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2021年美国局半导体零配件领域的专利竞争态势——台湾积体电路制造公司、三星电子公司、国际商业机器公司领先

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陈立新张琳黄颖：中美欧日韩五局专利报告2645.doc

█武汉大学科教管理与评价研究中心陈立新张琳黄颖

微信号：chenlixinip5

第二部分 2021年美国发明专利统计分析报告

17 不同技术领域下世界各国及机构的在美专利布局和竞争

17.39 半导体零配件领域的专利竞争态势

第39个技术领域是半导体零配件，主要包括安装架、密封层、支架、冷却装置、防辐射保护装置等半导体通用零部件。2021年，美国专利商标局在该领域共授权专利6512项（增长率为-10%），占总授权量的2%，是专利数量第49多的领域。

2021年，美国在该领域获得专利权2052项，占该领域专利授权总量的28%。中国在该领域做出专利发明323项，获得专利权339项，流失专利发明-16项。日本和韩国获得的专利权数量分别为1184和748项。

表17.39-1 2021年各国半导体零配件领域的在美专利发明和专利权数量

	国家和地区	发明数量	专利权数量	净流失数量	专利流失率	发明份额	专利权份额	份额流失量
1	美国	1845	2052	-207	-11.2%	28.3%	31.5%	-3.2%
2	日本	1265	1184	81	6.4%	19.4%	18.2%	1.2%
3	韩国	794	748	46	5.8%	12.2%	11.5%	0.7%
4	中国	323	339	-16	-5.0%	5.0%	5.2%	-0.2%
5	德国	204	205	-1	-0.5%	3.1%	3.1%	0.0%
6	法国	81	71	10	12.3%	1.2%	1.1%	0.2%
7	加拿大	34	20	14	41.2%	0.5%	0.3%	0.2%
8	英国	28	28	0	0.0%	0.4%	0.4%	0.0%
9	瑞士	20	23	-3	-15.0%	0.3%	0.4%	0.0%
10	荷兰	22	35	-13	-59.1%	0.3%	0.5%	-0.2%
11	瑞典	6	8	-2	-33.3%	0.1%	0.1%	0.0%
12	以色列	36	7	29	80.6%	0.6%	0.1%	0.4%
13	意大利	31	23	8	25.8%	0.5%	0.4%	0.1%
14	印度	18	1	17	94.4%	0.3%	0.0%	0.3%
15	其他	1805	1768	37	2.0%	27.7%	27.1%	0.6%
	小计	6512	6512	0	0%	100%	100%	0%

注：本表分别按照专利第一发明人和第一权利人进行统计（中国的数据暂未包含香港、澳门、台湾地区的专利）。

图17.39-1 2021年各国半导体零配件领域的在美专利发明和专利权数量对比

2021年，在半导体零配件领域上获得美国专利授权最多的机构是台湾积体电路制造公司、三星电子公司、国际商业机器公司。中国专利最多的机构是台湾积体电路制造公司，获得887项专利。

表17.39-2 2021年半导体零配件领域在美专利授权前10机构

	机构名称	国家	机构英文名称	2021	2020
1	台湾积体电路制造公司	中国	TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.	887	945
2	三星电子公司	韩国	SAMSUNG ELECTRONICS CO., LTD.	445	468
3	国际商业机器公司	美国	INTERNATIONAL BUSINESS MACHINES CORPORATION	347	415
4	英特尔公司	美国	INTEL CORPORATION	292	291
5	美光科技公司	美国	MICRON TECHNOLOGY, INC.	197	217
6	日月光半导体公司	中国	ADVANCED SEMICONDUCTOR ENGINEERING, INC.	125	89
7	德州仪器公司	美国	TEXAS INSTRUMENTS INCORPORATED	116	159
8	三菱电机公司	日本	MITSUBISHI ELECTRIC CORPORATION	115	110
9	英飞凌科技公司	德国	INFINEON TECHNOLOGIES AG	104	100
10	东芝存储器株式会社	日本	TOSHIBA MEMORY CORPORATION	95	118

注：本表数据按照第一权利人进行统计。

图17.39-2 2021年半导体零配件领域在美专利授权前10机构

致谢

感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时，向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。

