INTELLIGENT TECHNOLOGY CO., LTD. |
| WO/2021/164467 | DISPLAY DEVICE, DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/184938 | PIXEL ARRANGEMENT OPTIMIZATION METHOD, LIGHT-TRANSMITTING DISPLAY PANEL, AND DISPLAY PANEL | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/147730 | CIRCUIT DEVICE AND PREPARATION METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/147738 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169648 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147759 | DISPLAY UNIT AND DISPLAY | BEIJING IVISUAL 3D TECHNOLOGY CO., LTD. |
| WO/2021/143760 | TOUCH-CONTROL PANEL AND PREPARATION METHOD THEREFOR, AND TOUCH-CONTROL DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/143846 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147783 | DISPLAY SCREEN AND ELECTRONIC DEVICE | VIVO MOBILE COMMUNICATION CO., LTD. |
| WO/2021/147812 | SPECTRUM PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR | DURA-CHIP (NANTONG) LIMITED |
| WO/2021/179796 | CABLE ASSEMBLY, SIGNAL TRANSMISSION STRUCTURE, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/147858 | COLOR FILM STRUCTURE, COLOR FILM SUBSTRATE, DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147883 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147887 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147987 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/159944 | IMAGE SENSOR, CAMERA ASSEMBLY, AND MOBILE TERMINAL | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/148005 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227553 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164493 | DISPLAY SUBSTRATE, ORGANIC LIGHT-EMITTING DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169694 | MODULARLY ASSEMBLED MCU APPLICATION CIRCUIT BOARD | WANG, Zhigang |
| WO/2021/164501 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/179837 | PIXEL ARRANGEMENT STRUCTURE, DISPLAY PANEL, AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/190147 | HALF-VIA-HOLE STRUCTURE AND MANUFACTURING METHOD THEREFOR, ARRAY SUBSTRATE, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/155783 | ARRAY SUBSTRATE, ELECTRONIC DEVICE SUBSTRATE AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/190151 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/196867 | OLED DISPLAY PANEL AND PREPARATION METHOD, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/196868 | DISPLAY SUBSTRATE AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/190162 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/190163 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/196877 | ARRAY SUBSTRATE, DISPLAY PANEL, DISPLAY DEVICE AND MANUFACTURING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/190164 | DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/155801 | OLED DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/179859 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. |
| WO/2021/155813 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164569 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164581 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164582 | DISPLAY PANEL, DISPLAY METHOD, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR ORGANIC LIGHT-EMITTING SUB PIXEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164583 | BACKBOARD AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164599 | ORGANIC ELECTROLUMINESCENT DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164602 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169786 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/196898 | DISPLAY SUBSTRATE, CHIP-ON-FILM, DISPLAY DEVICE AND FABRICATION METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164617 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227581 | DISPLAY SUBSTRATE, DISPLAY PANEL, DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164639 | DISPLAY APPARATUS AND PREPARATION METHOD FOR DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164645 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/212979 | IMAGE SENSOR, PHOTOGRAPHING APPARATUS, AND ELECTRONIC DEVICE | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/160130 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/164699 | PIXEL DRIVING CIRCUIT AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169833 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164710 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164719 | LIGHT-EMITTING DEVICE, LIGHT-EMITTING METHOD, SPECTROPHOTOMETER, AND SPECTRUM MEASUREMENT METHOD | TING, Yi-Sheng |
| WO/2021/175120 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND VISIBLE LIGHT COMMUNICATION APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/164766 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/169882 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/185025 | PHOTODETECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND PHOTODETECTION DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/175130 | RAPID POWER MODULE AND POWER MODULE | SHENZHEN YITONG POWER ELECTRONICS CO., LTD. |
| WO/2021/253860 | METHOD, SYSTEM AND DEVICE FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND COMPUTER STORAGE MEDIUM | SUZHOU INSPUR INTELLIGENT TECHNOLOGY CO., LTD. |
| WO/2021/196919 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/175136 | SEMICONDUCTOR APPARATUS INCLUDING CAPACITOR AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/185037 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/170006 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/170042 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/190239 | LEAD ARRANGEMENT STRUCTURE FOR OLED DISPLAY DEVICE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/185045 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/170079 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/213009 | DISPLAY PANEL, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/175189 | ARRAY SUBSTRATE, FABRICATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/185062 | SEMICONDUCTOR STRUCTURE AND FORMATION METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218371 | GROUP-III NITRIDE SEMICONDUCTOR INTEGRATED CIRCUIT STRUCTURE, MANUFACTURING METHOD, AND APPLICATION THEREOF | GUANGDONG ZHINENG TECHNOLOGY CO., LTD. |
| WO/2021/218372 | DRIVING CIRCUIT, DRIVING IC, AND DRIVING SYSTEM | GUANGDONG ZHINENG TECHNOLOGY CO., LTD. |
| WO/2021/208629 | METHOD FOR FABRICATING ASYMMETRICAL BOARD | SHENZHEN KINWONG ELECTRONIC CO., LTD. |
| WO/2021/196972 | CIRCUIT BOARD ASSEMBLY, RADAR DEVICE AND METHOD FOR FABRICATING CIRCUIT BOARD ASSEMBLY | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/175312 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/175320 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/232893 | CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | INTELLIMICRO MEDICAL CO., LTD. |
| WO/2021/190285 | DISPLAY SUBSTRATE, DISPLAY SUBSTRATE MOTHERBOARD AND MANUFCTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/190286 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/213024 | ELECTROSTATIC PROTECTION CIRCUIT | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/213030 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/190293 | BIT LINE STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218395 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/203893 | DISPLAY MODULE AND FIXING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227623 | PIXEL UNIT, DISPLAY SUBSTRATE, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/213041 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/196999 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/203898 | ANTI-FUSE UNIT | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218417 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218418 | DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/213049 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/213051 | CIRCUIT BOARD AND METHOD FOR PREPARING SAME, AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218425 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218428 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/203908 | ANTIFUSE UNIT AND ANTIFUSE ARRAY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218437 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218438 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218444 | PRINTED CIRCUIT BOARD ASSEMBLY, ELECTRONIC DEVICE, AND METHOD FOR PROCESSING PRINTED CIRCUIT BOARD ASSEMBLY | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/218447 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/180214 | LIGHT DETECTION SUBSTRATE AND PREPARATION METHOD THEREFOR, AND LIGHT DETECTION DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/197039 | MEMORY AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/203915 | CAPACITOR ARRAY STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR STORAGE DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/238343 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/203917 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/185237 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/185289 | MICRO LIGHT EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/197079 | DISPLAY COMPONENT, DISPLAY DEVICE, AND DRIVING METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/232916 | SEMICONDUCTOR APPARATUS OF STAGGERED STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC EQUIPMENT | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| WO/2021/208665 | DISPLAY PANEL AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/238360 | DISPLAY PANEL AND DISPLAY DEVICE | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/223525 | DISPLAY PANEL, DISPLAY SCREEN, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/227659 | SUPERCONDUCTING INTEGRATED CIRCUIT DESIGN METHOD BASED ON DIFFERENT-LAYER JTL PLACEMENT AND ROUTING | SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY CHINESE ACADEMY OF SCIENCES |
| WO/2021/190491 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND ELECTRONIC DEVICE | VIVO MOBILE COMMUNICATION CO., LTD. |
| WO/2021/190508 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227672 | DISPLAY SUBSTRATE, PREPARATION METHOD AND BRIGHTNESS COMPENSATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/208691 | DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/197188 | LED DISPLAY UNIT GROUP AND DISPLAY PANEL | FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/232935 | ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY APPARATUS | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/213129 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/213130 | FORMING METHOD FOR MEMORY AND MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/223541 | DISPLAY PANEL, DISPLAY APPARATUS, AND METHOD FOR MANUFACTURING DISPLAY PANEL | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/208707 | FLEXIBLE CIRCUIT BOARD ASSEMBLY, DISPLAY ASSEMBLY AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/213162 | TERMINAL DEVICE AND DISPLAY PANEL THEREOF | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/204071 | TERMINAL CONNECTION STRUCTURE, DISPLAY UNIT, AND DISPLAY | BEIJING IVISUAL 3D TECHNOLOGY CO., LTD. |
| WO/2021/218569 | ARRAY SUBSTRATE AND FABRICATION METHOD THEREFOR, SHIFT REGISTER UNIT, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218571 | CIRCUIT BOARD STRUCTURE, DISPLAY PANEL, DISPLAY APPARATUS, AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/204093 | DISPLAY SCREEN AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/204100 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/204114 | FLEXIBLE DISPLAY PANEL, DISPLAY MODULE AND MOBILE TERMINAL | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/227710 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/232984 | DISPLAY PANEL, DRIVING METHOD AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238428 | DISPLAY PANEL, DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/208810 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238431 | ARRAY SUBSTRATE, PREPARATION METHOD, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/223566 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238443 | DISPLAY MODULE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/208824 | LIGHT EMITTING DIODE STRUCTURE HAVING RESONANT CAVITY AND METHOD FOR MANUFACTURING THE SAME | RAYSOLVE OPTOELECTRONICS (SUZHOU) CO. LTD. |
| WO/2021/208833 | MEMORY STRUCTURE AND FORMATION METHOD FOR MEMORY STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/204289 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/204290 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SEMICONDUCTOR DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218606 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR, MEMORY AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218607 | SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREFOR, AND MEMORY AND FORMATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233002 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227744 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238463 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238464 | DISPLAY PANEL AND CRACK DETECTION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238465 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218625 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218629 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238472 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/208944 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249015 | DISPLAY APPARATUS AND ELECTRONIC DEVICE | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/208967 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | VIVO MOBILE COMMUNICATION CO.,LTD. |
| WO/2021/208974 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | VIVO MOBILE COMMUNICATION CO.,LTD. |
| WO/2021/249016 | DISPLAY DEVICE, PROCESSING METHOD THEREFOR, AND ELECTRONIC DEVICE | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/227758 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227759 | DISPLAY PANEL, FABRICATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227760 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227761 | DISPLAY PANEL, FABRICATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238481 | OLED DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238482 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238484 | DISPLAY SUBSTRATE, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238486 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227765 | TOTAL REFLECTION TYPE DISPLAY SUBSTRATE AND PRODUCING METHOD THEREFOR, AND TOTAL REFLECTION TYPE DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238489 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238490 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/213283 | CIRCUIT BOARD AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258827 | TOUCH MODULE, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/218691 | DISPLAY PANEL, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258828 | THIN FILM TRANSISTOR ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE | KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD |
| WO/2021/227794 | TRANSPARENT DISPLAY PANEL AND METHOD FOR PREPARING SAME, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238507 | DISPLAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/253971 | PHOTOSENSITIVE PIXEL MODULE, IMAGE SENSOR, AND ELECTRONIC DEVICE | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. |
| WO/2021/213439 | DISPLAY DEVICE, AND DISPLAY PANEL AND FABRICATING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238512 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238517 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238519 | DISPLAY SCREEN, METHOD FOR MANUFACTURING DISPLAY SCREEN, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/238525 | DISPLAY SUBSTRATE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY SUBSTRATE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/227824 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/233070 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/223608 | DISPLAY MODULE AND DISPLAY PANEL | BEIJING IVISUAL 3D TECHNOLOGY CO., LTD. |
| WO/2021/218881 | SEMICONDUCTOR STRUCTURE, METHOD FOR FORMING SAME, AND MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218882 | SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREFOR AND MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233083 | LOW-POWER-CONSUMPTION BIDIRECTIONAL SCR DEVICE FOR ESD PROTECTION, AND ELECTROSTATIC PROTECTION CIRCUIT | SHENZHEN JINGYANG ELECTRONICS CO., LTD |
| WO/2021/233087 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/238549 | DISPLAY PANEL, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258849 | DISPLAY PANEL AND DISPLAY DEVICE | YUNGU (GU'AN) TECHNOLOGY CO., LTD. |
| WO/2021/219069 | STACKED STRUCTURE, DISPLAY SCREEN AND DISPLAY DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/227889 | THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/233113 | POWER MODULE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/227977 | PRINTED CIRCUIT BOARD | ZTE CORPORATION |
| WO/2021/227996 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244228 | DISPLAY PANEL, DISPLAY DEVICE, AND MANUFACTURING METHOD FOR DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254030 | SEMICONDUCTOR COMPONENT, CAPACITOR DEVICE, AND MANUFACTURING METHOD FOR CAPACITOR DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/238645 | SUBSTRATE FOR DISPLAY, PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244241 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254033 | FLEXIBLE DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254036 | DISPLAY SUBSTRATE AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258884 | DETECTION SUBSTRATE AND RAY DETECTOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244245 | FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND RELATED DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254037 | DETECTION SUBSTRATE AND RAY DETECTOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238658 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244248 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244251 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258903 | DISPLAY PANEL, CIRCUIT BOARD, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249105 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254049 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254053 | DISPLAY SUBSTRATE, PREPARATION METHOD AND DRIVING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238675 | IGBT CHIP INTEGRATED WITH TEMPERATURE SENSOR | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/228219 | OLED DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND OLED DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/233220 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249113 | REINFORCEMENT BOARD FOR FLEXIBLE PRINTED CIRCUIT, FLEXIBLE PRINTED CIRCUIT ASSEMBLY, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238681 | DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITING DIODE CHIP, DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/233229 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249117 | ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238682 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244266 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258910 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249122 | OLED DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238712 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254064 | MULTILAYER CAPACITOR AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/258918 | ATTACHING APPARATUS AND ATTACHING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249132 | SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233276 | SEMICONDUCTOR STRUCTURE, AND MANUFACTURING METHOD FOR SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233278 | HYBRID-IMAGING DETECTOR STRUCTURE | SHANGHAI IC R&D CENTER CO., LTD. |
| WO/2021/233280 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244279 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238726 | STRETCHABLE DISPLAY PANEL, PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244285 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258927 | DISPLAY SUBSTRATE, DISPLAY PANEL, ELECTRONIC DEVICE, AND DISPLAY METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238731 | FLEXIBLE DISPLAY APPARATUS AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254081 | DISPLAY PANEL, DISPLAY DEVICE AND TERMINAL APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/233382 | DISPLAY PANEL, PREPARATION METHOD THEREFOR, AND SPLICED SCREEN | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/233384 | TRANSPARENT DISPLAY DEVICE, SIMULATION METHOD, AND MANUFACTURING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249149 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244300 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238772 | DISPLAY SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249152 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254088 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249158 | DISPLAY SUBSTRATE, FABRICATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254094 | DISPLAY SUBSTRATE, DISPLAY APPARATUS, AND MASK | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238801 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/233437 | DISPLAY DEVICE | HISENSE VISUAL TECHNOLOGY CO., LTD. |
| WO/2021/238814 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244348 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/254102 | DETECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND RAY DETECTION APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/238926 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244370 | CAPACITOR STRUCTURE, FABRICATION METHOD THEREOF, AND MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/228269 | METHOD FOR PREPARING EMBEDDED WORD LINE STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/239112 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/258996 | DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/239124 | DISPLAY PANEL, PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/239127 | FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244466 | DOUBLE-SIDED CAPACITOR STRUCTURE AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/244530 | CIRCUIT BOARD ASSEMBLY, ASSEMBLING METHOD, AND OPTICAL MODULE | INNOLIGHT TECHNOLOGY (SUZHOU) LTD. |
| WO/2021/259021 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE WITH PRINTED CIRCUIT BOARD | ZTE CORPORATION |
| WO/2021/259030 | PRODUCTION METHOD FOR LIQUID CRYSTAL POLYMER FLEXIBLE COPPER-CLAD LAMINATE | SHENZHEN SUNWAY COMMUNICATION CO., LTD. |
| WO/2021/249274 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249277 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254164 | DISPLAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY SUBSTRATE MANUFACTURING METHOD | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/259036 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/244643 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249312 | DISPLAY PANEL, TRANSPARENT DISPLAY PANEL, AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249345 | FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249397 | CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE | ZTE CORPORATION |
| WO/2021/254217 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254242 | DISPLAY PANEL AND FABRICATING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249497 | DISPLAY PANEL, DISPLAY APPARATUS, AND PREPARATION METHOD FOR DISPLAY PANEL | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/249537 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/259082 | ORGANIC LIGHT-EMITTING DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254297 | OLED DISPLAY PANEL MANUFACTURING METHOD AND DISPLAY PANEL, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254315 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254317 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/254319 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/259241 | SILICON-BASED ORGANIC ELECTROLUMINESCENT DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/259248 | ULTRASONIC FINGERPRINT RECOGNITION SENSOR AND MANUFACTURING METHOD THEREFOR, AND DISPLAY MODULE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/259311 | ARRAY SUBSTRATE AND FABRICATION METHOD THEREFOR, DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/259356 | CHIP STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/052532 | OLED-WAVEGUIDE ASSEMBLY AND PRODUCTION METHOD THERFOR | CHRISTIAN-ALBRECHTS-UNIVERSITÄT ZU KIEL |
| WO/2021/083454 | INSULATING UNIT FOR CIRCUIT BOARD | HARTING ELECTRIC GMBH & CO. KG |
| WO/2021/083462 | PHOTOVOLTAIC ELEMENT WITH IMPROVED EFFICIENCY IN THE EVENT OF SHADE, AND METHOD FOR PRODUCING SUCH A PHOTOVOLTAIC ELEMENT | HELIATEK GMBH |
| WO/2021/190690 | METHOD FOR PRODUCING CONDUCTOR TRACK STRUCTURES ON A NON-CONDUCTIVE CARRIER SUBSTRATE | LPKF LASER & ELECTRONICS AKTIENGESELLSCHAFT |
| WO/2021/170194 | AIR TRANSPORT UNIT | LED Ibond International A/S |
| WO/2021/013333 | ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPONDING METHOD FOR LASER TREATING AN ELECTRICAL CONNECTION PAD | TECHNISCHE HOCHSCHULE ASCHAFFENBURG |
| WO/2021/037371 | OPTOELECTRONIC DEVICE WITH LIGHT EMITTER AND DETECTOR AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC DEVICE | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/047754 | FABRICATION METHOD | MICROSOFT TECHNOLOGY LICENSING LLC |
| WO/2021/069061 | ASSEMBLY COMPRISING A CIRCUIT CARRIER AND A HEAT SINK | HELLA GMBH & CO. KGAA |
| WO/2021/110274 | SEMICONDUCTOR-FERROMAGNETIC INSULATOR-SUPERCONDUCTOR HYBRID DEVICES | MICROSOFT TECHNOLOGY LICENSING LLC |
| WO/2021/197573 | METHOD OF FABRICATING GATES | MICROSOFT TECHNOLOGY LICENSING LLC |
| WO/2021/197590 | SIDE-GATED SEMICONDUDUCTOR-SUPERCONDUCTOR HYBRID DEVICES | MICROSOFT TECHNOLOGY LICENSING LLC |
| WO/2021/013396 | PRINTED CIRCUIT BOARD UNIT AND ELECTRONIC MODULE FOR A CONTROL DEVICE | ROBERT BOSCH GMBH |
| WO/2021/004751 | METHOD FOR REMOVING A COMPONENT APPLIED TO A PRINTED CIRCUIT BOARD | ENDRESS+HAUSER SE+CO. KG |
| WO/2021/001167 | METHOD FOR PRODUCING CIRCUIT BOARDS AND CIRCUIT BOARDS PRODUCED ACCORDING TO THE METHOD | GEBR. SCHMID GMBH |
| WO/2021/259477 | SEMICONDUCTOR DIE ASSEMBLY AND METHOD OF STACKING SEMICONDUCTOR COMPONENTS | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/013463 | SEMICONDUCTOR LIGHT-EMITTING DEVICE | LUMILEDS HOLDING B.V. |
| WO/2021/004906 | PROCESS FOR PRODUCING FLEXIBLE OLED SCREENS | AIRBUS OPERATIONS GMBH |
| WO/2021/005052 | LIGHT-EMITTING DEVICE | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/008965 | SECURE ELECTRONIC CIRCUIT AND CORRESPONDING ASSEMBLY PROCESS | BANKS AND ACQUIRERS INTERNATIONAL HOLDING |
| WO/2021/005121 | ASSEMBLY OF ELECTRONIC SEMICONDUCTOR COMPONENTS AND METHOD FOR OPERATING AN ASSEMBLY OF ELECTRONIC SEMICONDUCTOR COMPONENTS | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/008980 | IMAGE SENSOR | ISORG |
| WO/2021/013641 | LED ARRAYS | THE UNIVERSITY OF SHEFFIELD |
| WO/2021/013666 | IMAGE SENSOR PIXEL | ISORG |
| WO/2021/013667 | IMAGE SENSOR PIXEL | ISORG |
| WO/2021/013668 | IMAGE SENSOR PIXEL | ISORG |
| WO/2021/018726 | SENSOR UNIT | LEICA CAMERA AG |
| WO/2021/043501 | A PIXEL MODULE, A LIGHT EMITTING DEVICE AND A METHOD FOR PRODUCING A PIXEL MODULE | CONTINENTAL AUTOMOTIVE GMBH |
| WO/2021/013961 | HOUSING ELEMENT FOR A HOUSING OF A POWER SEMICONDUCTOR MODULE | ABB POWER GRIDS SWITZERLAND AG |
| WO/2021/018885 | CIRCUIT BOARD ASSEMBLY | LEONARDO MW LIMITED |
| WO/2021/018957 | POWER SEMICONDUCTOR DEVICE | ABB POWER GRIDS SWITZERLAND AG |
| WO/2021/023620 | LIGHT-EMITTING WINDOW ELEMENT AND MOTOR VEHICLE COMPRISING A LIGHT-EMITTING WINDOW ELEMENT | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/058185 | SUPPORT FOR ELECTRICAL COMPONENTS AND ELECTRONICS MODULE | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/028320 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/032507 | RADIATION DETECTOR | FREIE UNIVERSITÄT BERLIN |
| WO/2021/028396 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/063587 | PROCESS FOR PRODUCING FLEXIBLE OLED SCREENS AND FLEXIBLE OLED SCREENS | AIRBUS OPERATIONS GMBH |
| WO/2021/032775 | MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARDS AND A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD | ATOTECH DEUTSCHLAND GMBH |
| WO/2021/032776 | METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER | ATOTECH DEUTSCHLAND GMBH |
| WO/2021/037772 | A PHOTOVOLTAIC DEVICE AND A METHOD FOR PREPARATION THEREOF | SAULE S.A. |
| WO/2021/037773 | A TRANSLUCENT PHOTOVOLTAIC DEVICE AND A METHOD FOR MANUFACTURING THEREOF | SAULE SPOLKA AKCYJNA |
| WO/2021/043707 | DISPLAY-SCREEN PIXEL | ISORG |
| WO/2021/043727 | ASSEMBLY COMPRISING A CARD, AN ELECTRICAL COMPONENT AND AN ELECTRICAL CONNECTOR | VALEO SIEMENS EAUTOMOTIVE FRANCE SAS |
| WO/2021/043745 | LIGHT EMITTING DIODE AND METHOD OF FORMING A LIGHT EMITTING DIODE | PLESSEY SEMICONDUCTORS LIMITED |
| WO/2021/043748 | LED PRECURSOR INCORPORATING STRAIN RELAXING STRUCTURE | PLESSEY SEMICONDUCTORS LIMITED |
| WO/2021/047955 | CONTROL UNIT FOR A MOTOR VEHICLE AND METHOD FOR PRODUCING AND MEASURING THE TIGHTNESS OF A CONTROL UNIT | VITESCO TECHNOLOGIES GERMANY GMBH |
| WO/2021/047957 | CONTROL DEVICE FOR A MOTOR VEHICLE | VITESCO TECHNOLOGIES GERMANY GMBH |
| WO/2021/047958 | TRANSMISSION CONTROL UNIT, MOTOR VEHICLE AND METHOD FOR OVERMOULDING A CIRCUIT BOARD OF A TRANSMISSION CONTROL UNIT | VITESCO TECHNOLOGIES GERMANY GMBH |
| WO/2021/052795 | POWER ELECTRONICS UNIT COMPRISING A CIRCUIT BOARD AND A POWER MODULE, METHOD FOR PRODUCING A POWER ELECTRONICS UNIT, MOTOR VEHICLE COMPRISING A POWER ELECTRONICS UNIT | AUDI AG |
| WO/2021/048261 | CURRENT CONVERTER FOR A VEHICLE | INTERPLEX NAS ELECTRONICS GMBH |
| WO/2021/052912 | METHOD FOR MANUFACTURING A BACKSIDE ILLUMINATION OPTICAL SENSOR WITH IMPROVED DETECTION PARAMETERS | LFOUNDRY SRL |
| WO/2021/052938 | METHOD FOR OPERATING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/069288 | METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE | ALEDIA |
| WO/2021/073966 | CIRCUIT SUBSTRATE FOR A SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE | VITESCO TECHNOLOGIES GMBH |
| WO/2021/073981 | METHOD FOR PROTECTING AN OPTOELECTRONIC DEVICE FROM ELECTROSTATIC DISCHARGES | ALEDIA |
| WO/2021/074009 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING SUCH A COMPONENT | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/069631 | PRINTABLE ELECTRICAL COMPONENT COMPRISING A PLASTIC SUBSTRATE | FRESENIUS MEDICAL CARE DEUTSCHLAND GMBH |
| WO/2021/089277 | METHOD FOR PROTECTING AN OPTOELECTRONIC DEVICE AGAINST ELECTROSTATIC DISCHARGES | ALEDIA |
| WO/2021/078643 | METHOD FOR PRODUCING OLEDS STACKED ONE ABOVE THE OTHER | APEVA SE |
| WO/2021/078647 | ELECTRONIC CARD COMPRISING A FIRST GROUND PLANE AND A SECOND GROUND PLANE | SAFRAN ELECTRONICS & DEFENSE |
| WO/2021/078699 | ELECTRONIC SWITCHING DEVICE | MERCK PATENT GMBH |
| WO/2021/083757 | METHOD AND DEVICE FOR PRODUCING AN ELECTRONICS MODULE | ROBERT BOSCH GMBH |
| WO/2021/089330 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/084049 | AN OPTOELECTRONIC DEVICE | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/110333 | OPTOELECTRONIC DEVICE | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/110334 | APPARATUS COMPRISING A CARRIER WITH OPTOELECTRONIC ELEMENTS AND METHOD FOR MANUFACTURING THE APPARATUS | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/094124 | AN LED FILAMENT LAMP AND A METHOD OF PRODUCING A SPIRAL LED FILAMENT | SIGNIFY HOLDING B.V. |