如需要中美欧日韩五局及PCT专利数据、专利报告，以及咨询相关专利问题请添加微信号。

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附表 2021年该领域美国授权专利

PATENT NO.	TITLE	ASSIGNEE
10882258	Microchip affixing probe and method of use	PHARMASEQ, INC.
10882280	Magnetic articles	VIAVI SOLUTIONS INC.
10882298	System for adjusting relative positions between components of a bonding apparatus	ASM TECHNOLOGY SINGAPORE PTE LTD
10882736	Semiconductor structures provided within a cavity and related design structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10882737	Through silicon interposer wafer and method of manufacturing the same	AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
10882738	Wafer level package for a mems sensor device and corresponding manufacturing process	STMICROELECTRONICS (MALTA) LTD
10882740	Wafer-level package with enhanced performance and manufacturing method thereof	QORVO US, INC.
10882778	Glass substrate, laminated substrate, laminate, and method for producing semiconductor package	AGC INC.
10883694	Method of manufacturing an LED lighting assembly	LUMILEDS LLC
10883770	Loop type heat pipe	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10883777	Shape memory material based thermal coupler/decoupler and method	RAYTHEON COMPANY
10883953	Semiconductor device for sensing impedance changes in a medium	TEXAS INSTRUMENTS INCORPORATED
10884185	Semiconductor device including vertically integrated optical and electronic devices and comprising a superlattice	ATOMERA INCORPORATED
10884450	Clock distribution system	NORTHROP GRUMMAN SYSTEMS CORPORATION
10884560	Integrated light-emitting pixel arrays based devices by bonding	--
10884955	Stacked and folded above motherboard interposer	MORGAN/WEISS TECHNOLOGIES INC.
10885296	Electronic device and fingerprint sensing method	GUANGZHOU TYRAFOS SEMICONDUCTOR TECHNOLOGIES CO., LTD
10885421	RFID integrated circuits with antenna contacts on multiple surfaces	IMPINJ, INC.
10885811	Method of using hand-made circuit board for learning	AIDMICS BIOTECHNOLOGY (HK) CO., LIMITED
10885946	Stacked DRAM device and method of manufacture	RAMBUS INC.
10885971	Multi-die memory device	RAMBUS INC.
10885978	Nonvolatile nanotube switches with reduced switching voltages and currents	NANTERO, INC.
10886049	Coiled coupled-line hybrid coupler	NORTHROP GRUMMAN SYSTEMS CORPORATION
10886119	Aromatic underlayer	ROHM AND HAAS ELECTRONIC MATERIALS LLC
10886124	Multi-state device based on ion trapping	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886139	Method of etching one or more of mixed metal and dielectric layers of a semiconductor device	TESCAN BRNO, S.R.O.
10886145	Production of a multi-chip component	OSRAM OLED GMBH
10886146	Copper foil with carrier, production method for same, production method for coreless support with wiring layer, and production method for printed circuit board	MITSUI MINING & SMELTING CO., LTD.
10886149	Semiconductor device package and method of manufacturing the same	--
10886152	Method and system for dual stretching of wafers for isolated segmented chip scale packages	LUMILEDS LLC
10886153	Display including an LED element having a pressure sensitive adhesive (PSA) for micro pick and bond assembly of the display	INTEL CORPORATION
10886166	Dielectric surface modification in sub-40nm pitch interconnect patterning	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886168	Surface modified dielectric refill structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886169	Airgap formation in BEOL interconnect structure using sidewall image transfer	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886170	Method of forming tungsten film	TOKYO ELECTRON LIMITED
10886171	Rlink-on-die interconnect features to enable signaling	INTEL CORPORATION
10886172	Methods for wordline separation in 3D-NAND devices	APPLIED MATERIALS, INC.
10886175	Differentiated molecular domains for selective hardmask fabrication and structures resulting therefrom	INTEL CORPORATION
10886177	3D chip with shared clock distribution network	XCELSIS CORPORATION
10886178	Device with highly active acceptor doping and method of production thereof	GLOBALFOUNDRIES INC.
10886181	Semiconductor device	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
10886184	Test condition determining apparatus and test condition determining method	MITSUBISHI ELECTRIC CORPORATION
10886186	Semiconductor package system	INFINEON TECHNOLOGIES AG
10886187	Thermal management in integrated circuit using phononic bandgap structure	TEXAS INSTRUMENTS INCORPORATED
10886188	Electronic component-incorporating substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10886189	Semiconductor die with improved ruggedness	CREE, INC.
10886190	Devices and methods for heat dissipation of semiconductor integrated circuits	--
10886191	Heat transfer plate	ROBERT BOSCH GMBH
10886192	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10886193	Thermal interface material	PARKER-HANNIFIN CORPORATION
10886194	Radiator component and heat dissipation system for power semiconductor device	SIEMENS AKTIENGESELSCHAFT
10886195	Systems and methods for improved through-silicon-vias	INTEL CORPORATION
10886196	Semiconductor devices having conductive vias and methods of forming the same	MICRON TECHNOLOGY, INC.
10886197	Controlling via critical dimension with a titanium nitride hard mask	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886198	Robust electronics mounting device	CREE, INC.
10886199	Molded semiconductor package with double-sided cooling	INFINEON TECHNOLOGIES AG
10886200	Power module and manufacturing method thereof	DELTA ELECTRONICS (SHANGHAI) CO., LTD.
10886201	Power device having a substrate with metal layers exposed at surfaces of an insulation layer and manufacturing method thereof	--
10886202	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10886203	Packaging structure with recessed outer and inner lead surfaces	ROHM CO., LTD.
10886204	Semiconductor device with lead terminals having portions thereof extending obliquely	ROHM CO., LTD.
10886205	Terminal structure and semiconductor module	FUJI ELECTRIC CO., LTD.
10886206	Lead frame, resin-equipped lead frame, optical semiconductor device, and method for manufacturing lead frame	OHKUCHI MATERIALS CO., LTD.
10886207	Semiconductor device	DENSO CORPORATION
10886208	Semiconductor device package, electronic assembly and method for manufacturing the same	--
10886209	Multiple-layer, self-equalizing interconnects in package substrates	INTEL CORPORATION
10886210	Cover for an electronic device and method of fabrication	STMICROELECTRONICS (GRENOBLE 2) SAS
10886211	Wiring board and semiconductor package	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10886212	Phase-change material (PCM) radio frequency (RF) switches with capacitive couplings between lower portions and upper portions of RF terminals	NEWPORT FAB, LLC
10886213	Semiconductor device	RENESAS ELECTRONICS CORPORATION
10886214	Semiconductor device and method for manufacturing same	MICRON TECHNOLOGY, INC.
10886215	Interconnect structure and related methods	IMEC VZW
10886216	Electric fuse structure for optimizing programming current window of the electric fuse structure and manufacturing method	SHANGHAI HUALI INTEGRATED CIRCUIT MFG. CO., LTD.
10886217	Integrated circuit device with back-side interconnection to deep source/drain semiconductor	INTEL CORPORATION
10886218	Fabric die to fabric die interconnect for modularized integrated circuit devices	INTEL CORPORATION
10886219	Electronic component mounting package	TDK CORPORATION
10886220	Semiconductor integrated circuit device	SOCIONEXT INC.
10886221	Semiconductor device	TOSHIBA MEMORY CORPORATION
10886222	Via contact, memory device, and method of forming semiconductor structure	--
10886223	Semiconductor package	--
10886224	Power distribution network using buried power rail	SAMSUNG ELECTRONICS CO., LTD.
10886225	BEOL alternative metal interconnects: integration and process	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886226	Conductive contact having staircase barrier layers	--
10886227	Semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
10886228	Improving size and efficiency of dies	INTEL CORPORATION
10886229	Controlling warp in semiconductor laminated substrates with conductive material layout and orientation	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886230	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10886231	Method of forming RDLS and structure formed thereof	--
10886232	Package structure and fabrication methods	APPLIED MATERIALS, INC.
10886233	Semiconductor device package and method of manufacturing the same	--
10886234	Semiconductor device and semiconductor package comprising the same	SAMSUNG ELECTRONICS CO., LTD.
10886235	Integrated shield package and method	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10886236	Interconnect structure	--
10886237	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10886238	Supporting InFO packages to reduce warpage	--
10886239	Customisation of an integrated circuit during the realisation thereof	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10886240	Method for protecting an integrated circuit, and corresponding device	STMICROELECTRONICS (ROUSSET) SAS
10886241	Semiconductor package structure	--
10886242	Antenna module	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10886243	Fan-out antenna packaging structure and preparation thereof	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
10886244	Collars for under-bump metal structures and associated systems and methods	MICRON TECHNOLOGY, INC.
10886245	Semiconductor structure, 3DIC structure and method of fabricating the same	--
10886246	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10886247	Power converter	MITSUBISHI ELECTRIC CORPORATION
10886248	Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10886249	Hybrid wafer-to-wafer bonding and methods of surface preparation for wafers comprising an aluminum metalization	AMS INTERNATIONAL AG
10886250	Structures and methods for low temperature bonding using nanoparticles	INVENSAS CORPORATION
10886251	Multi-layered composite bonding materials and power electronics assemblies incorporating the same	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
10886252	Method of bonding semiconductor substrates	IMEC VZW
10886253	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10886254	Flip-chip electronic device with carrier having heat dissipation elements free of solder mask	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886255	Die stack structure, semiconductor package having the same and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10886256	Methods and systems for wafer bonding alignment compensation	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10886262	Light bulb	--
10886263	Stacked semiconductor package assemblies including double sided redistribution layers	--
10886264	Manufacturing method of light-emitting diode package structure	--
10886276	Semiconductor memory device and method of fabricating the same	SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
10886277	Methods of manufacturing devices including a buried gate cell and a bit line structure including a thermal oxide buffer pattern	SAMSUNG ELECTRONICS CO., LTD.
10886278	Method of forming an array of capacitors, a method of forming DRAM circuitry, and a method of forming an elevationally-elongated conductive structure of integrated circuitry	MICRON TECHNOLOGY, INC.
10886283	Compact antifuse element and fabrication process	STMICROELECTRONICS (ROUSSET) SAS
10886284	Anti-fuse with reduced programming voltage	INTERNATIONAL BUSINESS MACHINES CORPORATION
10886286	Vertical memory control circuitry located in interconnect layers	INTEL CORPORATION
10886295	Semiconductor storage device	TOSHIBA MEMORY CORPORATION
10886299	Semiconductor memory device and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10886300	Semiconductor device	ROHM CO., LTD.
10886307	Flexible electronic device	--
10886315	Photosensitive assembly and formation methods thereof, lens module, and electronic device	NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
10886316	Linear image sensor and method for manufacturing same	HAMAMATSU PHOTONICS K.K.
10886326	Display device	SAMSUNG DISPLAY CO., LTD.
10886330	Memory device having overlapping magnetic tunnel junctions in compliance with a reference pitch	SPIN MEMORY, INC.
10886348	Display device	SAMSUNG DISPLAY CO., LTD.
10886354	Display device	SAMSUNG DISPLAY CO., LTD.
10886357	Circuit for preventing static electricity and display device having the same	SAMSUNG DISPLAY CO., LTD.
10886361	Semiconductor devices including resistor structures	SAMSUNG ELECTRONICS CO., LTD.
10886378	Method of forming air-gap spacers and gate contact over active region and the resulting device	GLOBALFOUNDRIES INC.
10886383	Replacement gate structures for advanced integrated circuit structure fabrication	INTEL CORPORATION
10886394	Semiconductor structure	--
10886395	Method for fabricating tunneling field effect transistor having interfacial layer containing nitrogen	--
10886404	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10886426	Method for producing an electronic device and electronic device	OSRAM OLED GMBH
10886440	Wavelength converted semiconductor light emitting device	LUMILEDS LLC
10886465	Resistive random access memory device	--
10886593	Structure of integrated radio frequency multi-chip package and method of fabricating the same	--
10886594	Packaging structure and packaging method for antenna	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
10886606	Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems	INTEL CORPORATION
10886704	Semiconductor laser and method for producing a semiconductor laser	OSRAM OLED GMBH
10886730	Filter having an ESD protection device	MURATA MANUFACTURING CO., LTD.
10886846	Power converter with switching control	TEXAS INSTRUMENTS INCORPORATED
10886862	Semiconductor device	JTEKT CORPORATION
10886921	Multi-chip stacked devices	XILINX, INC.
10886924	Logic drive using standard commodity programmable logic IC chips	--
10887947	Transistor implemented heat source	--
10887977	Hybrid component carrier and method for manufacturing the same	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
10887978	Expanding thermal device and system for effecting heat transfer within electronics assemblies	RAYTHEON COMPANY
10887979	Low cycle fatigue prevention	HAMILTON SUNDSTRAND CORPORATION
10887985	Wiring substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10887994	Antenna substrate and antenna module including the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10888000	Manufacturing method of circuit board and of semiconductor device including the same	--
10888003	Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board	MITSUI MINING & SMELTING CO., LTD.
10888031	Memory device with memory modules located within liquid coolant chamber	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
10888032	Apparatus for liquid immersion cooling, system for liquid immersion cooling, and method of cooling electronic device	FUJITSU LIMITED
10888040	Double-sided module with electromagnetic shielding	QORVO US, INC.
10888257	Connectors for making connections between analyte sensors and other devices	ABBOTT DIABETES CARE INC.
10888929	Sheet and composite sheet	NITTO DENKO CORPORATION
10888940	Systems and methods for saw tooth milling to prevent chip fraud	CAPITAL ONE SERVICES, LLC
10888941	Power semiconductor module	HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
10888957	Soldering material	SENJU METAL INDUSTRY CO., LTD.
10888958	Hybrid high temperature lead-free solder preform	INDIUM CORPORATION
10889082	Laminated structure and method for producing the same	SONY CORPORATION
10889492	Methods for producing thin-film layers and microsystems having thin-film layers	INFINEON TECHNOLOGIES AG
10889899	Ceramic laminate, ceramic insulating substrate, and method for manufacturing ceramic laminate	NIPPON STEEL CORPORATION
10889900	Ceramic laminate	NIPPON STEEL CORPORATION
10890360	Heat exchanger	SHINWA CONTROLS, CO., LTD.
10890382	Heat dissipation device	--
10890385	Apparatus and system for exchanging heat with a fluid	ETALIM INC.
10890387	Heat sinks with vibration enhanced heat transfer	UNITED ARAB EMIRATES UNIVERSITY
10890553	Sensing device, sensing apparatus and sensing system	--
10890809	Display substrate and display device	BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
10890813	Electronic device having a first electronic component and a second electronic component connected by wiring, and manufacturing method therefor	OMRON CORPORATION
10891402	Active shield for detecting an intrusion on an integrated circuit	NAGRAVISION S.A.
10891459	Fingerprint sensor module and method for manufacturing a fingerprint sensor module	FINGERPRINT CARDS AB
10892011	Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells	--
10892080	Tunable inductor arrangement, transceiver, method, and computer program	TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
10892087	On-chip inductors	MARVELL ASIA PTE, LTD.
10892099	Fringe capacitor for high resolution ADC	NXP USA, INC.
10892159	Semipolar or nonpolar group III-nitride substrates	SAPHLUX, INC.
10892161	Enhanced selective deposition process	APPLIED MATERIALS, INC.
10892163	Semiconductor device with side wall protection film for bond pad and wiring	ABLIC INC.
10892169	3D semiconductor device and structure	MONOLITHIC 3D INC.
10892170	Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader	INTERNATIONAL BUSINESS MACHINES CORPORATION
10892185	Semiconductor device including a blocking pattern in an interconnection line	SAMSUNG ELECTRONICS CO., LTD.
10892187	Method for creating a fully self-aligned via	MICROMATERIALS LLC
10892189	Method for manufacturing a semiconductor device having a dummy section	LAPIS SEMICONDUCTOR CO., LTD.
10892192	Non-planar I/O and logic semiconductor devices having different workfunction on common substrate	INTEL CORPORATION
10892199	Semiconductor package structure, product and method for manufacturing the same	--
10892200	Semiconductor apparatus and electric power conversion apparatus	MITSUBISHI ELECTRIC CORPORATION
10892201	Electronic device comprising a support substrate and an encapsulating cover for an electronic component	STMICROELECTRONICS (GRENOBLE 2) SAS
10892202	External gettering method and device	MICRON TECHNOLOGY, INC.
10892203	Power semiconductor module	MITSUBISHI ELECTRIC CORPORATION
10892204	Electromagnetic wave absorbing heat conductive sheet, method for producing electromagnetic wave absorbing heat conductive sheet, and semiconductor device	DEXERIALS CORPORATION
10892205	Package structure and power module using same	DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
10892206	Methods of forming power electronic assemblies using metal inverse opal structures and encapsulated-polymer spheres	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
10892207	Power module	ROBERT BOSCH GMBH
10892208	Heat dissipation apparatus and method for power semiconductor devices	BEIJING E. MOTOR ADVANCE CO. LTD.
10892209	Semiconductor device with metal die attach to substrate with multi-size cavity	TEXAS INSTRUMENTS INCORPORATED
10892210	Package structures	--
10892211	Side-solderable leadless package	SEMTECH CORPORATION
10892212	Flat no-lead package with surface mounted structure	STMICROELECTRONICS, INC.
10892213	Wiring structure and method for manufacturing the same	--
10892214	Semiconductor chip comprising a multiplicity of external contacts, chip arrangement and method for checking an alignment of a position of a semiconductor chip	INFINEON TECHNOLOGIES AG
10892215	Metal on both sides with power distributed through the silicon	INTEL CORPORATION
10892216	Wiring substrate and semiconductor device	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10892217	Wiring substrate and semiconductor device	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10892218	Semiconductor device	ROHM CO., LTD.
10892219	Molded embedded bridge for enhanced EMIB applications	INTEL CORPORATION
10892220	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
10892221	Transformer for a circuit in MMIC technology	THALES
10892222	Anti-fuse for an integrated circuit (IC) product and method of making such an anti-fuse for an IC product	GLOBALFOUNDRIES INC.
10892223	Advanced lithography and self-assembled devices	INTEL CORPORATION
10892224	Apparatuses comprising protective material along surfaces of tungsten-containing structures	MICRON TECHNOLOGY, INC.
10892225	Die interconnect structures and methods	INTEL CORPORATION
10892226	Power semiconductor module	LSIS CO., LTD.
10892227	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10892228	Method of manufacturing conductive feature and method of manufacturing package	--
10892229	Media shield with EMI capability for pressure sensor	NXP USA, INC.
10892230	Magnetic shielding material with insulator-coated ferromagnetic particles	--
10892231	Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof	GENERAL ELECTRIC COMPANY
10892232	Semiconductor device	TOSHIBA MEMORY CORPORATION
10892233	Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers	INTERNATIONAL BUSINESS MACHINES CORPORATION
10892234	Method for detecting a differential fault analysis attack and a thinning of the substrate in an integrated circuit, and associated integrated circuit	STMICROELECTRONICS (ROUSSET) SAS
10892235	Die seal ring and manufacturing method thereof	--
10892236	Integrated circuit having a periphery of input/output cells	QUALCOMM INCORPORATED
10892237	Methods of fabricating high voltage semiconductor devices having improved electric field suppression	GENERAL ELECTRIC COMPANY
10892238	Circuit structure and chip package	--
10892239	Bond pad reliability of semiconductor devices	GLOBALFOUNDRIES SINGAPORE PTE. LTD.
10892240	Semiconductor fabrication apparatus and semiconductor fabrication method	TOSHIBA MEMORY CORPORATION
10892241	Substrate device, electronic apparatus, and method for manufacturing substrate device	SONY CORPORATION
10892242	Resin composition, conductive copper paste, and semiconductor device	NAMICS CORPORATION
10892243	Anisotropic electrically conductive film and connection structure	DEXERIALS CORPORATION
10892244	Apparatus and method for securing substrates with varying coefficients of thermal expansion	CEREBRAS SYSTEMS INC.
10892245	Semiconductor switching device	ABB POWER GRIDS SWITZERLAND AG
10892246	Structures and methods for low temperature bonding using nanoparticles	INVENSAS CORPORATION
10892247	Soldering a conductor to an aluminum metallization	INFINEON TECHNOLOGIES AG
10892248	Multi-stacked die package with flexible interconnect	INTEL CORPORATION
10892249	Carrier and integrated memory	INTERNATIONAL BUSINESS MACHINES CORPORATION
10892250	Stacked package structure with encapsulation and redistribution layer and fabricating method thereof	--
10892251	Semiconductor device	TOSHIBA MEMORY CORPORATION
10892252	Face-to-face mounted IC dies with orthogonal top interconnect layers	XCELSIS CORPORATION
10892253	Semiconductor device manufacturing method and semiconductor device	FUJI ELECTRIC CO., LTD.
10892254	Defect-tolerant layout and packaging for GaN power devices	--
10892257	Foldable display device	--
10892265	Word line structure and method of manufacturing the same	--
10892267	Three-dimensional memory device containing through-memory-level contact via structures and method of making the same	SANDISK TECHNOLOGIES LLC
10892270	Semiconductor memory device having an array chip bonded to a circuit chip by a bonding metal	TOSHIBA MEMORY CORPORATION
10892272	Semiconductor memory devices including a stress relief region	SAMSUNG ELECTRONICS CO., LTD.
10892277	High-κ dielectric layer in three-dimensional memory devices and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10892283	Flexible display panel	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
10892284	Display substrate, manufacturing method thereof, and display device	BOE TECHNOLOGY GROUP CO., LTD.
10892285	Display panel and manufacturing method thereof	--
10892290	Interconnect layer contact and method for improved packaged integrated circuit reliability	OMNIVISION TECHNOLOGIES, INC.
10892291	Bonding pad architecture using capacitive deep trench isolation (CDTI) structures for electrical connection	STMICROELECTRONICS (CROLLES 2) SAS
10892303	Electronic device and manufacturing method for same	GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
10892310	Display device including a passivation layer having an uneven surface	SAMSUNG DISPLAY CO., LTD.
10892312	Flexible display device	LG DISPLAY CO., LTD.
10892316	High density ball grid array (BGA) package capacitor design	GOOGLE LLC
10892318	Semiconductor device and method for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10892326	Removal of a bottom-most nanowire from a nanowire device stack	INTEL CORPORATION
10892333	Method of making a gallium nitride device	INTERNATIONAL BUSINESS MACHINES CORPORATION
10892337	Backside source/drain replacement for semiconductor devices with metallization on both sides	INTEL CORPORATION
10892338	Scaled gate contact and source/drain cap	GLOBALFOUNDRIES INC.
10892341	Flash memory with assistant gate and method of fabricating the same	--
10892372	High performance solar cells, arrays and manufacturing processes therefor	MPOWER TECHNOLOGY, INC.
10892384	Etched trenches in bond materials for die singulation, and associated systems and methods	MICRON TECHNOLOGY, INC.
10892391	Light-emitting device package including a lead frame	SAMSUNG ELECTRONICS CO., LTD.
10892405	Hall-effect sensor package with added current path	TEXAS INSTRUMENTS INCORPORATED
10892439	Display panel having filler layer and heat dissipation layer and packaging method thereof, and display apparatus	BOE TECHNOLOGY GROUP CO., LTD.
10892588	Electrical connections for wearables and other articles	DUPONT ELECTRONICS, INC.
10892712	Stacked-die bulk acoustic wave oscillator package	TEXAS INSTRUMENTS INCORPORATED
10892748	Power module	SHARP KABUSHIKI KAISHA
10893605	Textured test pads for printed circuit board testing	SEAGATE TECHNOLOGY LLC
10893610	Switching device driving unit	MITSUBISHI ELECTRIC CORPORATION
10894403	Semiconductor apparatus, liquid discharge head substrate, liquid discharge head, and liquid discharge apparatus	CANON KABUSHIKI KAISHA
10894848	Polyarylene resins	ROHM AND HAAS ELECTRONIC MATERIALS LLC
10894935	Composition for removing silicone resins and method of thinning substrate by using the same	SAMSUNG ELECTRONICS CO., LTD.
10895262	Pump module having two impellers in series and a multiple plate housing	--
10895538	Method of preparing sample surface, method of analyzing sample surface, field-enhanced oxidation probe, and scanning probe microscope including field-enhanced oxidation probe	SUMCO CORPORATION
10895594	Electrical connector assembly having fan support thereon	FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
10895680	Display device and manufacturing method thereof	--
10895807	Cured film and positive photosensitive resin composition	TORAY INDUSTRIES, INC.
10896720	Apparatuses and methods for drivers with reduced noise	MICRON TECHNOLOGY, INC.
10896780	Resonant LC tank package and method of manufacture	INTEL IP CORPORATION
10896820	Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process	ASM IP HOLDING B.V.
10896821	Asymmetric wafer bow compensation by physical vapor deposition	LAM RESEARCH CORPORATION
10896826	Method for fabricating semiconductor device and lead frame	RENESAS ELECTRONICS CORPORATION
10896844	Staircase formation in three-dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10896846	Controlling performance and reliability of conductive regions in a metallization network	INTERNATIONAL BUSINESS MACHINES CORPORATION
10896848	Method of manufacturing a semiconductor device	--
10896851	Vertically stacked transistors	INTERNATIONAL BUSINESS MACHINES CORPORATION
10896860	Method and curable compound for casting electronic components or component groups	ROBERT BOSCH GMBH
10896861	Heterogeneous multi-layer MMIC assembly	RAYTHEON COMPANY
10896862	Thermal interface material on package	INTERNATIONAL BUSINESS MACHINES CORPORATION
10896863	Semiconductor device and method for manufacturing the same	MITSUBISHI ELECTRIC CORPORATION
10896864	Power semiconductor chip module	HS ELEKTRONIK SYSTEM GMBH
10896865	Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
10896866	Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold	ROHM CO., LTD.
10896867	Terminal plate and semiconductor device	KABUSHIKI KAISHA TOSHIBA
10896868	Electronic device and connector	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
10896869	Method of manufacturing a semiconductor device	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10896870	Semiconductor device with air gaps in interlayer insulating layer and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10896871	Circuit board, method for manufacturing circuit board, and electronic device	FUJITSU LIMITED
10896872	Connecting structure and circuit	NEC CORPORATION
10896873	Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications	GOOGLE LLC
10896874	Interconnects separated by a dielectric region formed using removable sacrificial plugs	GLOBALFOUNDRIES INC.
10896875	Forming conductive plugs for memory device	MICRON TECHNOLOGY, INC.
10896876	Semiconductor device	RENESAS ELECTRONICS CORPORATION
10896877	System in package with double side mounted board	FLEX LTD.
10896878	Integrated circuit saw bow break point	NXP B.V.
10896879	Semiconductor package having reflective layer with selective transmittance	SAMSUNG ELECTRONICS CO., LTD.
10896880	Semiconductor package with in-package compartmental shielding and fabrication method thereof	--
10896881	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10896882	Electronic package having heat dissipating element and method for fabricating the same	PHOENIX & CORPORATION
10896883	Integrated circuit security	INTERNATIONAL BUSINESS MACHINES CORPORATION
10896884	Semiconductor package and antenna module including the same	SAMSUNG ELECTRONICS CO., LTD.
10896885	High-voltage MOSFET structures	POLAR SEMICONDUCTOR, LLC
10896886	Semiconductor devices having discretely located passivation material, and associated systems and methods	MICRON TECHNOLOGY, INC.
10896887	Stress relieving structure for semiconductor device	INFINEON TECHNOLOGIES AG
10896888	Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond	MICROCHIP TECHNOLOGY INCORPORATED
10896889	Multilayer clip structure attached to a chip	JMJ KOREA CO., LTD.
10896890	Multi-access memory system and a method to manufacture the system	ALTERA CORPORATION
10896891	Semiconductor device	TOSHIBA MEMORY CORPORATION
10896892	Wire bonding apparatus	FUJI ELECTRIC CO., LTD.
10896893	Soldering a conductor to an aluminum metallization	INFINEON TECHNOLOGIES AG
10896894	Wafer-level methods of fabricating semiconductor device packages and related packages	MICRON TECHNOLOGY, INC.
10896896	Semiconductor device comprising PN junction diode and schottky barrier diode	ROHM CO., LTD.
10896898	Edge interconnect self-assembly substrate	INDIANA INTEGRATED CIRCUITS, LLC
10896900	Methods and systems for packaging an integrated circuit	MARVELL ASIA PTE, LTD.
10896901	Method of manufacturing semiconductor device, and mounting device	SHINKAWA LTD.
10896909	Integrated assemblies, and methods of forming integrated assemblies	MICRON TECHNOLOGY, INC.
10896914	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
10896918	Semiconductor memory device and manufacturing method thereof	SK HYNIX INC.
10896919	Semiconductor integrated circuit device	RENESAS ELECTRONICS CORPORATION
10896945	Display device including concave/convex structure in the inorganic insulation layer	JAPAN DISPLAY INC.
10896949	Inductor/transformer with closed ring	QUALCOMM INCORPORATED
10896963	Semiconductor device contacts with increased contact area	INTEL CORPORATION
10896996	Optical device	ROHM CO., LTD.
10897093	Semiconductor apparatus	FUJI ELECTRIC CO., LTD.
10897142	Half bridge circuit with bootstrap capacitor charging circuit	NAVITAS SEMICONDUCTOR LIMITED
10897280	Electronic device including plurality of antenna arrays	SAMSUNG ELECTRONICS CO., LTD.
10897819	Display panel, flexible circuit board and display device	XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.
10897820	Printed wiring board, printed circuit board, and electronic device	CANON KABUSHIKI KAISHA
10897821	Method of making single reflow power pin connections	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10897833	Hierarchical hydrophilic/hydrophobic micro/nanostructures for pushing the limits of critical heat flux	UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED
10898946	Semiconductor-mounting heat dissipation base plate and production method therefor	MITSUBISHI ELECTRIC CORPORATION
10899067	Multi-layer stamp	X DISPLAY COMPANY TECHNOLOGY LIMITED
10899620	Carbon conductive structure and method of manufacturing the same	FUJITSU LIMITED
10899949	Filler-containing film	DEXERIALS CORPORATION
10900118	Magnetically enhanced low temperature-high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond like films	IONQUEST CORP.
10900120	Passivation against vapor deposition	ASM IP HOLDING B.V.
10900412	Electronics assembly having a heat sink and an electrical insulator directly bonded to the heat sink	BORGWARNER INC.
10900719	Heat dissipation unit	--
10900848	Articles comprising a resistor comprising core shell liquid metal encapsulates and method of detecting an impact	UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE
10901029	Chip and chip burning method	HUAWEI TECHNOLOGIES CO., LTD.
10901324	Imprint method, imprint apparatus, and article manufacturing method using the same	CANON KABUSHIKI KAISHA
10901391	Multi-scanning electron microscopy for wafer alignment	CARL ZEISS SMT GMBH
10902907	Output drivers, and related methods, memory devices, and systems	MICRON TECHNOLOGY, INC.
10902913	Semiconductor device	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10902917	Three-dimensional vertical NOR flash thin-film transistor strings	SUNRISE MEMORY CORPORATION
10902918	Semiconductor storage device	TOSHIBA MEMORY CORPORATION
10902919	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
10902967	Printed circuit surface finish, method of use, and assemblies made therefrom	--
10902973	Anisotropic conductive film and production method of the same	DEXERIALS CORPORATION
10903013	Dielectric powder and multilayer capacitor using the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10903070	Asymmetric wafer bow compensation by chemical vapor deposition	LAM RESEARCH CORPORATION
10903088	Electronic package and method for fabricating the same	--
10903089	3D semiconductor device and structure	MONOLITHIC 3D INC.
10903090	Method of singulate a package structure using a light transmitting film on a polymer layer	--
10903111	Semiconductor device with linerless contacts	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903113	Selective deposition of aluminum and nitrogen containing material	ASM IP HOLDING B.V.
10903114	Decoupled via fill	INTEL CORPORATION
10903115	Controlling grain boundaries in high aspect-ratio conductive regions	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903116	Void-free metallic interconnect structures with self-formed diffusion barrier layers	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903117	Fabricating vias with lower resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903118	Chamferless via structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903119	Semiconductor chip, method of producing a semiconductor chip and apparatus having a plurality of semiconductor chips	OSRAM OLED GMBH
10903120	Semiconductor wafer dicing crack prevention using chip peripheral trenches	INFINEON TECHNOLOGIES AUSTRIA AG
10903121	Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process	APPLIED MATERIALS, INC.
10903127	Film for a package substrate	SAMSUNG ELECTRONICS CO., LTD.
10903128	Hermetic package for power semiconductor	MICROSEMI CORPORATION
10903129	Electronic device	ROHM CO., LTD.
10903130	Semiconductor apparatus and manufacturing method of semiconductor apparatus	FUJI ELECTRIC CO., LTD.
10903131	Semiconductor packages including bridge die spaced apart from semiconductor die	SK HYNIX INC.
10903133	Method of producing an SMD package with top side cooling	INFINEON TECHNOLOGIES AUSTRIA AG
10903134	Silicon heat-dissipation package for compact electronic devices	--
10903135	Chip package structure and manufacturing method thereof	HUAWEI TECHNOLOGIES CO., LTD.
10903136	Package structure having a plurality of insulating layers	--
10903137	Electrical interconnections with improved compliance due to stress relaxation and method of making	INTEL CORPORATION
10903138	Semiconductor device and method of manufacturing the same	DENSO CORPORATION
10903139	Superlattice structures for thermoelectric devices	THE JOHNS HOPKINS UNIVERSITY
10903140	Bi-directional heatsink dampening force system	CISCO TECHNOLOGY, INC.
10903141	Thermal management of RF devices using embedded microjet arrays	MASSACHUSETTS INSTITUTE OF TECHNOLOGY
10903142	Micro through-silicon via for transistor density scaling	INTEL CORPORATION
10903143	Semiconductor device	--
10903144	Semiconductor package and manufacturing method thereof	--
10903145	Symmetric input circuitry for IC in two-pin package	MICROCHIP TECHNOLOGY INCORPORATED
10903146	Electrode connection structure, lead frame, and method for forming electrode connection structure	WASEDA UNIVERSITY
10903147	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10903148	High performance multi-component electronics power module	MICROCHIP TECHNOLOGY INCORPORATED
10903149	Semiconductor module, electric vehicle, and power control unit	FUJI ELECTRIC CO., LTD.
10903150	Lead frame	OHKUCHI MATERIALS CO., LTD.
10903151	Semiconductor device package and method of manufacturing the same	--
10903152	Low loss substrate for high data rate applications	--
10903153	Thinned die stack	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903154	Semiconductor device and method of forming cantilevered protrusion on a semiconductor die	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10903155	Vertical modular stiffeners for stacked multi-device packages	INTEL CORPORATION
10903156	Electronic device with stud bumps	TDK CORPORATION
10903157	Semiconductor device having a glass substrate core layer	SKC CO., LTD.
10903158	Semiconductor arrangement having a circuit board with a patterned metallization layer	INFINEON TECHNOLOGIES AG
10903159	Electrical cable	MD ELEKTRONIK GMBH
10903160	Housing for an electronic component, in particular a semiconductor chip	POSSEHL ELECTRONICS DEUTSCHLAND GMBH
10903161	Back end of line metallization structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903162	Fuse element resistance enhancement by laser anneal and ion implantation	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903163	Trench MOSFET with self-aligned body contact with spacer	VISHAY-SILICONIX, LLC
10903164	Bonded assembly including a semiconductor-on-insulator die and methods for making the same	SANDISK TECHNOLOGIES LLC
10903165	Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903166	Integrated circuit packages	INTEL IP CORPORATION
10903167	Electronic package, packaging substrate, and methods for fabricating the same	--
10903168	Multi-RDL structure packages and methods of fabricating the same	ADVANCED MICRO DEVICES, INC.
10903169	Conductive structure and wiring structure including the same	--
10903170	Substrate having embedded interconnect structure	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10903171	Semiconductor device	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
10903172	Package with interlocking leads and manufacturing the same	STMICROELECTRONICS, INC.
10903173	Pre-conditioned substrate	PALO ALTO RESEARCH CENTER INCORPORATED
10903174	Electronic chip	STMICROELECTRONICS (CROLLES 2) SAS
10903175	Semiconductor device having features to prevent reverse engineering	--
10903176	Method of forming a photodiode	PALO ALTO RESEARCH CENTER INCORPORATED
10903177	Method of manufacturing a semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10903178	Isolation network for multi-way power divider/combiners	QORVO US, INC.
10903179	Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar	--
10903180	Device including semiconductor chips and method for producing such device	INFINEON TECHNOLOGIES AG
10903181	Wafer level fan out semiconductor device and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10903182	Amplifier die bond pad design and amplifier die arrangement for compact Doherty amplifier modules	NXP USA, INC.
10903183	Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die	JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
10903184	Filler particle position and density manipulation with applications in thermal interface materials	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903185	Bonding material and bonding method using same	DOWA ELECTRONICS MATERIALS CO., LTD.
10903186	Power electronic assemblies with solder layer and exterior coating, and methods of forming the same	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
10903187	Selective area heating for 3D chip stack	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903188	Selectively cross-linked thermal interface materials	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903189	Stack packages including stacked semiconductor dies	SK HYNIX INC.
10903190	Semiconductor package using a coreless signal distribution structure	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10903196	Semiconductor packages including bridge die	SK HYNIX INC.
10903197	Assembly of wafer stacks	AMS SENSORS SINGAPORE PTE. LTD.
10903198	Semiconductor package assembly and method for forming the same	--
10903200	Semiconductor device manufacturing method	TOSHIBA MEMORY CORPORATION
10903208	Distributed decoupling capacitor	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903213	Integrated circuit devices	SAMSUNG ELECTRONICS CO., LTD.
10903214	Semiconductor device	RENESAS ELECTRONICS CORPORATION
10903222	Three-dimensional memory device containing a carbon-doped source contact layer and methods for making the same	SANDISK TECHNOLOGIES LLC
10903223	Driver placement in memories having stacked memory arrays	MICRON TECHNOLOGY, INC.
10903227	Semiconductor devices and methods of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10903228	Semiconductor storage device	TOSHIBA MEMORY CORPORATION
10903230	Three-dimensional memory device containing through-memory-level contact via structures and method of making the same	SANDISK TECHNOLOGIES LLC
10903236	Three-dimensional semiconductor memory device	SAMSUNG ELECTRONICS CO., LTD.
10903237	Three-dimensional memory device including stepped connection plates and methods of forming the same	SANDISK TECHNOLOGIES LLC
10903240	Integrated circuits (ICs) on a glass substrate	QUALCOMM INCORPORATED
10903274	Interconnect landing method for RRAM technology	--
10903276	Methods of forming metal on inhomogeneous surfaces and structures incorporating metal on inhomogeneous surfaces	MICRON TECHNOLOGY, INC.
10903302	Display device having an organic layer between a plurality of signal layers	SAMSUNG DISPLAY CO., LTD.
10903304	Semiconductor device and method of forming inductor over insulating material filled trench in substrate	STATS CHIPPAC PTE. LTD.
10903305	Ultra high density metal-oxide-metal capacitor	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
10903307	Fabrication of a MIM capacitor structure with via etch control with integrated maskless etch tuning layers	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903309	Capacitor	MURATA MANUFACTURING CO., LTD.
10903314	Semiconductor device and method for manufacturing the same	--
10903316	Radio frequency switches with air gap structures	GLOBALFOUNDRIES INC.
10903320	Transistor with source field plates and non-overlapping gate runner layers	TEXAS INSTRUMENTS INCORPORATED
10903329	Contact photolithography-based nanopatterning using photoresist features having re-entrant profiles	WISCONSIN ALUMNI RESEARCH FOUNDATION
10903343	Semiconductor device	MURATA MANUFACTURING CO., LTD.
10903345	Power MOSFET with metal filled deep sinker contact for CSP	TEXAS INSTRUMENTS INCORPORATED
10903359	Semiconductor device	PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
10903373	Chip diode and method for manufacturing same	ROHM CO., LTD.
10903388	Electronic device comprising electronic chips	STMICROELECTRONICS (GRENOBLE 2) SAS
10903393	Transfer template, display substrate, display panel, and method for manufacturing the same	BOE TECHNOLOGY GROUP CO., LTD.
10903406	Housing comprising a semiconductor body and a method for producing a housing with a semiconductor body	OSRAM OLED GMBH
10903409	Thermoelectric generator for semiconductor power module	DENSO INTERNATIONAL AMERICA, INC.
10903422	Vertically oriented memory structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
10903444	OLED package substrate having a conductor attached to electrode on an array substrate	BOE TECHNOLOGY GROUP CO., LTD.
10903538	Distributed LC filter structure	MURATA MANUFACTURING CO., LTD.
10903547	Electronic package	--
10903548	Antenna module	SAMSUNG ELECTRONICS CO., LTD.
10903561	Semiconductor device package and method of manufacturing the same	--
10903619	Semiconductor package	MITSUBISHI ELECTRIC CORPORATION
10903734	Delivering power to semiconductor loads	VICOR CORPORATION
10903754	Power converter	HITACHI AUTOMOTIVE SYSTEMS, LTD.
10903803	Semiconductor device and power amplifier module	MURATA MANUFACTURING CO., LTD.
10903816	Thin-film type package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10905015	Chip component having groove formed therein	LG CHEM, LTD.
10905029	Cooling structure for electronic boards	INTERNATIONAL BUSINESS MACHINES CORPORATION
10905033	Liquid-cooled electric drive component, powertrain, vehicle and method	SIEMENS AKTIENGESELLSCHAFT
10905037	Electronic device having interference shielding structure	SAMSUNG ELECTRONICS CO., LTD.
10905041	Methods for attachment and devices produced using the methods	ALPHA ASSEMBLY SOLUTIONS INC.
10906061	Coating method, coating apparatus and method for manufacturing component	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
10906300	Liquid jetting apparatus and wiring member	BROTHER KOGYO KABUSHIKI KAISHA
10906304	Semiconductor element, recording element substrate, and liquid discharge head	CANON KABUSHIKI KAISHA
10906305	Liquid ejection head	CANON KABUSHIKI KAISHA
10906407	Compact inverter and motor vehicle comprising such an inverter	ACILTEK
10908110	Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10908209	Semiconductor module including semiconductor package and semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10908210	Die crack detection	SANDISK TECHNOLOGIES LLC
10908468	Display device and method for manufacturing the same	SAMSUNG DISPLAY CO., LTD.
10908519	Alignment mark, imprinting method, manufacturing method of semiconductor device, and alignment device	TOSHIBA MEMORY CORPORATION
10910020	Three-dimensional memory device containing compact bit line switch circuit and method of making the same	SANDISK TECHNOLOGIES LLC
10910216	Low-k dielectric and processes for forming same	--
10910221	Semiconductor device structure with a fine pattern and method for forming the same	--
10910232	Copper plasma etching method and manufacturing method of display panel	SAMSUNG DISPLAY CO., LTD.
10910233	Semiconductor device package and method of manufacturing the same	--
10910261	Semiconductor devices and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10910262	Method of selectively depositing a capping layer structure on a semiconductor device structure	ASM IP HOLDING B.V.
10910263	Doping control of metal nitride films	APPLIED MATERIALS, INC.
10910265	Gate aligned contact and method to fabricate same	INTEL CORPORATION
10910266	Semiconductor device and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10910267	Alignment marks in substrate having through-substrate via (TSV)	--
10910270	Method of forming and packaging semiconductor die	MAGNACHIP SEMICONDUCTOR, LTD.
10910271	Wafer dicing using femtosecond-based laser and plasma etch	APPLIED MATERIALS, INC.
10910272	Reusable support substrate for formation and transfer of semiconductor devices and methods of using the same	SANDISK TECHNOLOGIES LLC
10910274	Backside processed semiconductor device	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
10910282	Prevention of charging damage in full-depletion devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
10910283	Pressure sensors on flexible substrates for stress decoupling	INFINEON TECHNOLOGIES AG
10910284	Semiconductor device and method of manufacturing thereof	INFINEON TECHNOLOGIES AUSTRIA AG
10910285	Package structure with TFTS and die covered RDL	--
10910286	Wafer-level system-in-package packaging method and package structure thereof	NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
10910287	Semiconductor package with protected sidewall and method of forming the same	STMICROELECTRONICS PTE LTD
10910288	Integrated circuit package structure and package method	BOE TECHNOLOGY GROUP CO., LTD.
10910289	Electronic substrate and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10910290	Structures and methods for heat dissipation of semiconductor devices	--
10910291	Method of creating thermal boundary control	RAYTHEON COMPANY
10910292	Electronic device and connection body	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
10910293	Leadframe with die pad having cantilevers to secure electronic component	TEXAS INSTRUMENTS INCORPORATED
10910294	Semiconductor device and method of manufacturing semiconductor device	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10910295	QFN pre-molded leadframe having a solder wettable sidewall on each lead	STMICROELECTRONICS, INC.
10910296	Lead frame and method of fabricating the same	DANFOSS SILICON POWER GMBH
10910297	Package including multiple semiconductor devices	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10910298	Method of forming a molded substrate electronic package and structure	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10910299	Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the method	HAESUNG DS CO., LTD.
10910300	Method for manufacturing interposer	QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
10910301	Post-grind die backside power delivery	INTEL CORPORATION
10910302	Power semiconductor device with a double island surface mount package	STMICROELECTRONICS S.R.L.
10910303	Package structure and manufacturing method thereof	DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
10910304	Tight pitch wirings and capacitor(s)	GLOBALFOUNDRIES U.S. INC.
10910305	Microelectronic devices designed with capacitive and enhanced inductive bumps	INTEL CORPORATION