| WO/2021/094313 | MAJORANA FERMION QUANTUM COMPUTING DEVICES WITH CHARGE SENSING FABRICATED WITH ION IMPLANT METHODS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/094315 | TWO-SIDED MAJORANA FERMION QUANTUM COMPUTING DEVICES FABRICATED WITH ION IMPLANT METHODS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/094320 | ADHESION LAYER TO ENHANCE ENCAPSULATION OF SUPERCONDUCTING DEVICES | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/115710 | ELECTRONIC ASSEMBLY | IMS CONNECTOR SYSTEMS GMBH |
| WO/2021/099222 | ION IMPLANT DEFINED NANOROD IN A SUSPENDED MAJORANA FERMION DEVICE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/099435 | METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/099477 | METHOD FOR MANUFACTURING A DETECTION DEVICE HAVING IMPROVED GETTER PROTECTION | COMMISSARIAT à L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| WO/2021/105090 | ASSEMBLY COMPRISING A SUPPORT, AN SMD COMPONENT AND A CONTACT ELEMENT, AND CORRESPONDING CONTACT ELEMENT | PHOENIX CONTACT GMBH & CO. KG |
| WO/2021/105453 | COMPONENT FOR A DISPLAY, AND METHOD FOR PRODUCING A COMPONENT | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/110580 | OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/115934 | METHOD OF FORMING A MONOLITHIC LIGHT EMITTING DIODE PRECURSOR | PLESSEY SEMICONDUCTORS LIMITED |
| WO/2021/115991 | A SWITCH DEVICE FACILITATING FREQUENCY SHIFT OF A RESONATOR IN A QUANTUM DEVICE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/144067 | PRINTED CIRCUIT BOARD AND FABRICATION THEREOF | DELPHI TECHNOLOGIES IP LIMITED |
| WO/2021/116192 | POWER SEMICONDUCTOR MODULE WITH TERMINAL BLOCK | ABB POWER GRIDS SWITZERLAND AG |
| WO/2021/116232 | IMAGE SENSOR FOR CORRECTING THE ELECTRONIC NOISE OF A SENSOR | ISORG |
| WO/2021/116286 | SOLID-STATE DEVICE | BROLIS SENSOR TECHNOLOGY, UAB |
| WO/2021/144085 | DECOUPLING OF A PEROVSKITE SOLAR CELL IN DARKNESS | SIEMENS ENERGY GLOBAL GMBH & CO. KG |
| WO/2021/122358 | ELEMENTARY CELL COMPRISING A RESISTIVE MEMORY AND A DEVICE INTENDED TO FORM A SELECTOR, CELL MATRIX, ASSOCIATED MANUFACTURING AND INITIALIZATION METHODS | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| WO/2021/122428 | CIRCUIT BOARD HAVING A SURFACE-MOUNTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAID CIRCUIT BOARD | ZKW GROUP GMBH |
| WO/2021/130073 | MICRO-LED DISPLAY EMITTING THROUGH THE ACTIVE MATRIX | THALES |
| WO/2021/122710 | COLOUR DISPLAY DEVICE COMPRISING A MOSAIC OF TILES OF LIGHT-EMITTING MICRO-DIODES | THALES |
| WO/2021/122723 | SUBSTRATE AND METHOD FOR MONOLITHIC INTEGRATION OF ELECTRONIC AND OPTOELECTRONIC DEVICES | IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FüR INNOVATIVE MIKROELEKTRONIK |
| WO/2021/122781 | LIGHT UNIT FOR A LIGHTING AND/OR SIGNALLING DEVICE FOR A MOTOR VEHICLE | VALEO VISION |
| WO/2021/148251 | SUPERCONDUCTING QUBIT CAPACITANCE AND FREQUENCY OF OPERATION TUNING | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/144188 | DISPLAY TRANSMISSION OPTIMIZATION | AMS INTERNATIONAL AG |
| WO/2021/148282 | RADIATION-EMITTING COMPONENT HAVING A CONVERTER LAYER AND METHOD FOR PRODUCING A RADIATION-EMITTING COMPONENT HAVING A CONVERTER LAYER | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/219254 | ELECTRONIC COMPONENT WITH CONTACT SURFACES | TDK ELECTRONICS AG |
| WO/2021/148484 | LED CHIP INSERT, ILLUMINATION DEVICE, LIGHTING MODULE AND METHOD FOR PRODUCING THE ILLUMINATION DEVICE | OSRAM GMBH |
| WO/2021/148603 | A SEMICONDUCTOR PHOTOMULTIPLIER MODULE COMPRISING A STACKED CONFIGURATION OF A SENSOR CHIP AND ELECTRONIC READOUT CHIPS | MAX-PLANCK-GESELLSCHAFT ZUR FÖRDERUNG DER WISSENSCHAFTEN E.V. |
| WO/2021/156207 | LED-BASED DEVICE | SIGNIFY HOLDING B.V. |
| WO/2021/175529 | FLUX BIAS LINE LOCAL HEATING DEVICE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/175530 | FABRICATION OF A FLUX BIAS LINE LOCAL HEATING DEVICE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/160503 | CERAMIC CARRIER SUBSTRATE AND POWER MODULE | ROBERT BOSCH GMBH |
| WO/2021/165047 | RADIATION-EMITTING DEVICE AND METHOD FOR PRODUCING A RADIATION-EMITTING DEVICE | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/160511 | CIRCUIT CARRIER HAVING A THERMALLY CONDUCTIVE PRINTED METAL INLAY | ROBERT BOSCH GMBH |
| WO/2021/156377 | DEVICE COMPRISING A SET OF JOSEPHSON JUNCTIONS, SYSTEM COMPRISING SUCH A DEVICE AND METHOD FOR USING SUCH A DEVICE | THALES |
| WO/2021/160596 | OPTOELECTRONIC DEVICE, AND METHOD | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/165101 | OPTOELECTRONIC COMPONENT, AND METHOD FOR VARYING THE CONTRAST BETWEEN EMITTERS | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/170407 | METHOD FOR PRODUCING AN ELECTRIC ASSEMBLY | SIEMENS MOBILITY GMBH |
| WO/2021/185515 | METHOD FOR FINELY STRUCTURING METAL-CONTAINING LAYERS, AND CERAMIC MULTILAYER COMPONENT | TDK ELECTRONICS AG |
| WO/2021/170562 | SUBSTRATE AND SEMICONDUCTOR LASER | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/170708 | MULTIPLE RESOLUTION DISPLAY SCREEN AND METHOD FOR PRODUCING SAME | ALEDIA |
| WO/2021/197722 | ELECTRIC SOLDER CONNECTION, SENSOR COMPRISING A SOLDER CONNECTION, AND PRODUCTION METHOD | TDK ELECTRONICS AG |
| WO/2021/180552 | PRINTED CIRCUIT BOARD ASSEMBLY | VITESCO TECHNOLOGIES GMBH |
| WO/2021/180917 | FLEXIBLE PRINTED CIRCUIT BOARD HAVING A BATTERY MOUNTED THERETO | ASCENSIA DIABETES CARE HOLDINGS AG |
| WO/2021/185989 | DEVICE AND METHOD FOR INHIBITING A SUBSTRATE CURRENT IN AN IC SEMICONDUCTOR SUBSTRATE | ELMOS SEMICONDUCTOR SE |
| WO/2021/197982 | VEHICLE, A MAIN FRAME, A MODULE POCKET, AN ELECTRONIC MODULE, AND A PRINTED CIRCUIT BOARD | VOLKSWAGEN AKTIENGESELLSCHAFT |
| WO/2021/213773 | METHOD FOR PRODUCING A MICROELECTRONIC DEVICE | ROBERT BOSCH GMBH |
| WO/2021/198003 | MONOLITHIC LED PIXEL | PLESSEY SEMICONDUCTORS LIMITED |
| WO/2021/204580 | METHOD FOR MANUFACTURING A SeOI INTEGRATED CIRCUIT CHIP | SOITEC |
| WO/2021/198317 | PREVENTING LIQUID INGRESS IN A DEVICE | KONINKLIJKE PHILIPS N.V. |
| WO/2021/204897 | SUPERCONDUCTING MICROWAVE FILTERS AND FILTER ELEMENTS FOR QUANTUM DEVICES | TECHNISCHE UNIVERSITEIT DELFT |
| WO/2021/209605 | PBC-LESS LIGHT EMITTING UNIT AND METHOD FOR MANUFACTURING THEREOF | VALOYA OY |
| WO/2021/219503 | SUPPORT SUBSTRATE AND METHOD FOR PRODUCING A SUPPORT SUBSTRATE | ROGERS GERMANY GMBH |
| WO/2021/219538 | ASSEMBLY WITH AN ELECTRONIC COMPONENT WHICH IS ARRANGED ON A PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUCH AN ASSEMBLY | VITESCO TECHNOLOGIES GMBH |
| WO/2021/219603 | TUNEABLE SUB-PIXEL | PLESSEY SEMICONDUCTORS LIMITED |
| WO/2021/219685 | SUPPORT SUBSTRATE AND METHOD FOR PRODUCING A SUPPORT SUBSTRATE | ROGERS GERMANY GMBH |
| WO/2021/219688 | SUPPORT SUBSTRATE, METHOD FOR PRODUCING SUCH A SUPPORT SUBSTRATE, AND METHOD FOR READING A CODING IN THE SUPPORT SUBSTRATE | ROGERS GERMANY GMBH |
| WO/2021/219744 | METHOD FOR FABRICATING 3D NAND USING A NICKEL OR COBALT ALLOY | AVENI |
| WO/2021/219800 | BARRIER FOR PREVENTING SMT COMPONENTS FROM DRIFTING | ZKW GROUP GMBH |
| WO/2021/249694 | MECHANICAL CONTACT COMPONENT FOR A CONTACT BLADE OF A PRINTED CIRCUIT WITH A STATOR WINDING OF A FAN DEVICE MOTOR FOR A HEATING, VENTILATION AND/OR AIR-CONDITIONING INSTALLATION OF A MOTOR VEHICLE AND MANUFACTURING METHOD | VALEO SYSTEMES THERMIQUES |
| WO/2021/224204 | METHOD FOR PRODUCING A CIRCUIT BOARD, AND CIRCUIT BOARD COMPRISING AT LEAST ONE EMBEDDED ELECTRONIC COMPONENT | UNIMICRON GERMANY GMBH |
| WO/2021/233917 | LIGHT EMITTING DEVICE ARRAY | PLESSEY SEMICONDUCTORS LIMITED |
| WO/2021/234158 | POWER CONVERTER ASSEMBLY | DANMARKS TEKNISKE UNIVERSITET |
| WO/2021/239765 | TOPOGRAPHY-BASED DEPOSITION HEIGHT ADJUSTMENT | MYCRONIC AB |
| WO/2021/244960 | ELECTRONIC CIRCUIT WITH ISOLATION | SIGNIFY HOLDING B.V. |
| WO/2021/244967 | ENHANCED COLOUR CONVERSION AND COLLIMATION OF MICRO-LED DEVICES | PLESSEY SEMICONDUCTORS LIMITED |
| WO/2021/259607 | WAFER BONDING | NANOWIRED GMBH |
| WO/2021/250063 | CIRCUIT BOARD HAVING AN EMBEDDED SEMICONDUCTOR COMPONENT, AND METHOD FOR PRODUCING A CIRCUIT BOARD | VITESCO TECHNOLOGIES GERMANY GMBH |
| WO/2021/259766 | SUPERCONDUCTING QUBIT LIFETIME AND COHERENCE IMPROVEMENT VIA SUBSTRATE BACKSIDE ETCHING | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/255203 | SYSTEM AND METHOD FOR CONNECTING DISPLAY PANELS | BARCO N.V. |
| WO/2021/259827 | MULTILAYER ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME | H.GLASS SA |
| WO/2021/259932 | PHOTODIODE DEVICE WITH IMPROVED DARK CURRENT | AMS AG |
| WO/2021/260084 | PHOTOVOLTAIC TOP MODULE | EVOLAR AB |
| WO/2021/116532 | A FORMED FILM AND A MANUFACTURING METHOD THEREOF | CANATU OY |
| WO/2021/130408 | INTEGRATED FUNCTIONAL MULTILAYER STRUCTURE AND METHOD OF MANUFACTURE THEREFOR | TACTOTEK OY |
| WO/2021/224548 | A METHOD FOR MANUFACTURING AN ELECTRONIC APPARATUS AND AN ELECTRONIC APPARATUS | TEKNOLOGIAN TUTKIMUSKESKUS VTT OY |
| WO/2021/229142 | CONNECTING STRUCTURES FOR INCLUSION IN INTEGRATED MULTILAYER STRUCTURES | TACTOTEK OY |
| WO/2021/234222 | METHOD OF MANUFACTURE OF A STRUCTURE AND STRUCTURE | TACTOTEK OY |
| WO/2021/260270 | ELECTRONIC DEVICE AND METHOD FOR FORMING ELECTRONIC DEVICE | EPEC OY |
| WO/2021/005278 | DEVICE FOR CONNECTING A SMART CARD TO A TEXTILE AND METHOD FOR MANUFACTURING ELECTRONIC CARDS IN A FLEXIBLE SMART CARD FORMAT | LINXENS HOLDING |
| WO/2021/009426 | OPTOELECTRONIC DEVICE IN WHICH THE PIXELS CONTAIN LIGHT-EMITTING DIODES THAT EMIT SEVERAL COLORS AND MANUFACTURING METHOD | ALEDIA |
| WO/2021/009458 | OPTOELECTRONIC DEVICE COMPRISING MULTICOLOUR LIGHT-EMITTING DIODES AND MANUFACTURING PROCESS THEREFOR | ALEDIA |
| WO/2021/144534 | METHOD FOR MANUFACTURING AN IMAGE SENSOR | SOITEC |
| WO/2021/198625 | ELECTRONIC CIRCUIT | SAFRAN VENTILATION SYSTEMS |
| WO/2021/245342 | OPTOELECTRONIC DEVICE FOR LIGHT-EMITTING DISPLAY AND CORRESPONDING MANUFACTURING METHOD | ALEDIA |
| WO/2021/245343 | ELECTRONIC DEVICE FOR CAPTURING OR EMITTING A PHYSICAL QUANTITY AND METHOD FOR PRODUCING SAME | ALEDIA |
| WO/2021/245344 | OPTOELECTRONIC DEVICE FOR LIGHT-EMITTING DISPLAY WITH CONDUCTIVE LIGHT-EMITTING CONFINEMENT WALLS AND CORRESPONDING MANUFACTURING METHOD | ALEDIA |
| WO/2021/089974 | CIRCUIT BOARD ASSEMBLY COMPRISING CHEMICAL VAPOR DEPOSITION DIAMOND (CVDD) WIRES FOR THERMAL TRANSPORT | MICROCHIP TECHNOLOGY CALDICOT LIMITED |
| WO/2021/032977 | ELECTRONIC CIRCUITS AND CIRCUIT ELEMENTS | PRAGMATIC PRINTING LTD. |
| WO/2021/032978 | ELECTRONIC CIRCUIT COMPRISING TRANSISTOR AND RESISTOR | PRAGMATIC PRINTING LTD. |
| WO/2021/032980 | RESISTORS FOR INTEGRATED CIRCUITS | PRAGMATIC PRINTING LTD. |
| WO/2021/048537 | ELECTRODE ARRANGEMENT, TEXTILE, GARMENT AND METHOD | PREVAYL LIMITED |
| WO/2021/140310 | SUBSTRATE COMPRISING A THROUGH-HOLE VIA AND MANUFACTURING METHOD | CANTOR TECHNOLOGIES LTD. |
| WO/2021/148781 | ELECTRONICS MODULE COMPRISING A PRINTED CIRCUIT BOARD STRUCTURE | PREVAYL LIMITED |
| WO/2021/148803 | MICRO-LED AND MANUFACTURING METHOD THEREOF | PORO TECHNOLOGIES LTD |
| WO/2021/161005 | MULTICOLOUR LIGHT EMITTING STRUCTURE | PLESSEY SEMICONDUCTORS LTD |
| WO/2021/171037 | FLEXIBLE DEVICES INCORPORATING ELECTRONICALLY-CONDUCTIVE LAYERS, INCLUDING FLEXIBLE WIRELESS LC SENSORS | THE UNIVERSITY COURT OF THE UNIVERSITY OF EDINBURGH |
| WO/2021/205188 | ELECTRONIC UNIT FOR A GARMENT | KYMIRA LTD. |
| WO/2021/234345 | ARRAY OF LIGHT EMITTING DEVICES WITH REDUCED OPTICAL CROSSTALK | PLESSEY SEMICONDUCTORS LTD |
| WO/2021/234346 | MONOLITHIC RGB MICRO LED DISPLAY | PLESSEY SEMICONDUCTORS LTD |
| WO/2021/245389 | MONOLITHIC LED ARRAY AND A PRECURSOR THERETO | PLESSEY SEMICONDUCTORS LTD |
| WO/2021/123852 | VERTICAL 3D MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | MICRON TECHNOLOGY, INC. |
| WO/2021/214504 | ELECTRONIC CONTROL MODULE | NISSAN MOTOR CO., LTD. |
| WO/2021/048622 | MULTI-COLOR LED PIXEL UNIT AND MICRO-LED DISPLAY PANEL | HONG KONG BEIDA JADE BIRD DISPLAY LIMITED |
| WO/2021/048624 | MULTI-COLOR LED PIXEL UNIT AND MICRO-LED DISPLAY PANEL | HONG KONG BEIDA JADE BIRD DISPLAY LIMITED |
| WO/2021/048625 | MULTI-COLOR LED PIXEL UNIT AND MICRO-LED DISPLAY PANEL | HONG KONG BEIDA JADE BIRD DISPLAY LIMITED |
| WO/2021/064465 | RESISTIVE PCB TRACES FOR IMPROVED STABILITY | KIOXIA CORPORATION |
| WO/2021/240203 | IMPROVED VERTICAL 3D MEMORY DEVICE AND ACCESSING METHOD | MICRON TECHNOLOGY, INC. |
| WO/2021/005442 | PEROVSKITE QUANTUM DOT PAPER FOR LIGHT-EMITTING DEVICE AND METHOD | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| WO/2021/001740 | METHOD AND DEVICE FOR PROTECTING AN INTEGRATED CIRCUIT AGAINST ELECTROSTATIC DISCHARGES | WISEKEY SEMICONDUCTORS |
| WO/2021/024083 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/038383 | MULTILAYERED BOTTOM ELECTRODE FOR MTJ-CONTAINING DEVICES | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/048669 | IMAGING DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/059079 | SEMICONDUCTOR DEVICE, STORAGE DEVICE, AND ELECTRONIC APPARATUS | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/074713 | STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/059092 | METHODS AND DEVICES USING MICROCHANNELS FOR INTERCONNECTIONS | 3M INNOVATIVE PROPERTIES COMPANY |
| WO/2021/074737 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/084353 | STRUCTURE AND METHOD TO FABRICATE RESISTIVE MEMORY WITH VERTICAL PRE-DETERMINED FILAMENT | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/090092 | STORAGE DEVICE, METHOD FOR OPERATING STORAGE DEVICE, INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING SYSTEM AND ELECTRONIC DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/094856 | STACKED VERTICAL TRANSISTOR MEMORY CELL | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/084435 | N-TYPE DOPANTS FOR PHOTOACTIVE REGIONS OF ORGANIC PHOTOVOLTAICS | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| WO/2021/059258 | DOUBLE-SIDED, SINGLE CONDUCTOR LAMINATED SUBSTRATE | GENTHERM INC. |
| WO/2021/105811 | STORAGE DEVICE AND ELECTRONIC DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/111222 | CAPACITORLESS DRAM CELL | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/111266 | RESISTIVE RANDOM ACCESS MEMORY INTEGRATED WITH VERTICAL TRANSPORT FIELD EFFECT TRANSISTORS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/124000 | RESISTIVE RANDOM ACCESS MEMORY CELLS INTEGRATED WITH VERTICAL FIELD EFFECT TRANSISTOR | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/130591 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/124201 | METHOD FOR PRODUCING A CONDUCTIVE PATTERN ON A SUBSTRATE | STORA ENSO OYJ |
| WO/2021/144661 | SEMICONDUCTOR APPARATUS, DRIVING METHOD OF SEMICONDUCTOR APPARATUS, AND ELECTRONIC DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/148895 | LIGHT PROCESSING DEVICE ARRAY AND METHOD FOR MANUFACTURING THEREOF | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| WO/2021/156690 | MTJ STACK CONTAINING TOP MAGNETIC PINNED LAYER HAVING STRONG PERPENDICULAR MAGNETIC ANISOTROPY | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/148987 | LOW PIM COAX TO PCB INTERFACE | TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
| WO/2021/161134 | IMAGING DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/156793 | COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT BOARD | HARTING AG |
| WO/2021/165781 | IMAGING APPARATUS, ELECTRONIC EQUIPMENT, AND MOVING BODY | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/171200 | MULTILAYER CIRCUIT BOARD | 3M INNOVATIVE PROPERTIES COMPANY |
| WO/2021/181188 | RESISTIVE RANDOM ACCESS MEMORY INTEGRATED WITH STACKED VERTICAL TRANSISTORS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/181192 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/176339 | MOLDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | MOLEX, LLC |
| WO/2021/186279 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/198839 | SHORT RANGE INFRARED IMAGING SYSTEMS | NATIONAL RESEARCH COUNCIL OF CANADA |
| WO/2021/198841 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/191860 | CONTACT STRUCTURES IN RC-NETWORK COMPONENTS | MURATA MANUFACTURING CO., LTD. |
| WO/2021/191863 | CONTACT STRUCTURES IN RC-NETWORK COMPONENTS | MURATA MANUFACTURING CO., LTD. |
| WO/2021/255545 | LIGHT-EMITTING DEVICE, LIGHT-EMITTING METHOD, LIGHT DETECTION DEVICE, SPECTRUM DETECTION METHOD, AND LIGHT-EMITTING CORRECTION METHOD | TING, Yi-sheng |
| WO/2021/250512 | LIGHT-EMITTING DEVICE, DISPLAY PANEL, LIGHT-EMITTING APPARATUS, DISPLAY APPARATUS, ELECTRONIC EQUIPMENT, AND ILLUMINATION APPARATUS | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/255570 | SLOPED EPITAXY BURIED CONTACT | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/255594 | PATTERNED ARTICLE INCLUDING METALLIC BODIES | 3M INNOVATIVE PROPERTIES COMPANY |
| WO/2021/260488 | LIGHT EMITTING DEVICE, FUNCTIONAL PANEL, LIGHT EMITTING APPARATUS, DISPLAY DEVICE, ELECTRONIC DEVICE AND LIGHTING DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/260541 | SEMICONDUCTOR STRUCTURE WITH SELECTIVE BOTTOM TERMINAL CONTACTING | MURATA MANUFACTURING CO., LTD. |
| WO/2021/002009 | PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR SAME | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/005683 | CIRCUIT PATTERN CREATING SYSTEM, AND METHOD FOR CREATING CIRCUIT PATTERN | FUJI CORPORATION |
| WO/2021/009816 | SOLID-STATE IMAGING DEVICE | TOWERJAZZ PANASONIC SEMICONDUCTOR CO., LTD. |
| WO/2021/009854 | THREE-DIMENSIONAL MOLDING MACHINE AND COMPONENT MOUNTING MACHINE | FUJI CORPORATION |
| WO/2021/009856 | SEMICONDUCTOR DEVICE | KABUSHIKI KAISHA TOSHIBA |
| WO/2021/009857 | SEMICONDUCTOR DEVICE | KABUSHIKI KAISHA TOSHIBA |
| WO/2021/009865 | HIGH-DENSITY MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME | MEIKO ELECTRONICS CO., LTD. |
| WO/2021/009920 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR MODULE MOUNTING BODY | ULTRAMEMORY INC. |
| WO/2021/019613 | SEMICONDUCTOR UNIT AND SEMICONDUCTOR DEVICE | KABUSHIKI KAISHA TOSHIBA |
| WO/2021/019675 | ELECTRONIC CIRCUIT PRODUCTION METHOD USING 3D LAYER SHAPING | FUJI CORPORATION |
| WO/2021/019682 | ELEMENT MODULE | TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION |
| WO/2021/019684 | METHOD FOR MANUFACTURING STACK COMPONENTS | FUJI CORPORATION |
| WO/2021/019707 | METHOD FOR MANUFACTURING CIRCUIT WIRING BY THREE-DIMENSIONAL ADDITIVE MANUFACTURING | FUJI CORPORATION |
| WO/2021/024445 | HEAT DISSIPATION SUBSTRATE AND PRODUCTION METHOD THEREFOR | MEIKO ELECTRONICS CO., LTD. |
| WO/2021/033227 | METHOD FOR BONDING MULTILAYER UNITS | FUJI CORPORATION |
| WO/2021/033228 | METHOD FOR MANUFACTURING 3-DIMENSIONAL STACKED ELECTRONIC DEVICE BY 3-DIMENSIONAL ADDITIVE MANUFACTURING | FUJI CORPORATION |
| WO/2021/033279 | SUBSTRATE WORK MACHINE | FUJI CORPORATION |
| WO/2021/038631 | ELECTRONIC CIRCUIT DEVICE AND MANUFACTURING METHOD OF SAME | FUJI CORPORATION |
| WO/2021/038724 | POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/044618 | MEMORY DEVICE | KIOXIA CORPORATION |
| WO/2021/048928 | MEMORY DEVICE | KIOXIA CORPORATION |
| WO/2021/049034 | SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF | KIOXIA CORPORATION |
| WO/2021/049039 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/053720 | HIGH FREQUENCY CIRCUIT AND METHOD FOR MANUFACTURING HIGH FREQUENCY CIRCUIT | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/053725 | MEMORY DEVICE | KIOXIA CORPORATION |
| WO/2021/059416 | PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD | KYOCERA CORPORATION |
| WO/2021/059456 | LASER SOLDERING METHOD AND DEVICE | O.M.C. CO., LTD. |
| WO/2021/059525 | ELECTRONIC DEVICE | SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. |
| WO/2021/064932 | QUANTUM CIRCUIT SYSTEM | MDR INC. |
| WO/2021/070260 | SEMICONDUCTOR DEVICE | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| WO/2021/070281 | LAMINATED SEMICONDUCTOR, WAFER LAMINATE, METHOD FOR MANUFACTURING LAMINATED SEMICONDUCTOR, ASSISTANCE DEVICE, AND PROGRAM | ULTRAMEMORY INC. |
| WO/2021/070305 | SPECTRAL ELEMENT ARRAY, IMAGING ELEMENT, AND IMAGING DEVICE | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/070373 | PACKAGE | NGK INSULATORS, LTD. |
| WO/2021/070375 | PACKAGE | NGK INSULATORS, LTD. |
| WO/2021/075051 | COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE | FUJI CORPORATION |
| WO/2021/079450 | PACKAGE | NGK INSULATORS, LTD. |
| WO/2021/095083 | SEMICONDUCTOR MODULE, DIMM MODULE AND MANUFACTURING METHOD THEREFOR | ULTRAMEMORY INC. |
| WO/2021/095193 | IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING IMAGE SENSOR MODULE | T-ABLE CO.,LTD. |
| WO/2021/095239 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/100126 | SEMICONDUCTOR DEVICE | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| WO/2021/106131 | POWER SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/111538 | ELECTRONIC MEMBER REMOVAL METHOD AND DEVICE THEREFOR | WONDER FUTURE CORPORATION |
| WO/2021/111590 | LAMINATE, METHOD FOR PRODUCING PATTERNED SUBSTRATE, ELECTRONIC DEVICE AND PACKAGE DEVICE | SASAKI Beji |
| WO/2021/111604 | SEMICONDUCTOR DEVICE | SOCIONEXT INC. |
| WO/2021/117129 | SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND MOBILE UNIT | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/117145 | SEMICONDUCTOR PACKAGE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/117227 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR SYSTEM, MOVING BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/130809 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/019802 | SEMICONDUCTOR MODULE | SANSHA ELECTRIC MANUFACTURING CO., LTD. |
| WO/2021/130891 | SUBSTRATE CONVEYANCE DEVICE | FUJI CORPORATION |
| WO/2021/152658 | IMAGING DEVICE AND ENDOSCOPE | OLYMPUS CORPORATION |
| WO/2021/152795 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/156958 | SEMICONDUCTOR MODULE AND POWER SUPPLY MODULE | TAIYO YUDEN CO., LTD. |
| WO/2021/157010 | METHOD FOR PRODUCING MULTILAYER SUBSTRATE | FUTURE TECHNOLOGY CO., LTD. |
| WO/2021/157072 | MAGNETIC RECORDING ARRAY AND RESERVOIR ELEMENT | TDK CORPORATION |
| WO/2021/161376 | CIRCUIT FORMING DEVICE AND CIRCUIT FORMING METHOD | FUJI CORPORATION |
| WO/2021/161449 | COMPONENT MODULE AND PRODUCTION METHOD FOR SAME | TAIYO YUDEN CO., LTD. |
| WO/2021/161526 | SEMICONDUCTOR DEVICE | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| WO/2021/166139 | CIRCUIT FORMING METHOD | FUJI CORPORATION |
| WO/2021/171408 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/176498 | WIRING FORMATION METHOD | FUJI CORPORATION |
| WO/2021/176499 | METHOD FOR FORMING WIRING LINE | FUJI CORPORATION |
| WO/2021/176540 | POWER SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/176644 | MAGNETIC RECORDING ARRAY | TDK CORPORATION |
| WO/2021/176656 | MAGNETIC RECORDING ARRAY, NEUROMORPHIC DEVICE, AND CONTROL METHOD FOR MAGNETIC RECORDING ARRAY | TDK CORPORATION |
| WO/2021/176695 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/181444 | SOLID-STATE QUANTUM MEMORY | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/181455 | SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE | KIOXIA CORPORATION |
| WO/2021/181607 | SEMICONDUCTOR STORAGE DEVICE | KIOXIA CORPORATION |
| WO/2021/181678 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/186629 | CIRCUIT SHEET, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/191951 | SEMICONDUCTOR STORAGE DEVICE | KIOXIA CORPORATION |
| WO/2021/192051 | SEMICONDUCTOR STORAGE DEVICE | KIOXIA CORPORATION |
| WO/2021/192073 | CIRCUIT BOARD AND ELECTRONIC DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/192172 | POWER MODULE AND PRODUCTION METHOD FOR SAME | TAIYO YUDEN CO., LTD. |
| WO/2021/024546 | CIRCUIT BOARD | KYB CORPORATION |
| WO/2021/192242 | METHOD FOR PRODUCING DISPLAY DEVICE, AND DISPLAY DEVICE | SHARP KABUSHIKI KAISHA |
| WO/2021/199300 | DISPLAY DEVICE | SHARP KABUSHIKI KAISHA |
| WO/2021/199336 | IVH MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME | MEIKO ELECTRONICS CO., LTD. |
| WO/2021/199341 | COMPONENT MODULE | TAIYO YUDEN CO., LTD. |
| WO/2021/005851 | PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/199443 | IMAGING ELEMENT, ENDOSCOPE, ENDOSCOPE SYSTEM, AND INSPECTION METHOD | OLYMPUS CORPORATION |
| WO/2021/090521 | LIGHT RECEIVING ELEMENT AND DISTANCE MEASURING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/014692 | POWER SEMICONDUCTOR MODULE | HITACHI POWER SEMICONDUCTOR DEVICE, LTD. |
| WO/2021/002075 | IMAGING ELEMENT UNIT AND IMAGING DEVICE | FUJIFILM CORPORATION |
| WO/2021/205662 | SEMICONDUCTOR IMAGE SENSOR | OPTOHUB CO., LTD |
| WO/2021/210067 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SHARP KABUSHIKI KAISHA |
| WO/2021/005864 | WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
| WO/2021/210150 | CIRCUIT BOARD PRODUCTION METHOD | MEIKO ELECTRONICS CO., LTD. |
| WO/2021/053867 | SEMICONDUCTOR DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/214813 | CIRCUIT FORMING METHOD AND CIRCUIT FORMING DEVICE | FUJI CORPORATION |
| WO/2021/214910 | LIGHT-EMITTING ELEMENT AND DISPLAY DEVICE | SHARP KABUSHIKI KAISHA |
| WO/2021/044667 | IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/075077 | IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/095285 | IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/214973 | CIRCUIT FORMING METHOD AND CIRCUIT FORMING DEVICE | FUJI CORPORATION |
| WO/2021/220351 | ELECTRICAL CONDUCTION STRUCTURE AND POWER SEMICONDUCTOR MODULE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/002090 | IMAGING ELEMENT, MULTILAYER IMAGING ELEMENT, AND SOLID-STATE IMAGING DEVICE | SONY CORPORATION |
| WO/2021/224982 | SEMICONDUCTOR DEVICE | ULTRAMEMORY INC. |
| WO/2021/229642 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME | ULTRAMEMORY INC. |
| WO/2021/229740 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | SOCIONEXT INC. |
| WO/2021/059579 | SEMICONDUCTOR DEVICE | NUVOTON TECHNOLOGY CORPORATION JAPAN |
| WO/2021/059580 | SEMICONDUCTOR DEVICE | NUVOTON TECHNOLOGY CORPORATION JAPAN |
| WO/2021/014731 | SEMICONDUCTOR PACKAGE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/090527 | MULTILAYER WIRING BOARD | NGK SPARK PLUG CO., LTD. |
| WO/2021/044675 | SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE | FUJITSU INTERCONNECT TECHNOLOGIES LIMITED |
| WO/2021/245722 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/049106 | CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE | FUJITSU INTERCONNECT TECHNOLOGIES LIMITED |
| WO/2021/024598 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR OPERATING SAME | JAPAN SCIENCE AND TECHNOLOGY AGENCY |
| WO/2021/010050 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/245912 | METHOD FOR PRODUCING FILLED-VIA SUBSTRATE, AND CONDUCTIVE PASTE KIT | MITSUBOSHI BELTING LTD. |
| WO/2021/250727 | ELECTRONIC MODULE, METHOD FOR MANUFACTURING ELECTRONIC MODULE, AND ENDOSCOPE | OLYMPUS CORPORATION |
| WO/2021/002157 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/002166 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/250822 | FILTER CIRCUIT | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/033398 | WIRING CIRCUIT BOARD, CONTAINER AND BOARD CONTAINING SET | NITTO DENKO CORPORATION |
| WO/2021/014810 | NON-VOLATILE MEMORY CELL, NON-VOLATILE MEMORY CELL ARRAY, AND METHOD FOR WRITING INFORMATION TO NON-VOLATILE MEMORY CELL ARRAY | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/005961 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/005965 | CIRCUIT BOARD | MURATA MANUFACTURING CO., LTD. |
| WO/2021/255811 | ELECTROMAGNETIC COUPLING CONTROL DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/255844 | DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | SHARP KABUSHIKI KAISHA |
| WO/2021/002200 | CIRCUIT BOARD AND CIRCUIT BOARD MODULE | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI |
| WO/2021/260756 | DISPLAY DEVICE | SHARP KABUSHIKI KAISHA |
| WO/2021/006020 | HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/006021 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/039067 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/260792 | SEMICONDUCTOR STORAGE DEVICE | KIOXIA CORPORATION |
| WO/2021/039068 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/260863 | ELECTRONIC MODULE, METHOD FOR MANUFACTURING ELECTRONIC MODULE, AND ENDOSCOPE | OLYMPUS CORPORATION |
| WO/2021/014875 | SEMICONDUCTOR DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/002271 | RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/002282 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/002296 | HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/070431 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/010182 | SOLID-STATE IMAGING SENSOR | CANON KABUSHIKI KAISHA |
| WO/2021/039116 | DETECTION DEVICE | JAPAN DISPLAY INC. |
| WO/2021/049140 | BACKSIDE INCIDENT-TYPE IMAGING ELEMENT | HAMAMATSU PHOTONICS K.K. |
| WO/2021/014979 | POWER SEMICONDUCTOR DEVICE | HITACHI, LTD. |
| WO/2021/006324 | FLEXIBLE PRINTED WIRING BOARD AND BATTERY WIRING MODULE | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
| WO/2021/006325 | FLEXIBLE PRINTED WIRING BOARD, BATTERY WIRING MODULE, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
| WO/2021/015009 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/015011 | IMAGE CAPTURE DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/020082 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE | ROHM CO., LTD. |
| WO/2021/015019 | CAPACITOR-FORMING SYSTEM AND CAPACITOR-FORMING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/039161 | DETECTION DEVICE | JAPAN DISPLAY INC. |
| WO/2021/079572 | IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/010425 | SOLAR CELL MODULE, ELECTRONIC DEVICE, AND POWER SUPPLY MODULE | RICOH COMPANY, LTD. |
| WO/2021/079573 | IMAGING DEVICE AND STORAGE DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/044743 | MOLECULAR MEMORY AND METHOD FOR MANUFACTURING MOLECULAR MEMORY | HIROSHIMA UNIVERSITY |
| WO/2021/075115 | SOLID-STATE IMAGING DEVICE AND IMAGING METHOD | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/075116 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/075117 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/079576 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/090537 | SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/044762 | IMAGING DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/084819 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/090545 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/029220 | POWER MODULE | ROHM CO., LTD. |
| WO/2021/033523 | WIRING BOARD CONNECTION STRUCTURE | AUTONETWORKS TECHNOLOGIES, LTD. |
| WO/2021/039300 | SEMICONDUCTOR ELEMENT, NON-VOLATILE STORAGE DEVICE, PRODUCT-SUM OPERATION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/033556 | SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/029321 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/033565 | POWER MODULE | ROHM CO., LTD. |
| WO/2021/044803 | IMAGING DEVICES AND IMAGING APPARATUSES, AND METHODS FOR THE SAME | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/025158 | OPTICAL MODULATOR AND OPTICAL TRANSMISSION DEVICE USING SAME | SUMITOMO OSAKA CEMENT CO., LTD. |
| WO/2021/044807 | SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE WITH SHARED CIRCUIT ELEMENTS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/033600 | CONTROL MODULE AND SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/039455 | IMAGING DEVICE, PRODUCTION METHOD, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/033664 | SEMICONDUCTOR DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/084852 | POWER CONVERSION DEVICE | DENSO CORPORATION |
| WO/2021/084860 | WIRING BOARD | KYOCERA CORPORATION |
| WO/2021/039629 | INTEGRATED SEMICONDUCTOR DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/044898 | POWER MODULE | DENSO CORPORATION |