10910306	Devices including vias extending through alternating dielectric materials and conductive materials, and related electronic devices	MICRON TECHNOLOGY, INC.
10910307	Back end of line metallization structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
10910308	Dual thickness fuse structures	GLOBALFOUNDRIES U.S. INC.
10910309	Nanotube structure based metal damascene process	INFINEON TECHNOLOGIES AG
10910310	Methods of forming semiconductor devices	MICRON TECHNOLOGY, INC.
10910311	Semiconductor device and manufacturing method thereof	SK HYNIX INC.
10910312	Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
10910313	Integrated circuit including field effect transistors having a contact on active gate compatible with a small cell area having a small contacted poly pitch	SAMSUNG ELECTRONICS CO., LTD.
10910314	Conductive coating for a microelectronics package	INTEL CORPORATION
10910315	Fabric with embedded electrical components	APPLE INC.
10910316	Electronic device	--
10910317	Semiconductor package having wafer-level active die and external die mount	INTEL CORPORATION
10910318	Optically detectable reference feature for die separation	INFINEON TECHNOLOGIES AUSTRIA AG
10910319	Method of manufacturing semiconductor device	FUJI ELECTRIC CO., LTD.
10910320	Shielded MOM capacitor	--
10910321	Semiconductor device and method of making the same	--
10910322	Shielded semiconductor package with open terminal and methods of making	STATS CHIPPAC PTE. LTD.
10910323	Semiconductor package with reduced noise	--
10910324	Semiconductor device having a resin case with a notch groove	FUJI ELECTRIC CO., LTD.
10910325	Integrated circuit packages with conductive element having cavities housing electrically connected embedded components	INTEL CORPORATION
10910326	Semiconductor package	MITSUBISHI ELECTRIC CORPORATION
10910327	Electronic device package with reduced thickness variation	INTEL CORPORATION
10910328	Silicon wafer manufacturing method	SUMCO CORPORATION
10910329	Semiconductor package device and method of manufacturing the same	--
10910330	Pad structure and integrated circuit die using the same	--
10910331	Semiconductor device bonding area including fused solder film and manufacturing method	LAPIS SEMICONDUCTOR CO., LTD.
10910332	Semiconductor device and manufacture thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
10910333	Display device	SAMSUNG DISPLAY CO., LTD.
10910334	Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium	EBARA CORPORATION
10910335	Semiconductor device and a method of manufacturing thereof	--
10910336	Chip package structure	--
10910337	Semiconductor device	RENESAS ELECTRONICS CORPORATION
10910338	Electronic device having an under-fill element, a mounting method of the same, and a method of manufacturing a display apparatus having the electronic device	SAMSUNG DISPLAY CO., LTD.
10910339	Flip chip bonding method	SAMSUNG ELECTRONICS CO., LTD.
10910340	Silver sintering preparation and the use thereof for the connecting of electronic components	HERAEUS DEUTSCHLAND GMBH & CO. KG
10910341	Bonding process with inhibited oxide formation	SITIME CORPORATION
10910342	Method for transferring and placing a semiconductor device on a substrate	IMEC VZW
10910343	Package structure with improvement layer and fabrication method thereof	TONGFU MICROELECTRONICS CO., LTD.
10910344	Systems and methods for releveled bump planes for chiplets	XCELSIS CORPORATION
10910345	Semiconductor device with stacked die device	--
10910346	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10910347	Method, apparatus and system to interconnect packaged integrated circuit dies	INTEL CORPORATION
10910349	Stacked semiconductor chips having transistor in a boundary region	SAMSUNG ELECTRONICS CO., LTD.
10910350	Structure of a semiconductor array	--
10910354	Apparatus for direct transfer of semiconductor device die	ROHINNI, LLC
10910355	Bezel-free displays	X DISPLAY COMPANY TECHNOLOGY LIMITED
10910357	Semiconductor package including hybrid bonding structure and method for preparing the same	--
10910358	Integrated assemblies having capacitive units, and having resistive structures coupled with the capacitive units	MICRON TECHNOLOGY, INC.
10910364	3D semiconductor device	MONOLITAIC 3D INC.
10910365	Structure and method for cooling three-dimensional integrated circuits	--
10910366	3D stacked integrated circuits having functional blocks configured to accelerate artificial neural network (ANN) computation	MICRON TECHNOLOGY, INC.
10910367	Semiconductor device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10910369	On-chip security circuit	INTERNATIONAL BUSINESS MACHINES CORPORATION
10910371	Self-heating test structure	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
10910378	Semiconductor memory devices	SAMSUNG ELECTRONICS CO., LTD.
10910379	Integrated assemblies comprising memory cells and shielding material between the memory cells, and methods of forming integrated assemblies	MICRON TECHNOLOGY, INC.
10910380	Method of manufacturing dynamic random access memory	--
10910382	Method for fabricating semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10910387	Semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
10910395	Methods of forming semiconductor device structures	MICRON TECHNOLOGY, INC.
10910396	Three-dimensional semiconductor memory devices	SAMSUNG ELECTRONICS CO., LTD.
10910397	Through array contact structure of three- dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10910409	Display device	SAMSUNG DISPLAY CO., LTD.
10910411	Array substrate, manufacturing method thereof and display panel	BOE TECHNOLOGY GROUP CO., LTD.
10910416	Semiconductor device, image pickup device, and method for manufacturing semiconductor device	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10910421	Molded image sensor chip scale packages and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10910438	Memory array with graded memory stack resistances	MICRON TECHNOLOGY, INC.
10910449	Electronic device and manufacturing method for same	GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
10910465	3D printed semiconductor package	TEXAS INSTRUMENTS INCORPORATED
10910466	Process for tuning via profile in dielectric material	--
10910491	Semiconductor device having reduced capacitance between source and drain pads	--
10910500	Load sensing devices, packages, and systems	STMICROELECTRONICS S.R.L.
10910510	Encapsulated flexible electronic device, and corresponding manufacturing method	STMICROELECTRONICS S.R.L.
10910515	Method of manufacturing a light-emitting device	NICHIA CORPORATION
10910523	Light emitting device	--
10910530	LED chip mounting method and device	--
10910537	Light emitting device, resin-attached lead frame, and methods of manufacturing the same	NICHIA CORPORATION
10910539	Light emitting device and manufacturing method thereof	TOSHIBA HOKUTO ELECTRONICS CORPORATION
10910540	Solid state light emitter die having a heat spreader between a plurality lead frame	SIGNIFY HOLDING B.V.
10910560	RRAM structure	--
10910562	Organic electroluminescent device and preparation method, evaporation device	CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
10910684	Machine temperature control device	DENSO CORPORATION
10910695	On-chip antenna	TDK CORPORATION
10910705	Antenna in package device having substrate stack	TEXAS INSTRUMENTS INCORPORATED
10910748	Cable socket connector assembly for an electronic	TE CONNECTIVITY CORPORATION
10910782	Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogen	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10910843	GaN circuit drivers for GaN circuit loads	NAVITAS SEMICONDUCTOR LIMITED
10910957	Silicon carbide power inverter/rectifier for electric machines	CALNETIX TECHNOLOGIES, LLC
10912185	Low-cost superior performance coinless RF power amplifier	TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
10912186	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10912192	Flexible circuit board, COF module and electronic device comprising the same	LG INNOTEK CO., LTD.
10912194	Printed circuit board	--
10912202	Method of manufacturing printed circuit board	LG INNOTEK CO., LTD.
10912215	Display device	SAMSUNG DISPLAY CO., LTD.
10912227	Methods, systems, and assemblies for cooling an electronic component	RENSSELAER POLYTECHNIC INSTITUTE
10912231	Automotive integrated power module and capacitor	FORD GLOBAL TECHNOLOGIES, LLC
10912233	Controller with heat sink clamping plate for enhanced thermal properties	ROCKWELL AUTOMATION TECHNOLOGIES, INC.
10912234	Controller with fan motoring and control	ROCKWELL AUTOMATION TECHNOLOGIES, INC.
10913183	Process for producing package for mounting a semiconductor element and mold release film	AGC INC.
10913655	Manufacturing of integrated circuit resonator	SITIME CORPORATION
10913680	Lead-free glass composition, glass composite material, glass paste, sealing structure, electrical/electronic component and coated component	HITACHI, LTD.
10913725	Oxazine compound, composition and cured product	DIC CORPORATION
10913818	Epoxy resin, epoxy resin composition, cured product and electrical or electronic component	MITSUBISHI CHEMICAL CORPORATION
10913879	Thermally conductive pre-applied underfill formulations and uses thereof	HENKEL IP & HOLDING GMBH
10913998	Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films	IONQUESTCORP.
10914008	Method and solution for forming interconnects	IMEC VZW
10914018	Porous Cu on Cu surface for semiconductor packages	INFINEON TECHNOLOGIES AG
10914445	Vehicle lamp using semiconductor light emitting device	LG ELECTRONICS INC.
10914535	Integrated multi-chamber heat exchanger	LOCKHEED MARTIN CORPORATION
10914539	Two piece aluminum heat sink	OSRAM SYLVANIA INC.
10914821	Calibration and alignment of coherent lidar system	GM GLOBAL TECHNOLOGY OPERATIONS LLC
10914822	Dual-laser chip-scale lidar for simultaneous range-doppler sensing	GM GLOBAL TECHNOLOGY OPERATIONS LLC
10914895	Package structure and manufacturing method thereof	--
10914924	Optical image capturing module	--
10914992	Display apparatus and method of manufacturing the same	SAMSUNG DISPLAY CO., LTD.
10915029	Particle irradiation apparatus, beam modifier device, and semiconductor device including a junction termination extension zone	INFINEON TECHNOLOGIES AG
10916290	Memory system having combined high density, low bandwidth and low density, high bandwidth memories	APPLE INC.
10916364	Tunable inductor arrangement, transceiver, method and computer program	TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
10916419	Insulator, capacitor with the same and fabrication method thereof, and method for fabricating semiconductor device	KEY FOUNDRY CO., LTD.
10916429	Semiconductor device packages and stacked package assemblies including high density interconnections	--
10916430	Semiconductor device and method for manufacturing the same	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
10916433	Methods of forming metal silicide layers and metal silicide layers formed therefrom	APPLIED MATERIALS, INC.
10916447	Semiconductor device and method for manufacturing semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10916448	Method for creating a wettable surface for improved reliability in QFN packages	TEXAS INSTRUMENTS INCORPORATED
10916449	Semiconductor package and method for fabricating base for semiconductor package	--
10916450	Package of integrated circuits having a light-to-heat-conversion coating material	--
10916461	Method of laser scribing of semiconductor workpiece using divided laser beams	EVANA TECHNOLOGIES, UAB
10916462	Laser marking focus feedback system having an intensity indication of reflected radiation passed through an objective lens, a beam splitter and a pinhole	KLA-TENCOR CORPORATION
10916466	Wafer uniting method	DISCO CORPORATION
10916468	Semiconductor device with buried local interconnects	ELPIS TECHNOLOGIES INC.
10916470	Modified dielectric fill between the contacts of field-effect transistors	GLOBALFOUNDRIES INC.
10916471	Dual silicide liner flow for enabling low contact resistance	ELPIS TECHNOLOGIES INC.
10916473	Method of cleaning wafer after CMP	--
10916475	Semiconductor device and a method for fabricating the same	--
10916482	Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure	JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
10916483	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10916484	Electronic device including redistribution layer pad having a void	INFINEON TECHNOLOGIES AG
10916485	Molded wafer level packaging	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10916486	Semiconductor device including silane based adhesion promoter and method of making	INTEL CORPORATION
10916487	Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant	MICRON TECHNOLOGY, INC.
10916488	Semiconductor package having thermal conductive pattern surrounding the semiconductor die	--
10916489	Memory core chip having TSVS	MICRON TECHNOLOGY, INC.
10916490	Semiconductor device	FUJI ELECTRIC CO., LTD.
10916491	Semiconductor module	FUJI ELECTRIC CO., LTD.
10916492	Semiconductor substrate and method of manufacturing the same	--
10916493	Direct current blocking capacitors	INTERNATIONAL BUSINESS MACHINES CORPORATION
10916494	Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction	QUALCOMM INCORPORATED
10916495	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10916496	Circuit module	MURATA MANUFACTURING CO., LTD.
10916497	Apparatuses and methods for protecting transistor in a memory circuit	MICRON TECHNOLOGY, INC.
10916498	Interconnect structure for logic circuit	--
10916499	Vias and gaps in semiconductor interconnects	INTEL CORPORATION
10916500	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
10916501	Back end of line electrical fuse structure and method of fabrication	INTERNATIONAL BUSINESS MACHINES CORPORATION
10916502	Semiconductor device and manufacturing method thereof	--
10916503	Back end of line metallization structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
10916504	Three-dimensional memory device including electrically conductive layers with molybdenum-containing liners	SANDISK TECHNOLOGIES LLC
10916505	Graphene diffusion barrier	APPLIED MATERIALS, INC.
10916506	Semiconductor device	DENSO CORPORATION
10916507	Multiple chip carrier for bridge assembly	INTERNATIONAL BUSINESS MACHINES CORPORATION
10916508	Semiconductor device package with radiation shield	TOSHIBA MEMORY CORPORATION
10916509	Substrate, method of sawing substrate, and semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10916510	Semiconductor device with stress-relieving features and method for fabricating the same	--
10916511	Method for reducing warpage occurred to substrate strip after molding process	--
10916512	Capacitor metal guard ring for moisture ingression prevention	SKYWORKS SOLUTIONS, INC.
10916513	Method and system for providing a reverse engineering resistant hardware embedded security module	SAMSUNG ELECTRONICS CO., LTD.
10916514	Metal-free frame design for silicon bridges for semiconductor packages	INTEL CORPORATION
10916515	Systems and methods using an RF circuit on isolating material	INFINEON TECHNOLOGIES AG
10916516	High bandwidth memory (HBM) bandwidth aggregation switch	XILINX, INC.
10916517	Redistribution layer metallic structure and method	--
10916518	Electrical binding structure and method of forming the same	MIKRO MESA TECHNOLOGY CO., LTD.
10916519	Method for manufacturing semiconductor package with connection structures including via groups	--
10916520	Semiconductor device, and method of manufacturing the same	MITSUBISHI ELECTRIC CORPORATION
10916521	Electrical connector with an elastic body having carbon nanotubes and method for manufacturing same	SHIN-ETSU POLYMER CO., LTD.
10916522	Semiconductor device and method for manufacturing same	NICHIA CORPORATION
10916523	Microdevice transfer setup and integration of micro-devices into system substrate	VUEREAL INC.
10916524	Stacked dice systems	INTEL CORPORATION
10916525	Semiconductor die for determining load of through silicon via and semiconductor device including the same	SAMSUNG ELECTRONICS CO., LTD.
10916527	Apparatuses and methods for semiconductor die heat dissipation	MICRON TECHNOLOGY, INC.
10916529	Electronics card including multi-chip module	--
10916531	Semiconductor module	SUMITOMO ELECTRIC INDUSTRIES, LTD.
10916533	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10916535	Semiconductor device including a field effect transistor	SAMSUNG ELECTRONICS CO., LTD.
10916538	Semiconductor device and manufacturing method therefor, solid-state imaging element, and electronic equipment	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10916540	Device including PCM RF switch integrated with group III-V semiconductors	NEWPORT FAB, LLC
10916543	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10916548	Memory arrays with vertical access transistors	MICRON TECHNOLOGY, INC.
10916551	Memory cell structure	--
10916560	Crenellated charge storage structures for 3D NAND	--
10916562	Non-volatile memory device	TOSHIBA MEMORY CORPORATION
10916569	Thin-film transistor and method of forming an electrode of a thin-film transistor	H.C. STARCK INC.
10916577	Semiconductor device and method of manufacturing the same, and electronic apparatus	SONY CORPORATION
10916578	Semiconductor apparatus and camera	CANON KABUSHIKI KAISHA
10916582	Vertically-strained silicon device for use with a perpendicular magnetic tunnel junction (PMTJ)	SPIN MEMORY, INC.
10916604	Organic light emitting display device having a multi-directional dam structure	LG DISPLAY CO., LTD.
10916622	High-voltage capacitor, system including the capacitor and method for manufacturing the capacitor	STMICROELECTRONICS S.R.L.
10916638	Vertical fin field effect transistor devices with reduced top source/drain variability and lower resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
10916660	Vertical transistor with a body contact for back-biasing	INTERNATIONAL BUSINESS MACHINES CORPORATION
10916688	Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip	XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
10916699	Resistive memory crossbar array employing selective barrier layer growth	INTERNATIONAL BUSINESS MACHINES CORPORATION
10916829	Semiconductor package structure having antenna module	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
10916854	Antenna structure with integrated coupling element and semiconductor package using the same	--
10916878	Unitary molded USB device	WESTERN DIGITAL TECHNOLOGIES, INC.
10916879	Can box with metallic reinforcement piece	FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
10916912	Optical module	MITSUBISHI ELECTRIC CORPORATION
10916931	Temperature sensing and fault detection for paralleled double-side cooled power modules	INFINEON TECHNOLOGIES AG
10917069	Electronic component	MURATA MANUFACTURING CO., LTD.
10917602	Stacked imaging device with Cu-Cu bonding portion	SONY CORPORATION
10917953	Electrically parallel fused LEDs	X DISPLAY COMPANY TECHNOLOGY LIMITED
10917965	Display panel and display device including the same	SAMSUNG DISPLAY CO., LTD.
10917966	Articles including metallized vias	CORNING INCORPORATED
10917972	Switching device and electronic device	KABUSHIKI KAISHA TOSHIBA
10917974	Circuit board incorporating electronic component and manufacturing method thereof	TDK CORPORATION
10917976	Designing a printed circuit board (PCB) to detect slivers of conductive material included within vias of the PCB	JUNIPER NETWORKS, INC.
10917994	Wickless capillary driven constrained vapor bubble heat pipes for application in rack servers	INTEL CORPORATION
10917995	Cooling device	NIDEC CORPORATION
10917999	Power module, power module assembly and assembling method thereof	DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
10918298	High-speed, high-resolution electrophysiology in-vivo using conformal electronics	THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
10919732	Embedded power module	OTIS ELEVATOR COMPANY
10919758	Physical quantity sensor, inertial measurement unit, electronic apparatus, portable electronic apparatus, and vehicle	SEIKO EPSON CORPORATION
10919760	Process for nano graphene platelet-reinforced composite material	GLOBAL GRAPHENE GROUP, INC.
10919811	Aluminum-silicon-carbide composite and method of manufacturing same	DENKA COMPANY LIMITED
10920109	Semiconductor device	LG CHEM, LTD.
10920117	Curable composition, method for producing curable composition, cured product, use of curable composition, and optical device	LINTEC CORPORATION
10920143	Etching liquid composition and etching method	ADEKA CORPORATION
10921062	Cooling fan and heat dissipating module including the same	INVENTEC (PUDONG) TECHNOLOGY CORPORATION
10921066	Enhanced heat dissipation module, cooling fin structure and stamping method thereof	--
10921169	Flow sensor, method for manufacturing flow sensor and flow sensor module	HITACHI AUTOMOTIVE SYSTEMS, LTD.
10921314	Method of making an integrated circuit for a single-molecule nucleic-acid assay platform	THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
10922464	RC tool accuracy time reduction	--
10923191	3D SRAM/ROM with several superimposed layers and reconfigurable by transistor rear biasing	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10923286	Method and apparatus for compensating for high thermal expansion coefficient mismatch of a stacked device	NXP USA, INC.
10923362	Manufacturing process of element chip	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
10923364	Methods for producing packaged semiconductor devices	INFINEON TECHNOLOGIES AG
10923365	Connection structure and method for forming the same	--
10923391	Semiconductor device with contact pad	--
10923392	Interconnect structure and method of forming the same	TOKYO ELECTRON LIMITED
10923393	Contacts and interconnect structures in field-effect transistors	--
10923396	Method of forming self-aligned via	APPLIED MATERIALS, INC.
10923397	Through-substrate via structures in semiconductor devices	GLOBALFOUNDRIES INC.
10923400	Method for producing a plurality of components	OSRAM OLED GMBH
10923404	Inspection method, inspection device, and marking forming method	HAMAMATSU PHOTONICS K.K.
10923407	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10923408	Cavity packages	INVENSAS BONDING TECHNOLOGIES, INC.
10923411	Method for manufacturing an ultrathin heat dissipation structure	AVARY HOLDING (SHENZHEN) CO., LIMITED.
10923412	Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion	CEREBRAS SYSTEMS INC.
10923413	Hard IP blocks with physically bidirectional passageways	XCELSIS CORPORATION
10923414	Semiconductor device and method of manufacturing semiconductor device	FUJI ELECTRIC CO., LTD.
10923415	Semiconductor package having integrated stiffener region	INTEL CORPORATION
10923416	Interconnect structure with insulation layer and method of forming the same	--
10923417	Integrated fan-out package with 3D magnetic core inductor	--
10923419	Semiconductor device and a method of increasing a resistance value of an electric fuse	RENESAS ELECTRONICS CORPORATION
10923420	Semiconductor device including dummy contact	SAMSUNG ELECTRONICS CO., LTD.
10923421	Package structure and method of manufacturing the same	--
10923422	Semiconductor device	RENESAS ELECTRONICS CORPORATION
10923423	Interconnect structure for semiconductor devices	--
10923424	Interconnect structure with air-gaps	--
10923425	Power distribution	ARM LIMITED
10923426	Standard-cell layout structure with horn power and smart metal cut	--
10923427	SOI wafers with buried dielectric layers to prevent CU diffusion	GLOBALFOUNDRIES U.S. INC.
10923428	Semiconductor package having second pad electrically connected through the interposer chip to the first pad	SAMSUNG ELECTRONICS CO., LTD.
10923429	Multi-chip package and method of providing die-to-die interconnects in same	INTEL CORPORATION
10923430	High density cross link die with polymer routing layer	ADVANCED MICRO DEVICES, INC.
10923431	Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side	--
10923432	Method of manufacturing a semiconductor device with epitaxial layers and an alignment mark	INFINEON TECHNOLOGIES AUSTRIA AG
10923433	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10923434	Semiconductor packages having EMI shielding layers	SK HYNIX INC.
10923435	Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance	--
10923436	Techniques for thermal matching of integrated circuits	QUALCOMM INCORPORATED
10923437	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
10923438	Package structure and method for forming the same	--
10923439	Core substrate, multi-layer wiring substrate, semiconductor package, semiconductor module, copper-clad substrate, and method for manufacturing core substrate	TOPPAN PRINTING CO., LTD.
10923440	Method of securing an integrated circuit during manufacturing	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10923441	Implementing transient electronic circuits for security applications	INTERNATIONAL BUSINESS MACHINES CORPORATION
10923442	Protecting analog circuits with parameter biasing obfuscation	DREXEL UNIVERSITY
10923443	Electronic device package including a capacitor	INTEL CORPORATION
10923444	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10923445	Monolithic decoupling capacitor between solder bumps	INTERNATIONAL BUSINESS MACHINES CORPORATION
10923446	Indium bump liftoff process on micro-machined silicon substrates	UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA
10923447	Semiconductor device assembly with die support structures	MICRON TECHNOLOGY, INC.
10923448	Bond pad with micro-protrusions for direct metallic bonding	MICRON TECHNOLOGY, INC.
10923449	Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect	COMPASS TECHNOLOGY COMPANY LIMITED
10923450	Memory arrays with bonded and shared logic circuitry	INTEL CORPORATION
10923451	Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods	NXP USA, INC.
10923452	Substrate bonding apparatus	SAMSUNG ELECTRONICS CO., LTD.
10923453	Bonding apparatus and method for using the same	SAMSUNG DISPLAY CO., LTD.
10923454	Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers	--
10923455	Semiconductor apparatus and method for preparing the same	--
10923456	Systems and methods for hierarchical exposure of an integrated circuit having multiple interconnected die	CEREBRAS SYSTEMS INC.
10923459	Three dimensional integrated circuit	SILICON GENESIS CORPORATION
10923462	Bifurcated memory die module semiconductor device	WESTERN DIGITAL TECHNOLOGIES, INC.
10923463	Method and machine-readable medium for configuring processors with base dies having landing slots	INTEL CORPORATION
10923464	Connection system of semiconductor packages using a printed circuit board	SAMSUNG ELECTRONICS CO., LTD.
10923465	Semiconductor device having stacked semiconductor chips and method for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10923467	Series resistor over drain region in high voltage device	--
10923469	Vertical resistor adjacent inactive gate over trench isolation	GLOBALFOUNDRIES U.S. INC.
10923470	Semiconductor device	MURATA MANUFACTURING CO., LTD.
10923475	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10923477	Semiconductor device and method for manufacturing semiconductor device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
10923480	Capacitance reduction in a semiconductor device	MICRON TECHNOLOGY, INC.
10923483	EFuse	--
10923484	Integrated circuit including at least one memory cell with an antifuse device	STMICROELECTRONICS (ROUSSET) SAS
10923485	Semiconductor structure and method for forming the same	--
10923491	Hybrid bonding contact structure of three-dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10923493	Microelectronic devices, electronic systems, and related methods	MICRON TECHNOLOGY, INC.
10923508	Array substrate and manufacturing method therefor, display panel, and display device	BOE TECHNOLOGY GROUP CO., LTD.
10923517	Solid-state imaging apparatus having output circuit unit for outputting a pixel signal	SONY CORPORATION
10923521	Fan-out sensor package and camera module	SAMSUNG ELECTRONICS CO., LTD.
10923524	Support for forming an optoelectronic component, optoelectronic component and method for manufacturing such a support and such a component	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10923549	Display apparatus including a shielding conductive layer	SAMSUNG DISPLAY CO., LTD.
10923558	Display device and method of manufacturing display device	JAPAN DISPLAY INC.
10923562	Semiconductor device, and method for manufacturing semicondcutor device	ROHM CO., LTD.
10923565	Self-aligned contact air gap formation	--
10923585	High electron mobility transistors having improved contact spacing and/or improved contact vias	CREE, INC.
10923591	Method for producing a semiconductor device	UNISANTIS ELECTRONICS SINGAPORE PTE. LTD.
10923606	Photoelectric conversion element	KANEKA CORPORATION
10923621	Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrate	--
10923639	Method for producing an optical semiconductor device	--
10923640	Optoelectronic component and method of producing same	OSRAM OLED GMBH
10923645	Light source device having package including first electrode and second electrode and substrate including wiring members facing first electrode and second electrode	NICHIA CORPORATION
10923650	Magneto-resistive chip package including shielding structure	SAMSUNG ELECTRONICS CO., LTD.
10923659	Wafers for use in aligning nanotubes and methods of making and using the same	--
10923790	Low-loss silicon on insulator based dielectric microstrip line	CITY UNIVERSITY OF HONG KONG
10923800	Packaged electronic device having integrated antenna and locking structure	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10924071	Semiconductor device	MURATA MANUFACTURING CO., LTD.
10924107	Low static current semiconductor device	--
10925111	EHF secure communication device	KEYSSA, INC.
10925132	Multipixel led component and method of operating a multipixel led component	OSRAM OLED GMBH
10925149	High frequency module, board equipped with antenna, and high frequency circuit board	MURATA MANUFACTURING CO., LTD.
10925152	Dielectric coating for crosstalk reduction	INTEL CORPORATION
10925464	Imaging unit and endoscope	OLYMPUS CORPORATION
10926360	Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device	TAMURA CORPORATION
10926485	Light generating microcapsules for photo-curing	INTERNATIONAL BUSINESS MACHINES CORPORATION
10927001	MEMS cryocooler systems and methods	FLIR SYSTEMS, INC.
10927220	Silazane-siloxane random copolymers, their production and use	AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
10927249	Resin compositions for underfill film for three dimensional through silica via (TSV) packages and compositions useful for the preparation thereof	HENKEL IP & HOLDING GMBH
10927278	Curable organopolysiloxane composition and semiconductor device	DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
10927453	TiN-based film and TiN-based film forming method	TOKYO ELECTRON LIMITED
10927468	Copper electroplating compositions and methods of electroplating copper on substrates	ROHM AND HAAS ELECTRONIC MATERIALS LLC
10928141	Heat exchanger for cooling multiple layers of electronic modules	DANA CANADA CORPORATION
10928263	Sensor device having adhesive between sensor portion and casing portion	FUJI ELECTRIC CO., LTD.
10928501	Target detection in rainfall and snowfall conditions using mmWave radar	INFINEON TECHNOLOGIES AG
10928739	Method of measuring misregistration of semiconductor devices	KLA-TENCOR CORPORATION
10929588	Integrated circuit layout, structure, system, and methods	--
10930334	Feedback field-effect electronic device using feedback loop operation and array circuit using feedback field-effect electronic device	KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
10930363	TSV auto repair scheme on stacked die	MICRON TECHNOLOGY, INC.
10930409	Resin compositions comprising sorbic esters	ELANTAS GMBH
10930435	Multilayer element and LC filter	MURATA MANUFACTURING CO., LTD.
10930511	Copper electrodeposition sequence for the filling of cobalt lined features	LAM RESEARCH CORPORATION
10930512	Method of processing workpiece	DISCO CORPORATION
10930516	Semiconductor device and semiconductor device manufacturing method	SONY CORPORATION
10930520	Self-formed liner for interconnect structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10930523	Method for manufacturing resin-sealed power semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10930524	Semiconductor component and method of manufacture	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10930525	Carrier substrate and method of manufacturing semiconductor package using the carrier substrate	SAMSUNG ELECTRONICS CO., LTD.
10930528	Method for transferring micro device	MIKRO MESA TECHNOLOGY CO., LTD.
10930532	Object detection system	BPM MICROSYSTEMS
10930541	Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package	INFINEON TECHNOLOGIES AG
10930547	Semiconductor structure and manufacturing method thereof	--
10930551	Methods for fabricating a low-resistance interconnect	--
10930552	Method of semiconductor integrated circuit fabrication	--
10930553	Forming self-aligned vias and air-gaps in semiconductor fabrication	TESSERA, INC.
10930554	Semiconductor device and method for manufacturing the same	--
10930555	Contact over active gate structure	APPLIED MATERIALS, INC.
10930556	Contact over active gate structure	APPLIED MATERIALS, INC.
10930557	Self-aligned contacts	INTEL CORPORATION
10930562	Internal via with improved contact for upper semi-conductor layer of a 3D circuit	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10930564	Metal gate structure cutting process	--
10930567	Maskless epitaxial growth of phosphorus-doped Si and boron-doped SiGe (Ge) for advanced source/drain contact	INTERNATIONAL BUSINESS MACHINES CORPORATION
10930572	Method for manufacturing a three dimensional power module	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10930573	Circuit module and manufacturing method therefor	MURATA MANUFACTURING CO., LTD.
10930574	Semiconductor device and method for manufacturing the same	ROHM CO., LTD.
10930575	Reconfigurable cooling assembly for integrated circuitry	INTEL CORPORATION
10930576	Gallium-nitride based devices implementing an engineered substrate structure	QROMIS, INC.
10930577	Device for cooling electrical components	ROBERT BOSCH GMBH
10930578	Circuit device	AUTONETWORKS TECHNOLOGIES, LTD.
10930579	Self-contained liquid cooled semiconductor packaging	INTERNATIONAL BUSINESS MACHINES CORPORATION
10930580	Semiconductor device and method of manufacture	--
10930581	Semiconductor package with wettable flank	STMICROELECTRONICS S.R.L.
10930582	Semiconductor device having terminals directly attachable to circuit board	TEXAS INSTRUMENTS INCORPORATED
10930583	Capacitor embedded with nanocrystals	--
10930584	Electronic component and three-terminal capacitor	MURATA MANUFACTURING CO., LTD.
10930585	Memory devices, semiconductor devices and related methods	MICRON TECHNOLOGY, INC.
10930586	Integrated fan-out package and method of fabricating the same	--
10930587	Semiconductor memory device	SK HYNIX INC.
10930588	Reduction of ohmic losses in monolithic chip inductors and transformers of radio frequency integrated circuits	INTEL CORPORATION
10930589	Advanced interconnects containing an IMT liner	INTERNATIONAL BUSINESS MACHINES CORPORATION
10930590	Interconnect device and method	--
10930591	Trench MOSFET with self-aligned body contact with spacer	VISHAY-SILICONIX, LLC
10930592	Wafer level fan-out application specific integrated circuit bridge memory stack	GOOGLE LLC
10930593	Package on package and package connection system comprising the same	SAMSUNG ELECTRONICS CO., LTD.
10930594	Multilayer wiring substrate, display unit, and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10930595	Standard cells having via rail and deep via structures	--
10930596	Embedded die on interposer packages	INTEL CORPORATION
10930597	Die screening using inline defect information	KLA-TENCOR CORPORATION
10930598	Display device and flexible circuit board thereof	HKC CORPORATION LIMITED
10930599	Semiconductor device and manufacturing method thereof	--
10930600	Display substrate, method of manufacturing display substrate, and display device	BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
10930601	Flexible fan-out wafer level process and structure	THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
10930602	Semiconductor device and method for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10930603	Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits	--
10930604	Ultra-thin multichip power devices	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10930605	Contact pad for semiconductor device	--
10930606	Electronic device comprising a discrete transistor assembled on a printed circuit board	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10930607	Manufacturing process for separating logic and memory array	WESTERN DIGITAL TECHNOLOGIES, INC.
10930608	3D semiconductor device and structure	MONOLITHIC 3D INC.
10930609	Method of forming a solder bump structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
10930610	Semiconductor chip including a bump structure and semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
10930611	Solder joints for board level reliability	XILINX, INC.
10930612	Copper paste for pressureless bonding, bonded body and semiconductor device	SHOWA DENKO MATERIALS CO., LTD.
10930613	Semiconductor package having recessed adhesive layer between stacked chips	SAMSUNG ELECTRONICS CO., LTD.
10930614	Chip arrangements	INFINEON TECHNOLOGIES AG
10930615	Semiconductor device and method of manufacturing semiconductor device	ROHM CO., LTD.
10930616	Semiconductor module, method for manufacturing semiconductor module, and power conversion apparatus	MITSUBISHI ELECTRIC CORPORATION
10930617	Packaging method and package structure of wafer-level system-in-package	NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
10930618	Semiconductor package having chip stack	SAMSUNG ELECTRONICS CO., LTD.
10930619	Multi-wafer bonding structure and bonding method	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
10930620	Multi-chip detector appratus	KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
10930621	Die stacking for multi-tier 3D integration	ADVANCED MICRO DEVICES, INC.
10930623	Micro-transfer printable electronic component	X DISPLAY COMPANY TECHNOLOGY LIMITED
10930625	Semiconductor package and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10930626	Display apparatus including a micro light-emitting diode	SAMSUNG DISPLAY CO., LTD.
10930627	Semiconductor package device and method of manufacturing the same	--
10930628	Photonic semiconductor device and method	--
10930633	Buffer design for package integration	--
10930634	Integrated circuit system and packaging method therefor	SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
10930635	Semiconductor device	SEIKO EPSON CORPORATION
10930638	Semiconductor device having overlapping resistance element and capacitor	LAPIS SEMICONDUCTOR CO., LTD.
10930645	Semiconductor devices with package-level configurability	MICRON TECHNOLOGY, INC.
10930646	Circuit and method of forming the same	ZERO-ERROR SYSTEMS PTE LTD
10930648	Semiconductor devices having multi-level metallization structures	SAMSUNG ELECTRONICS CO., LTD.
10930662	Method for forming staircase structure of three-dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10930663	Interconnect structure of three-dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10930666	Semiconductor device and method of manufacturing the same	SK HYNIX INC.
10930669	Three dimensional memory device and method for fabricating the same	--
10930672	Three-dimensional semiconductor memory devices	SAMSUNG ELECTRONICS CO., LTD.
10930673	Semiconductor storage device and method for manufacturing semiconductor storage device	TOSHIBA MEMORY CORPORATION
10930676	Metal oxide thin film semiconductor device monolithically integrated with dissimilar device on the same wafer	UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE
10930685	Image sensor including a shield structure	SAMSUNG ELECTRONICS CO., LTD.
10930687	Image sensor having phase difference detection pixel	SK HYNIX INC.
10930695	Semiconductor device and method of manufacturing the same	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10930697	Semiconductor device, solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode	SONY CORPORATION
10930704	Magnetic memory cell	--
10930730	Enhanced active and passive devices for radio frequency (RF) process and design technology	QUALCOMM INCORPORATED
10930731	Integrated circuit device	MEDIATEK SINGAPORE PTE. LTD.
10930736	Semiconductor apparatus	MITSUBISHI ELECTRIC CORPORATION
10930737	Transistor cell	VISIC TECHNOLOGIES LTD.
10930742	Wafer structure with mode suppression	RAYTHEON COMPANY
10930748	Semiconductor device	PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
10930752	Contact plugs and methods forming same	--
10930753	Trench isolation for advanced integrated circuit structure fabrication	INTEL CORPORATION
10930754	Replacement metal gate structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10930774	Shielded gate trench MOSFETs with floating trenched gates and channel stop trenched gates in termination	--
10930802	Semiconductor device package and method of manufacturing the same	--
10930819	Light emitting device and fluidic manufacture thereof	ELUX INC.
10930820	Light emitting device	NICHIA CORPORATION
10930832	Method for manufacturing semiconductor light emitting device	SEMICON LIGHT CO., LTD.
10930987	Microfabricated air bridges for planar microwave resonator circuits	INTERNATIONAL BUSINESS MACHINES CORPORATION
10931000	Antenna module and electronic device including the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10931009	Methods for selectively shielding radio frequency modules	SKYWORKS SOLUTIONS, INC.
10931036	Fluidic wire connectors	TEVERI LLC
10931230	Voltage controlled oscillator circuit, device, and method	--
10931257	WLP BAW device with through-WLP vias	QORVO US, INC.
10931258	Electronic device and module including the same	MURATA MANUFACTURING CO., LTD.
10932358	Semiconductor devices and methods for enhancing signal integrity of an interface provided by a semiconductor device	--
10932368	Substrate-embedded electronic component	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10932371	Bottom-up electrolytic via plating method	CORNING INCORPORATED
10932372	Fluid discharge device	SENJU METAL INDUSTRY CO., LTD.
10932374	3-D flex circuit forming	INTERNATIONAL BUSINESS MACHINES CORPORATION
10932386	Electronic module and method for producing same	DYCONEX AG
10932391	Liquid-cooling heat exchange apparatus	--
10932392	Vehicle thermal management system	AAVID THERMAL CORP.
10932395	Thermal management device for use on electronics in a transportation vehicle	GM GLOBAL TECHNOLOGY OPERATIONS LLC
10933505	Arrangement to enclose a circuit board	ATLAS COPCO AIRPOWER, NAAMLOZE VENNOOTSCHAP
10934157	Packaged circuit system structure	MURATA MANUFACTURING CO., LTD.
10934161	MEMS device and method for producing same	MURATA MANUFACTURING CO., LTD.
10934630	Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate	EBARA CORPORATION
10935227	Systems and methods for coupling a metal core PCB to a heat sink	FLURENCE BIOENGINEERING, INC.
10935325	Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid	MICROSOFT TECHNOLOGY LICENSING, LLC
10935330	Heat exchangers capable of bidirectional fluid flow	SENIOR UK LIMITED
10935573	Slip-plane MEMS probe for high-density and fine pitch interconnects	INTEL CORPORATION
10935590	Electrically-verifiable fuses and method of fuse verification	INFINEON TECHNOLOGIES AG
10935741	Optical module and solder ball bonding structure	ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
10935847	Display panel and fabrication method thereof and display device	BOE TECHNOLOGY GROUP CO., LTD.
10936221	Reconfigurable memory architectures	MICRON TECHNOLOGY, INC.
10936756	Methodology for forming a resistive element in a superconducting structure	NORTHROP GRUMMAN SYSTEMS CORPORATION
10937500	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
10937559	Micro device transferring apparatus and micro device transferring method	BOE TECHNOLOGY GROUP CO., LTD.
10937583	Laminated electronic component	MURATA MANUFACTURING CO., LTD.
10937657	Semiconductor device including a reactant metal layer disposed between an aluminum alloy film and a catalyst metal film and method for manufacturing thereof	MITSUBISHI ELECTRIC CORPORATION
10937665	Methods and apparatus for gettering impurities in semiconductors	INTEL CORPORATION
10937666	Method for manufacturing lead frame including electrode and hanger lead, method for manufacturing package having lead frame, and method for manufacturing light-emitting device having package	NICHIA CORPORATION
10937667	Semiconductor device and method for manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10937668	Semiconductor package manufacturing method	DISCO CORPORATION
10937671	Conductive heat spreader and heat sink assembly for optical devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
10937674	Method for transferring micro device	MIKRO MESA TECHNOLOGY CO., LTD.
10937680	Setting up ultra-small or ultra-thin discrete components for easy assembly	UNIQARTA, INC.
10937682	TCB bond tip design to mitigate top die warpage and solder stretching issue	MICRON TECHNOLOGY, INC.
10937688	Semiconductor package and method of fabricating semiconductor package	--
10937689	Self-aligned hard masks with converted liners	INTEL CORPORATION
10937692	Method for reducing via RC delay	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
10937694	Chamferless via structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10937695	FinFET switch	--
10937707	Wiring substrate, electronic device, and electronic module	KYOCERA CORPORATION
10937708	Power module and method of manufacturing the same	MITSUBISHI ELECTRIC CORPORATION
10937709	Substrates for semiconductor packages	INFINEON TECHNOLOGIES AG
10937710	Electronic component module	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10937711	Electronic device and method for manufacturing same	DENSO CORPORATION
10937713	Chip on film package	--
10937714	Electrical device having a covering material	ROBERT BOSCH GMBH
10937715	Substrate for power module, collective substrate for power modules, and method for manufacturing substrate for power module	NGK ELECTRONICS DEVICES, INC.
10937716	Multi-layer thin film composite thermal interface materials	ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
10937717	Heatsink secured to a heat source	INTEL CORPORATION
10937718	Package structures and method of forming the same	--
10937719	Package structure and method of fabricating the same	--
10937720	Semiconductor device with copper structure	INFINEON TECHNOLOGIES AUSTRIA AG
10937721	Semiconductor structure	--
10937722	Device substrate	--
10937723	Package carrier structure having integrated circuit design and manufacturing method thereof	--
10937724	Package structure applied to driving apparatus of display	--
10937725	Semiconductor device and method for manufacturing thereof	MITSUBISHI ELECTRIC CORPORATION
10937726	Package structure with embedded core	APPLIED MATERIALS, INC.
10937727	Semiconductor module and method for manufacturing semiconductor module	FUJI ELECTRIC CO., LTD.
10937728	Preformed lead frame and lead frame package made from the same	--
10937729	Integrated circuit devices and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10937730	Metal-on-metal capacitors	APPLE INC.
10937731	Semiconductor module and method for manufacturing semiconductor module	HITACHI, LTD.
10937732	Semiconductor devices including contacts and conductive line interfaces with contacting sidewalls	SAMSUNG ELECTRONICS CO., LTD.
10937733	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10937734	Conductive traces in semiconductor devices and methods of forming same	--
10937735	Hybrid under-bump metallization component	INTERNATIONAL BUSINESS MACHINES CORPORATION
10937736	Hybrid integrated circuit package and method	--
10937737	Wiring member and power conversion device	MITSUBISHI ELECTRIC CORPORATION
10937738	Semiconductor package and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10937739	Electronic device module and method of manufacturing the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10937741	Molded laser package with electromagnetic interference shield and method of making	STATS CHIPPAC PTE. LTD.
10937742	Package and manufacturing method thereof	--
10937743	Mixing organic materials into hybrid packages	--
10937744	Semiconductor packages including roughening features	INFINEON TECHNOLOGIES AG
10937745	Semiconductor chip package array	TONGFU MICROELECTRONICS CO., LTD.
10937746	Integrated ultralong time constant time measurement device and fabrication process	STMICROELECTRONICS (ROUSSET) SAS
10937747	Power inverter module with reduced inductance	GM GLOBAL TECHNOLOGY OPERATIONS LLC
10937748	Fan-out transition structure for transmission of mm-Wave signals from IC to PCB via chip-scale packaging	HUAWEI TECHNOLOGIES CO., LTD.
10937749	Methods of forming microelectronic devices including dummy dice	MICRON TECHNOLOGY, INC.
10937750	Low stress pad structure for packaged devices	NXP B.V.
10937751	Bump structure manufacturing method	LBSEMICON CO., LTD.
10937752	Lead free solder columns and methods for making same	TOPLINE CORPORATION
10937753	Semiconductor device	RENESAS ELECTRONICS CORPORATION
10937754	Semiconductor package and manufacturing method thereof	--
10937755	Bond pads for low temperature hybrid bonding	ADVANCED MICRO DEVICES, INC.
10937756	Method of aligning wafers, method of bonding wafers using the same, and apparatus for performing the same	SAMSUNG ELECTRONICS CO., LTD.
10937757	Device packaging facility and method, and device processing apparatus utilizing DEHT	SEMIGEAR, INC.
10937758	Semiconductor-device manufacturing method and manufacturing apparatus	SHINKAWA LTD.
10937759	Radio frequency transmission line	SKYWORKS SOLUTIONS, INC.
10937760	Method for manufacturing a chip package	--
10937761	Semiconductor device package and method for manufacturing the same	--
10937762	Logic drive based on multichip package using interconnection bridge	--
10937763	Semiconductor leadframes and packages with solder dams and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10937764	Three-dimensional microelectronic package with embedded cooling channels	INTERNATIONAL BUSINESS MACHINES CORPORATION
10937765	Semiconductor device with laminated semiconductor chips	ULTRAMEMORY INC.
10937766	Three-dimensional memory device with three-dimensional phase-change memory	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10937767	Chip packaging method and device with packaged chips	INNO-PACH TECHNOLOGY PTE LTD