| WO/2021/095323 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/049297 | POWER CONVERTER AND METHOD FOR MANUFACTURING POWER CONVERTER | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/106294 | IMAGE CAPTURING DEVICE AND CONTROL METHOD | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/049302 | IMAGING DEVICE, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/039955 | PHOTOELECTRIC CONVERSION ELEMENT, IMAGING ELEMENT, AND IMAGING SYSTEM | TOPPAN PRINTING CO., LTD. |
| WO/2021/054100 | METHOD FOR MANUFACTURING CIRCUIT STRUCTURE | OMRON CORPORATION |
| WO/2021/059882 | IMAGING DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/084902 | METHOD FOR MANUFACTURING CHIP-MOUNTED SUBSTRATE, AND SUBSTRATE PROCESSING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/045155 | ELECTRONIC COMPONENT MOUNTING STRUCTURE | TDK CORPORATION |
| WO/2021/054207 | SEMICONDUCTOR DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/060017 | LIGHT-RECEIVING ELEMENT, DISTANCE MEASUREMENT MODULE, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/229837 | SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/054317 | COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME | DENKA COMPANY LIMITED |
| WO/2021/100298 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/075195 | METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
| WO/2021/065490 | FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SAME | FUJIKURA LTD. |
| WO/2021/060098 | IMAGING ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/065587 | IMAGING DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/084971 | IMAGING DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/070615 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/075220 | SEMICONDUCTOR MODULE | FUJI ELECTRIC CO., LTD. |
| WO/2021/117313 | MULTI-LAYER PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS | SONY INTERACTIVE ENTERTAINMENT INC. |
| WO/2021/065722 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/065736 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/084994 | IMAGING ELEMENT | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/084995 | IMAGING ELEMENT | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/060552 | CAPACITOR | TAIYO YUDEN CO., LTD. |
| WO/2021/065810 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | KYOCERA CORPORATION |
| WO/2021/065957 | SEMICONDUCTOR MODULE | DENSO CORPORATION |
| WO/2021/065958 | SEMICONDUCTOR MODULE | DENSO CORPORATION |
| WO/2021/106363 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/085025 | SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/176758 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
| WO/2021/066193 | SEMICONDUCTOR ELEMENT | FLOSFIA INC. |
| WO/2021/100338 | SOLID-STATE IMAGE CAPTURE ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/106382 | DRIVER CIRCUIT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/100351 | LIGHT-RECEIVING ELEMENT AND RANGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/070918 | DETECTION DEVICE | JAPAN DISPLAY INC. |
| WO/2021/095416 | WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME | NITTO DENKO CORPORATION |
| WO/2021/075427 | DEVICE, ELECTRONIC DEVICE AND METHOD FOR CONNECTING WIRING LINE | SONY CORPORATION |
| WO/2021/117334 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/085181 | LAMINATED SUBSTRATE, ELECTRONIC COMPONENT MODULE, AND LAMINATED SUBSTRATE MANUFACTURING METHOD | MURATA MANUFACTURING CO., LTD. |
| WO/2021/106421 | FLEXIBLE SUBSTRATE | JAPAN DISPLAY INC. |
| WO/2021/124667 | FLEXIBLE SUBSTRATE | JAPAN DISPLAY INC. |
| WO/2021/095450 | IMAGING ELEMENT, LIGHT DETECTION ELEMENT, AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/090688 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/079945 | SUBSTRATE INSPECTION METHOD, SUBSTRATE INSPECTION PROGRAM, AND SUBSTRATE INSPECTION DEVICE | NIDEC READ CORPORATION |
| WO/2021/080016 | ELECTRONIC DEVICE COMPRISING SEMICONDUCTOR MODULE | DENSO CORPORATION |
| WO/2021/095494 | IMAGING DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/111762 | SUBSTRATE-DESIGN ASSISTANCE DEVICE, SUBSTRATE-DESIGN ASSISTANCE METHOD, AND PROGRAM | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/140727 | SEMICONDUCTOR LIGHT EMITTING DEVICE | ROHM CO., LTD. |
| WO/2021/131318 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/095562 | IMAGING DEVICE AND ELECTRONIC INSTRUMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/199475 | MODULE SUBSTRATE, HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/149320 | FLEXIBLE SUBSTRATE | JAPAN DISPLAY INC. |
| WO/2021/149321 | FLEXIBLE SUBSTRATE | JAPAN DISPLAY INC. |
| WO/2021/100447 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/100471 | WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
| WO/2021/111794 | METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
| WO/2021/095634 | SEMICONDUCTOR DEVICE | THE UNIVERSITY OF TOKYO |
| WO/2021/106519 | POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE | HITACHI ASTEMO, LTD. |
| WO/2021/095668 | SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SAME | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/111816 | SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SAME | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/095723 | MOUNTING WIRING BOARD, ELECTRONIC COMPONENT MOUNTED BOARD, METHOD OF MOUNTING ELECTRONIC COMPONENT, MICROWAVE HEATING METHOD, AND MICROWAVE HEATING DEVICE | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
| WO/2021/100556 | IMAGING DEVICE AND METHOD OF MANUFACTURING SAME, ELECTRONIC EQUIPMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/124747 | MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUBLE-SIDED WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
| WO/2021/111843 | CIRCUIT BOARD SOLDERING STRUCTURE | SANYO ELECTRIC CO., LTD. |
| WO/2021/131388 | SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/100696 | GLASS-CORE MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME | TOPPAN PRINTING CO.,LTD. |
| WO/2021/100747 | POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND POWER CONVERSION APPARATUS | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/106732 | IMAGING DEVICE AND ELECTRONIC INSTRUMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/106748 | SEMICONDUCTOR DEVICE AND APPARATUS | CANON KABUSHIKI KAISHA |
| WO/2021/111893 | SEMICONDUCTOR ELEMENT AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/171717 | SOLID-STATE IMAGING ELEMENT, IMAGING DEVICE, AND METHOD FOR CONTROLLING SOLID-STATE IMAGING ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/210211 | METHOD FOR MANUFACTURING PRINTED BOARD | NODA SCREEN CO., LTD. |
| WO/2021/149349 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/117501 | METHOD FOR MANUFACTURING WIRING CIRCUIT SUBSTRATE | NITTO DENKO CORPORATION |
| WO/2021/112001 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/107116 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | KYOCERA CORPORATION |
| WO/2021/112013 | SEMICONDUCTOR ELEMENT AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/124862 | INSPECTION DEVICE | NIDEC READ CORPORATION |
| WO/2021/112076 | SEMICONDUCTOR CIRCUIT CONTROL METHOD, AND POWER CONVERTER ADOPTING SAME | HITACHI, LTD. |
| WO/2021/112098 | IMAGING DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/124879 | WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME | NITTO DENKO CORPORATION |
| WO/2021/112128 | IMAGING DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/149363 | SHEET-LIKE DEVICE AND PRODUCTION METHOD THEREFOR | NISSHA CO.,LTD. |
| WO/2021/157174 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/112150 | IMAGING DEVICES AND IMAGING APPARATUSES, AND METHODS FOR THE SAME | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/112151 | SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE WITH COMBINED DYNAMIC VISION SENSOR AND IMAGING FUNCTIONS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/117627 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/131611 | SEMICONDUCTOR MODULE | ROHM CO., LTD. |
| WO/2021/117648 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/124964 | IMAGING ELEMENT, IMAGING ELEMENT DRIVE METHOD, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/124974 | IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/124975 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC INSTRUMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/149380 | IMAGING DEVICE, METHOD FOR MANUFACTURING IMAGING DEVICE, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/181774 | CAPACITOR AND METHOD FOR PRODUCING CAPACITOR | ROHM CO., LTD. |
| WO/2021/125031 | SOLID-STATE IMAGING DEVICE AND DISTANCE MEASUREMENT DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/153030 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/131774 | MODULE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/131776 | MODULE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/125116 | LIGHT-RECEIVING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/131833 | SENSOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/131840 | SEMICONDUCTOR ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/186817 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/125155 | SOLID-STATE IMAGING ELEMENT | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/125166 | WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
| WO/2021/131943 | POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE | HITACHI, LTD. |
| WO/2021/145127 | SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/205695 | VARIABLE-CAPACITANCE ELEMENT AND OSCILLATOR COMPRISING SAME | MURATA MANUFACTURING CO., LTD. |
| WO/2021/132006 | SENSOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/125258 | MULTILAYER BODY, BONDING METHOD AND HALF-FINISHED PRODUCT FOR CIRCUIT BOARDS | NHK SPRING CO., LTD. |
| WO/2021/192458 | FLEXIBLE SUBSTRATE | JAPAN DISPLAY INC. |
| WO/2021/176802 | ELECTRONIC DEVICE | JAPAN DISPLAY INC. |
| WO/2021/132084 | RESISTANCE DEVICE, INTEGRATED CIRCUIT DEVICE, IMPLANTABLE DEVICE, AND CORRECTION COEFFICIENT DETERMINING METHOD | OSAKA UNIVERSITY |
| WO/2021/132102 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/132174 | POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/132184 | SENSOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/132392 | PROCESS FOR MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE | NICHIA CORPORATION |
| WO/2021/140936 | LIGHT-RECEIVING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/132479 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME | MATERIAL CONCEPT, INC. |
| WO/2021/157250 | LIGHT RECEIVING ELEMENT, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/140958 | IMAGING ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/145206 | SEMICONDUCTOR DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/140971 | METHOD FOR MANUFACTURING WIRING BODY, PATTERN PLATE, AND WIRING BODY | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/140975 | HIGH FREQUENCY AMPLIFIER | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/166463 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/145226 | MANUFACTURING DEVICE, MANUFACTURING METHOD, AND SEMICONDUCTOR ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/153170 | SUBSTRATE ELECTRIC POTENTIAL STABILIZATION CIRCUIT AND BIDIRECTIONAL SWITCH SYSTEM | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/141030 | HIGH FREQUENCY AMPLIFIER | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/157269 | ELECTRONIC DEVICE | DENSO CORPORATION |
| WO/2021/161687 | SENSOR DEVICE AND RANGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/145256 | IMAGE-CAPTURING ELEMENT, RANGING DEVICE, AND ELECTRONIC APPLIANCE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/145257 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/176839 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/181855 | POSITION DETECTION SENSOR AND MANUFACTURING METHOD OF POSITION DETECTION SENSOR | WACOM CO., LTD. |
| WO/2021/141130 | CONDUCTIVE METAL OXIDE FILM, SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE | FLOSFIA INC. |
| WO/2021/149556 | LIGHT RECEIVING ELEMENT, IMAGING ELEMENT, AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/149577 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/166514 | SENSOR DEVICE, RANGING DEVICE, AND SENSING METHOD | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/149686 | METHOD FOR MANUFACTURING BACK-THINNED SOLID-STATE IMAGING DEVICE | HAMAMATSU PHOTONICS K.K. |
| WO/2021/149687 | SEMICONDUCTOR DEVICE AND MODULE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/181898 | ELECTRONIC APPARATUS AND PROXIMITY SENSOR | OMRON CORPORATION |
| WO/2021/199597 | SOLID-STATE IMAGING DEVICE | HAMAMATSU PHOTONICS K.K. |
| WO/2021/153429 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/149789 | CERAMIC-COPPER COMPOSITE AND METHOD FOR PRODUCING CERAMIC-COPPER COMPOSITE | DENKA COMPANY LIMITED |
| WO/2021/157386 | SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/186893 | CAPACITOR AND METHOD FOR PRODUCING SAME | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/153476 | MOTOR DRIVE DEVICE AND METHOD FOR MANUFACTURING SAME | FANUC CORPORATION |
| WO/2021/153494 | CIRCUIT BOARD AND PROBE CARD | KYOCERA CORPORATION |
| WO/2021/192576 | SOLID-STATE IMAGING ELEMENT, AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/157419 | SEMICONDUCTOR STORAGE DEVICE | FLOADIA CORPORATION |
| WO/2021/186909 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/186911 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/192600 | SOLID-STATE IMAGING ELEMENT | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/171901 | SWITCH CIRCUIT AND COMMUNICATION DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/215066 | LIGHT DETECTOR AND ELECTRONIC INSTRUMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/166689 | LIGHT-RECEIVING DEVICE, MANUFACTURING METHOD FOR LIGHT-RECEIVING DEVICE, AND DISTANCE-MEASURING MODULE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/199679 | IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/161948 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | PIONEER CORPORATION |
| WO/2021/229875 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HITACHI, LTD. |
| WO/2021/199695 | IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/162044 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | DAIKIN INDUSTRIES, LTD. |
| WO/2021/186969 | IMAGING DEVICE AND ELECTRONIC INSTRUMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/172036 | SENSOR ELEMENT AND SENSOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/162108 | OPTO-ELECTRIC HYBRID BOARD | NITTO DENKO CORPORATION |
| WO/2021/199724 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/166880 | SEMICONDUCTOR DEVICE AND MODULE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/166913 | SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE | NUVOTON TECHNOLOGY CORPORATION JAPAN |
| WO/2021/177026 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/199747 | PLATED MOLDED ARTICLE AND METHOD FOR MANUFACTURING PLATED MOLDED ARTICLE | SANKEI GIKEN KOGYO CO., LTD. |
| WO/2021/192739 | MODULE AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
| WO/2021/199754 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/186997 | WIRING BOARD | KYOCERA CORPORATION |
| WO/2021/215103 | ELECTRONIC CIRCUIT AND SEMICONDUCTOR MODULE | FUJI ELECTRIC CO., LTD. |
| WO/2021/177071 | ELECTRONIC COMPONENT | ROHM CO., LTD. |
| WO/2021/177114 | WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
| WO/2021/177133 | ELECTRONIC COMPONENT BUILT-IN CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME | TDK CORPORATION |
| WO/2021/246005 | CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC APPARATUS | FUJITSU INTERCONNECT TECHNOLOGIES LIMITED |
| WO/2021/187063 | ELECTRICAL DEVICE | AUTONETWORKS TECHNOLOGIES, LTD. |