10937769	In-vehicle display device using semiconductor light-emitting device	ZKW GROUP GMBH
10937771	Semiconductor packages	SAMSUNG ELECTRONICS CO., LTD.
10937772	Semiconductor package and method for manufacturing the same	--
10937774	Micro LED display panel, method for fabricating the same and display device	SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
10937778	Integrated circuit comprising macros and method of fabricating the same	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10937780	Low capacitance bidirectional transient voltage suppressor	ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
10937782	Electrostatic discharge protection structure	NXP B.V.
10937785	Semiconductor device	--
10937788	Memory device having vertical structure	SAMSUNG ELECTRONICS CO., LTD.
10937790	Semiconductor device with air gap structure and method for preparing the same	--
10937791	Method for fabricating and semiconductor device having the second bit line contact higher than the top surface of the first bit line	--
10937793	Vertical transistor contact for a memory cell with increased density	INTERNATIONAL BUSINESS MACHINES CORPORATION
10937799	Semiconductor device and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
10937805	Semiconductor memory device	SK HYNIX INC.
10937806	Through array contact (TAC) for three-dimensional memory devices	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10937811	Integrated circuit devices and fabrication techniques	STMICROELECTRONICS, INC.
10937834	Shared three-dimensional vertical memory	HANGZHOU HAICUN INFORMATION TECHNOLOGY CO., LTD.
10937860	Nanosheet transistor bottom isolation	INTERNATIONAL BUSINESS MACHINES CORPORATION
10937861	Semiconductor structures including middle-of-line (MOL) capacitance reduction for self-aligned contact in gate stack	TESSERA, INC.
10937862	Nanosheet substrate isolated source/drain epitaxy via airgap	INTERNATIONAL BUSINESS MACHINES CORPORATION
10937883	Vertical transport FETs having a gradient threshold voltage	ELPIS TECHNOLOGIES INC.
10937887	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10937923	Semiconductor device and semiconductor device package including the same	LG INNOTEK CO., LTD.
10937936	LED display unit group and display panel	FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
10937937	Optical semiconductor element	STANLEY ELECTRIC CO., LTD.
10937990	Encapsulation film	LG CHEM, LTD.
10938090	Antenna module	SAMSUNG ELECTRONICS CO., LTD.
10938368	Piezoelectric-resonator-mounting substrate, and piezoelectric resonator unit and method of manufacturing the piezoelectric resonator unit	MURATA MANUFACTURING CO., LTD.
10939537	Printed circuit board assembly embedded thermal management system using thin-film thermoelectric coolers	HONEYWELL INTERNATIONAL INC.
10939551	Opening in the pad for bonding integrated passive device in InFO package	--
10939553	Vertical-side solder method and package for power GaN devices	--
10939555	Grid array connector system	MOLEX, LLC
10939556	Electronic component embedded substrate	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10939564	Circuit board, display device and method for manufacturing the same	HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
10939583	Electronic component cooling module and electronic apparatus	FUJITSU LIMITED
10939585	Fixing structure of electronic component	YAZAKI CORPORATION
10939591	Power conversion device having a clip for fixing a plurality of switches	LG INNOTEK CO., LTD.
10940671	Substrate for electrical circuits and method for producing a substrate of this type	ROGERS GERMANY GMBH
10941280	Liquid sealing material for copper bump, and resin composition for use as same	NAMICS CORPORATION
10941325	Thermally conductive resin molded article	BANDO CHEMICAL INDUSTRIES, LTD.
10941498	Panel to be plated, electroplating process using the same, and chip manufactured from the same	--
10941990	Structures for radiative cooling	THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY
10942444	Optical control modules for integrated circuit device patterning and reticles and methods including the same	NXP USA, INC.
10943045	Semiconductor device including standard-cell-adapted power grid arrangement and method for generating layout diagram of same	--
10943046	Semiconductor apparatus including uncrowned and crowned cells and method of making	--
10943051	Metal fill shape removal from selected nets	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943642	Integrated memory assemblies comprising multiple memory array decks	MICRON TECHNOLOGY, INC.
10943645	Memory device with a booster word line	--
10943729	Entangled inductor structures	--
10943792	3D stacked-in-recess system in package	INTEL CORPORATION
10943794	Semiconductor device assembly with pillar array and test ability	MICRON TECHNOLOGY, INC.
10943795	Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger	INDIUM CORPORATION
10943796	Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger	INDIUM CORPORATION
10943798	Fan-out structure and method of fabricating the same	--
10943807	Method and device for alignment of substrates	EV GROUP E. THALLNER GMBH
10943810	Device and method for bonding	EV GROUP E. THALLNER GMBH
10943813	Radio frequency silicon on insulator wafer platform with superior performance, stability, and manufacturability	--
10943817	Etch-stop layer topography for advanced integrated circuit structure fabrication	INTEL CORPORATION
10943822	Forming gate line-end of semiconductor structures	--
10943823	Conductive feature formation and structure using bottom-up filling deposition	--
10943824	Semiconductor device and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10943835	Fabrication of silicon germanium channel and silicon/silicon germanium dual channel field-effect transistors	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943838	Measurement of overlay error using device inspection system	KLA-TENCOR CORPORATION
10943841	Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate	MICRON TECHNOLOGY, INC.
10943842	Semiconductor device with a protection mechanism and associated systems, devices, and methods	MICRON TECHNOLOGY, INC.
10943843	Semiconductor package structure	--
10943844	Semiconductor device including multiple chips	TOSHIBA MEMORY CORPORATION
10943845	Three-dimensional packaging structure and packaging method of power devices	HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
10943846	Chip package structure with heat conductive component and manufacturing thereof	--
10943847	Semiconductor chip and semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10943848	Apparatus, system, and method for dynamic compensation of heatsink-clamping mechanisms	JUNIPER NETWORKS, INC.
10943849	Microfluidic array	APR TECHNOLOGIES AB
10943850	Piezoelectric MEMS-based active cooling for heat dissipation in compute devices	FRORE SYSTEMS INC.
10943851	Reconstituted wafer assembly	INTEL CORPORATION
10943852	Semiconductor device and method for manufacturing the same	TOSHIBA MEMORY CORPORATION
10943853	Semiconductor device and manufacturing method thereof	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
10943854	Semiconductor package and semiconductor apparatus for use with high-frequency signals and improved heat dissipation	KYOCERA CORPORATION
10943855	Electronic device packaging with galvanic isolation	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10943856	System in package device including inductor	TEXAS INSTRUMENTS INCORPORATED
10943857	Substrate with multi-layer resin structure and semiconductor device including the substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10943858	Semiconductor package and fabricating method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10943859	Semiconductor device	DENSO CORPORATION
10943860	Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board	MICRON TECHNOLOGY, INC.
10943861	Semiconductor device	ROHM CO., LTD.
10943862	Integrated filler capacitor cell device and corresponding manufacturing method	STMICROELECTRONICS (ROUSSET) SAS
10943863	Techniques to improve reliability in Cu interconnects using Cu intermetallics	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943864	Programmable redistribution die	INTEL CORPORATION
10943865	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
10943866	Method and structure to construct cylindrical interconnects to reduce resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943867	Schemes for forming barrier layers for copper in interconnect structures	--
10943868	Structure for interconnection	--
10943869	High density interconnection using fanout interposer chiplet	APPLE INC.
10943870	Microphone package structure	MERRY ELECTRONICS (SHENZHEN) CO., LTD.
10943871	Semiconductor device having conductive wire with increased attachment angle and method	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10943872	Fabrication method of semiconductor package including shielding wall and cover	SAMSUNG ELECTRONICS CO., LTD.
10943873	Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same	--
10943874	Apparatus, system, and method for mitigating warpage of integrated circuits during reflow processes	JUNIPER NETWORKS, INC.
10943875	Fragmenting computer chips	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943876	Method for detecting an attack by means of a beam of electrically charged particles on an integrated circuit, and corresponding integrated circuit	STMICROELECTRONICS (ROUSSET) SAS
10943877	Semiconductor device	DENSO CORPORATION
10943878	Semiconductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10943879	Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure	DEXERIALS CORPORATION
10943880	Semiconductor chip with reduced pitch conductive pillars	ADVANCED MICRO DEVICES, INC.
10943881	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10943882	IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures	NVIDIA CORPORATION
10943883	Planar wafer level fan-out of multi-chip modules having different size chips	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943884	Method of manufacturing an electronic device and electronic device manufactured thereby	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10943885	Method for making semiconductor device with sidewall recess and related devices	STMICROELECTRONICS, INC.
10943886	Methods of forming semiconductor packages with back side metal	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10943887	Staggered die stacking across heterogeneous modules	INTEL CORPORATION
10943888	Interconnect structure with redundant electrical connectors and associated systems and methods	MICRON TECHNOLOGY, INC.
10943889	Semiconductor device and method of manufacture	--
10943891	Semiconductor module and power conversion apparatus	FUJI ELECTRIC CO., LTD.
10943894	Optical device having lens block having recessed portion covering photoelectric conversion block	ASAHI KASEI MICRODEVICES CORPORATION
10943895	Method of fabricating a plurality of linear arrays with submicron y-axis alignment	XEROX CORPORATION
10943897	Method of forming three-dimensional integrated circuit having ESD protection circuit	--
10943898	High switching frequency, low loss and small form factor fully integrated power stage	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943907	Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitry	MICRON TECHNOLOGY, INC.
10943913	Strap-cell architecture for embedded memory	--
10943921	Methods of forming integrated assemblies	MICRON TECHNOLOGY, INC.
10943922	Vertical memory devices	SAMSUNG ELECTRONICS CO., LTD.
10943924	Semiconductor-on-insulator finFET devices with high thermal conductivity dielectrics	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943925	Method of forming FinFET channel and structures thereof	--
10943939	Via structures including etch-delay structures and semiconductor devices having via plugs	SAMSUNG ELECTRONICS CO., LTD.
10943944	Flat panel display having embedded optical imaging sensor located at rear surface of display	LG DISPLAY CO., LTD.
10943948	Magnetic tunnel junction (MTJ) device and forming method thereof	--
10943972	Precision BEOL resistors	INTERNATIONAL BUSINESS MACHINES CORPORATION
10943975	Method of manufacturing a semiconductor device having side-diffused trench plug	LITTELFUSE, INC.
10943985	Cover member for a robot used in a painting process having absorptive properties	TD INDUSTRIAL COVERINGS, INC.
10944003	Vertical field effect transistor and semiconductor device including the same	SAMSUNG ELECTRONICS CO., LTD.
10944007	Silicon on insulator semiconductor device with mixed doped regions	--
10944016	Optical detection unit, optical detection device, and method for manufacturing optical detection unit	HAMAMATSU PHOTONICS K.K.
10944023	Micro-LED transfer method and manufacturing method	GOERTEK. INC
10944035	Resin package and light-emitting device	NICHIA CORPORATION
10944036	Semiconductor light-emitting device	ROHM CO., LTD.
10944046	Semiconductor device	ROHM CO., LTD.
10944165	Integrated antenna package structure and manufacturing method thereof	--
10944270	GaN circuit drivers for GaN circuit loads	NAVITAS SEMICONDUCTOR LIMITED
10944402	Reconfigurable interconnect structure in integrated circuits	INTEL CORPORATION
10944413	Field device in measurement and automation technology comprising a galvanic isolation device	ENDRESS+HAUSER FLOWTEC AG
10945332	Heat capacitive component carrier and method to produce said component carrier	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
10945333	Thermal management assemblies having cooling channels within electrically insulated posts for cooling electronic assemblies	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
10945336	Electronic device with relay mounted to substrate	TE CONNECTIVITY CORPORATION
10945338	Wiring substrate	KYOCERA CORPORATION
10945352	Cooling device and manufacturing method therefor	DAWNING INFORMATION INDUSTRY (BEIJING) CO., LTD
10945353	Mechanism with folded wrapping to seal components immersed in coolant	INTEL CORPORATION
10945643	Microelectronic sensor for biometric authentication	EPITRONIC HOLDINGS PTE. LTD.
10946406	Metering apparatus	MARCO SYSTEMANALYSE UND ENTWICKLUNG GMBH
10946658	Encapsulating a bonded wire with low profile encapsulation	HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
10947109	Semiconductor component and method for producing same	INFINEON TECHNOLOGIES AG
10947150	Decoy security based on stress-engineered substrates	PALO ALTO RESEARCH CENTER INCORPORATED
10947326	Adhesive composition, cured article, semiconductor device, and production method for same	SHOWA DENKO MATERIALS CO., LTD.
10947384	Curable resin composition, cured product thereof, and semiconductor device	DAICEL CORPORATION
10947992	Convectors	--
10948240	Vapor chamber structure	--
10948246	Heat dissipation system	INVENTEC (PUDONG) TECHNOLOGY CORPORATION
10948247	Adjustable heat sink fin spacing	INTERNATIONAL BUSINESS MACHINES CORPORATION
10948554	Magnetoresistive sensor package with encapsulated initialization coil	MULTIDIMENSION TECHNOLOGY CO., LTD.
10948837	Information determining apparatus and method	ASML NETHERLANDS B.V.
10950286	Periphery fill and localized capacitance	MICRON TECHNOLOGY, INC.
10950297	Semiconductor device, electronic component, and electronic device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
10950391	Photoelectric conversion device and manufacturing method and apparatus thereof	KABUSHIKI KAISHA TOSHIBA
10950406	Self-limiting electrical triggering for initiating fracture of frangible glass	PALO ALTO RESEARCH CENTER INCORPORATED
10950439	Pattern forming method	TOSHIBA MEMORY CORPORATION
10950459	Back end of line structures with metal lines with alternating patterning and metallization schemes	INTERNATIONAL BUSINESS MACHINES CORPORATION
10950464	Electronic device module and manufacturing method thereof	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10950471	Laser machining device and laser machining method	TOKYO SEIMITSU CO., LTD.
10950478	Info structure with copper pillar having reversed profile	--
10950487	Method for forming an alignment mark	INFINEON TECHNOLOGIES AUSTRIA AG
10950493	Interconnects having air gap spacers	INTERNATIONAL BUSINESS MACHINES CORPORATION
10950494	Semiconductor device including first and second contact layers and manufacturing method	INFINEON TECHNOLOGIES AG
10950495	Mitigating pattern collapse	--
10950496	Microelectronic devices comprising manganese-containing conductive structures, and related electronic systems	MICRON TECHNOLOGY, INC.
10950497	Electrical connection for semiconductor devices	--
10950498	Selective and self-limiting tungsten etch process	APPLIED MATERIALS, INC.
10950499	Integrated circuit devices and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10950500	Methods and apparatus for filling a feature disposed in a substrate	APPLIED MATERIALS, INC.
10950501	Triblock copolymers for self-aligning vias or contacts	INTEL CORPORATION
10950507	Electrical testing method of interposer	--
10950509	Semiconductor device with integrated shunt resistor	INFINEON TECHNOLOGIES AG
10950510	Semiconductor device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10950511	Die carrier package and method of forming same	MEDTRONIC, INC.
10950512	Semiconductor packages including a semiconductor chip and methods of forming the semiconductor packages	SK HYNIX INC.
10950513	Method for integrating power chips and power electronics modules	INSTITUT VEDECOM
10950514	Packaged semiconductor devices and methods of packaging semiconductor devices	--
10950515	Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10950516	Resin encapsulated power semiconductor module with exposed terminal areas	ABB SCHWEIZ AG
10950517	Printed circuit board and semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10950519	Integrated circuit package and method	--
10950520	Electronic package, method for fabricating the same, and heat dissipator	--
10950521	Thermal interface material layer and package-on-package device including the same	SAMSUNG ELECTRONICS CO., LTD.
10950522	Electronic device	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
10950523	Semiconductor devices having through electrodes and methods for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10950524	Heterojunction semiconductor device for reducing parasitic capacitance	--
10950525	Fabrication method of packaging structure	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
10950526	Semiconductor device	DENSO CORPORATION
10950527	Semiconductor device and method for manufacturing the same	RENESAS ELECTRONICS CORPORATION
10950528	Chip package assembly and method for manufacturing the same	SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
10950529	Semiconductor device package	ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
10950530	Semiconductor device package and method of manufacturing the same	--
10950531	Semiconductor device package and method of manufacturing the same	--
10950532	Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method	MITSUI CHEMICALS, INC.
10950533	Through electrode substrate and semiconductor device	DAI NIPPON PRINTING CO., LTD.
10950534	Through-substrate via structure and method of manufacture	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10950535	Package structure and method of manufacturing the same	--
10950536	Packed interconnect structure with reduced cross coupled noise	INTEL CORPORATION
10950537	Land side and die side cavities to reduce package z-height	INTEL CORPORATION
10950538	Semiconductor structure and manufacturing method thereof	--
10950539	Redistribution substrate, method of fabricating the same, and semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
10950540	Enhancing integrated circuit density with active atomic reservoir	--
10950541	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10950542	High-performance variable gain amplifier employing laminate transmission line structures	ANALOG DEVICES, INC.
10950543	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
10950544	Semiconductor device including gate pattern having pad region	SAMSUNG ELECTRONICS CO., LTD.
10950545	Circuit wiring techniques for stacked transistor structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10950546	Semiconductor device including back side power supply circuit	--
10950547	Stacked IC structure with system level wiring on multiple sides of the IC die	XCELSIS CORPORATION
10950548	Semiconductor device	MURATA MANUFACTURING CO., LTD.
10950549	ILD gap fill for memory device stack array	INTERNATIONAL BUSINESS MACHINES CORPORATION
10950550	Semiconductor package with through bridge die connections	INTEL CORPORATION
10950551	Embedded component package structure and manufacturing method thereof	--
10950552	Ring-in-ring configurable-capacitance stiffeners and methods of assembling same	INTEL CORPORATION
10950553	System on integrated chips and methods of forming the same	--
10950554	Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same	--
10950555	Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator	INTEL CORPORATION
10950556	EMI shielding structure in InFO package	--
10950557	Stacked chip package structure and manufacturing method thereof	--
10950558	Semiconductor device, power converter, and method for manufacturing semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10950559	Protected electronic integrated circuit chip	STMICROELECTRONICS (ROUSSET) SAS
10950560	Semiconductor module having slits and shunt resistor	MITSUBISHI ELECTRIC CORPORATION
10950561	Antenna module	SAMSUNG ELECTRONICS CO., LTD.
10950562	Impedance-matched through-wafer transition using integrated heat-spreader technology	HRL LABORATORIES, LLC
10950563	Chip packages and methods for forming the same	SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
10950564	Methods of forming microelectronic devices having a patterned surface structure	MICRON TECHNOLOGY, INC.
10950565	Interconnect structures for preventing solder bridging, and associated systems and methods	MICRON TECHNOLOGY, INC.
10950566	Semiconductor device and method for manufacturing the semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10950567	Hollow sealed device and manufacturing method therefor	MITSUBISHI ELECTRIC CORPORATION
10950568	Semiconductor device assembly with surface-mount die support structures	MICRON TECHNOLOGY, INC.
10950569	High frequency module and communication device	MURATA MANUFACTURING CO., LTD.
10950570	Bonding wire for semiconductor device	NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
10950571	Bonding wire for semiconductor device	NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
10950572	Die bonder and methods of using the same	--
10950573	Lead-free column interconnect	INTERNATIONAL BUSINESS MACHINES CORPORATION
10950574	Sensor having system-in-package module, method for producing the same, and sensor arrangement	CONTINENTAL TEVES AG & CO. OHG
10950575	Package structure and method of forming the same	--
10950576	Package structure	--
10950577	Redistribution layers in semiconductor packages and methods of forming same	--
10950578	Semiconductor device, semiconductor package and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10950579	Integrated circuit package and method of forming same	--
10950580	Semiconductor device assemblies with lids including circuit elements	MICRON TECHNOLOGY, INC.
10950581	3D semiconductor device and structure	MONOLITHIC 3D INC.
10950582	Semiconductor power module	ROHM CO., LTD.
10950586	Semiconductor devices having upper and lower solder portions and methods of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10950587	Printed circuit board and package structure	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10950588	Chip package structure and manufacturing method thereof	--
10950591	Display with embedded pixel driver chips	APPLE INC.
10950592	Display panel and method of fabricating the same, display device	BOE TECHNOLOGY GROUP CO., LTD.
10950593	Package structure including at least one connecting module and manufacturing method thereof	--
10950597	Electrostatic protection circuit and a semiconductor structure	--
10950599	3D semiconductor device and structure	MONOLITHIC 3D INC.
10950606	Dual fin endcap for self-aligned gate edge (SAGE) architectures	INTEL CORPORATION
10950617	Memory device with multiple layers	TOSHIBA MEMORY CORPORATION
10950623	3D NAND memory device and method of forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10950628	Vertical memory device and method of fabrication the same	SAMSUNG ELECTRONICS CO., LTD.
10950630	Semiconductor memory	TOSHIBA MEMORY CORPORATION
10950635	Orthogonal transistor layouts	SKYWORKS SOLUTIONS, INC.
10950637	Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment	SONY CORPORATION
10950647	Semiconductor device and method of manufacturing the same, and electronic apparatus	SONY CORPORATION
10950648	Semiconductor element, manufacturing method of semiconductor element, and electronic apparatus	SONY CORPORATION
10950661	Integrated circuits with resistive non-volatile memory cells and methods for producing the same	GLOBALFOUNDRIES SINGAPORE PTE. LTD.
10950664	Semiconductor memory device including phase change material layers and method for manufacturing thereof	--
10950686	Semiconductor device including a chip capacitor mounted on a wiring substrate	RENESAS ELECTRONICS CORPORATION
10950687	Manufacturing method of substrate structure	--
10950688	Packages for power modules with integrated passives	KEMET ELECTRONICS CORPORATION
10950689	Semiconductor device with a through-substrate via hole having therein a capacitor and a through-substrate via conductor	NANYANG TECHNOLOGICAL UNIVERSITY
10950692	Methods of forming air gaps between source/drain contacts and the resulting devices	GLOBALFOUNDRIES U.S. INC.
10950704	Vertical memory devices	SAMSUNG ELECTRONICS CO., LTD.
10950729	Contact structure with insulating cap	--
10950749	Light emission device including output coupler and optical apparatus adopting the same	SAMSUNG ELECTRONICS CO., LTD.
10950760	Two component glass body for tape casting phosphor in glass LED converters	OSRAM OPTO SEMICONDUCTORS GMBH
10950767	Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same	SHENZHEN JUFEI OPTOELECTRONICS CO., LTD.
10950778	Superconducting bump bond electrical characterization	NORTHROP GRUMMAN SYSTEMS CORPORATION
10950787	Method having resistive memory crossbar array employing selective barrier layer growth	INTERNATIONAL BUSINESS MACHINES CORPORATION
10950824	Flexible display device	SAMSUNG DISPLAY CO., LTD.
10951106	Semiconductor device	DENSO CORPORATION
10951174	High-frequency amplifier	MITSUBISHI ELECTRIC CORPORATION
10951180	RF power transistors with impedance matching circuits, and methods of manufacture thereof	NXP USA, INC.
10952310	High-frequency module	MURATA MANUFACTURING CO., LTD.
10952313	Via impedance matching	ARISTA NETWORKS, INC.
10952317	Ceramic circuit board and semiconductor module	KABUSHIKI KAISHA TOSHIBA
10952319	Electronic component embedded substrate	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10952333	Method for stress reduction in semiconductor package via carrier	MICRON TECHNOLOGY, INC.
10952354	Cold plate with metal tube connection and flexible metal tube	--
10953487	Ultrasonic vibration bonding apparatus	TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
10953593	Molding compound including a carbon nano-tube dispersion	MICRON TECHNOLOGY, INC.
10953630	Method for manufacturing clad material	HITACHI METALS, LTD.
10953793	Haptic function leather component and method of making the same	HONDA MOTOR CO., LTD.
10954122	Method for bonding of at least three substrates	EV GROUP E. THALLNER GMBH
10954591	Method for producing a structured coating on a substrate, coated substrate, and semi-finished product having a coated substrate	MSG LITHOGLAS AG
10955123	Micro-LED module and method for fabricating the same	LUMENS CO., LTD.
10955202	Cold plate heat exchanger	ADVANCED THERMAL SOLUTIONS, INC.
10955465	Method and apparatus for bond wire testing in an integrated circuit	TERADYNE, INC.
10955671	Stretchable film assembly with conductive traces	INVENSAS CORPORATION
10955700	Transparent panel provided with light emitting function	STANLEY ELECTRIC CO., LTD.
10955747	Apparatus and methods of electrically conductive optical semiconductor coating	GOODRICH CORPORATION
10955881	Memory module cooling assembly	SEAGATE TECHNOLOGY LLC
10955905	Apparatus for true power shedding via switchable electrical connections	NORTH SEA INVESTMENT COMPANY LTD.
10956622	Thermal hardware-based data security device that permanently erases data by using local heat generation phenomenon and method thereof	KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
10956645	Adaptive multi-tier power distribution grids for integrated circuits	QUALCOMM INCORPORATED
10957418	Interconnect system	MICRON TECHNOLOGY, INC.
10957537	Methods to design and uniformly co-fabricate small vias and large cavities through a substrate	HRL LABORATORIES, LLC
10957559	Thermally conductive structure for heat dissipation in semiconductor packages	--
10957560	Pressure sintering procedure in which power semiconductor components with a substrate are connected to each other via a sintered connection	SEMIKRON ELEKTRONIK GMBH & CO. KG
10957571	Apparatus and methods for determining wafer characters	--
10957575	Method for connecting a buried interconnect rail and a semiconductor fin in an integrated circuit chip	IMEC VZW
10957581	Self aligned via and pillar cut for at least a self aligned double pitch	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957582	Self aligned via and pillar cut for at least a self aligned double pitch	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957583	Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957584	Structure and method to improve FAV RIE process margin and electromigration	TESSERA, INC.
10957586	FDSOI with on-chip physically unclonable function	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957587	Structure and formation method of semiconductor device with conductive feature	--
10957588	Chamferless via structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957590	Method for forming a layer	APPLIED MATERIALS, INC.
10957591	Process of forming semiconductor device	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
10957592	Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate	DAI NIPPON PRINTING CO., LTD.
10957594	Manufacturing method of semiconductor chip	--
10957596	Caterpillar trenches for efficient wafer dicing	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957610	Integrated circuit component and package structure having the same	--
10957611	Semiconductor package including lid structure with opening and recess	--
10957612	Power semiconductor module arrangement and housing for a power semiconductor arrangement	INFINEON TECHNOLOGIES AG
10957613	Semiconductor module and semiconductor device container	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
10957614	Heat dissipation substrate and fabricating method thereof	--
10957615	Laser-seeding for electro-conductive plating	ELECTRO SCIENTIFIC INDUSTRIES, INC
10957616	Package structure and method	--
10957617	Semiconductor device	MURATA MANUFACTURING CO., LTD.
10957618	Thermally conductive electronic packaging	APEX MICROTECHNOLOGY, INC.
10957619	Semiconductor apparatus	FUJI ELECTRIC CO., LTD.
10957620	Electronic device including cooling structure	SAMSUNG ELECTRONICS CO., LTD.
10957621	Heat sink for a power semiconductor module	--
10957622	Spatially localized thermal interface materials	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957623	Thermal interface material structures including protruding surface features to reduce thermal interface material migration	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957624	Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems	MICROFABRICA INC.
10957625	Pillar-last methods for forming semiconductor devices	MICRON TECHNOLOGY, INC.
10957626	Sensor device with carbon nanotube sensor positioned on first and second substrates	THERMO ELECTRON SCIENTIFIC INSTRUMENTS LLC
10957627	Semiconductor packages including a bridge die	SK HYNIX INC.
10957628	Bottom up electroplating with release layer	CORNING INCORPORATED
10957629	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10957630	Semiconductor device and semiconductor device manufacturing method	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
10957631	Angled die pad of a leadframe for a molded integrated circuit package	TEXAS INSTRUMENTS INCORPORATED
10957632	Lead frame assembly for a semiconductor device	NEXPERIA B.V.
10957633	Semiconductor device packaging assembly, lead frame strip and unit lead frame with trenches or grooves for guiding liquefied molding material	INFINEON TECHNOLOGIES AG
10957634	Modified leadframe design with adhesive overflow recesses	STMICROELECTRONICS, INC.
10957635	Multi-chip package with high thermal conductivity die attach	TEXAS INSTRUMENTS INCORPORATED
10957636	Semiconductor device	ROHM CO., LTD.
10957637	Quad flat no-lead package with wettable flanges	TEXAS INSTRUMENTS INCORPORATED
10957638	Device with pillar-shaped components	LAPIS SEMICONDUCTOR CO., LTD.
10957639	Electronic component having a transistor and interdigitated fingers to form at least a portion of a capacitive component within the electronic component	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10957640	Method for manufacturing a semiconductor structure	--
10957641	Semiconductor device and manufacturing method thereof	TOSHIBA MEMORY CORPORATION
10957642	Resistance tunable fuse structure formed by embedded thin metal layers	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957643	Formation of semiconductor devices including electrically programmable fuses	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957644	Integrated structures with conductive regions having at least one element from group 2 of the periodic table	MICRON TECHNOLOGY, INC.
10957645	Package structure having conductive patterns with crystal grains copper columnar shape and method manufacturing the same	--
10957646	Hybrid BEOL metallization utilizing selective reflection mask	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957647	Integrated circuit devices including a boron-containing insulating pattern	SAMSUNG ELECTRONICS CO., LTD.
10957648	Three-dimensional memory device containing contact via structure extending through source contact layer and dielectric spacer assembly	SANDISK TECHNOLOGIES LLC
10957649	Overpass dice stacks and methods of using same	INTEL CORPORATION
10957650	Bridge support structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957651	Package level power gating	NVIDIA CORP.
10957652	Circuit board	TAIYO YUDENCO., LTD.
10957653	Methods for manufacturing semiconductor arrangements using photoresist masks	--
10957654	Semiconductor package and method of manufacturing the same	NEPES CO., LTD.
10957655	Integrated circuit with inductors having electrically split scribe seal	TEXAS INSTRUMENTS INCORPORATED
10957656	Integrated circuit packages with patterned protective material	INTEL CORPORATION
10957657	Advanced crack stop structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957658	Package structure with structure reinforcing element and manufacturing method thereof	--
10957659	Monolithic integration of III-V cells for powering memory erasure devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957660	Land grid array patterns for modular electronics platforms and methods of performing the same	HAND HELD PRODUCTS, INC.
10957661	Interconnections for a substrate associated with a backside reveal	INVENSAS CORPORATION
10957662	Semiconductor package	--
10957663	Spoked solder pad to improve solderability and self-alignment of integrated circuit packages	--
10957664	Semiconductor structure and manufacturing method thereof	--
10957665	Direct C4 to C4 bonding without substrate	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957666	Pre-molded leadframes in semiconductor devices	TEXAS INSTRUMENTS INCORPORATED
10957667	Indium solder metallurgy to control electro-migration	INTEL CORPORATION
10957668	Anisotropic conductive film (ACF) with controllable distribution state of conductive substance and manufacturing method thereof	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
10957669	Back side metallization	ADVANCED MICRO DEVICES, INC.
10957670	Package-on-package and package connection system comprising the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10957671	Method for fabricating a semiconductor and semiconductor package	INTEL DEUTSCHLAND GMBH
10957672	Package structure and method of manufacturing the same	--
10957673	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
10957675	Lighting-emitting device filament	SEOUL SEMICONDUCTOR CO., LTD.
10957678	Display module and system applications	APPLE INC.
10957679	Logic drive based on standardized commodity programmable logic semiconductor IC chips	--
10957680	Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same	SANDISK TECHNOLOGIES LLC
10957681	Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory array	MICRON TECHNOLOGY, INC.
10957682	LED display modules and methods for making the same	LUMENS CO., LTD.
10957683	Integrated circuit including multi-height standard cell and method of designing the same	SAMSUNG ELECTRONICS CO., LTD.
10957687	ESD hard backend structures in nanometer dimension	--
10957688	Monolithic single chip integrated radio frequency front end module configured with single crystal acoustic filter devices	AKOUSTIS, INC.
10957691	Semiconductor device, semiconductor device manufacturing method, and power conversion apparatus	MITSUBISHI ELECTRIC CORPORATION
10957692	Asymmetric transient voltage suppressor device and methods for formation	LITTELFUSE, INC.
10957693	Vertical transistors with different gate lengths	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957701	Fin-based anti-fuse device for integrated circuit (IC) products, methods of making such an anti-fuse device and IC products comprising such an anti-fuse device	GLOBALFOUNDRIES U.S. INC.
10957706	Multi-tier three-dimensional memory device with dielectric support pillars and methods for making the same	SANDISK TECHNOLOGIES LLC
10957708	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10957712	Substrate and method for producing substrate	SHARP KABUSHIKI KAISHA
10957719	Semiconductor device and a method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
10957733	Interconnect bump structures for photo detectors	SENSORS UNLIMITED, INC.
10957738	Magnetic random access memory (MRAM) structure with small bottom electrode	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957741	Multitier arrangements of integrated devices, and methods of forming sense/access lines	MICRON TECHNOLOGY, INC.
10957744	Display device including process key	LG DISPLAY CO., LTD.
10957760	Semiconductor structure having air gap dielectric and method of preparing the same	--
10957762	Manufacturing method of semiconductor device including conductive structure	--
10957764	Vertical semiconductor device	INFINEON TECHNOLOGIES AG
10957766	Fin-based strap cell structure	--
10957774	Laterally diffused metal oxide semiconductor with gate poly contact within source window	TEXAS INSTRUMENTS INCORPORATED
10957778	Formation of air gap spacers for reducing parasitic capacitance	INTERNATIONAL BUSINESS MACHINES CORPORATION
10957782	Trench contact structures for advanced integrated circuit structure fabrication	INTEL CORPORATION
10957787	Sensors based on a heterojunction bipolar transistor construction	GLOBALFOUNDRIES SINGAPORE PTE. LTD.
10957790	Semiconductor device with selectively etched surface passivation	NXP USA, INC.
10957803	Bidirectional Zener diode and method for manufacturing bidirectional Zener diode	ROHM CO., LTD.
10957812	Display device and method of manufacturing the same	LG DISPLAY CO., LTD.
10957832	Electronics package for light emitting semiconductor devices and method of manufacturing thereof	GENERAL ELECTRIC COMPANY
10957833	Light emitting diode display device	SAMSUNG ELECTRONICS CO., LTD.
10957836	Printed board and light emitting device	NICHIA CORPORATION
10957964	Multilayer transmission line plate	SHOWA DENKO MATERIALS CO., LTD.
10957982	Antenna module formed of an antenna package and a connection member	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10958250	Semiconductor device	RENESAS ELECTRONICS CORPORATION
10958268	Transformer-based driver for power switches	INFINEON TECHNOLOGIES AUSTRIA AG
10958270	Physical unclonable device and method of maximizing existing process variation for a physically unclonable device	--
10959320	Circuit board and electronic device including circuit board	KYOCERA CORPORATION
10959328	Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10959331	Electrical components attached to fabric	APPLE INC.
10959333	Semiconductor device	FUJI ELECTRIC CO., LTD.
10959336	Method of liquid assisted binding	MIKRO MESA TECHNOLOGY CO., LTD.
10959337	Connection structure	MIKUNI ELECTRON CORPORATION
10959342	Condensation resistant power semiconductor module	--
10959352	Cooling system with floating cold plate with single pipes	--
10959357	Circuit block assembly	MURATA MANUFACTURING CO., LTD.
10959358	Electronic component module	TAIYO YUDEN CO., LTD.
10960488	Operating method for an ultrasonic wire bonder with active and passive vibration damping	HESSE GMBH
10960498	Coated wire	HERAEUS MATERIALS SINGAPORE PTE., LTD.
10960666	Element substrate, liquid discharge head, and printing apparatus	CANON KABUSHIKI KAISHA
10961115	Semiconductor structure and manufacturing method thereof	--
10961398	High refractive index silicone nanocomposites	PIXELLIGENT TECHNOLOGIES, LLC
10961411	Inkjet adhesive, manufacturing method for semiconductor device, and electronic component	SEKISUI CHEMICAL CO., LTD.
10961423	Curable composition, thermally conductive material, and device with thermally conductive layer	FUJIFILM CORPORATION
10962296	Low-cost nano-heat pipe	INFINERA CORPORATION
10962297	Multidimensional heat transfer system for cooling electronic components	BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
10962299	Evaporator structure with improved layout of cooling fluid channels	--
10962309	Stacked heat exchanger	DENSO CORPORATION
10962434	Sensor device utilizing adhesives and manufacturing method thereof	FUJI ELECTRIC CO., LTD.
10962469	Microsystem device comprising integrated desiccant monitoring	ALBERT-LUDWIGS-UNIVERSIT&#XC4;T FREIBURG
10962570	System, a tangent probe card and a probe head assembly for testing semiconductor wafer	--
10962571	Interposers having cuts through an insulating substrate	TEXAS INSTRUMENTS INCORPORATED
10962573	Current sensor device	DENSO CORPORATION
10962610	On-chip detection of spin states in color centers for metrology and information processing	MASSACHUSETTS INSTITUTE OF TECHNOLOGY
10962728	Co-packaged optics and transceiver	ROCKLEY PHOTONICS LIMITED
10963022	Layered super-reticle computing : architectures and methods	INTEL CORPORATION
10963607	Determining mechanical reliability of electronic packages assembled with thermal pads	ANSYS, INC.
10964160	Player tracking device main body and player tracking device	UNIVERSAL ENTERTAINMENT CORPORATION
10964178	Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems	INTEL CORPORATION
10964380	Integrated device comprising memory bitcells comprising shared preload line and shared activation line	QUALCOMM INCORPORATED
10964397	Vertical memory device having improved electrical characteristics and method of operating the same	SAMSUNG ELECTRONICS CO., LTD.
10964440	Anisotropic conductive film	DEXERIALS CORPORATION
10964505	Naturally closed MEMs switch for ESD protection	CAVENDISH KINETICS, INC.
10964530	Method of forming blocking silicon oxide film, and storage medium	TOKYO ELECTRON LIMITED
10964552	Methods for producing laminate and substrate for mounting a semiconductor device	MITSUBISHI GAS CHEMICAL COMPANY, INC.
10964553	Manufacturing method of semiconductor device and semiconductor device	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10964554	Wafer-level fan-out package with enhanced performance	QORVO US, INC.
10964561	Integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA)	MATRICS2, INC.
10964583	Micro-transfer-printable flip-chip structures and methods	X DISPLAY COMPANY TECHNOLOGY LIMITED
10964588	Selective ILD deposition for fully aligned via with airgap	TESSERA, INC.
10964589	Semiconductor structure	--
10964590	Contact metallization process	--
10964591	Processes for reducing leakage and improving adhesion	--
10964594	Methods of packaging semiconductor devices including placing semiconductor devices into die caves	--
10964595	Method for singulating packaged integrated circuits and resulting structures	--
10964596	Backside metal patterning die singulation system and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10964610	Packaging mechanisms for dies with different sizes of connectors	--
10964611	Die edge integrity monitoring system	MELEXIS TECHNOLOGIES NV
10964613	Environmentally protected sensing device	INVENSENSE, INC.
10964614	Semiconductor device and method for fabricating the same	SK HYNIX INC.
10964615	Chip-scale sensor package structure	--
10964616	Semiconductor package structure and method of manufacturing the same	--
10964617	Methods for establishing thermal joints between heat spreaders or lids and heat sources	LAIRD TECHNOLOGIES, INC.
10964618	Semiconductor package and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10964620	Thermally conductive sheet	SEKISUI POLYMATECH CO., LTD.
10964621	Memory device with high resistivity thermal barrier	MICRON TECHNOLOGY, INC.
10964622	Semiconductor package	MITSUBISHI ELECTRIC CORPORATION
10964623	Electronic module and method for encapsulation thereof	ZF FRIEDRICHSHAFEN AG
10964624	Techniques for fluid cooling of integrated circuits in packages	INTEL CORPORATION
10964625	Device and method for direct liquid cooling via metal channels	GOOGLE LLC
10964626	Semiconductor structure and method of making the same	--
10964627	Integrated electronic device having a dissipative package, in particular dual side cooling package	STMICROELECTRONICS S.R.L.
10964628	Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture	INFINEON TECHNOLOGIES AG
10964629	Siderail with mold compound relief	TEXAS INSTRUMENTS INCORPORATED
10964630	Semiconductor device having a conductor plate and semiconductor elements	DENSO CORPORATION
10964631	Semiconductor package and module	MITSUBISHI ELECTRIC CORPORATION
10964632	Semiconductor device	TOSHIBA MEMORY CORPORATION
10964633	Wiring substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10964634	Method of manufacturing circuit carrier with embedded semiconductor substrate	--
10964635	Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making	SCHWEIZER ELECTRONIC AG
10964636	Interconnect structure with low resistivity and method for forming the same	--
10964637	Package and light emitting device	NICHIA CORPORATION
10964638	Vertical memory device including common source line structure	SAMSUNG ELECTRONICS CO., LTD.
10964639	Integrated circuits including via array and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10964640	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10964641	Method of forming semiconductor packages having through package vias	--
10964642	Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane	INFINEON TECHNOLOGIES AG
10964643	Semiconductor package and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10964644	Array substrate, chip on film, and alignment method	KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
10964645	Electronic component with thin-film shield layer	MURATA MANUFACTURING CO., LTD.
10964646	IC with insulating trench and related methods	STMICROELECTRONICS S.R.L.
10964647	Dielectric crack stop for advanced interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
10964648	Chip security fingerprint	INTERNATIONAL BUSINESS MACHINES CORPORATION
10964649	Tamper detection in integrated circuits	ARM LIMITED
10964650	Info structure and method forming same	--
10964651	Method and apparatus of ESD protection in stacked die semiconductor device	--
10964652	Semiconductor device package and method of manufacturing the same	--
10964653	Method of forming a semiconductor device comprising top conductive pads	--
10964654	3DI solder cup	MICRON TECHNOLOGY, INC.
10964655	Patterning polymer layer to reduce stress	--
10964656	Semiconductor package and method of manufacturing same	NEPES CO., LTD.
10964657	Radio-frequency module and communication device	MURATA MANUFACTURING CO., LTD.
10964658	Semiconductor device having a metallic oxide or metallic hydroxide barrier layer	TOSHIBA MEMORY CORPORATION
10964659	Semiconductor device	--
10964660	Use of adhesive films for 3D pick and place assembly of electronic components	FLEX LTD.
10964661	Wire bonding apparatus, circuit for wire bonding apparatus, and method for manufacturing semiconductor device	SHINKAWA LTD.
10964662	Method of transferring micro device	MIKRO MESA TECHNOLOGY CO., LTD.
10964663	Die bonder and methods of using the same	--
10964664	DBI to Si bonding for simplified handle wafer	INVENSAS BONDING TECHNOLOGIES, INC.
10964665	Method for forming complex electronic circuits by interconnecting groups of printed devices	NTHDEGREE TECHNOLOGIES WORLDWIDE, INC.
10964666	Chip on package structure and method	--
10964667	Stacked integrated circuit structure and method of forming	--
10964668	Stacked transistor packages	PGS GEOPHYSICAL AS
10964669	Semiconductor package including stress-equalizing chip	SAMSUNG ELECTRONICS CO., LTD.
10964670	Semiconductor package and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10964671	Stacked chips comprising interconnects	TOSHIBA MEMORY CORPORATION
10964673	Semiconductor device and manufacturing method of the same	--
10964676	Semiconductor structure and a method of making thereof	BROADPAK CORPORATION
10964677	Electronic packages with stacked sitffeners and methods of assembling same	INTEL CORPORATION
10964678	LED screen or illumination means with a flexible film structure	LEDFOIL FINLAND OY
10964680	Display device	SAMSUNG DISPLAY CO., LTD.
10964681	Semiconductor device and method for manufacturing the same	TOSHIBA MEMORY CORPORATION
10964682	Data storage system using wafer-level packaging	INTEL CORPORATION
10964683	Memory array circuit and method of manufacturing the same	--
10964685	Integrated circuit and method of generating integrated circuit layout	--
10964687	FinFET ESD device with Schottky diode	GLOBALFOUNDRIES U.S. INC.
10964688	Semiconductor device	ROHM CO., LTD.
10964689	Semiconductor structure	--
10964691	Method for manufacturing monolithic three-dimensional (3D) integrated circuits	--
10964692	Through silicon via design for stacking integrated circuits	--
10964693	Semiconductor device having a plurality of bipolar transistors with different heights between their respective emitter layers and emitter electrodes	MURATA MANUFACTURING CO., LTD.
10964695	Semiconductor structure	--
10964699	Multi-layer horizontal thyristor random access memory and peripheral circuitry	TCLAB, INC.
10964708	Fuse-array element	MICRON TECHNOLOGY, INC.
10964714	Three-dimensional semiconductor memory device	SAMSUNG ELECTRONICS CO., LTD.
10964715	Three-dimensional memory device containing channels with laterally pegged dielectric cores	SANDISK TECHNOLOGIES LLC
10964724	Display device	JAPAN DISPLAY INC.
10964781	High voltage resistor device	--
10964784	Integrated circuit device and manufacturing method thereof	--
10964786	Group III-V compound semiconductor substrate and group III-V compound semiconductor substrate with epitaxial layer	SUMITOMO ELECTRIC INDUSTRIES, LTD.
10964788	Semiconductor device and operating method thereof	--
10964805	Compound semiconductor device	FUJITSU LIMITED
10964810	Methodology and structure for field plate design	--
10964815	CMOS finFET with doped spacers and method for forming the same	--
10964818	Semiconductor device doped from a diffused layer	SEMICONDUCTOR MANUFACTURING (SHANGHAI) INTERNATIONAL CORPORATION
10964825	Semiconductor device	ROHM CO., LTD.
10964839	Manufacturing method of sensor chip package structure	--
10964865	Printed board, light emitting device, and method for manufacturing same	NICHIA CORPORATION
10964871	Micro LED structure and method of manufacturing same	POINT ENGINEERING CO., LTD.
10964882	Bonding method	NGK INSULATORS, LTD.
10964900	Light emitting diode display with redundancy scheme	APPLE INC.
10964912	Protective structure and electronic device with the same	--
10965013	Antenna module	KYOCERA CORPORATION
10965097	Light emitting device	NICHIA CORPORATION
10965121	Integrated thermally protected varistor and discharge tube	CITEL
10965269	Electronic devices formed in a cavity between substrates and including a via	SKYWORKS SOLUTIONS, INC.
10965289	Metal oxide semiconductor device of an integrated circuit	QUALCOMM INCORPORATED
10965851	Camera device and mobile terminal having same	TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
10965895	Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device	SONY CORPORATION
10966316	Wiring film, device transfer sheet, and textile type device	JAPAN SCIENCE AND TECHNOLOGY AGENCY
10966321	System-in-package including opposing circuit boards	APPLE INC.
10966322	Semiconductor device and manufacturing method of semiconductor device	FUJI ELECTRIC CO., LTD.
10966347	Liquid cooling device	--
10966348	Semiconductor cooling device, power control system and travelling body including a semiconductor colling device with microbubble generator	MITSUBISHI ELECTRIC CORPORATION
10966351	Heat pipe and vapor chamber heat dissipation	ELPIS TECHNOLOGIES INC.
10966352	Cooling electronic devices in a data center	GOOGLE LLC
10966354	Liquid cooling module	BAIDU USA LLC
10966355	Electric power conversion apparatus	HITACHI, LTD.
10966683	Integrated ultrasonic transducers	EXO IMAGING INC.
10967463	Sn whisker growth mitigation using NiO sublayers	THE UNIVERSITY OF TOLEDO
10967609	Clad material	HITACHI METALS, LTD.
10967756	Liquid cooling module	--
10968097	Support structure for MEMS device with particle filter	--
10968320	Thermal interface materials including polymeric phase-change materials	INTERNATIONAL BUSINESS MACHINES CORPORATION
10968348	Laser-releasable bonding materials for 3-D IC applications	BREWER SCIENCE, INC.
10968364	Plasma polymerized thin film having low dielectric constant, device, and method of preparing thin film	RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
10968519	Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor	TDK CORPORATION
10968529	Insulation systems and methods of depositing insulation systems	GENERAL ELECTRIC COMPANY
10968531	Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath	NOVELLUS SYSTEMS, INC.
10969102	Portable biometric lighter	JOHN GIBSON ENTERPRISES, INC.
10969177	Pin fin heat sink with integrated phase change material and method	HAMILTON SUNDSTRAND CORPORATION
10969222	Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect	INTERNATIONAL BUSINESS MACHINES CORPORATION
10969422	Guard ring monitor	INTERNATIONAL BUSINESS MACHINES CORPORATION
10969423	Switch coupling functional circuitry to via, scan cell contacting via	TEXAS INSTRUMENTS INCORPORATED
10969837	Heat sink and electronic device having same	HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.
10969840	Heat spreaders with interlocked inserts	INTEL CORPORATION
10969998	Semiconductor apparatus including a plurality of dies operating as a plurality of channels	SK HYNIX INC.
10970267	Preparing a hierarchical clustering data structure for compression	INTEL CORPORATION
10970439	System on chip (SOC) current profile model for integrated voltage regulator (IVR) co-design	--
10970440	Method and system for generating layout diagram for semiconductor device having engineering change order (ECO) cells	--
10970450	Cell structures and semiconductor devices having same	--
10970453	Method for the non-copyable manufacture of integrated circuits	UNIVERSITY OF LOUISIANA AT LAFAYETTE
10970627	Time borrowing between layers of a three dimensional chip stack	XCELSIS CORPORATION
10971175	Storage element	SONY CORPORATION
10971208	Semiconductor device having interconnection in package and method for manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10971296	Compact vertical inductors extending in vertical planes	--
10971358	Method of making a peeled magnesium oxide substrate using laser irradiation	SHIN-ETSU POLYMER CO., LTD.
10971371	Multi-chip structure and method of forming same	--
10971375	Method of manufacturing semiconductor devices and corresponding semiconductor device	STMICROELECTRONICS S.R.L.
10971376	Printed circuit board with protective member and method of manufacturing semiconductor package having the same	SAMSUNG ELECTRONICS CO., LTD.
10971377	Semiconductor chip	MURATA MANUFACTURING CO., LTD.
10971383	Fluorescence based thermometry for packaging applications	APPLIED MATERIALS, INC.
10971392	Amorphous metal thin film nonlinear resistor	AMORPHYX, INC.
10971393	Metal-insulator-metal (MIM) structure supporting high voltage applications and low voltage applications	INTEL CORPORATION
10971394	Maskless air gap to prevent via punch through	INTEL CORPORATION
10971395	Method for fabricating semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10971396	Conductive feature formation and structure	--
10971398	Cobalt interconnect structure including noble metal layer	INTERNATIONAL BUSINESS MACHINES CORPORATION
10971399	Oxygen-free replacement liner for improved transistor performance	INTERNATIONAL BUSINESS MACHINES CORPORATION
10971409	Methods and systems for measuring semiconductor devices	MICRON TECHNOLOGY, INC.
10971414	Semiconductor device	FUJI ELECTRIC CO., LTD.
10971415	Semiconductor device, manufacturing method for semiconductor device, semiconductor module, and power conversion device	HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
10971416	Package power delivery using plane and shaped vias	INTEL CORPORATION
10971417	3D stacked-chip package	--
10971418	Packaging structures with improved adhesion and strength	SKYWORKS SOLUTIONS, INC.
10971419	Method and apparatus for reducing noise on integrated circuit using broken die seal	PSEMI CORPORATION
10971420	Method of forming a thermal shield in a monolithic 3-D integrated circuit	SAMSUNG ELECTRONICS CO., LTD.
10971421	Gasket for electrically conductive thermal interface material over a bare die package	DELL PRODUCTS L.P.
10971422	Semiconductor die assembly having a heat spreader that extends through an underlying interposer and related technology	MICRON TECHNOLOGY, INC.
10971423	Metal nanowire based thermal interface materials	CARNEGIE MELLON UNIVERSITY
10971424	Power module and power convertor	MITSUBISHI ELECTRIC CORPORATION
10971425	Semiconductor device	--
10971426	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10971427	Heatsink for information handling system	DELL PRODUCTS L.P.
10971428	Semiconductor baseplates	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10971429	Method for forming a semiconductor package	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10971430	Semiconductor device	KYOCERA CORPORATION
10971431	Semiconductor device, cooling module, power converting device, and electric vehicle	FUJI ELECTRIC CO., LTD.
10971432	Semiconductor device including a through wiring area	SAMSUNG ELECTRONICS CO., LTD.
10971433	Surface mounted type leadframe and photoelectric device with multi-chips	KAISTAR LIGHTING (XIAMEN) CO., LTD.
10971434	Lead frame package having conductive surface with integral lead finger	SILANNA ASIA PTE LTD
10971435	Semiconductor device including bonding pad and bond wire or clip	INFINEON TECHNOLOGIES AG
10971436	Multi-branch terminal for integrated circuit (IC) package	INFINEON TECHNOLOGIES AG
10971437	Chip package structure and method for manufacturing the same	SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
10971438	Chip-on film and display device including the same	LG DISPLAY CO., LTD.
10971439	Ball grid array underfilling systems	HAMILTON SUNDSTRAND CORPORATION
10971440	Semiconductor package having an impedance-boosting channel	INTEL CORPORATION
10971441	Package with metal-insulator-metal capacitor and method of manufacturing the same	--
10971442	Semiconductor device having via sidewall adhesion with encapsulant	--
10971443	Packages with Si-substrate-free interposer and method forming same	--
10971444	Voltage noise reduction of power delivery networks for integrated circuits	INTEL CORPORATION
10971445	Comparison circuit including input sampling capacitor and image sensor including the same	SAMSUNG ELECTRONICS CO., LTD.
10971446	Semiconductor device and method of manufacture	--
10971447	BEOL electrical fuse	INTERNATIONAL BUSINESS MACHINES CORPORATION
10971448	Switching device	MURATA MANUFACTURING CO., LTD.
10971449	Semiconductor device with metallization structure on opposite sides of a semiconductor portion	INFINEON TECHNOLOGIES AG
10971450	Hexagonally arranged connection patterns for high-density device packaging	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
10971451	Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structure	SAMSUNG ELECTRONICS CO., LTD.
10971452	Semiconductor package including electromagnetic interference shielding layer	SK HYNIX INC.
10971453	Semiconductor packaging with high density interconnects	INTEL CORPORATION
10971454	Semiconductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10971455	Ground shield plane for ball grid array (BGA) package	QUALCOMM INCORPORATED
10971456	Electronic component	MURATA MANUFACTURING CO., LTD.
10971457	Semiconductor device comprising a composite material clip	INFINEON TECHNOLOGIES AG
10971458	Compensation network for high speed integrated circuits	CREDO TECHNOLOGY GROUP LIMITED
10971459	High-frequency module	MURATA MANUFACTURING CO., LTD.
10971460	Integrated devices in semiconductor packages and methods of forming same	--
10971461	Semiconductor device and method of manufacture	--
10971462	Package structure and manufacturing method thereof	--
10971463	Interconnection structure including a metal post encapsulated by a joint material having concave outer surface	--
10971464	Electrical connection device and chip module connection device	--
10971465	Driving chip, display substrate, display device and method for manufacturing display device	BOE TECHNOLOGY GROUP CO., LTD.
10971466	High frequency module and communication device	MURATA MANUFACTURING CO., LTD.
10971467	Packaging method and package structure of fan-out chip	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
10971468	Automatic registration between circuit dies and interconnects	3M INNOVATIVE PROPERTIES COMPANY
10971469	Semiconductor device including various peripheral areas having different thicknesses	LAPIS SEMICONDUCTOR CO., LTD.
10971470	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10971471	Methods and systems for manufacturing semiconductor devices	MICRON TECHNOLOGY, INC.
10971472	Method of liquid assisted bonding	MIKRO MESA TECHNOLOGY CO., LTD.
10971473	Semiconductor device	TOSHIBA MEMORY CORPORATION
10971474	Package integration for high bandwidth memory	XILINX, INC.
10971475	Semiconductor package structure	--
10971476	Bottom package with metal post interconnections	QUALCOMM INCORPORATED
10971477	Semiconductor packages and methods of forming the same	--
10971478	Interposer design in package structures for wire bonding applications	INTEL CORPORATION
10971479	Semiconductor package including stacked semiconductor chips	SK HYNIX INC.
10971483	Semiconductor structure and manufacturing method thereof	--
10971484	Package-on-package (PoP) semiconductor package and electronic system including the same	SAMSUNG ELECTRONICS CO., LTD.
10971485	Solenoid inductors within a multi-chip package	--
10971486	Semiconductor package and method of manufacturing the semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10971487	Semiconductor memory device	SK HYNIX INC.
10971488	Active ESD clamp deactivation	INFINEON TECHNOLOGIES AG
10971492	Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same	INTEL CORPORATION
10971493	Integrated circuit device with high mobility and system of forming the integrated circuit	--
10971502	SRAM structure	--
10971503	Structure and method for FinFET SRAM	--
10971512	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
10971514	Multi-tier three-dimensional memory device with dielectric support pillars and methods for making the same	SANDISK TECHNOLOGIES LLC
10971515	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
10971521	Three-dimensional semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10971540	Method and systems for coupling semiconductor substrates	FLIR SYSTEMS, INC.
10971541	Detector architecture using photodetector arrays on thinned substrates	VAREX IMAGING CORPORATION
10971545	Magnetoresistive stacks and methods therefor	EVERSPIN TECHNOLOGIES, INC.
10971576	High resistivity soft magnetic material for miniaturized power converter	INTERNATIONAL BUSINESS MACHINES CORPORATION
10971601	Replacement metal gate structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
10971609	Back end of line nanowire power switch transistors	--
10971620	Method for producing a semiconductor arrangement	INFINEON TECHNOLOGIES DRESDEN GMBH & CO. KG
10971622	Transistor structures	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
10971647	Solar cell via thin film solder bond	AMBERWAVE, INC.
10971656	Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same	NICHIA CORPORATION
10971666	Method for manufacturing an optical module and optical module	MITSUMI ELECTRIC CO., LTD.
10971668	Light-emitting device package including a lead frame	SAMSUNG ELECTRONICS CO., LTD.
10971790	Well thermalized microstrip formation for flexible cryogenic microwave lines in quantum applications	INTERNATIONAL BUSINESS MACHINES CORPORATION
10971798	Semiconductor device package and method of manufacturing the same	--
10971825	Antenna module and method of manufacturing the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10971929	Chip ESD protection circuit	CHINA ELECTRONIC TECHNOLOGY CORPORATION, 24TH RESEARCH INSTITUTE
10972001	Multi-terminal inductors for voltage regulators	INTEL CORPORATION
10972068	Process-invariant delay cell	QUALCOMM INCORPORATED
10973113	Component carrier with transistor components arranged side by side	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
10973117	Differential signal traces including a solder mask disposed thereon	FCI USA LLC
10973151	Vapor chamber	MURATA MANUFACTURING CO., LTD.
10973154	Reconfigurable thermal control of high-powered integrated circuitry	INTEL CORPORATION
10973155	Heat dissipation plate assembly, display module and its assembling method	CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
10973158	Apparatus and method for mounting components on a substrate	BESI SWITZERLAND AG
10973161	Electronic component removal device	RAYTHEON COMPANY
10975267	Anisotropic conductive film and connection structure	DEXERIALS CORPORATION
10976010	LED filament and led light bulb	ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LT
10976119	Heat transfer devices and methods of transfering heat	THE BOEING COMPANY
10976414	Heterogeneous integration of curved mirror structure for passive alignment in chip-scale lidar	GM GLOBAL TECHNOLOGY OPERATIONS LLC
10976491	Photonics interposer optoelectronics	THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
10976789	Systems and methods for thermal management of multilayered integrated circuits	VATHYS, INC.
10977414	Constructing via meshes for high performance routing on silicon chips	INTERNATIONAL BUSINESS MACHINES CORPORATION
10977415	Integrated device and method of forming the same	--
10977539	Systems and methods for use of capacitive member to prevent chip fraud	CAPITAL ONE SERVICES, LLC
10978117	Centralized placement of command and address swapping in memory devices	MICRON TECHNOLOGY, INC.
10978151	Semiconductor memory device with memory cells each including a charge accumulation layer and a control gate	TOSHIBA MEMORY CORPORATION
10978162	Method and semiconductor device for protecting a semiconductor integrated circuit from reverse engineering	--
10978303	Secure permanent integrated circuit personalization	--
10978305	Manufacturing method for a film stack of a semiconductor device	--
10978312	Semiconductor device package and method of manufacturing the same	--
10978313	Fixture facilitating heat sink fabrication	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978314	Multi integrated circuit chip carrier package	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978337	Aluminum-containing layers and methods of forming the same	--
10978338	Semiconductor device and manufacture method thereof	--
10978339	Metal interconnect structure and method for fabricating the same	--
10978342	Interconnect with self-forming wrap-all-around barrier layer	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978343	Interconnect structure having fully aligned vias	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978345	Interconnect structure for stacked device	--
10978346	Conductive vias in semiconductor packages and methods of forming same	--
10978347	Device chip and method of manufacturing device chip	DISCO CORPORATION
10978348	3D chip sharing power interconnect layer	XCELSIS CORPORATION
10978350	Structure and method for metal gates with roughened barrier layer	--
10978360	PNA temperature monitoring method	SHANGHAI HUALI INTEGRATED CIRCUIT CORPORATION
10978362	Semiconductor structure with conductive structure	--
10978363	Semiconductor structure with conductive structure	--
10978364	Semiconductor module	MITSUBISHI ELECTRIC CORPORATION
10978365	Composite compositions for electronics applications	SIRRUS, INC.
10978366	Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module	MITSUBISHI ELECTRIC CORPORATION
10978367	Semiconductor device and method for manufacturing the same	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
10978368	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10978369	Devices for absorbing energy from electronic components	LAIRD TECHNOLOGIES, INC.
10978370	Integrated fan-out packages with embedded heat dissipation structure	--
10978371	Semiconductor device and method for manufacturing semiconductor device	FUJI ELECTRIC CO., LTD.
10978372	Heat sink load balancing apparatus	GOOGLE LLC
10978373	Semiconductor device methods of manufacture	--
10978374	Semiconductor package for discharging heat generated by semiconductor chip	SAMSUNG ELECTRONICS CO., LTD.
10978375	Semiconductor device	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
10978376	Sensing device and method for fabricating the same	ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
10978377	Semiconductor chip set with double-sided off-chip bonding structure	--
10978378	Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier	INFINEON TECHNOLOGIES AG
10978379	Semiconductor device with island and associated leads	ROHM CO., LTD.
10978380	Semiconductor package with multi-level conductive clip for top side cooling	INFINEON TECHNOLOGIES AG
10978381	Semiconductor device	DENSO CORPORATION
10978382	Integrated circuit package and method	--
10978383	Wiring board and method of manufacturing the same	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10978384	Integrated circuits including multi-layer conducting lines	SAMSUNG ELECTRONICS CO., LTD.
10978385	Semiconductor device and manufacturing method thereof	RENESAS ELECTRONICS CORPORATION
10978386	Microelectronic devices with through-silicon vias and associated methods of manufacturing	MICRON TECHNOLOGY, INC.
10978387	Semiconductor device and method for manufacturing the same	--
10978388	Skip via for metal interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978389	Semiconductor device and manufacturing method thereof	--
10978390	Electronic device including switching element and semiconductor memory	SK HYNIX INC.
10978391	Connection structure of semiconductor device and manufacturing method thereof	--
10978392	Electrical chip and optical module	FUJITSU LIMITED
10978393	Hybrid dielectric scheme for varying liner thickness and manganese concentration	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978394	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
10978395	Method of manufacturing a semiconductor device having a power metallization structure	INFINEON TECHNOLOGIES AUSTRIA AG
10978396	Transient electronics using thermoresponsive materials	VANDERBILT UNIVERSITY
10978397	Semiconductor memory device	SAMSUNG ELECTRONICS CO., LTD.
10978398	Semiconductor device and method for fabricating the same	--
10978399	Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate	INTEL CORPORATION
10978400	Conductive vias	STMICROELECTRONICS (GRENOBLE 2) SAS
10978401	Package structure	--
10978402	Electronic devices with yielding substrates	COOLEDGE LIGHTING INC.
10978403	Package structure and method for fabricating the same	--
10978404	Semiconductor structure and method for fabricating semiconductor structure	--
10978405	Integrated fan-out package	--
10978406	Semiconductor package including EMI shielding structure and method for forming the same	--
10978407	Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same	INTEL CORPORATION
10978408	Semiconductor package and manufacturing method thereof	--
10978409	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10978410	Semiconductor structure and manufacturing method thereof	--
10978411	RF power package having planar tuning lines	INFINEON TECHNOLOGIES AG
10978412	Manufacturing method of package structure	--
10978413	Circuit system having compact decoupling structure	--
10978414	Semiconductor device and method of manufacturing a semiconductor device	ABLIC INC.
10978415	Semiconductor package having magnetic interconnects and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10978416	Dual bond pad structure for photonics	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978417	Wiring structure and method for manufacturing the same	--
10978418	Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer	INFINEON TECHNOLOGIES AG
10978419	Semiconductor package and manufacturing method thereof	--
10978420	Semiconductor chip mounting apparatus and semiconductor chip mounting method	SHINKAWA LTD.
10978421	Wafer-level packaging method and package structure	NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
10978423	Projecting contacts and method for making the same	INTEL CORPORATION
10978424	Semiconductor device and manufacturing method thereof	--
10978425	Reducing loss in stacked quantum devices	GOOGLE LLC
10978426	Semiconductor packages with pass-through clock traces and associated systems and methods	MICRON TECHNOLOGY, INC.
10978427	Stacked semiconductor die assemblies with partitioned logic and associated systems and methods	MICRON TECHNOLOGY, INC.
10978428	Manufacturing method of semiconductor device	SK HYNIX INC.
10978431	Semiconductor package with connection substrate and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10978432	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10978433	Package-on-package (PoP) device with integrated passive device in a via	--
10978434	Systems in packages including wide-band phased-array antennas and methods of assembling same	INTEL CORPORATION
10978436	Symmetric FET for RF nonlinearity improvement	PSEMI CORPORATION
10978437	Analog-mixed signal circuit cells with universal Fin pitch and poly pitch	QUALCOMM INCORPORATED
10978438	IC with test structures and E-beam pads embedded within a contiguous standard cell area	PDF SOLUTIONS, INC.
10978446	Semiconductor device	FUJI ELECTRIC CO., LTD.
10978449	Decoupling capacitor	--
10978452	Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978457	Semiconductor device and manufacturing method thereof	--
10978458	Semiconductor device including ultra low-k spacer and method for fabricating the same	SK HYNIX INC.
10978460	Semiconductor structure	--
10978461	Antifuse array and method of forming antifuse using anodic oxidation	--
10978465	Three-dimensional semiconductor device having a memory block and separation structures	SAMSUNG ELECTRONICS CO., LTD.
10978473	Flash memory structure and method of forming the same	--
10978474	Devices including stack structures, and related methods and electronic systems	MICRON TECHNOLOGY, INC.
10978475	Three-dimensional semiconductor memory device	SAMSUNG ELECTRONICS CO., LTD.
10978476	Semiconductor device and method of manufacturing the same	SK HYNIX INC.
10978477	Three-dimensional semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10978478	Block-on-block memory array architecture using bi-directional staircases	MICRON TECHNOLOGY, INC.
10978481	Nonvolatile memory device having a vertical structure and a memory system including the same	SAMSUNG ELECTRONICS CO., LTD.
10978485	Vertical-channel ferroelectric flash memory	--
10978494	Display including plurality of wiring layers in bending region	SAMSUNG ELECTRONICS CO., LTD.
10978495	Array substrate and method of manufacturing the same, and display device	ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
10978500	Flexible base substrate and fabrication method thereof	BOE TECHNOLOGY GROUP CO., LTD.
10978501	Multilevel semiconductor device and structure with waveguides	MONOLITHIC 3D INC.
10978505	Solid-state imaging device including a sensor substrate and a logic substrate	RENESAS ELECTRONICS CORPORATION
10978508	Infrared detector having a directly bonded silicon substrate present on top thereof	L3 CINCINNATI ELECTRONICS CORPORATION
10978547	Integrated inductor	--
10978549	Semiconductor device and method for fabricating the same	--
10978551	Surface area enhancement for stacked metal-insulator-metal (MIM) capacitor	INTERNATIONAL BUSINESS MACHINES CORPORATION
10978579	Semiconductor device	MURATA MANUFACTURING CO., LTD.
10978580	Insulated gate bipolar transistor and diode	ROHM CO., LTD.
10978581	Guard rings for cascode gallium nitride devices	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10978584	Semiconductor structure, semiconductor assembly and power semiconductor device	UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY
10978615	Plurality of light emitting devices having opaque insulating layer between them	--
10978623	Light emitting element including adhesive member containing particles	NICHIA CORPORATION
10978655	Semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
10978778	Wafer level package with integrated antennas and means for shielding	FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
10978779	Sputtered SIP antenna	ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
10978780	Antenna apparatus and antenna module	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10978781	3D antenna for integrated circuits	--
10978782	Semiconductor packages and manufacturing methods thereof	--
10978796	Antenna apparatus and antenna module	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10978869	USB type-C load switch ESD protection	ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
10979062	Data acquisition system-in-package	ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
10980106	Apparatus related to conformal coating implemented with surface mount devices	SKYWORKS SOLUTIONS, INC.
10980108	Multi-conductor interconnect structure for a microelectronic device	INTEL CORPORATION
10980125	Printed circuit board	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10980127	Methods for fabricating printed circuit board assemblies with high density via array	TTM TECHNOLOGIES INC.
10980134	Method for orienting solder balls on a BGA device	INTEL CORPORATION
10980151	Flexible heat transfer mechanism configurations	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
10981779	MEMS devices and methods of forming the same	--
10981781	Semiconductor arrangement and formation thereof	--
10981865	Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compound	DIC CORPORATION
10982053	Polymer containing silphenylene and polyether structures	SHIN-ETSU CHEMICAL CO., LTD.
10983082	Measurement device comprising a suspended semiconductor wire	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
10983278	Adhesion promoter apparatus and method	--
10983439	Calcite channel nanofluidics	SAUDI ARABIAN OIL COMPANY
10983558	Biometric sensor and device including the same	SAMSUNG ELECTRONICS CO., LTD.
10984862	Three-dimensional memory device with embedded dynamic random-access memory	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10984988	Method of manufacturing ring-shaped member and ring-shaped member	THINKON NEW TECHNOLOGY JAPAN CORPORATION
10985011	Structure and formation method of semiconductor device with resistive elements	--
10985020	Method (and related apparatus) that reduces cycle time for forming large field integrated circuits	--
10985030	Method for manufacturing semiconductor device	ROHM CO., LTD.
10985031	Semiconductor device and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10985032	Power MOSFET	--
10985033	Semiconductor package with reduced parasitic coupling effects and process for making the same	QORVO US, INC.
10985044	Machine vision system for substrate alignment and alignment device	SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
10985050	Semiconductor chip, semiconductor wafer and method for manufacturing semiconductor wafer	DYNAX SEMICONDUCTOR, INC.
10985051	Semiconductor device with air spacer and method for forming the same	--
10985053	Contact plugs and methods of forming same	--
10985054	Interconnect structure and method of forming the same	--
10985055	Interconnection structure with anti-adhesion layer	--
10985056	Structure and method to improve FAV RIE process margin and Electromigration	TESSERA, INC.
10985057	Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC	IMEC VZW
10985058	Semiconductor device and formation thereof	--
10985059	Preclean and dielectric deposition methodology for superconductor interconnect fabrication	NORTHROP GRUMMAN SYSTEMS CORPORATION
10985061	Methods for forming contact plugs with reduced corrosion	--
10985062	Self-aligned contact cap	INTERNATIONAL BUSINESS MACHINES CORPORATION
10985064	Buried power and ground in stacked vertical transport field effect transistors	INTERNATIONAL BUSINESS MACHINES CORPORATION
10985065	Method of dicing a wafer by pre-sawing and subsequent laser cutting	DISCO CORPORATION
10985076	Single metallization scheme for gate, source, and drain contact integration	INTERNATIONAL BUSINESS MACHINES CORPORATION
10985080	Electronic package that includes lamination layer	INTEL CORPORATION
10985081	Semiconductor device and electronic apparatus	SONY CORPORATION
10985082	Apparatus for efficient high-frequency communications	AKASH SYSTEMS, INC.
10985083	Semiconductor device and method for manufacturing the same	ROHM CO., LTD.
10985084	Integrated III-V device and driver device packages with improved heat removal and methods for fabricating the same	GLOBALFOUNDRIES U.S. INC.
10985085	Semiconductor device package and method for manufacturing the same	--
10985086	Information handling system low form factor interface thermal management	DELL PRODUCTS L.P.
10985087	Wiring board	NGK SPARK PLUG CO., LTD.
10985088	System comprising at least one power module comprising at least one power die that is cooled by liquid cooled system	MITSUBISHI ELECTRIC CORPORATION
10985089	Semiconductor cooling arrangement	YASA LIMITED
10985090	Methods of manufacturing a thin film resistor with ends overlapped by interconnect pads	--
10985091	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10985092	Semiconductor device	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
10985093	Semiconductor device and method for producing semiconductor device	ROHM CO., LTD.
10985094	Lead frame and method of manufacturing lead frame	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10985095	Power module for vehicle	HYUNDAI MOTOR COMPANY
10985096	Electrical device terminal finishing	TEXAS INSTRUMENTS INCORPORATED
10985097	Interposer-based damping resistor	ADVANCED MICRO DEVICES, INC.
10985098	Electronic component mounting substrate, electronic device, and electronic module	KYOCERA CORPORATION
10985099	Semiconductor packages	SK HYNIX INC.
10985100	Chip package with recessed interposer substrate	--
10985101	Semiconductor package and manufacturing method thereof	--
10985102	Semiconductor device, fabrication method for a semiconductor device and electronic apparatus	SONY CORPORATION
10985103	Apparatus and method of forming backside buried conductor in integrated circuit	SAMSUNG ELECTRONICS CO., LTD.
10985104	Semiconductor device having electrode pad and electrode layer intervening semiconductor layer inbetween and manufacturing method thereof	KABUSHIKI KAISHA TOSHIBA
10985105	Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements	INTERNATIONAL BUSINESS MACHINES CORPORATION
10985106	Stack packages including bridge dies	SK HYNIX INC.
10985107	Systems and methods for forming die sets with die-to-die routing and metallic seals	APPLE INC.
10985108	Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof	HENKEL IP & HOLDING GMBH
10985109	Shielded semiconductor packages with open terminals and methods of making via two-step process	STATS CHIPPAC PTE. LTD.
10985110	Semiconductor package having an electromagnetic shielding structure and method for producing the same	INFINEON TECHNOLOGIES AG
10985111	Electronic assembly, electronic apparatus including the same and method for fabricating electronic assembly	3M INNOVATIVE PROPERTIES COMPANY
10985112	Memory device and method for fabricating the memory device	SK HYNIX INC.
10985113	Display substrate, display panel and display device	CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
10985114	Scheme for connector site spacing and resulting structures	--
10985115	Semiconductor package and manufacturing method thereof	--
10985116	Semiconductor package and method of forming the same	--
10985117	Solder ball protection in packages	--
10985118	High-frequency module	XSIGHT LABS LTD.
10985119	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10985120	Chip packaging method and chip packaging structure	JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
10985121	Bump structure and fabricating method thereof	--
10985122	Semiconductor package system and method	--
10985123	Semiconductor apparatus	MURATA MANUFACTURING CO., LTD.
10985124	Semiconductor structure and manufacturing method thereof	--
10985125	Chip package structure	--
10985126	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10985127	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10985128	Anisotropic conductive film	DEXERIALS CORPORATION
10985129	Mitigating cracking within integrated circuit (IC) device carrier	INTERNATIONAL BUSINESS MACHINES CORPORATION
10985130	Cu alloy bonding wire for semiconductor device	NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
10985131	Microelectronic device having protected connections and manufacturing process thereof	STMICROELECTRONICS S.R.L.
10985132	Bonding apparatus, bonding system, bonding method and storage medium	TOKYO ELECTRON LIMITED
10985133	Die processing	INVENSAS BONDING TECHNOLOGIES, INC.
10985134	Method and system of manufacturing stacked wafers	--
10985135	Methods for controlling warpage in packaging	--
10985136	Microelectronic die stack having at least one rotated microelectronic die	INTEL CORPORATION
10985137	Stacked integrated circuit structure and method of forming	--
10985138	Semiconductor package having a plurality of chips and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
10985139	Semiconductor chip for sensing temperature and semiconductor system including the same	SAMSUNG ELECTRONICS CO., LTD.
10985140	Structure and formation method of package structure with underfill	--
10985141	Semiconductor device having stacked chips	TOSHIBA MEMORY CORPORATION
10985142	Multi-deck three-dimensional memory devices and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10985143	Micro assembled LED displays and lighting elements	X DISPLAY COMPANY TECHNOLOGY LIMITED
10985146	Semiconductor device with integrated heat distribution and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
10985147	Capacitors embedded in stiffeners for small form-factor and methods of assembling same	INTEL CORPORATION
10985149	Semiconductor device package and method of manufacturing the same	OMNIVISION TECHNOLOGIES, INC
10985150	Display devices and methods for forming the same	--
10985151	Semiconductor package and method for preparing the same	--
10985152	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10985153	Semiconductor device	TOSHIBA MEMORY CORPORATION
10985154	Logic drive based on multichip package comprising standard commodity FPGA IC chip with cryptography circuits	--
10985158	Semiconductor device with transistor portion having low injection region on the bottom of a substrate	FUJI ELECTRIC CO., LTD.
10985159	Method for manufacturing monolithic three-dimensional (3D) integrated circuits	--
10985160	Semiconductor structures and methods of forming the same	--
10985168	Semiconductor memory device	UNITED SEMICONDUCTOR (XIAMEN) CO., LTD.
10985169	Three-dimensional device with bonded structures including a support die and methods of making the same	SANDISK TECHNOLOGIES LLC
10985177	Method of manufacturing a semiconductor device having non-overlapping slits at one side of the channel layers of a memory block	SK HYNIX INC.
10985186	Display device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
10985189	Contact structure and display device including the same	LG DISPLAY CO., LTD.
10985199	Image sensor having stress releasing structure and method of forming same	--
10985201	Image sensor including silicon over germanium layer	--
10985211	Embedded MRAM structure and method of fabricating the same	--
10985212	Multi-component cell architectures for a memory device	MICRON TECHNOLOGY, INC.
10985221	Display device	LG DISPLAY CO., LTD.
10985237	Semiconductor device	TOSHIBA MEMORY CORPORATION
10985243	Castellated superjunction transistors	NORTHROP GRUMMAN SYSTEMS CORPORATION
10985252	Integrated assemblies, and methods of forming integrated assemblies	MICRON TECHNOLOGY, INC.
10985260	Trench silicide contacts with high selectivity process	INTERNATIONAL BUSINESS MACHINES CORPORATION
10985292	Method for transferring semiconductor bodies and semiconductor chip	OSRAM OLED GMBH
10985302	Pick-and-remove system with deformable contact surface	ELUX, INC.
10985333	Flexible display apparatus and rollable display apparatus comprising the same	LG DISPLAY CO., LTD.
10985342	Display device	ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
10985451	Antenna module	SAMSUNG ELECTRONICS CO., LTD.
10985466	Terahertz detector and method based on N×M dielectric resonant antenna array	GUANGDONG UNIVERSITY OF TECHNOLOGY
10985636	Semiconductor device	DENSO CORPORATION
10985727	Piezoelectric vibrator	MURATA MANUFACTURING CO., LTD.
10985760	Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells	--
10986292	Solid-state image pickup device and electronic apparatus to increase yield	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10986737	Method of restricting micro device on conductive pad	MIKRO MESA TECHNOLOGY CO., LTD.
10986750	Heat exchange device in directed flow system	HAMILTON SUNDSTRAND CORPORATION
10986755	Water cooler assembly and system	ARCTIC (HK) LTD
10987753	Wedge bonding tools, wedge bonding systems, and related methods	KULICKE AND SOFFA INDUSTRIES, INC.
10987893	Thermally conductive thin film sheet and article comprising same	INDONG ADVANCED MATERIALS, INC.
10988374	Device for supporting a MEMS component	MEAS SWITZERLAND S.&#XE0;.R.L.
10989396	Illumination device	--
10989887	Photonic integrated circuit package and method of forming the same	AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
10990008	Resin composition	TORAY INDUSTRIES, INC.
10990233	Display apparatus	SAMSUNG DISPLAY CO., LTD.
10990722	FinFET cell architecture with insulator structure	SYNOPSYS, INC.
10990739	Scan channel fabric for tiled circuit designs	AMAZON TECHNOLOGIES, INC.
10990781	Exposure method, electronic device and master-slave system	GUANGZHOU TYRAFOS SEMICONDUCTOR TECHNOLOGIES CO., LTD
10991423	Flying and twisted bit line architecture for dual-port static random-access memory (DP SRAM)	--
10991429	Word line decoder circuitry under a three-dimensional memory array	SANDISK TECHNOLOGIES LLC
10991572	Manufacturing method for semiconductor apparatus	SEMICONDUCTOR MANUFACTURING (SHANGHAI) INTERNATIONAL CORPORATION
10991597	Method of fabricating a semiconductor device using an adhesive layer	SAMSUNG ELECTRONICS CO., LTD.
10991598	Methods of fabricating semiconductor packages including circuit patterns	SK HYNIX INC.
10991599	Self-aligned via and plug patterning for back end of line (BEOL) interconnects	INTEL CORPORATION
10991604	Method of manufacturing semiconductor structure	--
10991618	Semiconductor device and method of manufacture	--
10991620	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10991621	Semiconductor die singulation	TEXAS INSTRUMENTS INCORPORATED
10991632	Assembly process for circuit carrier and circuit carrier	AB MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
10991635	Multiple chip bridge connector	INTERNATIONAL BUSINESS MACHINES CORPORATION
10991636	Semiconductor device and method	--
10991637	Wafer-level chip-scale package including power semiconductor and manufacturing method thereof	MAGNACHIP SEMICONDUCTOR, LTD.
10991638	Semiconductor package system	SAMSUNG ELECTRONICS CO., LTD.
10991639	Compliant Pin Fin heat sink with base integral pins	INTERNATIONAL BUSINESS MACHINES CORPORATION
10991640	Semiconductor packages including bridge die	SK HYNIX INC.
10991641	Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies	TEXAS INSTRUMENTS INCORPORATED
10991642	Integrated circuit, and motor device including the same	JOHNSON ELECTRIC INTERNATIONAL AG
10991643	Power module comprising a housing which is formed in levels	ROBERT BOSCH GMBH
10991644	Integrated circuit package having a low profile	ALLEGRO MICROSYSTEMS, LLC
10991645	Wiring substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
10991646	Flexible circuit board for display	SILICON WORKS CO., LTD.
10991647	Printed circuit board and package structure having the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10991648	Redistribution layer structure and semiconductor package	--
10991649	Semiconductor device and method of manufacturing semiconductor device	--
10991650	Semiconductor device and method of manufacturing semiconductor device	FUJI ELECTRIC CO., LTD.
10991651	Interconnection structure having reduced capacitance and method of manufacturing the same	--
10991652	Energy storage interposer device with conductive nanostructures	SMOLTEK AB
10991653	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
10991654	Inductive connection structure for use in an integrated circuit	STMICROELECTRONICS S.R.L.
10991655	E-fuse and manufacturing method thereof, and memory cell	SHENZHEN WEITONGBO TECHNOLOGY CO., LTD.
10991656	Semiconductor device package	--
10991657	Method for fabricating semiconductor device	--
10991658	Electronic element module and method for manufacturing the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
10991659	Substrate-less integrated components	APPLE INC.
10991660	Semiconductor package having high mechanical strength	ALPHA ANC OMEGA SEMICONDUCTOR (CAYMAN) LTD.
10991661	Radio-frequency isolation using backside cavities	SKYWORKS SOLUTIONS, INC.
10991662	Isolation cavities in semiconductor devices	SKYWORKS SOLUTIONS, INC.
10991663	Semiconductor device including dummy conductive cells	--
10991664	Integrated fuse	STMICROELECTRONICS (ROUSSET) SAS
10991665	Package-level noise filtering for EMI RFI mitigation	INTEL CORPORATION
10991666	Location displacement detection method, location displacement detection device, and display device	SHARP KABUSHIKI KAISHA
10991667	Isolation structure for bond pad structure	--
10991668	Connection pad configuration of semiconductor device	SYNAPTICS INCORPORATED
10991669	Semiconductor package using flip-chip technology	--
10991670	Semiconductor device assemblies including spacer with embedded semiconductor die	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10991671	Multi-piece wiring substrate, electronic component housing package, and electronic device	KYOCERA CORPORATION
10991672	Cu alloy bonding wire for semiconductor device	NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
10991673	Electronic device	KABUSHIKI KAISHA TOSHIBA
10991674	Electronic assembly and electronic system with impedance matched interconnect structures	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
10991675	3D semiconductor device and structure	MONOLITHIC 3D INC.
10991676	Systems and methods for flash stacking	INVENSAS CORPORATION
10991677	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
10991678	Semiconductor device and method for manufacturing semiconductor device	LG CHEM, LTD.
10991679	Stair-stacked dice device in a system in package, and methods of making same	INTEL CORPORATION
10991680	Common source land grid array package	ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD.
10991681	Three-dimensional package structure	--
10991683	Method of producing an optoelectronic component, and optoelectronic component	OSRAM OLED GMBH
10991684	3D stacked integrated circuits having functional blocks configured to provide redundancy sites	MICRON TECHNOLOGY, INC.
10991685	Assembling of chips by stacking with rotation	INTERNATIONAL BUSINESS MACHINES CORPORATION
10991694	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10991697	NAND string utilizing floating body memory cell	ZENO SEMICONDUCTOR, INC.
10991712	Semiconductor device and manufacturing method thereof	TOSHIBA MEMORY CORPORATION
10991715	Semiconductor memory device and method of manufacturing semiconductor memory device	TOSHIBA MEMORY CORPORATION
10991716	Semiconductor device having a vertical channel layer with an impurity region surrounding a dielectric core	SK HYNIX INC.
10991717	Vertical memory devices	SAMSUNG ELECTRONICS CO., LTD.
10991721	Three-dimensional memory device including liner free molybdenum word lines and methods of making the same	SANDISK TECHNOLOGIES LLC
10991728	Display panel	--
10991742	Image sensors	SAMSUNG ELECTRONICS CO., LTD.
10991743	Solid state image pickup device and production method, semiconductor wafer, and electronic apparatus	SONY CORPORATION
10991748	3D image sensor	SAMSUNG ELECTRONICS CO., LTD.
10991760	Memory device having PUC structure	SK HYNIX INC.
10991761	Three-dimensional cross-point memory device containing inter-level connection structures and method of making the same	SANDISK TECHNOLOGIES LLC
10991787	Display device and method of manufacturing the same	SAMSUNG DISPLAY CO., LTD.
10991804	Transistor level interconnection methodologies utilizing 3D interconnects	XCELSIS CORPORATION
10991808	Steep-switch field effect transistor with integrated bi-stable resistive system	INTERNATIONAL BUSINESS MACHINES CORPORATION
10991846	Method of manufacturing micro light-emitting element array, transfer carrier, and micro light-emitting element array	--
10991853	Carrier for an optoelectronic component, method of producing a carrier for an optoelectronic component, wafer and soldering method	OSRAM OLED GMBH
10991854	Light-emitting element with crack preventing cushion	--
10991873	Semiconductor device and method for fabricating the same	--
10991882	Methods of forming resistive memory elements	MICRON TECHNOLOGY, INC.
10992017	Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom	INTEL CORPORATION
10992022	Microwave antenna apparatus, packing and manufacturing method	SONY CORPORATION
10992040	TFT substrate, scanning antenna comprising TFT substrate, and method for producing TFT substrate	SHARP KABUSHIKI KAISHA
10992055	Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
10992261	Semiconductor integrated circuitry	SOCIONEXT INC.
10992267	Power amplifier module, frontend circuit, and communication device	MURATA MANUFACTURING CO., LTD.
10993014	Integrated circuit packages in headphones and method for forming and operating the same	--
10993317	Wafer level optical module	APPLE INC.
10993325	Interposer printed circuit boards for power modules	ABB POWER ELECTRONICS INC.
10993326	Securing mechanism for use with processor module	FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
10993330	Display panel, display device, and method for manufacturing display panel	BOE TECHNOLOGY GROUP CO., LTD.
10993332	Circuit substrate	--
10993351	One mixed heat sink fins for better thermal dissipation used on electrical products	HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
10993355	Ground strap and method of grounding a plurality of electrically conductive members therewith	FEDERAL-MOGUL POWERTRAIN LLC
10994369	Method of reducing photoelectron yield and/or secondary electron yield of a ceramic surface; corresponding apparatus and product	UNIVERSITY OF DUNDEE
10994387	Fabrication of flexible conductive films, with semiconductive material, formed with rubbing-in technology for elastic or deformable devices	KING ABDULAZIZ UNIVERSITY
10994517	Glass substrate and laminated substrate	AGC INC.
10994878	Feeding device for an electrostatic bag	WORLD PRECISION MANUFACTURING (DONGGUAN) CO., LTD.
10995196	Thermally conductive sheet and method for manufacturing thermally conductive sheet	KITAGAWA INDUSTRIES CO., LTD.
10996198	Integrated circuit sensor and sensor substrate	SHARP KABUSHIKI KAISHA
10996569	Measurement device, method and display device	HITACHI HIGH-TECH CORPORATION
10997108	Memory package including buffer, expansion memory module, and multi-module memory system	SAMSUNG ELECTRONICS CO., LTD.