| WO/2021/182149 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/182157 | RESIN MULTILAYER SUBSTRATE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/182158 | RESIN MULTILAYER SUBSTRATE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/187092 | IMAGING ELEMENT AND SEMICONDUCTOR CHIP | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/199866 | CIRCUIT MODULE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/182247 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/187151 | IMAGE-CAPTURING ELEMENT, SEMICONDUCTOR CHIP | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/192926 | WIRING CIRCUIT BOARD ASSEMBLY SHEET | NITTO DENKO CORPORATION |
| WO/2021/187201 | LAMINATE, CERAMIC-COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING CERAMIC-COPPER CIRCUIT BOARD | KABUSHIKI KAISHA TOSHIBA |
| WO/2021/193084 | SOLID-STATE IMAGING DEVICE, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/193092 | WIRING BOARD | KYOCERA CORPORATION |
| WO/2021/210306 | POWER CONVERSION DEVICE | DENSO CORPORATION |
| WO/2021/193254 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/193266 | SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/193288 | WIRING BOARD AND WIRING METHOD | SHASHIN KAGAKU CO., LTD. |
| WO/2021/225036 | LIGHT DETECTION DEVICE AND METHOD FOR DRIVING LIGHT SENSOR | HAMAMATSU PHOTONICS K.K. |
| WO/2021/200337 | ELECTRONIC DEVICE | ROHM CO., LTD. |
| WO/2021/200386 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/205879 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/200508 | IMAGING ELEMENT AND IMAGING DEVICE | SONY GROUP CORPORATION |
| WO/2021/200509 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/193824 | SUBSTRATE INSPECTION DEVICE | NIDEC READ CORPORATION |
| WO/2021/200538 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | KYOCERA CORPORATION |
| WO/2021/205924 | INTEGRATED CIRCUIT | MINEBEA MITSUMI INC. |
| WO/2021/200820 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME | KYOCERA CORPORATION |
| WO/2021/246033 | PRINTED WIRING BOARD | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
| WO/2021/235101 | SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/200867 | SILICON NITRIDE PLATE AND METHOD FOR PRODUCING SAME, COMPOSITE SUBSTRATE AND METHOD FOR PRODUCING SAME, AND CIRCUIT BOARD AND METHOD FOR PRODUCING SAME | DENKA COMPANY LIMITED |
| WO/2021/200874 | BONDED BODY AND INSULATING CIRCUIT BOARD | MITSUBISHI MATERIALS CORPORATION |
| WO/2021/201000 | SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS | BRILLNICS SINGAPORE PTE. LTD. |
| WO/2021/240988 | RANGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/201252 | THERMOSETTING RESIN SHEET AND PRINTED CIRCUIT BOARD | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/206019 | MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
| WO/2021/241019 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/215290 | SOLID-STATE IMAGING ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/215294 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/215299 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/215303 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/210600 | POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/241048 | AI CHIP | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/215337 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/241062 | SOLID-STATE IMAGING DEVICE, ELECTRONIC MACHINE, AND SOLID-STATE IMAGING DEVICE PRODUCTION METHOD | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/251004 | LIGHT RECEIVING ELEMENT AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/251006 | SENSOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/251009 | SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/235167 | IMAGING DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/246076 | IMAGING DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/251010 | IMAGING ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/235192 | OPTOELECTRIC HYBRID BOARD | NITTO DENKO CORPORATION |
| WO/2021/235196 | MOUNTING STRUCTURE FOR CHIP COMPONENT | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/221087 | SEMICONDUCTOR DEVICE AND MODULE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/251029 | SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/241155 | WIRING BOARD | KYOCERA CORPORATION |
| WO/2021/256114 | SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/241175 | SOLID-STATE IMAGING DEVICE, PIXEL DRIVE METHOD, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/235256 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/251042 | CIRCUIT BOARD AND MOTOR | NIDEC CORPORATION |
| WO/2021/235282 | STRETCHABLE WIRING BOARD | MURATA MANUFACTURING CO., LTD. |
| WO/2021/261107 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/251081 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | ROHM CO., LTD. |
| WO/2021/241449 | SEMICONDUCTOR DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/251152 | LIGHT RECEIVING DEVICE, METHOD FOR MANUFACTURING SAME, AND RANGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/256208 | WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
| WO/2021/251170 | SUBSTRATE CONNECTION STRUCTURE AND WIRING MODULE FOR VEHICLE | AUTONETWORKS TECHNOLOGIES, LTD. |
| WO/2021/256230 | SiC COMPLEMENTARY TYPE FIELD EFFECT TRANSISTOR | KYOTO UNIVERSITY |
| WO/2021/246374 | INSULATING RESIN CIRCUIT BOARD | MITSUBISHI MATERIALS CORPORATION |
| WO/2021/261178 | WIRING CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING SAME | NITTO DENKO CORPORATION |
| WO/2021/256261 | IMAGING ELEMENT AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/246467 | MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
| WO/2021/251270 | METHOD FOR MANUFACTURING OPTICAL DETECTION DEVICE, OPTICAL DETECTION DEVICE, AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/251272 | SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/256291 | SOLID-STATE IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/261219 | DETECTION DEVICE | JAPAN DISPLAY INC. |
| WO/2021/251354 | FILTER CIRCUIT | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/261234 | SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/256407 | MOTOR DRIVE DEVICE | FANUC CORPORATION |
| WO/2021/261314 | ELECTRONIC DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | TOYOBO CO., LTD. |
| WO/2021/256561 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
| WO/2021/261428 | OPTICAL COMMUNICATION MODULE SUBSTRATE | NITTO DENKO CORPORATION |
| WO/2021/261493 | REVERSED-STRUCTURE ELECTROLUMINESCENCE ELEMENT HAVING COATED INORGANIC TRANSPARENT OXIDE SEMICONDUCTOR ELECTRON TRANSPORT LAYER | MIKUNI ELECTRON CORPORATION |
| WO/2021/261503 | MANUFACTURING METHOD FOR CONNECTION STRUCTURE | SEKISUI CHEMICAL CO., LTD. |
| WO/2021/002490 | DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/006385 | DISPLAY DEVICE USING MICRO LED AND MANUFACTURING METHOD THEREOF | LG ELECTRONICS INC. |
| WO/2021/015306 | DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/020594 | METHOD FOR MANUFACTURING DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE | LG ELECTRONICS INC. |
| WO/2021/015350 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/025190 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/025202 | METHOD FOR MANUFACTURING DISPLAY DEVICE, AND SUBSTRATE FOR MANUFACTURE OF DISPLAY DEVICE | LG ELECTRONICS INC. |
| WO/2021/033801 | DISPLAY DEVICE USING MICRO LED AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/033802 | DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/040066 | DISPLAY DEVICE USING MICRO LED AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/040102 | DISPLAY DEVICE USING MICRO LED AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/040110 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/033822 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/049692 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING DIODE | LG ELECTRONICS INC. |
| WO/2021/054491 | DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/060577 | DISPLAY APPARATUS USING MICRO LED AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/066221 | DISPLAY DEVICE USING MICRO-LEDS AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/060595 | DISPLAY DEVICE USING MICRO-LEDS AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/070977 | DISPLAY DEVICE USING MICRO LED AND METHOD OF MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/002538 | DISPLAY PANEL | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/080028 | DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/080030 | DISPLAY APPARATUS USING MICRO LED AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/080068 | MEMS MICROPHONE PACKAGE | PARTRON CO., LTD. |
| WO/2021/085694 | IMAGE SENSOR, AND CAMERA AND ELECTRONIC DEVICE INCLUDING SAME | LG ELECTRONICS INC. |
| WO/2021/095938 | METHOD OF MANUFACTURING DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENT | LG ELECTRONICS INC. |
| WO/2021/033843 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/025234 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/025236 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/107222 | TEMPERATURE ADJUSTMENT DEVICE | JUN, Hea-Young |
| WO/2021/107237 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/100955 | DISPLAY APPARATUS USING LIGHT-EMITTING DEVICE | LG ELECTRONICS INC. |
| WO/2021/112284 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/040152 | LAMINATED CIRCUIT STRUCTURE FOR REDUCING PARASITIC INDUCTANCE | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| WO/2021/117956 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/117957 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/125421 | DISPLAY DEVICE USING LIGHT EMITTING ELEMENTS AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/025243 | DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT EMITTING DEVICE | LG ELECTRONICS INC. |
| WO/2021/132789 | APPARATUS AND METHOD OF MANUFACTURING DISPLAY USING LIGHT EMITTING ELEMENT | LG ELECTRONICS INC. |
| WO/2021/125423 | DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT-EMITTING DEVICE | LG ELECTRONICS INC. |
| WO/2021/141168 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/145498 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT | LG ELECTRONICS INC. |
| WO/2021/145499 | DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT-EMITTING DEVICE | LG ELECTRONICS INC. |
| WO/2021/091020 | NON-VOLATILE MULTI-LEVEL OPTICAL MEMORY USING POLYDIMETHYLSILOXANE, AND MANUFACTURING METHOD THEREFOR | UNIVERSITY-INDUSTRY FOUNDATION(UIF), YONSEI UNIVERSITY |
| WO/2021/107266 | DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/107267 | DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/149856 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF | LG ELECTRONICS INC. |
| WO/2021/117979 | DISPLAY DEVICE RELATED TO MICRO-LED AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/010560 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/153833 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/107270 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/107271 | DISPLAY DEVICE USING MICRO LED | LG ELECTRONICS INC. |
| WO/2021/025249 | METHOD FOR MANUFACTURING DISPLAY DEVICE, AND SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE | LG ELECTRONICS INC. |
| WO/2021/107273 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/149861 | DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT-EMITTING DEVICE | LG ELECTRONICS INC. |
| WO/2021/162147 | SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/162148 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/162153 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/162155 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING DEVICES | LG ELECTRONICS INC. |
| WO/2021/162159 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING DEVICES | LG ELECTRONICS INC. |
| WO/2021/167125 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS AND METHOD OF MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/006450 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS, AND METHOD FOR MANUFACTURING SAME | LG ELECTRONICS INC. |
| WO/2021/167149 | DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT-EMITTING DEVICE | LG ELECTRONICS INC. |
| WO/2021/049725 | LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE COMPRISING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/149863 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/167150 | DISPLAY DEVICE | LG ELECTRONICS INC. |
| WO/2021/107278 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | LG DISPLAY CO.,LTD. |
| WO/2021/075647 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/100983 | DISPLAY DEVICE | LG DISPLAY CO.,LTD. |
| WO/2021/091032 | THIN FILM TRANSISTOR AND DISPLAY APPARATUS | LG DISPLAY CO., LTD. |
| WO/2021/002573 | LIGHT-EMITTING MODULE HAVING PLURALITY OF LIGHT-EMITTING DIODE CHIPS CONNECTED IN SERIES AND PARALLEL | SEOUL SEMICONDUCTOR CO., LTD. |
| WO/2021/137360 | COLOR CONVERSION MEMBER AND DISPLAY DEVICE COMPRISING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/020701 | RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/132814 | COLOR CONVERSION SUBSTRATE, METHOD OF MANUFACTURING COLOR CONVERSION SUBSTRATE, AND DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/096011 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/182679 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/040189 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/020705 | ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING QUANTUM DOTS | INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY |
| WO/2021/132816 | METHOD FOR MANUFACTURING DISPLAY DEVICE | LG DISPLAY CO.,LTD. |
| WO/2021/015407 | DISPLAY MODULE HAVING LED PACKAGES AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/020710 | ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/033887 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE COMPRISING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/020716 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/177509 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/177510 | LIGHT-EMITTING DEVICE AND DISPLAY COMPRISING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/066287 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/162180 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/029527 | LIGHTING APPARATUS USING LIGHT EMITTING DEVICE DIE ARRAY AND MANUFACTURING METHOD THEREFOR | IDC KOREA CO., LTD. |
| WO/2021/251529 | DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENT | LG ELECTRONICS INC. |
| WO/2021/002610 | MICRO LED DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/235589 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/256591 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | LG ELECTRONICS INC. |
| WO/2021/157787 | COLOR CONVERTING SUBSTRATE AND DISPLAY DEVICE INCLUDING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/002622 | MICRO LED DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/215581 | DISPLAY DEVICE AND METHOD FOR REPAIRING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/182681 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/261627 | SUBSTRATE FOR MANUFACTURING DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS USING SAME | LG ELECTRONICS INC. |
| WO/2021/033907 | THREE-DIMENSIONAL FLASH MEMORY AIMED AT INTEGRATION, AND METHOD FOR MANUFACTURING SAME | INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY |
| WO/2021/010616 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/006509 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/015438 | ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD ASSEMBLY | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/167180 | DISPLAY APPARATUS | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/025299 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/002704 | LIGHTING MODULE, LIGHTING APPARATUS AND LAMP | LG INNOTEK CO., LTD. |