10997355	Design-rule checking for curvilinear device features	GLOBALFOUNDRIES U.S. INC.
10997386	Image data transmission system and image data transmission method	GUANGZHOU TYRAFOS SEMICONDUCTOR TECHNOLOGIES CO., LTD
10997389	Electronic device with exposed conductive member at step in mold and fingerprint recognition apparatus equipped with the same	MURATA MANUFACTURING CO., LTD.
10998014	Semiconductor dies supporting multiple packaging configurations and associated methods	MICRON TECHNOLOGY, INC.
10998079	Structure and method for testing three-dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
10998182	Semiconductor wafer and method of wafer thinning	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
10998189	Laser annealing process of drive backplane and mask	BOE TECHNOLOGY GROUP CO., LTD.
10998199	Etching method and etching apparatus	TOKYO ELECTRON LIMITED
10998201	Semiconductor encapsulation structure	SHENZHEN REFOND OPTOELECTRONICS CO., LTD.
10998202	Semiconductor package and manufacturing method thereof	--
10998224	Semiconductor devices comprising conductive patterns of varying dimensions and related systems	MICRON TECHNOLOGY, INC.
10998225	Semiconductor device and method of forming the same	--
10998226	Method of forming interconnection structure with anti-adhesion liner	--
10998227	Metal insulator metal capacitor with extended capacitor plates	INTERNATIONAL BUSINESS MACHINES CORPORATION
10998228	Self-aligned interconnect with protection layer	--
10998230	Fabrication of self-aligned gate contacts and source/drain contacts directly above gate electrodes and source/drains	INTERNATIONAL BUSINESS MACHINES CORPORATION
10998231	Method for increasing semiconductor device wafer strength	NXP USA, INC.
10998236	Method for fabricating a row of MOS transistors	STMICROELECTRONICS (CROLLES 2) SAS
10998242	Semiconductor device including dual trench epitaxial dual-liner contacts	INTERNATIONAL BUSINESS MACHINES CORPORATION
10998246	Method of manufacturing a semiconductor device	RENESAS ELECTRONICS CORPORATION
10998247	Board with embedded passive component	SAMSUNG ELECTRONICS CO., LTD.
10998248	Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die	JCET SEMICONDUCTOR (SHAOXING) CO. LTD.
10998249	Semiconductor assembly	SIEMENS AKTIENGESELLSCHAFT
10998250	Bonded body and insulating circuit substrate	MITSUBISHI MATERIALS CORPORATION
10998251	Semiconductor package structure and a method of manufacturing the same	--
10998252	Efficient heat-sinking in PIN diode	JUNIPER NETWORKS, INC.
10998253	Fluid diverting heat sink	GOOGLE LLC
10998255	Overmolded microelectronic packages containing knurled flanges and methods for the production thereof	NXP USA, INC.
10998256	High voltage semiconductor device lead frame and method of fabrication	TEXAS INSTRUMENTS INCORPORATED
10998257	Semiconductor device and method of manufacturing same	KABUSHIKI KAISHA TOSHIBA
10998258	Circuit carrier and manufacturing method thereof	--
10998259	Semiconductor device and method of manufacture	--
10998260	Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances	INTEL CORPORATION
10998261	Over-molded IC package with in-mold capacitor	INTEL CORPORATION
10998262	Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge	INTEL CORPORATION
10998263	Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device	INTERNATIONAL BUSINESS MACHINES CORPORATION
10998264	Dual-gate trench IGBT with buried floating P-type shield	ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
10998265	Interface structures and methods for forming same	INVENSAS BONDING TECHNOLOGIES, INC.
10998266	Semiconductor devices including redistributed layer structures and methods of forming semiconductor devices including redistributed layer structures	SK HYNIX INC.
10998267	Wafer-level chip-size package with redistribution layer	--
10998268	Semiconductor device	SK HYNIX INC.
10998269	Chemical direct pattern plating method	--
10998270	Local interconnect for group IV source/drain regions	INTEL CORPORATION
10998271	High density pillar interconnect conversion with stack to substrate connection	MICRON TECHNOLOGY, INC.
10998272	Organic interposers for integrated circuit packages	INTEL CORPORATION
10998273	Hybrid integrated circuit architecture	HRL LABORATORIES, LLC
10998274	Seal ring structure, semiconductor die, and method for detecting cracks on semiconductor die	--
10998275	Package with cathodic protection for corrosion mitigation	INTEL CORPORATION
10998276	Integrated circuit	INFINEON TECHNOLOGIES AG
10998277	Guard ring method for semiconductor devices	--
10998278	Process and method for achieving high immunity to ultrafast high voltage transients across inorganic galvanic isolation barriers	TEXAS INSTRUMENTS INCORPORATED
10998279	On-chip integrated cavity resonator	INFINEON TECHNOLOGIES AG
10998280	Balance-unbalance converter and semiconductor integrated circuit having the same	ANRITSU CORPORATION
10998281	Semiconductor packages	SK HYNIX INC.
10998282	Surface finishes for high density interconnect architectures	INTEL CORPORATION
10998283	Semiconductor device production method	TOSHIBA MEMORY CORPORATION
10998284	Low pressure sintering powder	ALPHA ASSEMBLY SOLUTIONS INC.
10998285	Code pattern for representing tracing number of chip	OMNIVISION TECHNOLOGIES, INC.
10998286	Laser-induced selective heating for microLED placement and bonding	FACEBOOK TECHNOLOGIES, LLC
10998287	Semiconductor device and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
10998288	Method of manufacturing a semiconductor device	RENESAS ELECTRONICS CORPORATION
10998289	Packaging structure and forming method thereof	TONGFU MICROELECTRONICS CO., LTD.
10998290	Semiconductor device assemblies with molded support substrates	MICRON TECHNOLOGY, INC.
10998291	Channel routing for memory devices	MICRON TECHNOLOGY, INC.
10998292	Offset pads over TSV	INVENSAS BONDING TECHNOLOGIES, INC.
10998293	Method of fabricating semiconductor structure	--
10998294	Semiconductor packages having stacked chip structure	SK HYNIX INC.
10998295	Semiconductor device	DENSO CORPORATION
10998296	In-vehicle display device using semiconductor light-emitting device	ZKW GROUP GMBH
10998300	Display unit	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10998301	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
10998302	Packaged device with a chiplet comprising memory resources	INTEL CORPORATION
10998303	Method of manufacturing package-on-package device and bonding apparatus used therein	SAMSUNG ELECTRONICS CO., LTD.
10998304	Conductive line patterning	--
10998306	Protection of an integrated circuit	STMICROELECTRONICS (ROUSSET) SAS
10998309	Semiconductor unit, semiconductor module, and semiconductor device having terminal region extending in parallel to the transistors	FUJI ELECTRIC CO., LTD.
10998314	Gate cut with integrated etch stop layer	TESSERA, INC.
10998316	Vertical memory device and method for fabricating vertical memory device	SK HYNIX INC.
10998324	Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
10998333	Vertical memory device and method for fabricating the same	SK HYNIX INC.
10998334	Three-dimensional semiconductor memory devices	SAMSUNG ELECTRONICS CO., LTD.
10998335	Semiconductor device including a passivation film and multiple word lines	TOSHIBA MEMORY CORPORATION
10998337	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
10998347	Semiconductor device, display device, and electronic device	JAPAN DISPLAY INC.
10998351	Source drive integrated circuit, method of manufacturing the same, and display apparatus including the source drive integrated circuit	SILICON WORKS CO., LTD.
10998355	Semiconductor device and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
10998361	Image-sensor package and associated method	OMNIVISION TECHNOLOGIES, INC.
10998367	Image sensor and image-capturing apparatus	NIKON CORPORATION
10998368	Semiconductor apparatus	CANON KABUSHIKI KAISHA
10998370	Semiconductor device with insulating layers forming a bonding plane between first and second circuit components, method of manufacturing the same, and electronic device	CANON KABUSHIKI KAISHA
10998390	Organic light emitting diode display and a manufacturing method thereof	SAMSUNG DISPLAY CO., LTD.
10998397	Capacitor structure with low capacitance	--
10998405	Low-defect graphene-based devices and interconnects	INTEL CORPORATION
10998436	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
10998437	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
10998451	ESD protection diode	KABUSHIKI KAISHA TOSHIBA
10998478	Light-emitting element, light-emitting element package comprising light-emitting element, and light-emitting device comprising light-emitting element package	LG INNOTEK CO., LTD.
10998485	Cooler device with superconductor shunts	NORTHROP GRUMMAN SYSTEMS CORPORATION
10998605	Connecting unit for connecting to first and second interfaces, where the connecting unit comprises an internal conductor disposed within a housing formed by half-shell construction	TESAT-SPACECOM GMBH & CO. KG
10998721	Electrostatic discharge (ESD) protection circuits using tunneling field effect transistor (TFET) and impact ionization MOSFET (IMOS) devices	STMICROELECTRONICS INTERNATIONAL N.V.
10998831	Power switching module and electronic power device integrating said module	INSTITUT VEDECOM
10998855	Scalable arrays of radiating oscillating units	THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
10998873	Capacitor unit, integrated capacitor, and resonance unit	HUAWEI TECHNOLOGIES CO., LTD.
10998879	Monolithic die with acoustic wave resonators and active circuitry	INTEL CORPORATION
10998902	Semiconductor module and semiconductor package	MITSUBISHI ELECTRIC CORPORATION
10999545	Solid-state image sensor, imaging device, and electronic device	SONY CORPORATION
10999551	Solid-state image capture device including stacked pixel substrate and circuit substrate and image capture device	PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
10999919	Flexible electronic assembly for placement on a vehicle motor assembly	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
10999924	Sideband conductor resonance mitigation	INTEL CORPORATION
10999926	Stress relief encapsulation for flexible hybrid electronics	FLEX LTD.
10999932	Electronic package including cavity defined by resin and method of forming same	SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
10999957	Communication module and mounting structure thereof	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11000923	Tool and method of reflow	--
11002469	Integral heat superconducting plate heat exchanger and fabrication method therefor	ZHEJIANG JIAXI OPTOELECTRONIC EQUIPMENT MANUFACTURING CO., LTD.
11002496	Thermal conduction device and associated heat dissipation system	ALSTOM TRANSPORT TECHNOLOGIES
11002788	Circuit test structure	--
11002832	Chip-scale LIDAR with a single 2D MEMS scanner	GM GLOBAL TECHNOLOGY OPERATIONS LLC
11002927	Package structure	--
11003164	Methods for aligning a physical layer to a pattern formed via multi-patterning, and associated systems	MICRON TECHNOLOGY, INC.
11003227	Liquid-type cooling apparatus and manufacturing method for heat radiation fin in liquid-type cooling apparatus	MITSUBISHI ELECTRIC CORPORATION
11003291	Semiconductor device having a communication bus	SYNAPTICS INCORPORATED
11004381	Array substrate comprising an antenna, driving method and display device	ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
11004478	Semiconductor memory device	KIOXIA CORPORATION
11004574	Method for manufacturing anisotropic conductive film, and anisotropic conductive film	DEXERIALS CORPORATION
11004603	Vertical electrode decoupling/bypass capacitor	AVX CORPORATION
11004614	Stacked capacitors for use in integrated circuit modules and the like	INTERNATIONAL BUSINESS MACHINES CORPORATION
11004677	Method for forming metal oxide layer, and plasma-enhanced chemical vapor deposition device	SAMSUNG DISPLAY CO., LTD.
11004680	Semiconductor device package thermal conduit	TEXAS INSTRUMENTS INCORPORATED
11004688	FinFET device and method of forming	--
11004694	3D semiconductor device and structure	MONOLITHIC 3D INC.
11004695	Power semiconductor module arrangement having a base plate and a contact element	INFINEON TECHNOLOGIES AG
11004697	Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods	MICRON TECHNOLOGY, INC.
11004698	Power module package	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11004699	Electronic device and method for manufacturing the same	OMRON CORPORATION
11004700	Temporary post-assisted embedding of semiconductor dies	INFINEON TECHNOLOGIES AG
11004719	Methods for producing a 3D semiconductor memory device and structure	MONOLITHIC 3D INC.
11004723	Wafer production method	SILTECTRA GMBH
11004726	Stairstep structures in multilevel circuitry, and method for forming the same	--
11004728	Semiconductor die having edge with multiple gradients and method for forming the same	--
11004730	Methods of forming conductive features using a vacuum environment	--
11004731	Semiconductor device	KIOXIA CORPORATION
11004733	Protection structures for bonded wafers	--
11004734	Metal-based etch-stop layer	--
11004735	Conductive interconnect having a semi-liner and no top surface recess	INTERNATIONAL BUSINESS MACHINES CORPORATION
11004736	Integrated circuit having a single damascene wiring network	INTERNATIONAL BUSINESS MACHINES CORPORATION
11004737	Field effect device with reduced capacitance and resistance in source/drain contacts at reduced gate pitch	INTERNATIONAL BUSINESS MACHINES CORPORATION
11004739	Gate contact structure over active gate and method to fabricate same	INTEL CORPORATION
11004740	Structure and method for interconnection with self-alignment	--
11004742	Methods and apparatus for an improved integrated circuit package	TEXAS INSTRUMENTS INCORPORATED
11004755	Apparatus and method for the minimization of undercut during a UBM etch process	VEECO INSTRUMENTS INC.
11004756	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11004757	Bonded structures	INVENSAS BONDING TECHNOLOGIES, INC.
11004758	Integrated circuit package and method	--
11004759	Electronic component and method for manufacturing the same	MURATA MANUFACTURING CO., LTD.
11004760	Chip structure operating method including heating elements to reduce temperature variation	SAMSUNG ELECTRONICS CO., LTD.
11004761	Packaging of a semiconductor device with dual sealing materials	MITSUBISHI ELECTRIC CORPORATION
11004762	Semiconductor device, vehicle-mounted semiconductor device, and vehicle-mounted control device	HITACHI AUTOMOTIVE SYSTEMS, LTD.
11004763	Superconducting device with multiple thermal sinks	NORTHROP GRUMMAN SYSTEMS CORPORATION
11004764	Semiconductor package having symmetrically arranged power terminals and method for producing the same	INFINEON TECHNOLOGIES AG
11004765	Field-effect transistor with a heat absorber in contact with a surface of the gate electrode on its back side	DENSO CORPORATION
11004766	Cooler	TOYOTA JIDOSHA KABUSHIKI KAISHA
11004767	Composite material, electronic apparatus, and method for manufacturing electronic apparatus	SONY CORPORATION
11004768	Multi-chip package with partial integrated heat spreader	INTEL CORPORATION
11004769	Metal inverse opal substrate with integrated jet cooling in electronic modules	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11004770	Phase changing on-chip thermal heat sink	INTERNATIONAL BUSINESS MACHINES CORPORATION
11004771	Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices	--
11004772	Cooling structure, cooling structure manufacturing method, power amplifier, and transmitter	NEC CORPORATION
11004773	Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same	SANDISK TECHNOLOGIES LLC
11004774	Fabricating field-effect transistors with body contacts between source, gate and drain assemblies	SKYWORKS SOLUTIONS, INC.
11004775	SMDS integration on QFN by 3D stacked solution	STMICROELECTRONICS S.R.L.
11004776	Semiconductor device with frame having arms and related methods	STMICROELECTRONICS, INC.
11004777	Semiconductor device assemblies	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11004778	Polygonal BGA semiconductor package	MARVELL ISRAEL (M.I.S.L) LTD.
11004779	Semiconductor device package and a method of manufacturing the same	--
11004780	Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro	QUALCOMM INCORPORATED
11004781	Electronic component mounting substrate, electronic device, and electronic module	KYOCERA CORPORATION
11004782	Semiconductor device with internal and external electrode and method of manufacturing	ROHM CO., LTD.
11004783	Integrated circuit chip design for symmetric power delivery	MICROSOFT TECHNOLOGY LICENSING, LLC
11004784	Metal-on-metal capacitor	QUALCOMM INCORPORATED
11004785	Co-integrated vertically structured capacitive element and fabrication process	STMICROELECTRONICS (ROUSSET) SAS
11004786	Package structure and method of forming the same	--
11004787	Semiconductor chip	TOSHIBA MEMORY CORPORATION
11004788	Semiconductor devices and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11004789	Semiconductor device including back side power supply circuit	--
11004790	Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material	INTERNATIONAL BUSINESS MACHINES CORPORATION
11004791	Semiconductor chip with stacked conductor lines and air gaps	ADVANCED MICRO DEVICES, INC.
11004792	Microelectronic device including fiber-containing build-up layers	INTEL CORPORATION
11004793	Method of forming an interconnect structure having an air gap and structure thereof	--
11004794	Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof	--
11004795	Semiconductor structure and manufacturing method thereof	--
11004796	Integrated fan-out package	--
11004797	Package structure, semiconductor package and method of fabricating the same	--
11004798	Apparatuses including conductive structure layouts	MICRON TECHNOLOGY, INC.
11004799	Package structure and manufacturing method thereof	--
11004800	Secure chips with serial numbers	ASML NETHERLANDS B.V.
11004801	Semiconductor devices and methods of manufacturing semiconductor devices	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11004802	Reliability extreme temperature integrated circuits and method for producing the same	UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
11004803	Dummy dies for reducing warpage in packages	--
11004804	Semiconductor device and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
11004805	Semiconductor device and method of fabricating same including two seal rings	--
11004806	Semiconductor device, manufacturing method of semiconductor device, integrated substrate, and electronic device	SONY CORPORATION
11004807	Method of producing laminated substrate, method of producing semiconductor module, laminated substrate, and semiconductor module	FUJI ELECTRIC CO., LTD.
11004808	Package with different types of semiconductor dies attached to a flange	CREE, INC.
11004809	Chip package with antenna element	--
11004810	Semiconductor package structure	--
11004811	Semiconductor structure	--
11004812	Package structure and method of forming the same	--
11004813	Semiconductor device and manufacturing method of semiconductor device	LAPIS SEMICONDUCTOR CO., LTD.
11004814	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11004815	Semiconductor device	DENSO CORPORATION
11004816	Hetero-integrated structure	--
11004817	Semiconductor device and method for manufacturing the same	SOCIONEXT INC.
11004818	Package with passive devices and method of forming the same	--
11004819	Prevention of bridging between solder joints	INTERNATIONAL BUSINESS MACHINES CORPORATION
11004820	Apparatus and method for filling a ball grid array	AURIGIN TECHNOLOGY PTE LTD
11004821	Wire bonding method and wire bonding apparatus	SHINKAWA LTD.
11004822	Wire clamp apparatus calibration method and wire bonding apparatus	SHINKAWA LTD.
11004823	Chip assembly and method of manufacturing thereof	INFINEON TECHNOLOGIES AG
11004824	Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same	INTEL CORPORATION
11004825	Semiconductor package of package-on-package type	SAMSUNG ELECTRONICS CO., LTD.
11004826	3DIC formation with dies bonded to formed RDLs	--
11004827	Semiconductor package and manufacturing method of semiconductor package	--
11004829	Memory scaling semiconductor device	SANDISK TECHNOLOGIES LLC
11004831	Stack packages including a fan-out sub-package	SK HYNIX INC.
11004832	System, structure, and method of manufacturing a semiconductor substrate stack	--
11004833	Multi-chip stacked devices	XILINX, INC.
11004836	Method for integrating a light emitting device	APPLE INC.
11004837	Semiconductor device with improved heat dissipation	TOSHIBA MEMORY CORPORATION
11004838	Packaged die and RDL with bonding structures therebetween	--
11004841	Semiconductor device having multiple gate pads	VISHAY SILICONIX, LLC
11004845	Semiconductor device and manufacturing method thereof	--
11004855	Buried metal track and methods forming same	--
11004856	Stacked vertical transistor memory cell with epi connections	INTERNATIONAL BUSINESS MACHINES CORPORATION
11004860	Non-volatile memory device and method for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11004882	Method for manufacturing semiconductor device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11004890	Substrate based light emitter devices, components, and related methods	CREELED, INC.
11004895	Pixel or display with sub pixels selected by antifuse programming	BLACK PEAK LLC
11004903	Electronic device having hexagonal structure and addressing method therefor	INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
11004929	Trimmable silicon-based thermistor with reduced stress dependence	TEXAS INSTRUMENTS INCORPORATED
11004930	High density three-dimensional integrated capacitors	TESSERA, INC.
11004931	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
11004937	Semiconductor device and manufacturing method thereof	--
11004951	Surface treatment and passivation for high electron mobility transistors	--
11004972	Semiconductor device having conducting member for electrically coupling gate structure to underlying substrate of SOI structure	GLOBALFOUNDRIES SINGAPORE PTE. LTD.
11004987	Metallization of conductive wires for solar cells	SUNPOWER CORPORATION
11004989	Photodiodes formed on a thermally conductive layer and, photodiode systems	PHASE SENSITIVE INNOVATIONS, INC.
11004992	Rear face element for a solar module	MATRIX MODULE GMBH
11005022	Vertical transmon qubit device with microstrip waveguides	INTERNATIONAL BUSINESS MACHINES CORPORATION
11005033	Component semiconductor structure	TDK-MICRONAS GMBH
11005149	Metaconductor skins for low loss RF conductors	UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED
11005155	Microwave antenna apparatus and package	SONY CORPORATION
11005262	Arc mitigation in electrical power distribution system	GE AVIATION SYSTEMS LIMITED
11005263	Electro-static discharge (ESD) protection clamp technology	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11005436	Monolithic microwave integrated circuit having an overlay transformer and low impedance transmission lines	BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
11005444	Acoustic wave device, radio-frequency front end circuit, and communication device	MURATA MANUFACTURING CO., LTD.
11006193	Electro-optical apparatus having high-throughput electrical data links	NOKIA SOLUTIONS AND NETWORKS OY
11006513	Electronic assembly having sectional thermal management	DEERE & COMPANY
11006514	Three-dimensional decoupling integration within hole in motherboard	INTEL CORPORATION
11006521	Wiring base plate, electronic device package, and electronic device	KYOCERA CORPORATION
11006832	Wireless sensor device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11007601	Device for establishing a bonding connection and transducer therefor	HESSE GMBH
11007751	Impact resistant structure and electronic device	--
11008462	Heat-conductive sheet	SEKISUI POLYMATECH CO., LTD.
11009798	Wafer alignment markers, systems, and related methods	MICRON TECHNOLOGY, INC.
11009905	Semiconductor integrated circuit and clock supply method including a sample and hold circuit	RICOH COMPANY, LTD.
11009927	Loop heat pipe, method of manufacturing the same, and electronic device	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11011127	Display apparatus	LG DISPLAY CO., LTD.
11011209	Three-dimensional memory device including contact-level bit-line-connection structures and methods of making the same	SANDISK TECHNOLOGIES LLC
11011297	Semiconductor device and semiconductor module	ROHM CO., LTD.
11011315	Thin film capacitor, manufacturing method therefor, and multilayer circuit board embedded with thin film capacitor	TDK CORPORATION
11011373	Engineered substrate structures for power and RF applications	QROMIS, INC.
11011374	Group III nitride semiconductor substrate and method for manufacturing group III nitride semiconductor substrate	FURUKAWA CO., LTD.
11011376	Method of manufacturing semiconductor structure with an epitaxial layer	--
11011389	Additively manufactured flexible interposer	THE BOEING COMPANY
11011390	Micro device stabilization post	APPLE INC.
11011394	System and method for annealing die and wafer	--
11011396	Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them	--
11011412	Semiconductor structure and method for the forming same	SEMICONDUCTOR MANUFACTURING (SHANGHAI) INTERNATIONAL CORPORATION
11011414	Multi-barrier deposition for air gap formation	--
11011415	Airgap vias in electrical interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
11011416	Semiconductor structure and method for forming a semiconductor structure	SEMICONDUCTOR MANUFACTURING (SHANGHAI) INTERNATIONAL CORPORATION
11011417	Method and structure of metal cut	INTERNATIONAL BUSINESS MACHINES CORPORATION
11011418	3D IC method and device	INVENSAS BONDING TECHNOLOGIES, INC.
11011419	Method for forming interconnect structure	--
11011420	Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods	MICRON TECHNOLOGY, INC.
11011421	Semiconductor device having voids and method of forming same	--
11011422	Self-aligned wrap-around trench contacts	INTERNATIONAL BUSINESS MACHINES CORPORATION
11011423	Semiconductor device and method of using a standardized carrier in semiconductor packaging	STATS CHIPPAC PTE. LTD.
11011431	Semiconductor structure and manufacturing method thereof	--
11011435	Apparatus and method inspecting bonded semiconductor dice	ASM TECHNOLOGY SINGAPORE PTE LTD
11011439	Pre-molded substrate, method of manufacturing pre-molded substrate, and hollow type semiconductor device	ABLIC INC.
11011440	Semiconductor element bonding body, semiconductor device, and method of manufacturing semiconductor element bonding body	MITSUBISHI ELECTRIC CORPORATION
11011441	Multilayer ceramic substrate and electronic device	MURATA MANUFACTURING CO., LTD.
11011442	Power module	MITSUBISHI ELECTRIC CORPORATION
11011443	Power semiconductor device including a spacer	HITACHI AUTOMOTIVE SYSTEMS, LTD.
11011444	Semiconductor package structure	--
11011445	Semiconductor package device	MAGNACHIP SEMICONDUCTOR, LTD.
11011446	Semiconductor device and method of making a semiconductor device	NEXPERIA B.V.
11011447	Semiconductor package and method for forming the same	--
11011448	IC package including multi-chip unit with bonded integrated heat spreader	INTEL CORPORATION
11011449	Apparatus and method for dissipating heat in multiple semiconductor device modules	MICRON TECHNOLOGY, INC.
11011450	Preparation method of a ceramic module for power semiconductor integrated packaging	XI'AN BAIXIN CHUANGDA ELECTRONIC TECHNOLOGY CO., LTD.
11011451	Integrated circuit package and method	--
11011452	Heat spreaders for semiconductor devices, and associated systems and methods	MICRON TECHNOLOGY, INC.
11011453	Cooling apparatus, semiconductor module, vehicle, and manufacturing method	FUJI ELECTRIC CO., LTD.
11011454	Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle	ROHM CO., LTD.
11011455	Electronic package structure with improved board level reliability	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11011456	Lead frames including lead posts in different planes	INFINEON TECHNOLOGIES AG
11011457	Wiring substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11011458	Circuit board structure and manufacturing method thereof	--
11011459	Back-end-of-line (BEOL) on-chip sensor	QUALCOMM INCORPORATED
11011460	Package structure, package-on-package structure and manufacturing method thereof	--
11011461	Perpendicular inductors integrated in a substrate	QUALCOMM INCORPORATED
11011462	Method for forming fuse pad and bond pad of integrated circuit	--
11011463	Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom	INTEL CORPORATION
11011464	Package structures and method of forming the same	--
11011465	Single crystal silicon carbide substrate, method of manufacturing single crystal silicon carbide substrate, and semiconductor laser	HITACHI POWER SOLUTIONS CO., LTD.
11011466	Integrated circuit package with integrated voltage regulator	ADVANCED MICRO DEVICES, INC.
11011467	Method of forming interconnection structure	--
11011468	Semiconductor structure and method for manufacturing the same	--
11011469	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11011470	Microelectronic package with mold-integrated components	INTEL CORPORATION
11011471	Semiconductor device	LONGITUDE LICENSING LIMITED
11011472	Self-aligned register structure for base polysilicon and preparation method thereof	JIANGSU
11011473	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11011474	Electromagnetic wave attenuator and electronic device	KABUSHIKI KAISHA TOSHIBA
11011476	Lead frame surface finishing	STMICROELECTRONICS INTERNATIONAL N.V.
11011477	High-reliability electronic packaging structure, circuit board, and device	HUAWEI TECHNOLOGIES CO., LTD.
11011478	Semiconductor device	--
11011479	Protected electronic chip	STMICROELECTRONICS (ROUSSET) SAS
11011480	Semiconductor device having a flat region with an outer peripheral shape including chamfer portions	ABLIC INC.
11011481	Configurable resistor	INTEL CORPORATION
11011482	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11011483	Nickel alloy for semiconductor packaging	TEXAS INSTRUMENTS INCORPORATED
11011484	Semiconductor device having first and second terminals	KIOXIA CORPORATION
11011485	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11011486	Bonded semiconductor structure and method for forming the same	--
11011487	Semiconductor package having varying conductive pad sizes	--
11011488	Zinc-cobalt barrier for interface in solder bond applications	TEXAS INSTRUMENTS INCORPORATED
11011489	Semiconductor device	ROHM CO., LTD.
11011490	Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11011491	Semiconductor device packages and methods of manufacturing the same	--
11011492	Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same	KULICKE AND SOFFA INDUSTRIES, INC.
11011493	Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods	KULICKE AND SOFFA INDUSTRIES, INC.
11011494	Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics	INVENSAS BONDING TECHNOLOGIES, INC.
11011495	Multiple-die integrated circuit with integrated voltage regulator	ADVANCED MICRO DEVICES, INC.
11011496	Semiconductor device packages and methods of manufacturing the same	--
11011497	Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11011499	Stacked device, stacked structure, and method of manufacturing stacked device	FUJIFILM CORPORATION
11011500	Memory scaling semiconductor device	SANDISK TECHNOLOGIES LLC
11011501	Package structure, package-on-package structure and method of fabricating the same	--
11011502	Semiconductor package	NEPES CO., LTD.
11011503	Direct-bonded optoelectronic interconnect for high-density integrated photonics	INVENSAS BONDING TECHNOLOGIES, INC.
11011505	Semiconductor memory and manufacturing method thereof	TOSHIBA MEMORY CORPORATION
11011507	3D semiconductor device and structure	MONOLITHIC 3D INC.
11011526	Methods of manufacturing semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11011529	Memory arrays comprising vertically-alternating tiers of insulative material and memory cells and methods of forming a memory array comprising memory cells individually comprising a transistor and a capacitor	MICRON TECHNOLOGY, INC.
11011539	Multi-stack three-dimensional memory devices and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11011540	Three-dimensional memory devices and fabrication methods thereof	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11011541	Semiconductor memory device in which memory cells are three-dimensionally arrange	TOSHIBA MEMORY CORPORATION
11011543	Semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11011548	Electronic device and method of manufacturing the same	MURATA MANUFACTURING CO., LTD.
11011551	Array substrate with a plurality of different signal lines	BOE TECHNOLOGY GROUP CO., LTD.
11011566	Bonding pad on a back side illuminated image sensor	--
11011580	Memory device	TOSHIBA MEMORY CORPORATION
11011599	Stretchable display panel and stretchable display device including the same	LG DISPLAY CO., LTD.
11011600	Semiconductor structure having integrated inductor therein	--
11011602	Circuits employing adjacent low-k dummy gate to a field-effect transistor (FET) to reduce FET source/drain parasitic capacitance, and related fabrication methods	QUALCOMM INCORPORATED
11011614	High electron mobility transistor (HEMT) device and method of forming same	--
11011616	Gate line plug structures for advanced integrated circuit structure fabrication	INTEL CORPORATION
11011622	Closely packed vertical transistors with reduced contact resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11011681	Light-emitting device and the method of manufacturing the same	--
11011686	Semiconductor light emitting device	ROHM CO., LTD.
11011689	Quantum dot LED package and quantum dot LED module including the same	LUMENS CO., LTD.
11011693	Integrated quantum circuit assemblies for cooling apparatus	INTEL CORPORATION
11011715	Display panel and display device	WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
11011813	Power amplifier with shielded transmission lines	NXP B.V.
11011815	Circularly-polarized dielectric waveguide launch for millimeter-wave data communication	TEXAS INSTRUMENTS INCORPORATED
11011816	Radar assembly with a slot transition through a printed circuit board	APTIV TECHNOLOGIES LIMITED
11011827	Antenna boards and communication devices	INTEL IP CORPORATION
11011844	Antenna module and electronic device including the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11011846	Antenna and semiconductor device with improved tradeoff relationship between antenna gain and antenna size	LAPIS SEMICONDUCTOR CO., LTD.
11011847	Multi-antenna structure with two radiating antennas with one antenna fed from the other antenna	PLUME DESIGN, INC.
11012035	Amplifier devices with input transient termination	NXP USA, INC.
11012600	Display device and manufacturing method of the same	BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
11013057	Extremely high frequency systems and methods of operating the same	KEYSSA, INC.
11013102	Printed circuit board and electronic device	SEIKO EPSON CORPORATION
11013112	Ceramic copper circuit board and semiconductor device based on the same	KABUSHIKI KAISHA TOSHIBA
11013116	Flexible assembly for display device and display device	BOE TECHNOLOGY GROUP CO., LTD.
11013120	Tape wiring board and semiconductor device	SHENZHEN TOREY MICROELECTRONIC TECHNOLOGY CO. LTD.
11013126	Connection structure	DEXERIALS CORPORATION
11013133	Electronic devices comprising butyl rubber	ARLANXEO SINGAPORE PTE. LTD
11013144	Absorption/desorption processes and systems for liquid immersion cooling	TMGCORE, LLC
11013146	Asymmetric heat pipe coupled to a heat sink	CIENA CORPORATION
11013147	Thermal interface material structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11013155	Electromagnetic wave shielding structure and manufacturing method therefor	SAMSUNG ELECTRONICS CO., LTD.
11013463	Capacitive sensor systems and method	ADIDAS AG
11014203	System for applying interface materials	--
11014256	Semiconductor memory device and method for manufacturing same	KIOXIA CORPORATION
11015017	Resin composition for encapsulating semiconductor, semiconductor device, and method for producing resin composition for encapsulating semiconductor	SUMITOMO BAKELITE CO., LTD.
11015019	Epoxy resin, production method, epoxy resin composition and cured product of same	DIC CORPORATION
11015089	Polyimide film for semiconductor package reflow process, and manufacturing method therefor	IPI TECH INC.
11015879	Interface-free thermal management system for high power devices co-fabricated with electronic circuit	TELEDYNE SCIENTIFIC & IMAGING, LLC
11015985	Time-controlled switch capacitor based temperature sensor	INTEL IP CORPORATION
11016255	Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture	INTERNATIONAL BUSINESS MACHINES CORPORATION
11017143	Method for modeling excess current in irradiated bipolar junction transistors	ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
11017554	Method for securing a bonding product in a working region of a bonder	HESSE GMBH
11017916	Particles, connecting material and connection structure	SEKISUI CHEMICAL CO., LTD.
11017940	Integrated circuit comprising a variable inductor	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11018002	Method for selectively depositing a Group IV semiconductor and related semiconductor device structures	ASM IP HOLDING B.V.
11018007	Self aligned pattern formation post spacer etchback in tight pitch configurations	TESSERA, INC.
11018024	Method of fabricating embedded traces	NXP USA, INC.
11018025	Redistribution lines having stacking vias	--
11018026	Interposer, semiconductor package, and method of fabricating interposer	SAMSUNG ELECTRONICS CO., LTD.
11018027	Interconnect structure	--
11018028	Method of applying conductive adhesive and manufacturing device using the same	--
11018029	Method for producing an at least partly packaged semiconductor wafer	UNITED MONOLITHIC SEMICONDUCTORS GMBH
11018030	Fan-out wafer level chip-scale packages and methods of manufacture	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11018040	Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11018042	3D semiconductor memory device and structure	MONOLITHIC 3D INC.
11018043	Wafer processing method using a ring frame and a polyester sheet	DISCO CORPORATION
11018052	Interconnect structure and method of forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11018053	Semiconductor structure with material modification and low resistance plug	--
11018054	Integrated circuit interconnects	INTEL CORPORATION
11018055	Physical vapor deposition process for semiconductor interconnection structures	--
11018056	Encapsulated solder TSV insertion interconnect	MICRON TECHNOLOGY, INC.
11018057	Semiconductor devices	--
11018063	Method and apparatus for nanoscale-dimension measurement using a diffraction pattern filter	SANDISK TECHNOLOGIES LLC
11018065	Semiconductor device structure with magnetic element in testing region	--
11018066	Integrated circuit package and method of forming same	--
11018067	Semiconductor device and method of manufacturing a semiconductor device	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11018068	Methods and apparatuses for packaging an ultrasound-on-a-chip	BUTTERFLY NETWORK, INC.
11018069	Underfill control structures and method	--
11018070	Semiconductor die, manufacturing method thereof, and semiconductor package	--
11018071	Initiation of one or more processors in an integrated circuit	QUALCOMM INCORPORATED
11018072	Semiconductor package having overlapping electrically conductive regions and method for producing the same	INFINEON TECHNOLOGIES AG
11018073	Heat spreading device and method	--
11018074	Energy supply	WITTENSTEIN SE
11018076	Cooling apparatus, semiconductor module, and vehicle	FUJI ELECTRIC CO., LTD.
11018077	Modular microjet cooling of packaged electronic components	MASSACHUSETTS INSTITUTE OF TECHNOLOGY
11018078	Method of producing electronic components, corresponding electronic component	STMICROELECTRONICS S.R.L.
11018079	Land structure for semiconductor package and method therefor	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11018080	Semiconductor package and method of forming the same	AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
11018081	Heterogeneous fan-out structure and method of manufacture	--
11018082	Space transformer and manufacturing method thereof	--
11018083	Semiconductor package and manufacturing method thereof	--
11018084	Managed integrated circuit power supply distribution	INTERNATIONAL BUSINESS MACHINES CORPORATION
11018085	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11018086	Passive devices in package-on-package structures and methods for forming the same	--
11018087	Metal interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
11018088	Dummy features in redistribution layers (RDLS) and methods of forming same	--
11018089	Display devices and methods for manufacturing the same	--
11018090	Selective CVD alignment-mark topography assist for non-volatile memory	INTERNATIONAL BUSINESS MACHINES CORPORATION
11018091	Eliminate sawing-induced peeling through forming trenches	--
11018092	Thinned semiconductor wafer	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11018093	Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same	GLOBALFOUNDRIES SINGAPORE PTE. LTD.
11018094	Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packages	SK HYNIX INC.
11018095	Semiconductor structure	--
11018096	Crack sensor for sensing cracks in a solder pad, and method for production quality control	STMICROELECTRONICS (CROLLES 2) SAS
11018097	Electronic component guard ring	INTEL CORPORATION
11018098	Fabricated two-sided millimeter wave antenna using through-silicon-vias	MICRON TECHNOLOGY, INC.
11018099	Semiconductor structure having a conductive bump with a plurality of bump segments	--
11018100	Semiconductor device having a passivation layer	--
11018101	Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11018102	Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11018103	Integrated circuit structure	--
11018104	Semiconductor structure and method for manufacturing the same	--
11018105	Semiconductor device and method of manufacturing the same	CYPRESS SEMICONDUCTOR CORPORATION
11018106	Semiconductor device including solder bracing material with a rough surface, and manufacturing method thereof	--
11018107	Semiconductor device	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11018108	Method of fabricating semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11018109	Power semiconductor module with low gate path inductance	ABB POWER GRIDS SWITZERLAND AG
11018110	Semiconductor device, manufacturing method, and solid-state imaging device	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11018111	Wafer level derived flip chip package	TEXAS INSTRUMENTS INCORPORATED
11018112	Bonding method of semiconductor chip and bonding apparatus of semiconductor chip	KABUSHIKI KAISHA TOSHIBA
11018113	Memory module, semiconductor package including the same, and manufacturing method thereof	--
11018114	Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory	INTEL IP CORPORATION
11018115	Semiconductor package having a high reliability	SAMSUNG ELECTRONICS CO., LTD.
11018116	Method to form a 3D semiconductor device and structure	MONOLITHIC 3D INC.
11018117	Half-bridge module with coaxial arrangement of the DC terminals	ABB POWER GRIDS SWITZERLAND AG
11018120	Semiconductor device package with stress buffering layer and method for manufacturing the same	--
11018121	Semiconductor packages	SAMSUNG ELECTRONICS CO., LTD.
11018123	Multi-chip modules	INTERNATIONAL BUSINESS MACHINES CORPORATION
11018124	Embedded memory device and method for embedding memory device in a substrate	INTEL CORPORATION
11018125	Multi-chip package with offset 3D structure	ADVANCED MICRO DEVICES, INC.
11018126	IC with test structures and e-beam pads embedded within a contiguous standard cell area	PDF SOLUTIONS, INC.
11018128	Semiconductor device	TOSHIBA MEMORY CORPORATION
11018130	Method to mitigate signal feed through ESD elements	XILINX, INC.
11018131	Semiconductor device and fabricating method thereof	--
11018133	3D integrated circuit	MONOLITHIC 3D INC.
11018134	Semiconductor device and method for manufacturing the same	--
11018136	Method of maintaining the state of semiconductor memory having electrically floating body transistor	ZENO SEMICONDUCTOR, INC.
11018142	Memory cell and method of manufacturing the same	--
11018144	Anti-fuse cell and chip having anti-fuse cells	--
11018145	Semiconductor device and method of manufacturing the same	SK HYNIX INC.
11018151	Three-dimensional flat NAND memory device including wavy word lines and method of making the same	SANDISK TECHNOLOGIES LLC
11018154	Memory device and method for fabricating the same	--
11018157	Local interconnect structure	--
11018159	Display device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11018174	Apparatus and method related to sensor die ESD protection	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11018189	Storage apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11018215	Package and manufacturing method thereof	--
11018220	Device isolation design rules for HAST improvement	MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
11018221	Air gap regions of a semiconductor device	GLOBALFOUNDRIES U.S. INC.
11018222	Metallization in integrated circuit structures	INTEL CORPORATION
11018235	Vertically stacked semiconductor devices having vertical channel transistors	IMEC VZW
11018241	Polysilicon design for replacement gate technology	--
11018264	Three-dimensional nanoribbon-based logic	INTEL CORPORATION
11018269	Thin optoelectronic modules with apertures and their manufacture	AMS SENSOR SINGAPORE PTE. LTD.
11018288	Metal-base substrate and semiconductor device	NICHSA CORPORATION
11018321	Sealing structure and light emitting device	PIONEER CORPORATION
11018629	Integrated multiple-path power amplifier	NXP USA, INC.
11018713	Radio frequency shielding within a semiconductor package	INTEL IP CORPORATION
11019324	Stereo camera	HITACHI AUTOMOTIVE SYSTEMS, LTD.
11019751	Activate loading mechanism	INTEL CORPORATION
11019756	Power conversion device	MITSUBISHI ELECTRIC CORPORATION
11020811	Solder removal from semiconductor devices	MICRON TECHNOLOGY, INC.
11021389	Supporting glass substrate	AGC INC.
11021607	Metal-polyorganosiloxanes	DOW SILICONES CORPORATION
11021634	Adhesive film, preparation method of semiconductor device, and semiconductor device	LG CHEM, LTD.
11022280	Linkage modularized LED display module	SHENZHEN CHIP OPTECH CO. LTD.
11022379	CTE-matched heat pipe	AAVID THERMAL CORP.
11022380	Heat pipe with micro-pore tube array and heat exchange system employing the heat pipe	GUANGWEI HETONG ENERGY TECHOLOGY (BEIJING) CO., LTD
11022383	Interface-free thermal management system for high power devices co-fabricated with electronic circuit	TELEDYNE SCIENTIFIC & IMAGING, LLC
11022590	Electronic component including sensor device and method of manufacturing same	SENSIRION AG
11022657	Processor and chipset continuity testing of package interconnect for functional safety applications	INTEL CORPORATION
11023196	Display system and methods	NANOLUMENS ACQUISTION, INC.
11023247	Processor package with optimization based on package connection type	INTEL CORPORATION
11023647	Integrated circuit stack verification method and system for performing the same	--
11024366	Under-memory array process edge mats with sense amplifiers	MICRON TECHNOLOGY, INC.
11024398	Semiconductor device having a diode type electrical fuse (e-fuse) cell array	KEY FOUNDRY CO., LTD.
11024439	Particles, connecting material and connection structure	SEKISUI CHEMICAL CO., LTD.
11024530	Method for the bonding and debonding of substrates	EV GROUP E. THALLNER GMBH
11024533	Methods of forming interconnect structures using via holes filled with dielectric film	--
11024534	Semiconductor device having opening and via hole and method for manufacturing the same	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11024537	Methods and apparatus for hybrid feature metallization	APPLIED MATERIALS, INC.
11024539	Self-aligned cut process for self-aligned via process window	INTERNATIONAL BUSINESS MACHINES CORPORATION
11024540	Fin field-effect transistor device and method of forming the same	--
11024541	Process for molding a back side wafer singulation guide	QORVO US, INC.
11024542	Manufacturing method of device chip	DISCO CORPORATION
11024551	Metal replacement vertical interconnections for buried capacitance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11024552	Device arrangement structure assembly having adhesive tape layer	--
11024553	Semiconductor structure and manufacturing method thereof	--
11024554	Wiring substrate, electronic device, and electronic module	KYOCERA CORPORATION
11024555	Semiconductor substrate, semiconductor package, and method for forming the same	--
11024556	Semiconductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11024557	Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die	--
11024558	Heat transfer device with fins defining air flow channels	HAMILTON SUNDSTRAND CORPORATION
11024559	Semiconductor package with electromagnetic interference shielding structures	INTEL CORPORATION
11024560	Semiconductor structure and manufacturing method thereof	--
11024561	Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units	STATS CHIPPAC PTE. LTD.
11024562	Lead frame system	TEXAS INSTRUMENTS INCORPORATED
11024563	Semiconductor device and manufacturing method thereof	ABLIC INC.
11024564	Packaged electronic device with film isolated power stack	TEXAS INSTRUMENTS INCORPORATED
11024565	Direct selective adhesion promotor plating	INFINEON TECHNOLOGIES AG
11024566	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
11024567	SMD diode taking a runner as body and manufacturing method thereof	SIYANG GRANDE ELECTRONICS CO., LTD.
11024568	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11024569	Semiconductor package device and method of manufacturing the same	--
11024570	Semiconductor package device and method of manufacturing the same	--
11024571	Coil built-in multilayer substrate and power supply module	MURATA MANUFACTURING CO., LTD.
11024572	Wiring board, electronic device, and electronic module	KYOCERA CORPORATION
11024573	Substrate structure with high-density wiring and manufacturing method thereof	--
11024574	Integrated substrate communication frontend	INTEL CORPORATION
11024575	Semiconductor device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11024576	Semiconductor package with underfill between a sensor coil and a semiconductor die	TEXAS INSTRUMENTS INCORPORATED
11024577	Embedded anti-fuses for small scale applications	INTERNATIONAL BUSINESS MACHINES CORPORATION
11024578	Conductive component and display device	SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11024579	Dual power structure with connection pins	--
11024580	Random cut patterning	--
11024581	Semiconductor packages and methods of manufacturing the same	--
11024582	Semiconductor device and manufacturing method thereof	--
11024583	Integration of a programmable device and a processing system in an integrated circuit package	XILINX, INC.
11024584	Electronic device	--
11024585	Integrated circuit packaging system with shielding and method of manufacture thereof	STATS CHIPPAC PTE. LTD.
11024586	Semiconductor device package and method of manufacturing the same	--
11024587	Self-destructible apparatus and method and semiconductor chip using the same	ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
11024588	Power integrated module	DELTA ELECTRONICS (SHANGHAI) CO., LTD.
11024589	Distributing on chip inductors for monolithic voltage regulation	ORACLE INTERNATIONAL CORPORATION
11024590	And placement of de-coupling capacitors for PDN design	SEAGATE TECHNOLOGY LLC
11024591	Mobile object and wireless communication module	KYOCERA CORPORATION
11024592	Semiconductor device with spacer over sidewall of bonding pad and method for preparing the same	--
11024593	Metal bumps and method forming same	--
11024594	Substrate and package structure	--
11024595	Thermocompression bond tips and related apparatus and methods	MICRON TECHNOLOGY, INC.
11024596	Bonding apparatus and bonding method	SHINKAWA LTD.
11024597	Connecting conductive pads with post-transition metal and nanoporous metal	FACEBOOK TECHNOLOGIES, LLC
11024598	Metallic sintered bonding body and die bonding method	SENJU METAL INDUSTRY CO., LTD.
11024599	Semiconductor device and method of manufacturing thereof	RENESAS ELECTRONICS CORPORATION
11024600	Unified semiconductor devices having programmable logic device and heterogeneous memories and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11024601	Hyperchip	INTEL CORPORATION
11024602	Hybrid bond pad structure	--
11024603	Manufacturing method and a related stackable chip package	--
11024605	Integrated circuit package and method	--
11024606	Semiconductor device and manufacturing method thereof	--
11024607	Method for interconnecting stacked semiconductor devices	INTEL CORPORATION
11024609	Four-in-one mini-LED module, display screen and manufacturing method	SHENZHEN ZHIXUNDA OPTOELECTRONICS CO., LTD.
11024615	Display driver integrated circuit device	SAMSUNG ELECTRONICS CO., LTD.
11024616	Package structure and method of manufacturing the same	--
11024617	Semiconductor packages having photon integrated circuit (PIC) chips	MICRON TECHNOLOGY, INC.
11024619	Semiconductor manufacturing apparatus	TOSHIBA MEMORY CORPORATION
11024621	Memory circuit layout method	--
11024622	Integrated circuit having angled conductive feature	--
11024625	ESD protection circuit cell	--
11024633	SRAM cell word line structure with reduced RC effects	--
11024634	Semiconductor device having an inter-layer via (ILV), and method of making same	--
11024636	Vertical 3D stack NOR device	INTERNATIONAL BUSINESS MACHINES CORPORATION
11024643	Methods of forming integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material	MICRON TECHNOLOGY, INC.
11024645	Three-dimensional memory device containing a silicon nitride ring in an opening in a memory film and method of making the same	SANDISK TECHNOLOGIES LLC
11024649	Integrated circuit with resurf region biasing under buried insulator layers	TEXAS INSTRUMENTS INCORPORATED
11024652	Flexible display device and method of manufacturing the same	LG DISPLAY CO., LTD.
11024662	Dual image sensor	SAMSUNG ELECTRONICS CO., LTD.
11024701	Integrated electronic component suitable for broadband biasing	MURATA INTEGRATED PASSIVE SOLUTIONS
11024702	Stacked electronic structure	--
11024703	Semiconductor device and a method for fabricating the same	--
11024717	Semiconductor device and method of manufacturing semiconductor device	KABUSHIKI KAISHA TOSHIBA
11024735	Methods of forming integrated circuitry	MICRON TECHNOLOGY, INC.
11024770	Light emitting element and light emitting device	NICHIA CORPORATION
11024771	Method for manufacturing light emitting device	NICHIA CORPORATION
11024782	Light-emitting device, manufacturing method thereof and display module using the same	--
11024785	Light-emitting diode packages	CREELED, INC.
11024801	Diffusion layer for magnetic tunnel junctions	--
11024875	Silicon secondary battery	REKRIX CO., LTD.
11024942	Antenna-in-package system and mobile terminal	AAC TECHNOLOGIES PTE. LTD.
11024953	Antenna-integrated module and radar device	PANASONIC CORPORATION
11024954	Semiconductor package with antenna and fabrication method thereof	--
11024979	3D IC antenna array with laminated high-k dielectric	--
11025034	Laser cooling system	NLIGHT, INC.
11025194	Integrated circuit device, oscillator, electronic apparatus, and vehicle	SEIKO EPSON CORPORATION
11026326	Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly	INTERNATIONAL BUSINESS MACHINES CORPORATION
11026341	Method of changing a switching module using pressure-applying device	LSIS CO., LTD.
11026360	Method for manufacturing a mounting board	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11026565	Image sensor for endoscopic use	DEPUY SYNTHES PRODUCTS, INC.
11027360	Bonded body and method for manufacturing the same	DENSO CORPORATION
11027481	Method for treating millimetre and/or micrometre and/or nanometre structures on a surface of a substrate	EV GROUP E. THALLNER GMBH
11028022	Copper-ceramic bonded body and insulation circuit substrate	MITSUBISHI MATERIALS CORPORATION
11028059	Oxazine compound, composition and cured product	DIC CORPORATION
11028266	Curable organopolysiloxane composition, encapsulant and semiconductor device	WACKER CHEMIE AG
11028269	Silicone-modified epoxy resin composition and semiconductor device	SHIN-ETSU CHEMICAL CO., LTD
11029278	Ion sensor based on differential measurement, and production method	CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS (CSIC)
11029331	Universal test mechanism for semiconductor device	--
11029546	Flexible display device	--
11029738	Heat exchange module and serial pump thereof	--
11030348	Circuit edit and obfuscation for trusted chip fabrication	UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED
11030353	Guide layout creating apparatus, guide layout creating method and recording medium	TOSHIBA MEMORY CORPORATION
11030368	Metal cut optimization for standard cells	--
11030373	System for generating standard cell layout having engineering change order (ECO) cells	--
11030734	Mirror die image recognition system, reference die setting system, and mirror die image recognition method	FUJI CORPORATION
11031237	Aromatic amino siloxane functionalized materials for use in capping porous dielectrics	MERCK PATENT GMBH
11031254	Method for manufacturing a semiconductor device	RENESAS ELECTRONICS CORPORATION
11031255	Stack frame for electrical connections and the method to fabricate thereof	--
11031256	Semiconductor device with tiered pillar and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11031258	Semiconductor packages with patterns of die-specific information	MICRON TECHNOLOGY, INC.
11031259	Method of manufacturing an electronic device and electronic device manufactured thereby	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11031274	Semiconductor device packages and method for manufacturing the same	--
11031275	3D semiconductor device and structure with memory	MONOLITHIC 3D INC.
11031281	Semiconductor devices and methods of fabricating a deep trench isolation structure	GLOBALFOUNDRIES SINGAPORE PTE. LTD.
11031282	Three-dimensional memory devices with deep isolation structures	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11031284	Semiconductor device and method of forming the same	--
11031285	Diffusion barrier collar for interconnects	INVENSAS BONDING TECHNOLOGIES, INC.
11031286	Conductive feature formation and structure	--
11031287	Fully self-aligned via with selective bilayer dielectric regrowth	TOKYO ELECTRON LIMITED
11031288	Passive components in vias in a stacked integrated circuit package	INTEL CORPORATION
11031289	Semiconductor package and methods of forming the same	--
11031296	3D vertical FET with top and bottom gate contacts	INTERNATIONAL BUSINESS MACHINES CORPORATION
11031306	Quality control method of position measurement light source, semiconductor manufacturing apparatus, and method for manufacturing semiconductor device	TOSHIBA MEMORY CORPORATION
11031307	Semiconductor package, buffer wafer for semiconductor package, and method of manufacturing semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11031308	Connectivity detection for wafer-to-wafer alignment and bonding	SANDISK TECHNOLOGIES LLC
11031309	Cover lid with selective and edge metallization	MATERION CORPORATION
11031310	Chip package	QUALCOMM INCORPORATED
11031311	Packaged semiconductor device with multilayer stress buffer	TEXAS INSTRUMENTS INCORPORATED
11031312	Multi-fractal heatsink system and method	FRACTAL HEATSINK TECHNOLOGIES, LLC
11031313	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11031314	Spacer structure for double-sided-cooled power module and method of manufacturing the same	HYUNDAI MOTOR COMPANY
11031315	Semiconductor structure and fabrication method thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11031316	Retainer	--
11031317	Direct bonded metal substrates with encapsulated phase change materials and electronic assemblies incorporating the same	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11031318	Encapsulated phase change porous layer	TOYOTA JIDOSHA KABUSHIKI KAISHA
11031319	Thermal interface materials with adhesive selant for electronic components	HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
11031320	Structures and methods for reducing process charging damages	--
11031321	Semiconductor device having a die pad with a dam-like configuration	INFINEON TECHNOLOGIES AG
11031322	Semiconductor device mounted on circuit board of electronic device	ROHM CO., LTD.
11031323	Interconnecting member for power module	ABB POWER GRIDS SWITZERLAND AG
11031324	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11031325	Low-stress passivation layer	--
11031326	Wiring structure, electronic device and method for manufacturing the same	--
11031327	Through vias and methods of formation thereof	INFINEON TECHNOLOGIES AG
11031328	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11031329	Method of fabricating packaging substrate	--
11031330	Electroconductive substrate, electronic device and display device	TDK CORPORATION
11031331	Phase-change material (PCM) radio frequency (RF) switches with trench metal plugs for RF terminals	NEWPORT FAB, LLC
11031332	Package panel processing with integrated ceramic isolation	TEXAS INSTRUMENTS INCORPORATED
11031333	Three-dimensional memory devices having a plurality of NAND strings	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11031334	Semiconductor device including a conductive feature over an active region	--
11031335	Semiconductor devices including redistribution layers	MICRON TECHNOLOGY, INC.
11031336	Semiconductor memory device having contact element of rectangular shape	--
11031337	Forming dual metallization interconnect structures in single metallization level	INTERNATIONAL BUSINESS MACHINES CORPORATION
11031338	Semiconductor device and method for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11031339	Metal interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
11031340	Semiconductor device including a multilayer etch stop layer	SAMSUNG ELECTRONICS CO., LTD.
11031341	Side mounted interconnect bridges	INTEL CORPORATION
11031342	Semiconductor package and method	--
11031343	Fins for enhanced die communication	INTERNATIONAL BUSINESS MACHINES CORPORATION
11031344	Package having redistribution layer structure with protective layer and method of fabricating the same	--
11031345	Integrated circuit package and method of forming same	MEDTRONIC, INC.
11031346	Advanced wafer security method including pattern and wafer verifications	INTERNATIONAL BUSINESS MACHINES CORPORATION
11031347	Semiconductor packages	SAMSUNG ELECTRONICS CO., LTD.
11031348	Semiconductor structure	--
11031349	Method of forming a semiconductor device and current sensing circuit therefor	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11031350	Leadframe with pad anchoring members and method of forming the same	STMICROELECTRONICS, INC.
11031351	Method of manufacturing a semiconductor device	--
11031352	Routing design of dummy metal cap and redistribution line	--
11031353	Warpage control in microelectronic packages, and related assemblies and methods	MICRON TECHNOLOGY, INC.
11031354	Mixing organic materials into hybrid packages	--
11031355	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11031356	Semiconductor package structure for improving die warpage and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11031357	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11031358	Overhang model for reducing passivation stress and method for producing the same	MARVELL ASIA PTE, LTD.
11031359	Capacitor loop structure	INTEL CORPORATION
11031360	Techniques for an inductor at a second level interface	INTEL CORPORATION
11031361	Semiconductor bonding structure and method of manufacturing the same	--
11031362	3D-interconnect	INVENSAS CORPORATION
11031363	Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices	--
11031364	Nanoparticle backside die adhesion layer	TEXAS INSTRUMENTS INCORPORATED
11031365	Semiconductor device having a solder blocking metal layer	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
11031366	Shielded electronic component package	AMKOR TECHNOLOGY SINGAPORE PTE. LTD.
11031367	Bond head assemblies including reflective optical elements, related bonding machines, and related methods	KULICKE AND SOFFA INDUSTRIES, IN.
11031368	Bonding apparatus	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11031369	Apparatus for bond wave propagation control	--
11031370	Semiconductor device and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11031371	Semiconductor package and method of fabricating semiconductor package	SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
11031372	Semiconductor device including dummy pull-down wire bonds	WESTERN DIGITAL TECHNOLOGIES, INC.
11031373	Spacer for die-to-die communication in an integrated circuit	INTERNATIONAL BUSINESS MACHINES CORPORATION
11031375	Semiconductor devices having a conductive pillar and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11031376	Chip package and method of forming the same	--
11031377	Integration of three-dimensional NAND memory devices with multiple functional chips	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11031378	Semiconductor device including high speed heterogeneous integrated controller and cache	WESTERN DIGITAL TECHNOLOGIES, INC.
11031379	Stray inductance reduction in packaged semiconductor devices	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11031381	Optical transceiver and manufacturing method thereof	--
11031382	Passive element, electronic device and method for manufacturing the same	--
11031384	Integrated circuits and methods of manufacturing and designing the same	SAMSUNG ELECTRONICS CO., LTD.
11031385	Standard cell for removing routing interference between adjacent pins and device including the same	SAMSUNG ELECTRONICS CO., LTD.
11031409	Cell boundary structure for embedded memory	--
11031413	Three-dimensional memory devices and fabricating methods thereof	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11031416	Semiconductor storage device and method for manufacturing semiconductor storage device	TOSHIBA MEMORY CORPORATION
11031429	Semiconductor device, solid-state image pickup element, image pickup device, and electronic apparatus	SONY CORPORATION
11031430	Image sensor with dummy lines for minimizing fixed pattern noise (FPN) and electronic apparatus including the same	SAMSUNG ELECTRONICS CO., LTD.
11031431	Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11031446	Display device	SAMSUNG DISPLAY CO., LTD.
11031454	Electronic component, electric device including the same	SAMSUNG DISPLAY CO., LTD.
11031457	Low resistance high capacitance density MIM capacitor	INTERNATIONAL BUSINESS MACHINES CORPORATION
11031458	Metal-insulator-metal (MIM) capacitor structure and method for forming the same	--
11031459	Semiconductor device including a capacitor and method of manufacturing semiconductor device	KABUSHIKI KAISHA TOSHIBA
11031462	Semiconductor structure with improved guard ring structure	--
11031487	Contact over active gate structures for advanced integrated circuit structure fabrication	INTEL CORPORATION
11031489	Semiconductor device	--
11031499	Germanium transistor structure with underlap tip to reduce gate induced barrier lowering/short channel effect while minimizing impact on drive current	INTEL CORPORATION
11031503	Non-planar gate thin film transistor	INTEL CORPORATION
11031535	Thermoelectric power generation system	YANMAR POWER TECHNOLOGY CO., LTD.
11031675	Antenna module	SAMSUNG ELECTRO-MECHANICS CO. LTD.
11031681	Package integrated waveguide	NXP USA, INC.
11031699	Antenna with graded dielectirc and method of making the same	INTEL IP CORPORATION
11031762	Circuit assembly	AUTONETWORKS TECHNOLOGIES, LTD.
11031833	Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus	SONY CORPORATION
11031846	Co-packaged electric motor and motor drive	ABB SCHWEIZ AG
11031923	Interface device and interface method for 3D semiconductor device	--
11032454	Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device	NINGBO SUNNY OPOTECH CO., LTD.
11032911	Embedded component package structure and manufacturing method thereof	--
11032915	Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor	RICHVIEW ELECTRONICS CO., LTD.
11032935	Support structure for a flexible interconnect of a superconductor	NORTHROP GRUMMAN SYSTEMS CORPORATION
11032940	Cooling plate, cooling device, and electronic apparatus	FUJITSU LIMITED
11032942	Structure for a heat transfer interface and method of manufacturing the same	ALCATEL LUCENT
11032944	Crushable heat sink for electronic devices	INTEL CORPORATION
11032946	Electrical connector cage assembly, electrical connector, and electronic apparatus	--
11032947	Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones	RAYTHEON COMPANY
11034623	Thermal conductive member and heat dissipation structure including the same	DENKA COMPANY LIMITED
11034864	Adhesive film having adhesive resin layers and method of manufacturing electronic apparatus using the adhesive film	MITSUI CHEMICALS TOHCELLO, INC.
11034888	Aluminate fluorescent material, light emitting device, and method for producing aluminate fluorescent material	NICHIA CORPORATION
11035525	LED light bulb	ZHEJIANG SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
11035563	Light source device	LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
11035621	Electronics cooling with multi-phase heat exchange and heat spreader	GE AVIATION SYSTEMS LLC
11035625	Adjustable heat sink fin spacing	INTERNATIONAL BUSINESS MACHINES CORPORATION
11035709	CMOS thermal fluid flow sensing device employing a flow sensor and a pressure sensor on a single membrane	CAMBRIDGE ENTERPRISE LIMITED
11036100	Display device	JAPAN DISPLAY INC.
11036660	Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices	INTEL CORPORATION
11036911	Charging prevention method and structure	--
11037608	Stacked memory device and memory system including the same	SK HYNIX INC.
11037796	Manufacturing method of semiconductor device structure	--
11037799	Metal heterojunction structure with capping metal layer	--
11037802	Package substrate having copper alloy sputter seed layer and high density interconnects	INTEL CORPORATION
11037803	Method for making redistribution circuit structure	CENTURY TECHNOLOGY (SHENZHEN) CORPORATION LIMITED
11037814	Wafer processing method using a ring frame with a polyester sheet with no adhesive layer	DISCO CORPORATION
11037817	Apparatus with multi-wafer based device and method for forming such	INTEL CORPORATION
11037819	Wafer level chip scale packaging intermediate structure apparatus and method	--
11037821	Multiple patterning with self-alignment provided by spacers	GLOBALFOUNDRIES U.S. INC.
11037822	Svia using a single damascene interconnect	INTERNATIONAL BUSINESS MACHINES CORPORATION
11037823	Method of manufacturing semiconductor device	KOKUSAI ELECTRIC CORPORATION
11037824	Semiconductor device and method for manufacturing the same	--
11037825	Selective removal process to create high aspect ratio fully self-aligned via	MICROMATERIALS LLC
11037834	Simple contact over gate on active area	INTERNATIONAL BUSINESS MACHINES CORPORATION
11037842	Semiconductor device with inspection patterns	SAMSUNG ELECTRONICS CO., LTD.
11037843	Apparatuses and methods for TSV resistance and short measurement in a stacked device	MICRON TECHNOLOGY, INC.
11037844	Power semiconductor device and method of manufacturing the same, and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11037845	Semiconductor device and manufacturing method thereof	MITSUBISHI ELECTRIC CORPORATION
11037846	Semiconductor package structure and method of manufacturing the same	--
11037847	Method of manufacturing semiconductor module and semiconductor module	RENESAS ELECTRONICS CORPORATION
11037848	Semiconductor module and semiconductor module manufacturing method	FUJI ELECTRIC CO., LTD.
11037849	Semiconductor structure and manufacturing method thereof	--
11037850	Passivation structure and methods of manufacturing a semiconductor device including the same	SAMSUNG ELECTRONICS CO., LTD.
11037851	Nitrogen-rich silicon nitride films for thin film transistors	APPLIED MATERIALS, INC.
11037852	3DIC packaging with hot spot thermal management features	--
11037853	Semiconductor package structure and method of manufacturing the same	--
11037854	Thermal dissipation through seal rings in 3DIC structure	--
11037855	Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus	INTEL IP CORPORATION
11037856	Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the same	INFINEON TECHNOLOGIES AG
11037857	IGBT module with heat dissipation structure having copper layers of different thicknesses	--
11037858	Semiconductor module, method for manufacturing the same, and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11037859	Power conversion apparatus	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11037860	Multi layer thermal interface material	INTERNATIONAL BUSINESS MACHINES CORPORATION
11037861	Interconnect structure for package-on-package devices	--
11037862	Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module	SIEMENS AKTIENGESELLSCHAFT
11037863	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
11037864	Lead frame for improving adhesive fillets on semiconductor die corners	STMICROELECTRONICS, INC.
11037865	Semiconductor with external electrode	ROHM CO., LTD.
11037866	Semiconductor device and method of manufacturing the same	ABLIC INC.
11037867	Semiconductor module	ROBERT BOSCH GMBH
11037868	Semiconductor device package and method of manufacturing the same	--
11037869	Package structure and preparation method thereof	--
11037870	Electronic module, lead frame and manufacturing method for electronic module	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11037871	Gate drive interposer with integrated passives for wide band gap semiconductor devices	KEMET ELECTRONICS CORPORATION
11037872	Semiconductor devices and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11037873	Hermetic barrier for semiconductor device	MARVELL GOVERNMENT SOLUTIONS, LLC.
11037874	Plane-less voltage reference interconnects	INTEL CORPORATION
11037875	Forming dual metallization interconnect structures in single metallization level	INTERNATIONAL BUSINESS MACHINES CORPORATION
11037876	Power network and method for routing power network	SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
11037877	Package structure and method of manufacturing the same	--
11037878	Semiconductor device with EMI protection liners and method for fabricating the same	--
11037879	Semiconductor device	TOSHIBA MEMORY CORPORATION
11037880	Semiconductor package and antenna module including the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11037881	Component carrier with face-up and face-down embedded components	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11037882	Overlay mark	--
11037883	Regulator circuit package techniques	ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
11037884	Semiconductor package having through-hole including shielding wiring structure	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11037885	Semiconductor packaging device comprising a shield structure	--
11037886	Semiconductor structure of work unit module	--
11037887	Method of making package assembly including stress relief structures	--
11037888	Nitride-based electronic device and method for manufacturing same	WAVICE INC.
11037889	Display device	--
11037890	Semiconductor assembly with package on package structure and electronic device including the same	SAMSUNG ELECTRONICS CO., LTD.
11037891	Device package	--
11037892	Substrate dielectric waveguides in semiconductor packages	INTEL CORPORATION
11037893	Selectively shielded radio frequency module with linearized low noise amplifier	SKYWORKS SOLUTIONS, INC.
11037894	Semiconductor device having metal bump and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11037895	Electronic component	MOLEX, LLC
11037896	Method and apparatus for forming backside die planar devices and saw filter	INTEL CORPORATION
11037897	Semiconductor device	ROHM CO., LTD.
11037898	Semiconductor device package and method for manufacturing the same	--
11037899	Package structures and methods of forming the same	--
11037900	Chip bonding device and bonding method thereof	SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
11037901	Semiconductor element bonding apparatus and semiconductor element bonding method	TOYOTA JIDOSHA KABUSHIKI KAISHA
11037902	Light-emitting apparatus including sacrificial pattern and manufacturing method thereof	--
11037903	Plasma etch singulated semiconductor packages and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11037904	Singulation and bonding methods and structures formed thereby	--
11037906	3D IC package with RDL interposer and related method	GLOBALFOUNDRIES U.S. INC.
11037907	Semiconductor package and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11037908	Bonded die assembly containing partially filled through-substrate via structures and methods for making the same	SANDISK TECHNOLOGIES LLC
11037909	Stacked semiconductor structure and method	--
11037913	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11037915	Integrated display devices	FACEBOOK TECHNOLOGIES, LLC
11037916	Apparatus with multi-wafer based device comprising embedded active devices and method for forming such	INTEL CORPORATION
11037917	Semiconductor device module and method of assembly	LITTELFUSE, INC.
11037919	Techniques for processing devices	INVENSAS BONDING TECHNOLOGIES, INC.
11037924	Method for forming source/drain contacts	--
11037934	SRAM circuits with aligned gate electrodes	--
11037935	Semiconductor device including trimmed-gates	--
11037936	Semiconductor device and fabrication method thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11037939	Semiconductor device and method of manufacturing the same	SK HYNIX INC.
11037947	Array of pillars located in a uniform pattern	--
11037948	Semiconductor storage device and method for manufacturing semiconductor storage device	TOSHIBA MEMORY CORPORATION
11037950	Semiconductor memory device, semiconductor device, and method of manufacturing semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11037952	Peripheral circuitry under array memory device and method of fabricating thereof	--
11037953	Semiconductor device and method of manufacturing the same	SK HYNIX INC.
11037954	Three dimensional flash memory element with middle source-drain line and manufacturing method thereof	SAMSUNG ELECTRONICS CO., LTD.
11037971	Fan-out sensor package and optical fingerprint sensor module including the same	SAMSUNG ELECTRONICS CO., LTD.
11037983	Semiconductor structure and method of forming the same	--
11037984	Electronic device and method for fabricating the same	SK HYNIX INC.
11038006	Display panel and bonding method of the same	--
11038012	Capacitor device and manufacturing method therefor	--
11038023	III-nitride material semiconductor structures on conductive silicon substrates	MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
11038029	Semiconductor device structure and method for forming the same	--
11038030	Transistor having low capacitance field plate structure	RAYTHEON COMPANY
11038031	Field-effect transistor	MITSUBISHI ELECTRIC CORPORATION
11038047	Normally-off HEMT transistor with selective generation of 2DEG channel, and manufacturing method thereof	STMICROELECTRONICS S.R.L.
11038053	Semiconductor device and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11038067	Stress sensor suitable for measuring mechanical stress in a layered metallization structure of a microelectronic component	IMEC VZW
11038084	Light-emitting device	NICHIA CORPORATION
11038086	Semiconductor light-emitting element and manufacturing method therefor	SEMICON LIGHT CO., LTD.
11038091	Light-emitting device packages	SAMSUNG ELECTRONICS CO., LTD.
11038095	Systems and methods for fabrication of superconducting integrated circuits	D-WAVE SYSTEMS INC.
11038096	Stack assembly having electro-acoustic device	SKYWORKS SOLUTIONS, INC.
11038103	Tightly integrated 1T1R ReRAM for planar technology	INTERNATIONAL BUSINESS MACHINES CORPORATION
11038144	Organic light-emitting display apparatus	SAMSUNG DISPLAY CO., LTD.
11038210	Dipole antenna via flexible circuitry	FORD GLOBAL TECHNOLOGIES, LLC
11038265	Semiconductor-based beamforming antenna	ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
11038267	Apparatus and methods for electromagnetic shielding using an outer cobalt layer	SKYWORKS SOLUTIONS, INC.
11038283	Reconfigurable aperture-coupled patch antenna	THE BOEING COMPANY
11038701	Method for securing an integrated circuit during fabrication	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11039528	Assembly and sub-assembly for thermal control of electronic devices	DELTA DESIGN, INC.
11039532	Printed circuit board and manufacturing method thereof	SAMSUNG ELECTRONICS CO., LTD.
11039550	Heat sink with turbulent structures	GOOGLE LLC
11040416	Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device	SHOWA DENKO MATERIALS CO., LTD.
11040516	Graphite sheet and method for manufacturing same	SKC CO., LTD.
11040517	Printed wiring board and semiconductor package	SHOWA DENKO MATERIALS CO., LTD.
11040837	Method for manufacturing display device	SAMSUNG DISPLAY CO., LTD.
11041087	Coatings	P2I LTD
11041098	Anisotropic conductive film and fabricating method thereof	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11041211	Power distribution for active-on-active die stack with reduced resistance	XILINX, INC.
11041242	Gas shower head with plural hole patterns and with corresponding different plural hole densities and film formation method	--
11042183	Electronic display with mount-accessible components	MANUFACTURING RESOURCES INTERNATIONAL, INC.
11042211	Serially connected computing nodes in a distributed computing system	--
11043258	Memory system topologies including a memory die stack	RAMBUS INC.
11043285	Bioinformatics systems, apparatus, and methods executed on an integrated circuit processing platform	EDICO GENOME CORPORATION
11043409	Method of forming contacts to an embedded semiconductor die and related semiconductor packages	INFINEON TECHNOLOGIES AG
11043410	Packages with through-vias having tapered ends	--
11043411	Integration of air spacer with self-aligned contact in transistor	INTERNATIONAL BUSINESS MACHINES CORPORATION
11043413	Barrier layer formation for conductive feature	--
11043415	Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping	APPLIED MATERIALS, INC.
11043416	Gradient atomic layer deposition	--
11043417	Line structure for fan-out circuit and manufacturing method thereof, and photomask pattern for fan-out circuit	--
11043418	Middle of the line self-aligned direct pattern contacts	GLOBALFOUNDRIES U.S. INC.
11043419	Semiconductor device and manufacturing method thereof	TOSHIBA MEMORY CORPORATION
11043420	Fan-out wafer level packaging of semiconductor devices	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11043422	Jet ablation die singulation systems and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11043432	Radio-frequency switching devices having improved voltage handling capability	SKYWORKS SOLUTIONS, INC.
11043435	Semiconductor die with hybrid wire bond pads	INNOGRIT TECHNOLOGIES CO., LTD.
11043436	Semiconductor device, manufacturing method, imaging device, and electronic apparatus for enabling component mounting with high flatness	SONY CORPORATION
11043437	Transparent substrate with light blocking edge exclusion zone	APPLIED MATERIALS, INC.
11043438	Chip on film package and display device including the same	SAMSUNG DISPLAY CO., LTD.
11043440	Semiconductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11043441	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11043442	Heat sink, heat dissipation apparatus, heat dissipation system, and communications device	HUAWEI TECHNOLOGIES CO., LTD.
11043443	Electric device and heat radiator	TDK CORPORATION
11043444	Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices	FRORE SYSTEMS INC.
11043445	Semiconductor device having a through silicon via and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11043446	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11043448	Semiconductor device with vertically separated openings and manufacturing method thereof	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11043449	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11043450	Anti-fuse structure and method for fabricating same, as well as semiconductor device	CHANGXIN MEMORY TECHNOLOGIES, INC.
11043451	Electrical fuse and/or resistor structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11043452	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
11043453	Method of preventing pattern collapse	--
11043454	Low resistivity interconnects with doped barrier layer for integrated circuits	SAMSUNG ELECTRONICS CO., LTD.
11043455	Three-dimensional memory device including self-aligned dielectric isolation regions for connection via structures and method of making the same	SANDISK TECHNOLOGIES LLC
11043456	Semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11043457	Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same	INTEL CORPORATION
11043458	Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11043459	Multiple reticle field semiconductor devices	INTEL CORPORATION
11043460	Measurement method of overlay mark structure	--
11043461	Semiconductor device having an electromagnetic wave absorbing thermal conductive sheet between a semiconductor element and a cooling member	DEXERIALS CORPORATION
11043462	Solderless interconnection structure and method of forming same	--
11043463	Interconnect structures and methods of forming same	--
11043464	Semiconductor device having upper and lower redistribution layers	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11043465	Semiconductor device	SUMITOMO ELECTRIC INDUSTRIES, LTD.
11043466	Radio frequency modules	SKYWORKS SOLUTIONS, INC.
11043467	Flip chip backside die grounding techniques	TEXAS INSTRUMENTS INCORPORATED
11043468	Lead-free solder joining of electronic structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11043469	Method of forming three dimensional semiconductor structure	--
11043470	Inductor design in active 3D stacking technology	XILINX, INC.
11043471	Mixed-orientation multi-die integrated circuit package with at least one vertically-mounted die	MICROCHIP TECHNOLOGY INCORPORATED
11043472	3D integrated ultra high-bandwidth memory	KEPLER COMPUTE INC.
11043473	Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same	--
11043474	Semiconductor device	DENSO CORPORATION
11043477	Power converter monolithically integrating transistors, carrier, and components	TEXAS INSTRUMENTS INCORPORATED
11043478	Integrated circuit bridge for photonics and electrical chip integration	CISCO TECHNOLOGY, INC.
11043481	Method of manufacturing semiconductor package structure	--
11043482	Semiconductor component, package structure and manufacturing method thereof	--
11043484	Method and apparatus of package enabled ESD protection	XILINX, INC.
11043485	Electronic device having semiconductor device with protective resistor	HITACHI AUTOMOTIVE SYSTEMS, LTD.
11043488	High voltage protection for high-speed data interface	WESTERN DIGITAL TECHNOLOGIES, INC.
11043492	Self-aligned gate edge trigate and finFET devices	INTEL CORPORATION
11043500	Integrated assemblies comprising twisted digit line configurations	MICRON TECHNOLOGY, INC.
11043510	Array substrate and display panel	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11043512	Display apparatus	SAMSUNG DISPLAY CO., LTD.
11043522	Stacked substrate structure with inter-tier interconnection	--
11043523	Multilevel semiconductor device and structure with image sensors	MONOLITHIC 3D INC.
11043524	Device-bonded body, image pickup module, endoscope and method for manufacturing device-bonded body	OLYMPUS CORPORATION
11043525	Transmission circuit and electronic device	CANON KABUSHIKI KAISHA
11043549	Flexible display device and method of manufacturing the same	SAMSUNG DISPLAY CO., LTD.
11043559	Method for manufacturing semiconductor device	--
11043570	Semiconductor device and manufacturing method thereof	--
11043571	Insulated gate field effect transistor having passivated schottky barriers to the channel	ACORN SEMI, LLC
11043616	Airtight package	NIPPON ELECTRIC GLASS CO., LTD.
11043730	Fan-out package structure with integrated antenna	--
11043731	Package structure	--
11043805	Semiconductor device and a semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
11044808	Printed circuit board	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11044812	Component carrier with adhesion promoting shape of wiring structure	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11044830	Loop heat pipe and electronic device	FUJITSU LIMITED
11044839	Electric power inverter	MAHLE INTERNATIONAL GMBH
11045910	Metal paste and use thereof for joining components	HERAEUS DEUTSCHLAND GMBH & CO. KG
11046051	Metal-on-ceramic substrates	MATERION CORPORATION
11046190	Pressing member	DENSO CORPORATION
11046677	Hydrofluoroolefins and methods of using same	3M INNOVATIVE PROPERTIES COMPANY
11046848	Heat-curable resin composition for semiconductor encapsulation and semiconductor device	SHIN-ETSU CHEMICAL CO., LTD.
11047038	Metallization for a thin-film component, process for the production thereof and sputtering target	PLANSEE SE
11047537	Fixing of LED strips	SIGNIFY HOLDING B.V.
11047559	Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling or a light source assembly	SIGNIFY HOLDING B.V.
11047627	Cooling device	NEC CORPORATION
11047628	Electronic device having heat collection/diffusion structure	SAMSUNG ELECTRONICS CO., LTD.
11047817	Physical properties measurement system	NORTHROP GRUMMAN SYSTEMS CORPORATION
11048309	Heat dissipation module	--
11048653	Integrated circuit inputs and outputs	NORDIC SEMICONDUCTOR ASA
11048849	Integrated circuit and method of manufacturing the same	--
11049542	Semiconductor device with multiple chips and weak cell address storage circuit	SK HYNIX INC.
11049682	Electric-power conversion apparatus	MITSUBISHI ELECTRIC CORPORATION
11049734	Method of packaging chip and chip package structure	PEP INNOVATION PTE. LTD.
11049757	Wafer processing method including applying a polyester sheet to a wafer	DISCO CORPORATION
11049762	Electronic circuit comprising electrical insulation trenches	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11049764	Method for fabricating a semiconductor device	--
11049765	Semiconductor device	--
11049767	Semiconductor device and methods of manufacturing thereof	--
11049769	Self-aligned interconnection for integrated circuits	MICRON TECHNOLOGY, INC.
11049776	Semiconductor memory device having chip-to-chip bonding structure	SK HYNIX INC.
11049777	Ceramic combo lid with selective and edge metallizations	MATERION CORPORATION
11049778	Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11049779	Carrier for chip packaging and manufacturing method thereof	--
11049780	Electronic module and method for manufacturing same	TATEYAMA KAGAKU CO., LTD.
11049781	Chip-scale package device	--
11049782	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11049784	Semiconductor device for use in harsh media	MELEXIS TECHNOLOGIES NV
11049785	Semiconductor device and fabrication method thereof	FUJI ELECTRIC CO., LTD.
11049786	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11049787	Semiconductor device and method of manufacturing the same	MITSUBISHI ELECTRIC CORPORATION
11049788	Integrated circuit chip device with thermal control	MICROSOFT TECHNOLOGY LICENSING, LLC
11049789	Semiconductor microcooler	INTERNATIONAL BUSINESS MACHINES CORPORATION
11049790	Electrically insulating thermal interface on the discontinuity of an encapsulation structure	INFINEON TECHNOLOGIES AG
11049791	Heat spreading layer integrated within a composite IC die structure and methods of forming the same	INTEL CORPORATION
11049792	Package structure for semiconductor devices	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11049793	Flexible base design for chipset heat sink	--
11049794	Circuit board with phase change material	ADVANCED MICRO DEVICES, INC.
11049795	Electronic power module comprising a dielectric support	SUPERGRID INSTITUTE
11049796	Manufacturing method of packaging device	--
11049797	Method for manufacturing a semiconductor structure comprising a semiconductor device layer formed on a tem, porary substrate having a graded SiGe etch stop layer therebetween	--
11049798	Embedded bridge with through-silicon Vias	INTEL CORPORATION
11049799	Semiconductor structure and method for forming the same	--
11049800	Semiconductor device package with grooved substrate	TEXAS INSTRUMENTS INCORPORATED
11049801	Encapsulated vertical interconnects for high-speed applications and methods of assembling same	INTEL CORPORATION
11049802	Semiconductor device and method of manufacture	--
11049803	Semiconductor module	MITSUBISHI ELECTRIC CORPORATION
11049804	Arrays of memory cells individually comprising a capacitor and a transistor and methods of forming such arrays	MICRON TECHNOLOGY, INC.
11049805	Semiconductor package and method	--
11049806	Semiconductor device including semiconductor chip transmitting signals at high speed	RENESAS ELECTRONICS CORPORATION
11049807	Three-dimensional memory device containing tubular blocking dielectric spacers	SANDISK TECHNOLOGIES LLC
11049808	Semiconductor storage device	TOSHIBA MEMORY CORPORATION
11049809	Semiconductor device having a reduced pitch between lead-out wirings	LONGITUDE LICENSING LIMITED
11049810	Integrated circuit device and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11049811	Forming interlayer dielectric material by spin-on metal oxide deposition	--
11049812	Semiconductor devices and methods of forming the same	--
11049813	Interconnection structure, fabricating method thereof, and semiconductor device using the same	--
11049814	Semiconductor device including a through contact extending between sub-chips and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11049815	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11049816	Alignment mark and semiconductor device, and fabrication methods thereof	NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
11049817	Semiconductor device with integral EMI shield	NXP B.V.
11049818	Electromagnetic wave attenuator and electronic device	KABUSHIKI KAISHA TOSHIBA
11049819	Shielded package assemblies with integrated capacitor	INTERNATIONAL BUSINESS MACHINES CORPORATION
11049820	Crack suppression structure for HV isolation component	TEXAS INSTRUMENTS INCORPORATED
11049821	Circuit module	MURATA MANUFACTURING CO., LTD.
11049822	Systems and methods for the use of fraud prevention fluid to prevent chip fraud	CAPITAL ONE SERVICES, LLC
11049823	Integrated circuit package apparatus deployed with antenna and method for manufacturing integrated circuit package apparatus	HUAWEI TECHNOLOGIES CO., LTD.
11049824	Antenna apparatus with integrated antenna array and low loss multi-layer interposer	VIASAT, INC.
11049825	Method for producing semiconductor device	SHOWA DENKO MATERIALS CO., LTD.
11049826	Semiconductor device and semiconductor device manufacturing method	LAPIS SEMICONDUCTOR CO., LTD.
11049827	Semiconductor devices including a thick metal layer and a bump	SAMSUNG ELECTRONICS CO., LTD.
11049828	Electronic device with interconnection structure oblate ellipsoid-shaped aperture	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11049829	Redistribution metal and under bump metal interconnect structures and method	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
11049830	Level shifting between interconnected chips having different voltage potentials	INTERNATIONAL BUSINESS MACHINES CORPORATION
11049831	Circuit substrate	MURATA MANUFACTURING CO., LTD.
11049832	Formation method of package structure with warpage-control element	--
11049833	Semiconductor packages with an intermetallic layer	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11049834	Hybrid bonding using dummy bonding contacts	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11049835	Semiconductor module	MURATA MANUFACTURING CO., LTD.
11049836	Bond wire support systems and methods	TEXAS INSTRUMENTS INCORPORATED
11049837	Bond wire array for packaged semiconductor device	NXP USA, INC.
11049838	Conductive bump and electroless Pt plating bath	C. UYEMURA & CO., LTD.
11049839	Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods	KULICKE AND SOFFA INDUSTRIES, INC.
11049840	Bonding device	OSAKA UNIVERSITY
11049841	Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection	INTERNATIONAL BUSINESS MACHINES CORPORATION
11049842	Alignment method, method for connecting electronic component, method for manufacturing connection body, connection body and anisotropic conductive film	DEXERIALS CORPORATION
11049843	Semiconductor packages	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11049844	Semiconductor wafer having trenches with varied dimensions for multi-chip modules	INTERNATIONAL BUSINESS MACHINES CORPORATION
11049845	Semiconductor device having wires connecting connection pads	LONGITUDE LICENSING LIMITED
11049846	Integrated circuit chip, method of manufacturing the integrated circuit chip, and integrated circuit package and display apparatus including the integrated circuit chip	SAMSUNG ELECTRONICS CO., LTD.
11049847	Semiconductor device for preventing defects between bit lines and channels	SAMSUNG ELECTRONICS CO., LTD.
11049850	Methods of bonding the strip-shaped under bump metallization structures	--
11049854	MIMCAP creation and utilization methodology	AMPERE COMPUTING LLC
11049855	Tunable capacitive compensation for RF switch FET stacks	PSEMI CORPORATION
11049856	Semiconductor device	NUVOTON TECHNOLOGY CORPORATION JAPAN
11049866	Three-dimensional memory devices having through array contacts and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11049868	Stacked type semiconductor memory device	TOSHIBA MEMORY CORPORATION
11049874	NOR-type memory device and method of fabricating the same	--
11049876	Three-dimensional memory device containing through-memory-level contact via structures	SANDISK TECHNOLOGIES LLC
11049877	Semiconductor memory	KIOXIA CORPORATION
11049879	Three-dimensional vertical NOR flash thin-film transistor strings	SUNRISE MEMORY CORPORATION
11049905	Memory device and memory system	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11049931	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11049953	Nanosheet transistor	TESSERA, INC.
11049980	Integrated MIM diode	TEXAS INSTRUMENTS INCORPORATED
11049983	Conductive paste and solar cell	NAMICS CORPORATION
11050017	Semiconductor device and method for fabricating the same	--
11050022	Radio frequency (RF) switches having phase-change material (PCM) and heat management for increased manufacturability and performance	NEWPORT FAB, LLC
11050030	OLED display and OLED display device	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11050135	Antenna-in-package with better antenna performance	--
11050153	Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas	--
11050155	Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems	INTEL CORPORATION
11050329	Method for manufacturing a winding core	MURATA MANUFACTURING CO., LTD.
11050388	Compact three-way Doherty amplifier module	NXP USA, INC.
11050395	Radio frequency (RF) amplifier	NXP USA, INC.
11050407	Electronic devices formed in a cavity between substrates	SKYWORKS SOLUTIONS, INC.
11051391	Thermally highly conductive coating on base structure accommodating a component	AT&S (CHINA) CO. LTD.
11051401	Method of integrating an electronic module with conductive fabric	FLEXTRONICS AP, LLC
11051427	High-performance electronics cooling system	GOOGLE LLC
11051428	Oscillating heat pipe integrated thermal management system for power electronics	HAMILTON SUNDSTRAND CORPORATION
11052636	Fused sheet for electromagnetic wave absorption-extinction and shielding, and for electronic equipment high heat dissipation, and method of manufacturing the same	--
11052637	Structure containing Sn layer or Sn alloy layer	ISHIHARA CHEMICAL CO., LTD.
11052647	Direct additive synthesis of diamond semiconductor	LOCKHEED MARTIN CORPORATION
11053118	Sensor package substrate and sensor module having the same	TDK CORPORATION
11053264	Limonene-based, non-halogenated flame retardants for polymeric applications	INTERNATIONAL BUSINESS MACHINES CORPORATION
11053382	Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device	MITSUBISHI GAS CHEMICAL COMPANY, INC.
11053384	Curable composition and cured product thereof	DIC CORPORATION
11053579	Fine metal mask, display substrate, and alignment method therefor	KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
11053600	Tin or tin alloy plating solution and bump forming method	MITSUBISHI MATERIALS CORPORATION
11054385	Gas sensor	HITACHI METALS, LTD.
11054593	Chip-scale optoelectronic transceiver with microspringed interposer	PALO ALTO RESEARCH CENTER INCORPORATED
11054744	Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package	SHOWA DENKO MATERIALS CO., LTD.
11054953	Display device with integrated circuits stack structure	SAMSUNG DISPLAY CO., LTD.
11055459	Heterogeneous miniaturization platform	INTERNATIONAL BUSINESS MACHINES CORPORATION
11056027	Chip-on-film package, display panel, and display device	SAMSUNG DISPLAY CO., LTD.