| WO/2021/029535 | MICRO LED ELEMENT AND MICRO LED DISPLAY MODULE HAVING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/010627 | PIXEL, DISPLAY DEVICE HAVING SAME AND PRODUCTION METHOD THEREFOR | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/020750 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/060683 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/071060 | ADHESIVE MEMBER, DISPLAY DEVICE COMPRISING SAME, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/010754 | PRINTED CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/010763 | FLEXIBLE DISPLAY DEVICE | GLOW ONE COMPANY LTD. |
| WO/2021/145522 | METHOD OF MANUFACTURING DISPLAY APPARATUS, DISPLAY APPARATUS, AND STRUCTURE FOR MANUFACTURING DISPLAY APPARATUS | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/025333 | ELECTRONIC APPARATUS INCLUDING FPCB STRUCTURE | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/015540 | METHOD FOR MANUFACTURING PIXEL CSP HAVING EXTENSIBLE ELECTRODE PAD, AND PIXEL CSP MANUFACTURED BY METHOD | LIGHTIZER CO., LTD. |
| WO/2021/029558 | PRINTED CIRCUIT BOARD INCLUDING AUXILIARY POWER SUPPLY AND ELECTRONIC APPARATUS INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/230426 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/177516 | DISPLAY DEVICE USING MICRO LED AND MODULE-TYPE DISPLAY DEVICE USING SAME | LG ELECTRONICS INC. |
| WO/2021/020919 | RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/033949 | LIGHT-EMITTING ELEMENT FOR DISPLAY, AND DISPLAY DEVICE INCLUDING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/025386 | AN ELECTRONIC DEVICE HAVING A FLEXIBLE PRINTED CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/033951 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | STEMCO CO., LTD. |
| WO/2021/025436 | LIGHT-EMITTING DIODE DISPLAY PANEL AND DISPLAY DEVICE INCLUDING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/029615 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/025514 | LIGHT SOURCE MODULE, DISPLAY PANEL, PATTERNS OF DISPLAY PANEL, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING SAME | AMAP-PLUS CO., LTD. |
| WO/2021/194022 | ZERO-BEZEL DISPLAY DEVICE HAVING PERIPHERAL CIRCUIT STRUCTURE UNDER DISPLAY AREA APPLIED THERETO, AND MANUFACTURING METHOD THEREFOR | UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY |
| WO/2021/246572 | LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/235600 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE COMPRISING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/033989 | SUBSTRATE FOR USE IN MANUFACTURING DISPLAY AND MANUFACTURING METHOD THEREFOR | THE SHUM |
| WO/2021/029657 | MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/071077 | DISPLAY MODULE AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/034009 | APPARATUS AND PRINTED CIRCUIT BOARD INCLUDING PCB EMBEDDED FILTER HAVING VIA GROUP PATTERNS | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/045413 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/167190 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/080148 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD | HANBAT NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
| WO/2021/040364 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/040367 | PRINTED CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/066328 | ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/137382 | THIN FILM TRANSISTOR AND DISPLAY PANEL USING SAME | LG DISPLAY CO.,LTD. |
| WO/2021/045482 | MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/132841 | LED DISPLAY DEVICE AND LED ELEMENT MANUFACTURING METHOD | LG DISPLAY CO.,LTD. |
| WO/2021/132842 | LED DISPLAY DEVICE | LG DISPLAY CO.,LTD. |
| WO/2021/045506 | WIRELESS COMMUNICATION BOARD AND ELECTRONIC DEVICE HAVING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/091061 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/091062 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/054663 | DISPLAY APPARATUS | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/066339 | APPARATUS FOR MANUFACTURING MICRO LED DISPLAY, AND METHOD FOR MANUFACTURING MICRO LED DISPLAY | POINT ENGINEERING CO., LTD. |
| WO/2021/091065 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/149889 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/049859 | PRINTED CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/075728 | DISPLAY MODULE AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/049904 | ELECTRONIC DEVICE INCLUDING CONNECTOR MOUNTED ON CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/251556 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/137388 | MICRO LED DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | LG DISPLAY CO., LTD. |
| WO/2021/096050 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/054702 | LIGHT-EMITTING ELEMENT FOR DISPLAY, AND LIGHT-EMITTING PACKAGE HAVING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/054728 | METHOD FOR MANUFACTURING NEGATIVE DIFFERENTIAL RESISTANCE ELEMENT | RESEARCH BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY |
| WO/2021/060832 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/060878 | LIGHT-EMITTING DEVICE FOR DISPLAY, AND DISPLAY APPARATUS COMPRISING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/071148 | PIXEL, DISPLAY DEVICE INCLUDING SAME, AND MANUFACTURING METHOD THEREFOR | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/075755 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/080203 | INSULATING LAYER FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD COMPRISING SAME, AND METHOD FOR PRODUCING SAME | LG CHEM, LTD. |
| WO/2021/118027 | LED-MOUNTED DISPLAY AND MANUFACTURING METHOD THEREOF | KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
| WO/2021/096062 | DEVICE FOR BENDING BATTERY CELL FLEXIBLE PRINTED CIRCUIT BOARD AND BENDING METHOD USING SAME | LG ENERGY SOLUTION, LTD. |
| WO/2021/066478 | METHOD FOR MANUFACTURING DOUBLE-ACCESS-TYPE FPCB | HANWHA SOLUTIONS CORPORATION |
| WO/2021/075794 | MANUFACTURING METHOD OF DISPLAY APPARATUS, INTERPOSER SUBSTRATE, AND COMPUTER PROGRAM STORED IN READABLE MEDIUM | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/071303 | SUBSTRATE FOR IMAGE SENSOR | LG INNOTEK CO., LTD. |
| WO/2021/091098 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/096070 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/251560 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/246582 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/125524 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME | SL VIONICS CO., LTD. |
| WO/2021/107400 | METHOD FOR MANUFACTURING MICRO LED DISPLAY | POINT ENGINEERING CO., LTD. |
| WO/2021/246583 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/091119 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/080305 | PRINTED CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/080311 | LED DISPLAY DEVICE | SEOUL VIOSYS CO., LTD. |
| WO/2021/080325 | PRINTED CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/107409 | METHOD FOR FILLING VIA HOLE OF CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURED USING SAME | YMT CO.,LTD. |
| WO/2021/096099 | DISPLAY DEVICE MANUFACTURING METHOD AND DISPLAY DEVICE MANUFACTURED THEREBY | LIGHTIZER CO., LTD. |
| WO/2021/085964 | OSCILLATOR STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/137404 | DISPLAY DEVICE | LG DISPLAY CO.,LTD. |
| WO/2021/086026 | LED DISPLAY DEVICE | SEOUL VIOSYS CO., LTD. |
| WO/2021/091166 | PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS INCLUDING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/194034 | APPARATUS EQUIPPED WITH MULTIPLE ROUTER SPINDLES, AND PROCESSING METHOD USING SAME | NEONTECH CO.,LTD |
| WO/2021/246585 | FLEXIBLE CIRCUIT BOARD AND MULTI-BAND ANTENNA DEVICE USING SAME | NURI TELECOM CO., LTD. |
| WO/2021/137413 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD | PROTEC CO., LTD. |
| WO/2021/096170 | MULTILAYER PCB ASSEMBLY | MDM INC. |
| WO/2021/132881 | LED DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | LG DISPLAY CO.,LTD. |
| WO/2021/118081 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/125574 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/118088 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/101256 | PRINTED CIRCUIT BOARD INCLUDING NOISE FILTER STRUCTURE, AND ELECTRONIC DEVICE INCLUDING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/101318 | WIRING METHOD FOR LED MESH STRUCTURE | KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY |
| WO/2021/118108 | SURFACE TREATMENT METHOD FOR THROUGH-HOLES OF PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR | KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
| WO/2021/125606 | LED DISPLAY APPARATUS | LG DISPLAY CO.,LTD. |
| WO/2021/118119 | PRINTED CIRCUIT BOARD, ANTENNA STRUCTURE COMPRISING SAME, AND IMAGE DISPLAY DEVICE COMPRISING SAME | DONGWOO FINE-CHEM CO., LTD. |
| WO/2021/107636 | MICRO LED DISPLAY WITH PRINTED CIRCUIT BOARD ASSEMBLY | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/107654 | PRINTED CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/112499 | PRINTED CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/107698 | MICRO-LENS ARRAY HAVING COLOR-CONVERSION FUNCTION, MICRO-LED DISPLAY MODULE INCLUDING MICRO-LENS ARRAY, AND METHOD FOR MANUFACTURING MICRO-LENS ARRAY | ANYCASTING CO., LTD. |
| WO/2021/118131 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/112590 | POWER SEMICONDUCTOR MODULE | AMOSENSE CO.,LTD |
| WO/2021/118176 | PRINTED CIRCUIT BOARD MODULE | LG INNOTEK CO., LTD. |
| WO/2021/137463 | DOUBLE-SIDED ORGANIC LIGHT-EMITTING DISPLAY DEVICE | TOVIS CO., LTD. |
| WO/2021/118268 | DISPLAY APPARATUS HAVING DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/125704 | DISPLAY APPARATUS | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/125705 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/118301 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/125722 | CERAMIC SUBSTRATE FOR POWER MODULE AND POWER MODULE COMPRISING SAME | AMOSENSE CO.,LTD |
| WO/2021/149917 | LAMINATOR | DOOSAN CORPORATION |
| WO/2021/125757 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/125780 | METHOD FOR RESTORING LIGHT EMITTING ELEMENTS, AND DISPLAY PANEL COMPRISING RESTORED LIGHT EMITTING ELEMENTS | SEOUL VIOSYS CO., LTD. |
| WO/2021/132991 | SUBSTRATE | LG INNOTEK CO., LTD. |
| WO/2021/125890 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE HAVING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/133008 | DISPLAY APPARATUS HAVING DISPLAY MODULE AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/133025 | ELECTRONIC DEVICE COMPRISING IMAGE SENSOR AND METHOD OF OPERATION THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/133028 | CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/133107 | METHOD FOR RECOVERING LIGHT-EMITTING DEVICE, APPARATUS FOR RECOVERING LIGHT-EMITTING DEVICE, AND DISPLAY PANEL COMPRISING RECOVERED LIGHT-EMITTING DEVICE | SEOUL VIOSYS CO., LTD. |
| WO/2021/133117 | THREE-DIMENSIONAL FLASH MEMORY SUPPORTING HOLE INJECTION ERASE TECHNIQUE AND METHOD FOR MANUFACTURING SAME | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| WO/2021/133124 | LED DISPLAY DEVICE | SEOUL VIOSYS CO., LTD. |
| WO/2021/137625 | DISPLAY PANEL, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING SAME | AMAP-PLUS CO., LTD. |
| WO/2021/137654 | LIGHT-EMITTING ELEMENT AND LED DISPLAY DEVICE COMPRISING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/137660 | LIGHT-EMITTING ELEMENT AND LED DISPLAY DEVICE COMPRISING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/137662 | ELECTRONIC DEVICE INCLUDING STRUCTURE FOR STACKING SUBSTRATES | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/045605 | DISPLAY DEVICE, AND METHOD FOR PRODUCING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/172739 | ELECTRONIC DEVICE COMPRISING INTERPOSER | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/162249 | PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/145662 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/145664 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/162251 | ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD HAVING SHIELDING STRUCTURE | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/149979 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/157901 | ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/172763 | DISPLAY DEVICE | LG ELECTRONICS INC. |
| WO/2021/157923 | ELECTRONIC DEVICE INCLUDING DISPLAY PANEL HAVING DUMMY PIXEL | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/162294 | COMPOSITE DEVICE | MODA-INNOCHIPS CO., LTD. |
| WO/2021/215631 | DEVICE AND METHOD FOR FORMING CONDUCTIVE MICRO-PATTERNS | UNIJET CO., LTD. |
| WO/2021/230468 | RESIST FINE PATTERN FORMATION DEVICE AND FORMATION METHOD | UNIJET CO., LTD. |
| WO/2021/162380 | ANTENNA INSERTION ELECTRODE STRUCTURE AND IMAGE DISPLAY DEVICE INCLUDING SAME | DONGWOO FINE-CHEM CO., LTD. |
| WO/2021/162414 | DISPLAY DEVICE, PIXEL MODULE, AND UNIT PIXEL HAVING LIGHT-EMITTING DIODE | SEOUL VIOSYS CO., LTD. |
| WO/2021/162420 | RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/177620 | DISPLAY MODULE INCLUDING GLASS SUBSTRATE HAVING SIDE WIRINGS, AND DISPLAY MODULE MANUFACTURING METHOD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/162454 | PCB STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/172799 | DISPLAY DEVICE AND DISPLAY PANEL PROVIDED THEREON | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/194093 | FLUX TOOL USING ELASTIC PAD | S.S.P. INC. |
| WO/2021/194099 | QUICK-PRESS APPARATUS | HANWHA SOLUTIONS CORPORATION |
| WO/2021/167373 | ELECTRONIC DEVICE COMPRISING DISPLAY | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/215638 | ULTRA-HIGH DENSITY MEMORY AND MULTILEVEL MEMORY ELEMENT, AND METHOD FOR MANUFACTURING SAME | UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) |
| WO/2021/172821 | METHOD FOR CONNECTING FLEXIBLE PRINTED CIRCUIT BOARDS | HANWHA SOLUTIONS CORPORATION |
| WO/2021/172850 | METHOD AND APPARATUS FOR MANUFACTURING STACKED STRUCTURE OF FLEXIBLE PRINTED CIRCUIT BOARD CONTAINING TERNARY COMPOUND | FLEX-E VISION CO.,LTD. |
| WO/2021/187764 | PRINTED CIRCUIT BOARD COMPRISING GROUND WIRE | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/177646 | DISPLAY MODULE AND METHOD FOR MANUFACTURING DISPLAY MODULE | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/172909 | MULTI-WAVELENGTH LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/201441 | DEVICE AND METHOD FOR ELIMINATING FOREIGN SUBSTANCE ON SUBSTRATE | STEMCO CO., LTD. |
| WO/2021/177673 | A SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND A MANUFACTURING METHOD USING THE SAME | LG ELECTRONICS INC. |
| WO/2021/177704 | LAMINATE FOR FLEXIBLE CIRCUIT BOARD HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS CHARACTERISTIC | KOREA TACONIC CO., LTD |
| WO/2021/182790 | PRINTED CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/177777 | CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/182825 | LIGHTING MODULE AND LIGHTING DEVICE COMPRISING SAME | LG INNOTEK CO., LTD. |
| WO/2021/182826 | LIGHTING MODULE AND LIGHTING DEVICE COMPRISING SAME | LG INNOTEK CO., LTD. |
| WO/2021/182920 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/182925 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/201466 | PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAND AND ELECTRONIC DEVICE COMPRISING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/230493 | ELECTRONIC DEVICE INCLUDING DISPLAY AND CAMERA | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/251601 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/215693 | LIGHT-EMITTING ELEMENT INK AND METHOD FOR MANUFACTURING DISPLAY APPARATUS | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/225284 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/201646 | DISPLAY MODULE AND METHOD FOR MANUFACTURING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/225290 | ELECTRONIC DEVICE COMPRISING INTERPOSER | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/235689 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/206460 | HIGH-DENSITY INTERCONNECTION PRINTED CIRCUIT BOARD HAVING PLATING LAYERS, AND METHOD FOR MANUFACTURING SAME | YMT CO.,LTD. |
| WO/2021/221347 | ELECTRONIC DEVICE COMPRISING FLEXIBLE CIRCUIT BOARD INCLUDING CONNECTION ELEMENT | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/210941 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/251612 | MATRIX ARRAY MICROCHIP MODULE AND MANUFACTURING METHOD THEREOF | IDC KOREA CO., LTD. |
| WO/2021/215784 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/215823 | DISPLAY MODULE | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/215833 | PIXEL, DISPLAY APPARATUS COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/230520 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/215879 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/221408 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/221422 | ELECTRONIC DEVICE COMPRISING SENSOR | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/221438 | FULL-COLOR LED DISPLAY USING MICRO-NANOPIN LED ELEMENTS, AND METHOD FOR PRODUCING SAME | KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION |
| WO/2021/241896 | MICRO-NANO PIN LED ELECTRODE ASSEMBLY, MANUFACTURING METHOD THEREFOR, AND LIGHT SOURCE INCLUDING SAME | KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION |
| WO/2021/225323 | INTERPOSER STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/235721 | METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD | COMET NETWORK CO., LTD |
| WO/2021/221454 | DISPLAY MODULE COMPRISING JUNCTION STRUCTURE BETWEEN MICRO LED AND TFT LAYER | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/261744 | THREE-DIMENSIONAL FLASH MEMORY COMPRISING BACK GATE | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| WO/2021/225341 | DISPLAY MODULE INCLUDING GLASS SUBSTRATE HAVING SIDE WIRING FORMED THEREIN AND MANUFACTURING METHOD THEREFOR | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/225353 | 3D FLASH MEMORY WITH IMPROVED STRUCTURE | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| WO/2021/261757 | LIGHT EMITTING DIODE MODULE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE MODULE | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/241903 | THREE-DIMENSIONAL FLASH MEMORY FOR PROMOTING INTEGRATION, AND MANUFACTURING METHOD THEREFOR | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| WO/2021/246664 | THREE-DIMENSIONAL FLASH MEMORY FOR IMPROVING LEAKAGE CURRENT | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| WO/2021/251626 | FERROELECTRIC MATERIAL-BASED 2D FLASH MEMORY AND SEMICONDUCTOR FILM FORMING SYSTEM FOR MANUFACTURING SAME | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| WO/2021/235744 | IMAGE SENSOR PACKAGE AND CAMERA DEVICE INCLUDING SAME | LG INNOTEK CO., LTD. |
| WO/2021/230630 | LIGHT-EMITTING DEVICE FOR DISPLAY AND DISPLAY DEVICE HAVING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/230657 | FINGERPRINT SENSOR AND ELECTRONIC DEVICE COMPRISING FINGERPRINT SENSOR | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/230671 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/246682 | PRINTED CIRCUIT BOARD TRANSMITTING HIGH-FREQUENCY BAND SIGNAL, AND ELECTRONIC DEVICE COMPRISING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/235805 | ELECTRONIC DEVICE INCLUDING A PLURALITY OF CAMERAS | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/246685 | OPTICAL FINGERPRINT RECOGNITION SENSOR MODULE AND ELECTRONIC DEVICE USING SAME | PARTRON CO., LTD. |
| WO/2021/241937 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/235877 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/242012 | PACKAGE SUBSTRATE | LG INNOTEK CO., LTD. |
| WO/2021/246741 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/246760 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/246767 | METHOD FOR MOUNTING CONDUCTIVE BALL BY USING ELECTROSTATIC CHUCK | PROTEC CO., LTD. |
| WO/2021/261793 | ELECTRONIC DEVICE COMPRISING INTERPOSER FOR ENCOMPASSING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/256742 | ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/246825 | THREE-DIMENSIONAL FLASH MEMORY BASED ON FERROELECTRIC MATERIAL AND OPERATING METHOD THEREOF | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| WO/2021/261807 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY MODULE COMPRISING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/256771 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/251763 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/251794 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/251795 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/256790 | METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD | LG ENERGY SOLUTION, LTD. |
| WO/2021/261832 | CIRCUIT BOARD ASSEMBLY MANUFACTURING METHOD, CIRCUIT BOARD ASSEMBLY MANUFACTURED BY SAME, AND ELECTRIC VEHICLE INCLUDING SAME | LG ENERGY SOLUTION, LTD. |
| WO/2021/256869 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/261854 | CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/261933 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/242074 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/235920 | CIRCUIT BOARD | LG INNOTEK CO., LTD. |
| WO/2021/133165 | AN INTEGRATED CIRCUIT SUBSTRATE HAVING A RECESS FOR RECEIVING A SOLDER FILLET | QDOS FLEXCIRCUITS SDN BHD |
| WO/2021/034193 | ELECTRONIC COMPONENT ON FLEXIBLE SUBSTRATE | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
| WO/2021/040524 | ELECTRONIC DEVICE WITH MULTILAYER LAMINATE | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
| WO/2021/177827 | PROCESS OF MANUFACTURING AN X-RAY IMAGING DEVICE AND TO AN X-RAY IMAGING DEVICE PRODUCED BY SUCH A PROCESS | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
| WO/2021/206541 | CONTROLLED DEPOSITION METHOD OF A DONOR MATERIAL ONTO A TARGET SURFACE AND PLATE THEREFOR | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
| WO/2021/215929 | PATTERN TRANSFER OF HIGH VISCOSITY MATERIAL | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
| WO/2021/230746 | TRANSFERRING VISCOUS MATERIALS | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
| WO/2021/177863 | PRINTED CIRCUIT BOARD HAVING A COOLING RADIATOR | OBSCHESTVO S OGRANICHENNOY OTVETSTVENNOSTIY "DONELECTROINTEL" |
| WO/2021/262067 | IMAGE SENSOR WITH NANOSTRUCTURE-BASED CAPACITORS | SMOLTEK AB |
| WO/2021/061052 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE THEREOF | NEW SILICON CORPORATION PTE LTD |
| WO/2021/076059 | MANUFACTURING AND TAPE TRANSFER METHOD FOR A PATTERNED PREFORM | HERAEUS MATERIALS SINGAPORE PTE. LTD. |
| WO/2021/118468 | THIN FILM-BASED MICROFLUIDIC ELECTRONIC DEVICE, METHOD OF FORMING THEREOF, AND SKIN AND TISSUE ADHESIVE APPLICATIONS | SINGAPORE UNIVERSITY OF TECHNOLOGY AND DESIGN |
| WO/2021/137762 | A METHOD OF MANUFACTURING A PLURALITY OF OPTOELECTRONIC MODULES | AMS SENSORS ASIA PTE. LTD. |
| WO/2021/230812 | WAFER LEVEL CHIP SCALE PACKAGING | AMS SENSORS ASIA PTE. LTD. |
| WO/2021/236022 | SYSTEM, METHOD, DEVICE AND DATA STRUCTURE FOR DIGITAL PIXEL SENSORS | BRILLNICS SINGAPORE PTE. LTD. |
| WO/2021/256990 | IMAGE SENSORS | AMS SENSORS SINGAPORE PTE. LTD. |
| WO/2021/040679 | CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS | HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
| WO/2021/112872 | DISPLAYS WITH MULTIPLE SIZES OF LIGHTING ELEMENTS | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
| WO/2021/118525 | OPTICALLY CLEAR RESIN COMPOSITION, FLEXIBLE OPTICAL FILM AND IMAGE DISPLAY DEVICE | ARES MATERIALS INC. |
| WO/2021/158241 | METHOD AND APPARATUS FOR THE MANUFACTURE OF SILICON VIA SUBSTRATE | INNOVENT TECHNOLOGIES, LLC |
| WO/2021/162680 | DUAL PLATE OLET DISPLAYS | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
| WO/2021/183095 | CLAMPS FOR POWER TRANSISTORS | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
| WO/2021/091587 | PACKAGED ELECTRONIC MODULE AND MANUFACTURING METHOD THEREOF | LALO, Cyril |
| WO/2021/066875 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT-LEVEL BIT-LINE-CONNECTION STRUCTURES AND METHODS OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/107970 | BONDED ASSEMBLY CONTAINING LATERALLY BONDED BONDING PADS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/055009 | FERROELECTRIC MEMORY DEVICES WITH DUAL DIELECTRIC CONFINEMENT AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/029915 | FERROELECTRIC MEMORY DEVICES INCLUDING A STACK OF FERROELECTRIC AND ANTIFERROELECTRIC LAYERS AND METHOD OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/107971 | BONDED ASSEMBLY CONTAINING HORIZONTAL AND VERTICAL BONDING INTERFACES AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/029916 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ALTERNATING STACK OF SOURCE LAYERS AND DRAIN LAYERS AND VERTICAL GATE ELECTRODES | SANDISK TECHNOLOGIES LLC |
| WO/2021/015826 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SELF-ALIGNED DIELECTRIC ISOLATION REGIONS FOR CONNECTION VIA STRUCTURES AND METHOD OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/080641 | REUSABLE SUPPORT SUBSTRATE FOR FORMATION AND TRANSFER OF SEMICONDUCTOR DEVICES AND METHODS OF USING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/086430 | VARIABLE DIE SIZE MEMORY DEVICE AND METHODS OF MANUFACTURING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/015827 | BONDED DIE ASSEMBLY CONTAINING PARTIALLY FILLED THROUGH-SUBSTRATE VIA STRUCTURES AND METHODS FOR MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/025730 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING EPITAXIAL FERROELECTRIC MEMORY ELEMENTS AND METHODS FOR FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/086431 | METHOD OF FORMING A THREE-DIMENSIONAL MEMORY DEVICE AND A DRIVER CIRCUIT ON OPPOSITE SIDES OF A SUBSTRATE | SANDISK TECHNOLOGIES LLC |
| WO/2021/021253 | BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/107973 | THREE-DIMENSIONAL FERROELECTRIC MEMORY ARRAY INCLUDING INTEGRATED GATE SELECTORS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/118621 | THREE-DIMENSIONAL NOR ARRAY INCLUDING ACTIVE REGION PILLARS AND METHOD OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/118622 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SPLIT MEMORY CELLS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/071545 | THREE-DIMENSIONAL MEMORY DIE CONTAINING STRESS-COMPENSATING SLIT TRENCH STRUCTURES OR STRESS-ABSORBING SEAL RING STRUCTURES AND METHODS FOR MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/050114 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING FERROELECTRIC MEMORY ELEMENTS ENCAPSULATED BY TRANSITION METAL-CONTAINING CONDUCTIVE ELEMENTS AND METHOD OF MAKING THEREOF | SANDISK TECHNOLOGIES LLC |
| WO/2021/133427 | THREE-DIMENSIONAL NOR ARRAY INCLUDING VERTICAL WORD LINES AND DISCRETE CHANNELS AND METHODS OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/040809 | EMBEDDED BONDED ASSEMBLY AND METHOD FOR MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/118627 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PLURAL WORK FUNCTION WORD LINES AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/133428 | BONDING PADS INCLUDING SELF-ALIGNED DIFFUSION BARRIER LAYERS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/055015 | ADDITIVE MANUFACTURING TECHNOLOGY (AMT) INVERTED PAD INTERFACE | RAYTHEON COMPANY |
| WO/2021/216039 | NANOWIRE LIGHT EMITTING DIODES WITH DIRECTIONAL EMISSION AND DISPLAYS INCLUDING THE SAME | GOOGLE LLC |
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| WO/2021/002942 | ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH THREE OR MORE DIFFERENT MATERIALS | MICRON TECHNOLOGY, INC. |
| WO/2021/029931 | APPARATUS WITH CIRCUIT-LOCATING MECHANISM | MICRON TECHNOLOGY, INC. |
| WO/2021/154325 | BONDED ASSEMBLY WITH VERTICAL POWER AND CONTROL SIGNAL CONNECTION ADJACENT TO SENSE AMPLIFIER REGIONS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/167639 | THREE-DIMENSIONAL MEMORY DEVICE WITH COMPOSITE CHARGE STORAGE STRUCTURES AND METHODS FOR FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/145916 | BONDING PADS INCLUDING INTERFACIAL ELECTROMIGRATION BARRIER LAYERS AND METHODS OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/141616 | FERROELECTRIC TUNNEL JUNCTION MEMORY DEVICE WITH INTEGRATED OVONIC THRESHOLD SWITCHES AND METHODS OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/173172 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MOLYBDENUM WORD LINES AND METAL OXIDE SPACERS AND METHOD OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
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| WO/2021/034372 | TREATMENT DURING FABRICATION OF A QUANTUM COMPUTING DEVICE TO INCREASE CHANNEL MOBILITY | MICROSOFT TECHNOLOGY LICENSING, LLC |
| WO/2021/150265 | BONDED ASSEMBLY OF SEMICONDUCTOR DIES CONTAINING PAD LEVEL ACROSS-DIE METAL WIRING AND METHOD OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
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| WO/2021/251985 | METHOD FOR CONNECTING SURFACE-MOUNT ELECTRONIC COMPONENTS TO A CIRCUIT BOARD | NCC NANO, LLC |
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| WO/2021/040860 | NITROGEN-RICH SILICON NITRIDE FILMS FOR THIN FILM TRANSISTORS | APPLIED MATERIALS, INC. |
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| WO/2021/096616 | METHOD OF MAKING 3D SOURCE DRAINS WITH HYBRID STACKING FOR OPTIMUM 3D LOGIC LAYOUT | TOKYO ELECTRON LIMITED |
| WO/2021/072161 | OPTICAL COUPLING LAYER TO IMPROVE OUTPUT FLUX IN LIGHT EMITTING DIODES | LUMILEDS LLC |
| WO/2021/194552 | FINFET SPLIT GATE NON-VOLATILE MEMORY CELLS WITH ENHANCED FLOATING GATE TO FLOATING GATE CAPACITIVE COUPLING | SILICON STORAGE TECHNOLOGY, INC. |
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| WO/2021/086646 | INTEGRATED ASSEMBLIES HAVING SHIELD LINES BETWEEN NEIGHBORING TRANSISTOR ACTIVE REGIONS | MICRON TECHNOLOGY, INC. |
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| WO/2021/077104 | ELECTRO-OPTICAL DEVICE FABRICATED ON A SUBSTRATE AND COMPRISING FERROELECTRIC LAYER EPITAXIALLY GROWN ON THE SUBSTRATE | PSIQUANTUM CORP. |
| WO/2021/101650 | BONDING OF LIGHT EMITTING DIODE ARRAYS | FACEBOOK TECHNOLOGIES, LLC |
| WO/2021/108046 | LED ARRAY HAVING TRANSPARENT SUBSTRATE WITH CONDUCTIVE LAYER FOR ENHANCED CURRENT SPREAD | FACEBOOK TECHNOLOGIES, LLC |
| WO/2021/081300 | PIGMENTED AND SCATTERING PARTICLES IN SIDE COATING MATERIALS FOR LED APPLICATIONS | LUMILEDS LLC |
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| WO/2021/091743 | SINGLE STEP ELECTROLYTIC METHOD OF FILLING THROUGH HOLES IN PRINTED CIRCUIT BOARDS AND OTHER SUBSTRATES | MACDERMID ENTHONE INC. |
| WO/2021/087109 | TEXTURING FOR HIGH DENSITY PIXELATED-LED CHIPS | CREE, INC. |
| WO/2021/087216 | PIXEL WITH ENHANCED DRAIN | QUANTUM-SI INCORPORATED |
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| WO/2021/091824 | METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING SLOTTED LAYERS | RAYTHEON COMPANY |
| WO/2021/113000 | METHODS OF FORMING CHARGE-BLOCKING MATERIAL, AND INTEGRATED ASSEMBLIES HAVING CHARGE-BLOCKING MATERIAL | MICRON TECHNOLOGY, INC. |
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| WO/2021/092463 | SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM PRINTED CIRCUIT BOARDS | TTM TECHNOLOGIES INC. |
| WO/2021/113029 | HIGH PERFORMANCE CMOS USING 3D DEVICE LAYOUT | TOKYO ELECTRON LIMITED |
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| WO/2021/137945 | METHOD OF MAKING SIX TRANSISTOR SRAM CELL USING CONNECTIONS BETWEEN 3D TRANSISTOR STACKS | TOKYO ELECTRON LIMITED |
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| WO/2021/222920 | ELECTRONIC STRUCTURES COMPRISING MULTIPLE, ADJOINING HIGH‑K DIELECTRIC MATERIALS AND RELATED ELECTRONIC DEVICES, SYSTEMS, AND METHODS | MICRON TECHNOLOGY, INC. |
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