11056271	Coil pattern and formation method therefor, and chip element having same	MODA-INNOCHIPS CO., LTD.
11056348	Bonding surfaces for microelectronics	INVENSAS BONDING TECHNOLOGIES, INC.
11056349	Method of fabricating semiconductor device, vacuum processing apparatus and substrate processing apparatus	TOKYO ELECTRON LIMITED
11056354	Semiconductor separation device	LUMENTUM TECHNOLOGY UK LIMITED
11056364	Method for substrate thinning	--
11056373	3D fanout stacking	APPLE INC.
11056382	Cavity formation within and under semiconductor devices	GLOBALFOUNDRIES U.S. INC.
11056383	Forming array contacts in semiconductor memories	MICRON TECHNOLOGY, INC.
11056384	Method for forming contact plug	--
11056385	Selective formation of metallic films on metallic surfaces	ASM INTERNATIONAL N.V.
11056386	Two-dimensional (2D) self-aligned contact (or via) to enable further device scaling	INTERNATIONAL BUSINESS MACHINES CORPORATION
11056387	Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11056390	Structures and methods for reliable packages	INVENSAS CORPORATION
11056403	Wafer with beveled edge region and method for analyzing shape of the same	SK SILTRON CO., LTD.
11056407	Semiconductor chips including through electrodes and methods of testing the through electrodes	SK HYNIX INC.
11056408	Power semiconductor device with active short circuit failure mode	ABB POWER GRIDS SWITZERLAND AG
11056409	Composite material and a semiconductor container made of the same	--
11056410	Method of manufacturing semiconductor package using alignment mark on wafer	NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
11056411	Chip packaging structure	--
11056412	Semiconductor package and manufacturing method thereof	--
11056413	Combined inductor and heat transfer device	INTERNATIONAL BUSINESS MACHINES CORPORATION
11056414	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11056415	Semiconductor device	HITACHI AUTOMOTIVE SYSTEMS, LTD.
11056416	Semiconductor device and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11056417	Power conversion apparatus	DENSO CORPORATION
11056418	Semiconductor microcooler	INTERNATIONAL BUSINESS MACHINES CORPORATION
11056419	Semiconductor device having backside interconnect structure on through substrate via and method of forming the same	--
11056420	Pressing-type semiconductor power device package	JMJ KOREA CO., LTD.
11056421	Package structure for power converter and manufacture method thereof	SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
11056422	Semiconductor module	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11056423	Semiconductor device	MURATA MANUFACTURING CO., LTD.
11056424	Display device	SAMSUNG DISPLAY CO., LTD.
11056425	Structural enhancement of Cu nanowires	INTERNATIONAL BUSINESS MACHINES CORPORATION
11056426	Metallization interconnect structure formation	INTERNATIONAL BUSINESS MACHINES CORPORATION
11056427	Chip package	--
11056428	Semiconductor device extension insulation	--
11056429	Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device	TESSERA, INC.
11056430	Thin film based semiconductor devices and methods of forming a thin film based semiconductor device	GLOBALFOUNDRIES SINGAPORE PTE. LTD.
11056431	Electric fuse structure and method for fabricating the same	--
11056432	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11056433	Redistribution layer structures for integrated circuit package	--
11056434	Semiconductor device having specified p-type dopant concentration profile	--
11056435	Semiconductor package with chamfered pads	--
11056436	Integrated fan-out structure with rugged interconnect	--
11056437	Panel-level chip device and packaging method thereof	SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
11056438	Semiconductor packages and method of forming the same	--
11056439	Optical chip ID definition using nanoimprint lithography	INTERNATIONAL BUSINESS MACHINES CORPORATION
11056440	Methods of manufacturing semiconductor device and semiconductor device	--
11056441	Electromagnetic shielding of compact electronic modules	APPLE INC.
11056442	Substrate structure, electronic package having the same, and method for fabricating the same	--
11056443	Apparatuses exhibiting enhanced stress resistance and planarity, and related methods	MICRON TECHNOLOGY, INC.
11056444	Surface-mount thin-film components having terminals configured for visual inspection	AVX CORPORATION
11056445	Package structure with buffer layer sandwiched between encapsulation layer and semiconductor substrate	--
11056446	Semiconductor package device and semiconductor process	--
11056447	Power module having at least one power semiconductor	SIEMENS AKTIENGESELLSCHAFT
11056448	Covert gates to protect gate-level semiconductors	UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED
11056449	Guard ring structures and their methods of fabrication	INTEL CORPORATION
11056450	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11056451	Semiconductor device manufacturing method and semiconductor device	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
11056452	Interface bus for inter-die communication in a multi-chip package over high density interconnects	INTEL CORPORATION
11056453	Stackable fully molded semiconductor structure with vertical interconnects	DECA TECHNOLOGIES USA, INC.
11056454	Stacked three-dimensional heterogeneous memory devices and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11056455	Negative fillet for mounting an integrated device die to a carrier	ANALOG DEVICES, INC.
11056456	Semiconductor apparatus	SUMITOMO ELECTRIC INDUSTRIES, LTD.
11056457	Semiconductor device with bond wire reinforcement structure	NXP USA, INC.
11056458	Package comprising chip contact element of two different electrically conductive materials	INFINEON TECHNOLOGIES AG
11056459	Chip package structure and method for forming the same	--
11056460	Method for producing an electric circuit comprising a circuit carrier, contact areas, and an insulating body	SIEMENS AKTIENGESELLSCHAFT
11056461	Method of manufacturing fan-out wafer level package	SAMSUNG ELECTRONICS CO., LTD.
11056462	Locking dual leadframe for flip chip on leadframe packages	TEXAS INSTRUMENTS INCORPORATED
11056463	Arrangement of penetrating electrode interconnections	SONY CORPORATION
11056464	Packages with metal line crack prevention design	--
11056465	Semiconductor package having singular wire bond on bonding pads	INTEL CORPORATION
11056466	Package on package thermal transfer systems and methods	INTEL CORPORATION
11056467	Semiconductor devices with through silicon vias and package-level configurability	MICRON TECHNOLOGY, INC.
11056468	3D semiconductor device and structure	MONOLITHIC 3D INC.
11056469	Multimedia device having a pixel array and method for manufacturing the multimedia device	--
11056470	Electronic package and method for fabricating the same	--
11056471	Semiconductor device and method of manufacture	--
11056472	Stretchable display device	LG DISPLAY CO., LTD.
11056474	Semiconductor package, semiconductor device and method of forming the same	--
11056475	Semiconductor module	FUJI ELECTRIC CO., LTD.
11056476	Microcontroller unit and fabrication method thereof	NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
11056477	Semiconductor device having a first cell row and a second cell row	SOCIONEXT INC.
11056480	Method of forming a TVS semiconductor device	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11056483	Heterolithic microwave integrated circuits including gallium-nitride devices on intrinsic semiconductor	MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
11056487	Single diffusion break local interconnect	QUALCOMM INCORPORATED
11056488	Metal-oxide-semiconductor device	--
11056489	Integrated circuit devices including vertical field-effect transistors (VFETs)	SAMSUNG ELECTRONICS CO., LTD.
11056501	Three-dimensional NAND memory device with source line comprising metallic and semiconductor layers	TOSHIBA MEMORY CORPORATION
11056502	Semiconductor device including multi-stack structure	SAMSUNG ELECTRONICS CO., LTD.
11056503	Semiconductor memory device including vertical barrier	SK HYNIX INC.
11056505	Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assemblies	MICRON TECHNOLOGY, INC.
11056506	Semiconductor device including stack structure and trenches	SAMSUNG ELECTRONICS CO., LTD.
11056512	Device substrate	--
11056525	Semiconductor photomultiplier	SENSL TECHNOLOGIES LTD
11056535	Non-volatile memory element arrays in a wheatstone bridge arrangement	GLOBALFOUNDRIES U.S. INC.
11056555	Semiconductor device having 3D inductor and method of manufacturing the same	--
11056560	Hetero-epitaxial output device array with serial connections	HANGZHOU HAICUN INFORMATION TECHNOLOGY CO., LTD.
11056563	Semiconductor device, semiconductor module, and packaged semiconductor device	NUVOTON TECHNOLOGY CORPORATION JAPAN
11056589	Semiconductor device	NUVOTON TECHNOLOGY CORPORATION JAPAN
11056629	Mounting an LED element on a flat carrier	LUMILEDS LLC
11056632	Thermoelectric conversion substrate, thermoelectric conversion module and method for producing thermoelectric conversion substrate	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11056646	Memory device having programmable impedance elements with a common conductor formed below bit lines	ADESTO TECHNOLOGIES CORPORATION
11056673	Light emitting device	PIONEER CORPORATION
11056756	Multilayer substrate connecting body and transmission line device	MURATA MANUFACTURING CO., LTD.
11056757	Manufacturing method of a radio-frequency member	NIDEC CORPORATION
11056765	Microelectronic devices designed with foldable flexible substrates for high frequency communication modules	INTEL CORPORATION
11056860	Bus structure for parallel connected power switches	EATON INTELLIGENT POWER LIMITED
11057019	Non-volatile adjustable phase shifter using non-volatile radio frequency (RF) switch	NEWPORT FAB, LLC
11057991	Waterproof stretchable optoelectronics	THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
11057992	Connection structure	MIKUNI ELECTRON CORPORATION
11057996	Circuit board, method of manufacturing circuit board, and electronic device	FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
11057997	High-frequency module	MURATA MANUFACTURING CO., LTD.
11058004	Metallic layer as carrier for component embedded in cavity of component carrier	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11058007	Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11058031	Vapor chamber	MURATA MANUFACTURING CO., LTD.
11058032	Memory module cooler with vapor chamber device connected to heat pipes	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
11058035	Electric power inverter	MAHLE INTERNATIONAL GMBH
11058038	Electromagnetic shields for sub-modules	QORVO US, INC.
11059966	Liquid epoxy resin composition for sealing, and electronic component device	SHOWA DENKO MATERIALS CO., LTD.
11059972	Curable organopolysiloxane composition and optical semiconductor device	DOW SILICONES CORPORATION
11059973	Heat-curable resin composition and semiconductor device	SHIN-ETSU CHEMICAL CO., LTD.
11060799	Vapor chamber structure	--
11060805	Thermal interface material system	TELEDYNE SCIENTIFIC & IMAGING, LLC
11061064	Semiconductor device and method for detecting cracks	--
11061193	Semiconductor chip package having optical interface	LIPAC CO., LTD.
11061327	Polyimides	FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
11061450	Cooling apparatus for electronic components	--
11061455	Systems and methods for integrating batteries with stacked integrated circuit die elements	ARBOR COMPANY, LLLP
11061773	Fault tolerant memory systems and components with interconnected and redundant data interfaces	RAMBUS INC.
11062070	Die to die interconnect structure for modularized integrated circuit devices	INTEL CORPORATION
11062851	Thin film capacitor embedded substrate and its manufacturing method	TDK CORPORATION
11062901	Low-k dielectric and processes for forming same	--
11062908	Contact structure	--
11062909	Interconnect structure having a carbon-containing barrier layer	--
11062915	Redistribution structures for semiconductor packages and methods of forming the same	--
11062917	Packaging method, panel assembly, wafer package and chip package	PEP INNOVATION PTE. LTD.
11062923	Apparatus to control transfer parameters during transfer of semiconductor devices	ROHINNI, LLC
11062924	Semiconductor packaging apparatus and method of manufacturing semiconductor device using the same	SAMSUNG ELECTRONICS CO., LTD.
11062927	Device and method for contactlessly transferring at least partly ferromagnetic electronic components from a carrier to a substrate	MUEHLBAUER GMBH & CO. KG
11062933	Die placement and coupling apparatus	INTEL CORPORATION
11062938	Semiconductor device and a method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
11062943	Top via interconnects with wrap around liner	INTERNATIONAL BUSINESS MACHINES CORPORATION
11062945	Methods for reducing contact depth variation in semiconductor fabrication	--
11062947	Inorganic dies with organic interconnect layers and related structures	INTEL CORPORATION
11062949	Method of manufacturing power device with improved the utilization rate of wafer area	--
11062961	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11062965	Flipped vertical field-effect-transistor	INTERNATIONAL BUSINESS MACHINES CORPORATION
11062966	Defect detection structure of a semiconductor die, semiconductor device including the same and method of detecting defects in semiconductor die	SAMSUNG ELECTRONICS CO., LTD.
11062968	Package structure and method for forming the same	--
11062969	Wafer level chip scale package structure and manufacturing method thereof	ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
11062970	Heat spreader edge standoffs for managing bondline thickness in microelectronic packages	INTEL CORPORATION
11062971	Package structure and method and equipment for forming the same	--
11062972	Electronic module for power control and method for manufacturing an electronic module power control	ZF FRIEDRICHSHAFEN AG
11062973	Synthetic diamond heat spreaders	ELEMENT SIX TECHNOLOGIES LIMITED
11062974	Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate	MITSUBISHI MATERIALS CORPORATION
11062975	Package structures	--
11062976	Functional stiffener that enables land grid array interconnections and power decoupling	INTERNATIONAL BUSINESS MACHINES CORPORATION
11062977	Shield structure for backside through substrate vias (TSVs)	--
11062978	Semiconductor package and method	--
11062979	High-frequency device and manufacturing method thereof	--
11062980	Integrated circuit packages with wettable flanks and methods of manufacturing the same	TEXAS INSTRUMENTS INCORPORATED
11062981	Bidirectional switch and bidirectional switch device including the switch	PANASONIC CORPORATION
11062982	Packaged semiconductor device with a particle roughened surface	TEXAS INSTRUMENTS INCORPORATED
11062983	Substrate for mounting semiconductor element	OHKUCHI MATERIALS CO., LTD.
11062984	Methods for forming semiconductor devices	MICRON TECHNOLOGY, INC.
11062985	Wiring structure having an intermediate layer between an upper conductive structure and conductive structure	--
11062986	Articles having vias with geometry attributes and methods for fabricating the same	CORNING INCORPORATED
11062987	Semiconductor device	--
11062988	3D IC decoupling capacitor structure and method for manufacturing the same	--
11062989	Assemblies which include wordlines over gate electrodes	MICRON TECHNOLOGY, INC.
11062990	Semiconductor package of using insulating frame	NEPES LAWEH CORPORATION
11062992	Electronic component	ROHM CO., LTD.
11062993	Contacts having a geometry to reduce resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11062994	Semiconductor device package and method of manufacturing the same	--
11062995	Interconnect fabricated with flowable copper	INTEL CORPORATION
11062996	Embedded component package structure and manufacturing method thereof	--
11062997	Method for forming chip package structure	--
11062998	Semiconductor package and manufacturing method thereof	--
11062999	Semiconductor package and antenna module comprising the same	SAMSUNG ELECTRONICS CO., LTD.
11063000	Semiconductor package authentication feature	INFINEON TECHNOLOGIES AG
11063001	Semiconductor device and method of manufacturing thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11063002	Methods related to shielded module having compression overmold	SKYWORKS SOLUTIONS, INC.
11063003	Semiconductor device with diced semiconductor chips and method for manufacturing the same	--
11063004	Semiconductor device, control device, and method for manufacturing semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11063005	Via rail solution for high power electromigration	--
11063006	Semiconductor device structure with fine patterns forming varied height spacer and method for forming the same	--
11063007	Semiconductor device and method of manufacture	--
11063008	Semiconductor structure and manufacturing method thereof	--
11063009	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11063010	Redistribution layer (RDL) structure and method of manufacturing the same	--
11063011	Chip and wafer having multi-layered pad	--
11063012	Semiconductor structure having buffer under bump pad and manufacturing method thereof	--
11063013	Semiconductor package structure	--
11063014	Semiconductor devices including a metal silicide layer and methods for manufacturing thereof	INFINEON TECHNOLOGIES AG
11063015	Semiconductor device package and method of manufacturing the same	--
11063016	Integrated fan-out package including voltage regulators and methods forming same	--
11063017	Embedded organic interposer for high bandwidth	INVENSAS CORPORATION
11063018	Semiconductor device assemblies with electrically functional heat transfer structures	MICRON TECHNOLOGY, INC.
11063019	Package structure, chip structure and method of fabricating the same	--
11063020	Semiconductor device, manufacturing method for semiconductor device, and electronic device	SONY CORPORATION
11063021	Microelectronics package with vertically stacked dies	QORVO US, INC.
11063022	Package and manufacturing method of reconstructed wafer	--
11063023	Semiconductor package	--
11063024	Method to form a 3D semiconductor device and structure	MONLITHIC 3D INC.
11063025	Semiconductor module and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11063027	Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die	STMICROELECTRONICS S.R.L.
11063029	Method for forming an electro-optical system	STMICROELECTRONICS S.R.L.
11063031	Semiconductor memory system	TOSHIBA MEMORY CORPORATION
11063034	Capacitor structures	MICRON TECHNOLOGY, INC.
11063036	Semiconductor device and method for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11063038	Through silicon via design for stacking integrated circuits	--
11063041	Integrated circuit device including a power supply line and method of forming the same	--
11063045	Semiconductor device and method of manufacturing the same	--
11063046	Multi-die fine grain integrated voltage regulation	APPLE INC.
11063056	Non-volatile memory device and manufacturing method thereof	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11063061	Semiconductor memory device and manufacturing method thereof	SK HYNIX INC.
11063062	Semiconductor device and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
11063063	Three-dimensional memory device containing plural work function word lines and methods of forming the same	SANDISK TECHNOLOGIES LLC
11063071	Multilevel semiconductor device and structure with waveguides	MONOLITHIC 3D INC.
11063078	Anti-flare semiconductor packages and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11063108	Organic light emitting diode array substrate and electronic device	ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
11063110	Conductive pattern with tapered angle, display device including the same, and method of manufacturing conductive pattern	SAMSUNG DISPLAY CO., LTD.
11063111	Semiconductor structure and manufacturing method for the same	--
11063120	Metal-graphene structures forming a lattice of interconnected segments	TEXAS INSTRUMENTS INCORPORATED
11063127	Semiconductor element and semiconductor device provided with the same	ROHM CO., LTD.
11063128	Conformal source and drain contacts for multi-gate field effect transistors	--
11063132	Semiconductor device layout structure and manufacturing method thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11063133	Fin cut and fin trim isolation for advanced integrated circuit structure fabrication	INTEL CORPORATION
11063151	Metal chemical vapor deposition approaches for fabricating wrap-around contacts and resulting structures	INTEL CORPORATION
11063157	Trench capacitor profile to decrease substrate warpage	--
11063159	Methods for routing electrical interconnections and resultant structures	FLIR SYSTEMS, INC.
11063193	Colour micro-LED display apparatus	REALD SPARK, LLC
11063194	Ultra-small LED electrode assembly	SAMSUNG DISPLAY CO., LTD.
11063195	Electronic device and method for manufacturing the same	--
11063216	Confined phase change memory with double air gap	INTERNATIONAL BUSINESS MACHINES CORPORATION
11063495	Heatsink clamp for multiple electronic components	NIDEC MOTOR CORPORATION
11063571	Packaged electronic components	ZHUHAI CRYSTAL RESONANCE TECHNOLOGIES CO., LTD.
11063586	Main-auxiliary field-effect transistor configurations with an auxiliary stack and interior parallel transistors	SKYWORKS SOLUTIONS, INC.
11064603	Electronic apparatus having package base substrate	SAMSUNG ELECTRONICS CO., LTD.
11064609	Printable 3D electronic structure	X DISPLAY COMPANY TECHNOLOGY LIMITED
11064632	Heat-sinking improved structure for evaporators	--
11065466	Shock determination based on prior shocks	ZOLL MEDICAL CORPORATION
11065805	Warpage reduction device and warpage reduction method	EO TECHNICS CO., LTD.
11066510	Epoxy resin composition, process for producing same, and uses of said composition	SUMITOMO SEIKA CHEMICALS CO., LTD.
11066577	Electrically conductive adhesive film and dicing-die bonding film using the same	FURUKAWA ELECTRIC CO., LTD.
11067343	Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11067345	Passively deployable thermal management devices, systems, and methods	ROCCOR, LLC
11067466	Pressure sensor devices and methods for manufacturing pressure sensor devices	INFINEON TECHNOLOGIES AG
11067554	Gas sensor package and sensing apparatus including the same	SAMSUNG ELECTRONICS CO., LTD.
11067600	Multilayer circuit board used for probe card and probe card including multilayer circuit board	MURATA MANUFACTURING CO., LTD.
11067643	Magnetic field sensor and method for making same	MELEXIS TECHNOLOGIES NV
11067645	Magnetic sensor component and assembly	MELEXIS TECHNOLOGIES SA
11067670	Heterogeneously integrated chip-scale lidar system	GM GLOBAL TECHNOLOGY OPERATIONS LLC
11067857	Display panel, display device, and method for manufacturing display panel	SAKAI DISPLAY PRODUCTS CORPORATION
11068166	Hybrid memory device using different types of capacitors and operating method thereof	MICRON TECHNOLOGY, INC.
11068636	Method for semiconductor package and semiconductor package design system	SAMSUNG ELECTRONICS CO., LTD.
11068638	Power grid, IC and method for placing power grid	--
11068640	Power shared cell architecture	INTEL CORPORATION
11069383	Thermal interface materials for immersion cooled data storage devices	SEAGATE TECHNOLOGY LLC
11069410	Three-dimensional NOR-NAND combination memory device and method of making the same	SANDISK TECHNOLOGIES LLC
11069419	Test line letter for embedded non-volatile memory technology	--
11069475	Compact isolated inductors	PSEMI CORPORATION
11069476	Self-contained device with planar overlapping coils	VAYYAR IMAGING LTD.
11069526	Using a self-assembly layer to facilitate selective formation of an etching stop layer	--
11069530	Etching platinum-containing thin film using protective cap layer	TEXAS INSTRUMENTS INCORPORATED
11069538	Semiconductor device and method of manufacturing semiconductor device	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11069539	3D packages and methods for forming the same	--
11069540	Package on package and a method of fabricating the same	--
11069541	Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same	SAMSUNG ELECTRONICS CO., LTD.
11069551	Method of dampening a force applied to an electrically-actuatable element	ROHINNI, LLC
11069561	Methods of forming electronic devices, and related electronic devices and electronic systems	MICRON TECHNOLOGY, INC.
11069562	Passivation layer for integrated circuit structure and forming the same	--
11069565	Semiconductor interconnect structure and manufacturing method thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
11069566	Hybrid sidewall barrier facilitating low resistance interconnection	INTERNATIONAL BUSINESS MACHINES CORPORATION
11069567	Modulating metal interconnect surface topography	INTERNATIONAL BUSINESS MACHINES CORPORATION
11069571	High speed, high density, low power die interconnect system	GULA CONSULTING LIMITED LIABILITY COMPANY
11069572	Semiconductor device and forming method thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11069573	Wafer level package structure and method of forming same	--
11069585	Semiconductor substrate crack mitigation systems and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11069586	Chip-on-film package	--
11069587	Integrated semiconductor device and process for manufacturing an integrated semiconductor device	STMICROELECTRONICS S.R.L.
11069588	Semiconductor package and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11069589	Circuit board and circuit module	TAIYO YUDEN CO., LTD.
11069590	Wafer-level fan-out package with enhanced performance	QORVO US, INC.
11069591	Semiconductor device and method for manufacturing semiconductor device	ROHM CO., LTD.
11069592	Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure	SAMSUNG ELECTRONICS CO., LTD.
11069593	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11069594	Methods of forming electronic assemblies with inverse opal structures using variable current density electroplating	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11069595	Water cooling module	--
11069596	Through silicon contact structure and method of forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11069597	Semiconductor chips and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11069598	Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs)	MICRON TECHNOLOGY, INC.
11069599	Recessed lead leadframe packages	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11069600	Semiconductor package with space efficient lead and die pad design	INFINEON TECHNOLOGIES AG
11069601	Leadless semiconductor package with wettable flanks	STMICROELECTRONICS, INC.
11069602	Package and terminal arrangement for semiconductor module	MITSUBISHI ELECTRIC CORPORATION
11069603	Semiconductor device	SUMITOMO ELECTRIC INDUSTRIES, LTD.
11069604	Semiconductor package and method of making the same	ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD. GRAND
11069605	Wiring structure having low and high density stacked structures	--
11069606	Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect	COMPASS TECHNOLOGY COMPANY LIMITED
11069607	Metal option structure of semiconductor device	SK HYNIX INC.
11069608	Semiconductor structure and manufacturing method thereof	--
11069609	Techniques for forming vias and other interconnects for integrated circuit structures	INTEL CORPORATION
11069610	Methods for forming microelectronic devices with self-aligned interconnects, and related devices and systems	MICRON TECHNOLOGY, INC.
11069611	Liner-free and partial liner-free contact/via structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11069612	Semiconductor devices having electrically and optically conductive vias, and associated systems and methods	MICRON TECHNOLOGY, INC.
11069613	Integrated circuit device and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11069614	Semiconductor package structure	--
11069615	Inductor, filter, and multiplexer	TAIYO YUDEN CO., LTD.
11069616	Horizontal programmable conducting bridges between conductive lines	TOKYO ELECTRON LIMITED
11069617	Semiconductor device and nonvolatile memory	TOSHIBA MEMORY CORPORATION
11069618	Line structure and a method for producing the same	DAI NIPPON PRINTING CO., LTD.
11069619	Interconnect structure and electronic device employing the same	SAMSUNG ELECTRONICS CO., LTD.
11069620	Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate	INTEL CORPORATION
11069621	Semiconductor device	FUJI ELECTRIC CO., LTD.
11069622	Interposer-type component carrier and method of manufacturing the same	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11069623	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11069624	Electrical devices and methods of manufacture	FARADAY SEMI, INC.
11069625	Method for forming package structure	--
11069626	Molding compound and semiconductor package with a molding compound	INFINEON TECHNOLOGIES AG
11069627	Scribe seals and methods of making	TEXAS INSTRUMENTS INCORPORATED
11069628	Integrated circuit provided with decoys against reverse engineering and corresponding fabrication process	STMICROELECTRONICS (ROUSSET) SAS
11069630	Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging	--
11069631	Three-dimensional memory die containing stress-compensating slit trench structures and methods for making the same	SANDISK TECHNOLOGIES LLC
11069632	Array substrate and manufacturing method thereof	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11069633	Electronic package	--
11069634	Amplifier and amplification apparatus	FUJITSU LIMITED
11069635	Radio frequency transistor amplifiers and other multi-cell transistors having isolation structures	CREE, INC.
11069636	Package structure and method of forming the same	--
11069637	Semiconductor device, manufacturing method, and electronic device	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11069638	Method for fabricating the electronic component, and method for transposing a micro-element	--
11069639	Semiconductor module, electronic component and method of manufacturing a semiconductor module	INFINEON TECHNOLOGIES AUSTRIA AG
11069640	Package for power electronics	CREE FAYETTEVILLE, INC.
11069641	Integrated circuit package and display device using the same	LG DISPLAY CO., LTD.
11069642	Package structure and method of manufacturing the same	--
11069643	Semiconductor device manufacturing method	FUJI ELECTRIC CO., LTD.
11069644	Semiconductor device including a solder compound containing a compound Sn/Sb	INFINEON TECHNOLOGIES AG
11069645	Electronic component module	MURATA MANUFACTURING CO., LTD.
11069646	Printed circuit board structure having pads and conductive wire	--
11069647	Semiconductor wafer, bonding structure and wafer bonding method	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11069648	Semiconductor structure and method for obtaining light emitting diodes reconstituted over a carrier substrate	IMEC VZW
11069649	Laser assisted solder bonding of direct conversion compound semiconductor detector	DETECTION TECHNOLOGY OY
11069650	Bonding condition evaluation apparatus	SHINKAWA LTD.
11069651	Method of mounting die	SHINKAWA LTD.
11069652	Method of manufacturing semiconductor structure	--
11069653	Methods and structures for packaging semiconductor dies	--
11069654	Metal frame, dummy wafer, semiconductor device, electronic device, and method of manufacturing semiconductor device	SONY CORPORATION
11069655	Semiconductor device including two or more chips mounted over wiring substrate	MICRON TECHNOLOGY, INC.
11069656	Three-layer package-on-package structure and method forming same	--
11069657	Chip package having die structures of different heights and method of forming same	--
11069658	System on integrated chips and methods of forming same	--
11069661	Electronic package	--
11069662	Semiconductor package and manufacturing method thereof	--
11069665	Trimmable banked capacitor	APPLE INC.
11069666	Semiconductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11069667	Wafer level proximity sensor	STMICROELECTRONICS PTE LTD
11069670	Camera assembly and packaging method thereof, lens module, and electronic device	NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
11069671	Semiconductor package and method	--
11069673	Semiconductor package and manufacturing method thereof	--
11069691	Memory cell array with large gate widths	GLOBALFOUNDRIES U.S. INC.
11069695	Floating gate test structure for embedded memory device	--
11069699	NAND memory cell string having a stacked select gate structure and process for forming same	CYPRESS SEMICONDUCTOR CORPORATION
11069703	Three-dimensional device with bonded structures including a support die and methods of making the same	SANDISK TECHNOLOGIES LLC
11069706	Three-dimensional semiconductor memory devices	SAMSUNG ELECTRONICS CO., LTD.
11069707	Variable die size memory device and methods of manufacturing the same	SANDISK TECHNOLOGIES LLC
11069721	Display device and method of manufacturing the same	LG DISPLAY CO., LTD.
11069734	Image sensor device	INVENSAS CORPORATION
11069735	Semiconductor device and imaging device	SONY CORPORATION
11069746	Electronic device	SK HYNIX INC.
11069747	Display device and electronic device having multiple overlapping display panels	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11069763	Display apparatus	SAMSUNG DISPLAY CO., LTD.
11069783	Semiconductor device, semiconductor module, and packaged semiconductor device	NUVOTON TECHNOLOGY CORPORATION JAPAN
11069838	Light-emitting device with light-emitting element mounted on supporting member and display apparatus	ROHM CO, LTD.
11070171	Apparatus and methods for biasing of power amplifiers	SKYWORKS SOLUTIONS, INC.
11070175	Power amplification module	MURATA MANUFACTURING CO., LTD.
11070209	Programmable logic device with fine-grained disaggregation	INTEL CORPORATION
11071197	Multilayer ceramic electronic package with modulated mesh topology and alternating rods	INTERNATIONAL BUSINESS MACHINES CORPORATION
11071203	Circuit substrate arrangement with improved electrical contact	ROBERT BOSCH GMBH
11071207	Electronic module	IMBERATEK, LLC
11071212	Semiconductor device manufacturing method	FUJI ELECTRIC CO., LTD.
11071224	Functional panel, method for manufacturing the same, module, data processing device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11071230	Heat dissipation structure of heat generating component	DENSO TEN LIMITED
11071238	Fluid cooling system	ICEOTOPE GROUP LIMITED
11071240	Power converting apparatus	HYUNDAI MOTOR COMPANY
11071513	Test key design to enable X-ray scatterometry measurement	--
11072706	Gel-type thermal interface material	HONEYWELL INTERNATIONAL INC.
11072710	Surface-treated silica filler, and resin composition containing surface-treated silica filler	NAMICS CORPORATION
11073336	Shell heat dissipating structure of small form-factor pluggable transceiver	--
11073572	Current sensor device with a routable molded lead frame	INFINEON TECHNOLOGIES AG
11073873	Electronic device interconnect	INTEL CORPORATION
11074866	Light emitting display apparatus	LG DISPLAY CO., LTD.
11075072	Wafer scale ultrasonic sensing device and manufacturing method thereof	--
11075090	Semiconductor packages and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11075091	Method for manufacturing semiconductor device	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11075092	Multi-layer substrate	MURATA MANUFACTURING CO., LTD.
11075093	Assembly of a carrier and a plurality of electrical circuits fixed thereto, and method of making the same	CARDLAB APS
11075097	3D IC bump height metrology APC	--
11075102	Positioning device	SUSS MICROTEC LITHOGRAPHY GMBH
11075109	Radio frequency silicon on insulator structure with superior performance, stability, and manufacturability	--
11075112	Method of forming interconnection structure	--
11075113	Metal capping layer and methods thereof	--
11075116	Integrated antenna on interposer substrate	--
11075117	Die singulation and stacked device structures	XILINX, INC.
11075118	Semiconductor die singulation methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11075122	Semiconductor device and manufacturing method thereof	KIOXIA CORPORATION
11075129	Substrate processing carrier	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11075130	Package substrate having polymer-derived ceramic core	INTEL CORPORATION
11075131	Semiconductor package and method of forming the same	--
11075132	Integrated fan-out package, package-on-package structure, and manufacturing method thereof	--
11075133	Underfill structure for semiconductor packages and methods of forming the same	--
11075134	Semiconductor device with a portion including silicon and nitrogen and method of manufacturing	INFINEON TECHNOLOGIES AG
11075135	Semiconductor structure and method of forming a semiconductor structure	SEMICONDUCTOR MANUFACTURING (BEIJING) INTERNATIONAL CORPORATION
11075136	Heat transfer structures and methods for IC packages	--
11075137	High power module package structures	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11075138	Semiconductor package system	SAMSUNG ELECTRONICS CO., LTD.
11075139	Heat radiation structure, electronic device and manufacturing method of heat radiation structure	FUJITSU LIMITED
11075140	Heat conduction structure or semiconductor apparatus	TOYOTA JIDOSHA KABUSHIKI KAISHA
11075141	Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices	RAYTHEON COMPANY
11075142	Cooling apparatus for power semiconductor and a method of manufacturing the same	HYUNDAI MOTOR COMPANY
11075143	Cooling apparatus	SHOWA DENKO K.K.
11075144	Cooler and semiconductor module	FUJI ELECTRIC CO., LTD.
11075145	Semiconductor device including through die via and manufacturing method thereof	--
11075146	Microfeature workpieces having alloyed conductive structures, and associated methods	MICRON TECHNOLOGY, INC.
11075147	Stacked die semiconductor package	TEXAS INSTRUMENTS INCORPORATED
11075148	Stacked transistor assembly with dual middle mounting clips	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11075149	Redistribution substrate, method of manufacturing the same, and semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
11075150	Semiconductor package and method of manufacturing the same	--
11075151	Fan-out package with controllable standoff	--
11075152	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11075153	Electronic component-incorporating substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11075154	Semiconductor device and method of manufacturing semiconductor device	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11075155	Package structure and manufacturing method thereof	--
11075156	Substrate having electronic component embedded therein	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11075157	IC having trench-based metal-insulator-metal capacitor	TEXAS INSTRUMENTS INCORPORATED
11075158	MIM structure	--
11075159	Integrated fan-out packages and methods of forming the same	--
11075160	Semiconductor device and method for fabricating thereof	SAMSUNG ELECTRONICS CO., LTD.
11075161	Large via buffer	INTERNATIONAL BUSINESS MACHINES CORPORATION
11075162	Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics	--
11075163	Vertical NAND string multiple data line memory	MICRON TECHNOLOGY, INC.
11075164	Semiconductor device including a conductive feature over an active region	--
11075165	Methods and apparatus for forming dual metal interconnects	APPLIED MATERIALS, INC.
11075166	Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate	INTEL CORPORATION
11075167	Pillared cavity down MIS-SIP	DIALOG SEMICONDUCTOR (UK) LIMITED
11075168	InFO-POP structures with TIVs having cavities	--
11075169	Integrated-circuitry overlay alignment mark, a substrate comprising an overlay alignment mark, a method of forming an overlay alignment mark in the fabrication of integrated circuitry, and a method of determining overlay alignment in the fabrication of integrated circuitry	MICRON TECHNOLOGY, INC.
11075170	Semiconductor package with EMI shield and fabricating method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11075171	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11075172	Process for manufacturing a strained semiconductor device and corresponding strained semiconductor device	STMICROELECTRONICS S.R.L.
11075173	Semiconductor device and method of forming same	--
11075174	Semiconductor device	--
11075175	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11075176	Semiconductor device and method	--
11075177	Integrated circuit comprising a substrate equipped with a trap-rich region, and fabricating process	STMICROELECTRONICS (CROLLES 2) SAS
11075178	RF power amplifier pallet	AMPLEON NETHERLANDS B.V.
11075179	Semiconductor device and method of forming the same	--
11075180	Semiconductor device and method of manufacturing the semiconductor device	AOI ELECTRONICS CO., LTD.
11075181	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11075182	Semiconductor package and method of forming the same	--
11075183	Semiconductor chip and semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
11075184	Semiconductor package and method of fabricating semiconductor package	--
11075185	Semiconductor package with multi-level conductive clip for top side cooling	INFINEON TECHNOLOGIES AG
11075186	Semiconductor package	--
11075187	Semiconductor device and method of forming insulating layers around semiconductor die	SEMTECH CORPORATION
11075188	Package structure and assembly structure	--
11075189	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11075193	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11075194	IC with test structures and E-beam pads embedded within a contiguous standard cell area	PDF SOLUTIONS, INC.
11075203	Semiconductor structure	--
11075212	Semiconductor device and method of manufacturing	--
11075214	NOR memory cell with vertical floating gate	GREENLIANT IP, LLC
11075217	Vertical semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11075220	Semiconductor device	KIOXIA CORPORATION
11075223	Thin film transistor array panel with integrated gate driver including noise removal unit	SAMSUNG DISPLAY CO., LTD.
11075226	Display device	--
11075235	Image sensor mounting base, imaging device, and imaging module	KYOCERA CORPORATION
11075260	Substrate comprising recessed interconnects and a surface mounted passive component	QUALCOMM INCORPORATED
11075265	Trigate device with full silicided epi-less source/drain for high density access transistor applications	INTERNATIONAL BUSINESS MACHINES CORPORATION
11075279	Metal gate and contact plug design and method forming same	--
11075281	Additive core subtractive liner for metal cut etch processes	INTERNATIONAL BUSINESS MACHINES CORPORATION
11075293	Qubit-detector die assemblies	INTEL CORPORATION
11075294	Protective insulator for HFET devices	POWER INTEGRATIONS, INC.
11075303	Oxide semiconductor compound, semiconductor element provided with layer of oxide semiconductor compound, and laminated body	TOKYO INSTITUTE OF TECHNOLOGY
11075321	Semiconductor device	SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
11075330	Package structure and electronic device	--
11075335	Techniques for MRAM MTJ top electrode connection	--
11075439	Electronic device and manufacturing method thereof	--
11075499	Heat sink comprising synthetic diamond material	ELEMENT SIX TECHNOLOGIES LIMITED
11075635	Display device and manufacturing method of same	--
11076249	Electronic device and control method thereof	SAMSUNG ELECTRONICS CO., LTD.
11076477	Cooling and compression clamp for short lead power devices	MKS INSTRUMENTS, INC.
11076478	Electronic assemblies having embedded passive heat pipes and associated method	EAGLE TECHNOLOGY, LLC
11076488	Board having electronic component embedded therein	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11076502	Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates	JUNIPER NETWORKS, INC.
11076503	Thermally conductive insert element for electronic unit	APTIV TECHNOLOGIES LIMITED
11076513	Circuit module	TDK CORPORATION
11077647	Thermally conductive silicone rubber composite sheet	SHIN-ETSU CHEMICAL CO., LTD.
11078075	Packaging method and associated packaging structure	--
11078112	Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same	CORNING INCORPORATED
11078894	Microfluidic fan	CHILLWIND TECHNOLOGIES AB
11079270	Optical sensor and apparatus comprising an optical sensor having a photodetector and a semiconductor guard ring are dimensioned so that a fill factor of each pixel is less than or equal to 50%	STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
11079540	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11079997	Display apparatus and methods	NANLUMENS ACQUISITION, INC.
11080454	Integrated circuit, system, and method of forming the same	--
11080455	Layout design of integrated circuit with through-substrate via	--
11081147	Pseudo-cryogenic semiconductor device having pseudo-cryogenic temperature sensor and voltage supplier and pseudo-cryogenic semiconductor stack	SK HYNIX INC.
11081173	Via formation for cross-point memory	MICRON TECHNOLOGY, INC.
11081185	Non-volatile memory array driven from both sides for performance improvement	SANDISK TECHNOLOGIES LLC
11081186	Non-volatile memory device and erasing method of the same	SAMSUNG ELECTRONICS CO., LTD.
11081271	Element for protecting circuit	MODA-INNOCHIPS CO., LTD.
11081346	Semiconductor structure having a group iii-v semiconductor layer comprising a hexagonal mesh crystalline structure	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11081352	Method (and related apparatus) that reduces cycle time for forming large field integrated circuits	--
11081366	MCM package isolation through leadframe design and package saw process	TEXAS INSTRUMENTS INCORPORATED
11081367	Support and method for producing semiconductor device-mounting substrate using the same	MITSUBISHI GAS CHEMICAL COMPANY, INC.
11081368	Method of dicing wiring substrate, and packaging substrate	TOPPAN PRINTING CO., LTD.
11081369	Package structure and manufacturing method thereof	--
11081371	Chip package process	VIA ALLIANCE SEMICONDUCTOR CO., LTD.
11081372	Package system for integrated circuits	--
11081384	Method for stabilizing a semiconductor arrangement	INFINEON TECHNOLOGIES AG
11081388	Forming barrierless contact	INTERNATIONAL BUSINESS MACHINES CORPORATION
11081390	Multi-pass plating process with intermediate rinse and dry	TEXAS INSTRUMENTS INCORPORATED
11081391	Wafer level dicing method and semiconductor device	--
11081392	Dicing method for stacked semiconductor devices	--
11081403	Methods of forming contact features in field-effect transistors	--
11081406	Via integrity and board level reliability testing	TEXAS INSTRUMENTS INCORPORATED
11081407	Methods for assessing semiconductor structures	--
11081411	Semiconductor structure	X-FAB SEMICONDUCTOR FOUNDRIES GMBH
11081412	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
11081413	Semiconductor package with inner and outer cavities	--
11081414	Power semiconductor module arrangement	INFINEON TECHNOLOGIES AG
11081415	Method for manufacturing electronic package	--
11081416	Configuring a sealing structure sealing a component embedded in a component carrier for reducing mechanical stress	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11081417	Manufacturing a package using plateable encapsulant	INFINEON TECHNOLOGIES AG
11081419	Semiconductor package and a method of manufacturing the same	MAGNACHIP SEMICONDUCTOR, LTD.
11081420	Substrate structure and semiconductor package structure	--
11081421	IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chips	--
11081422	Self-healing PDMS encapsulation and repair of power modules	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11081423	Power distribution by a working fluid contained in a conduit	THE BOEING COMPANY
11081424	Micro-fluidic channels having various critical dimensions	INTERNATIONAL BUSINESS MACHINES CORPORATION
11081425	Semiconductor packages	SAMSUNG ELECTRONICS CO., LTD.
11081426	3D IC power grid	--
11081427	Semiconductor device with through silicon via structure	--
11081428	Electronic device with three dimensional thermal pad	TEXAS INSTRUMENTS INCORPORATED
11081429	Finger pad leadframe	TEXAS INSTRUMENTS INCORPORATED
11081430	Multi-die-package and method	INFINEON TECHNOLOGIES AUSTRIA AG
11081431	Circuit device	AUTONETWORKS TECHNOLOGIES, LTD.
11081432	Semiconductor device with semiconductor element and electrodes on different surfaces	ROHM CO., LTD.
11081433	Semiconductor device	ROHM CO., LTD.
11081434	Package substrates with magnetic build-up layers	INTEL CORPORATION
11081435	Package substrate and flip-chip package circuit including the same	--
11081436	Component carrier with integrated strain gauge	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11081437	Imaging element mounting board, producing method of imaging element mounting board, and mounting board assembly	NITTO DENKO CORPORATION
11081438	Method of manufacturing semiconductor device	RENESAS ELECTRONICS CORPORATION
11081439	Integrated circuit and electronic circuit comprising the same	KABUSHIKI KAISHA TOSHIBA
11081440	Interposer and semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
11081441	Chip on film and display device	TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11081442	Low cost metallization during fabrication of an integrated circuit (IC)	SKYWORKS SOLUTIONS, INC.
11081443	Multi-tier three-dimensional memory device containing dielectric well structures for contact via structures and methods of forming the same	SANDISK TECHNOLOGIES LLC
11081444	Integrated circuit with guard ring	--
11081445	Semiconductor device comprising air gaps having different configurations	--
11081446	Semiconductor device	SK HYNIX INC.
11081447	Graphene-assisted low-resistance interconnect structures and methods of formation thereof	--
11081448	Embedded die microelectronic device with molded component	INTEL CORPORATION
11081449	Semiconductor device and method for manufacturing the same and wireless communication apparatus	MITSUBISHI ELECTRIC CORPORATION
11081450	Radiation shield around a component on a substrate	INTEL CORPORATION
11081451	Die stack with reduced warpage	INTEL CORPORATION
11081452	Field effect transistor and semiconductor device	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
11081453	Semiconductor package structure with antenna	--
11081454	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
11081455	Semiconductor device with bond pad extensions formed on molded appendage	INFINEON TECHNOLOGIES AUSTRIA AG
11081456	Textured bond pads	TEXAS INSTRUMENTS INCORPORATED
11081457	Semiconductor package and methods of manufacturing a semiconductor package	INFINEON TECHNOLOGIES AUSTRIA AG
11081458	Methods and apparatuses for reflowing conductive elements of semiconductor devices	MICRON TECHNOLOGY, INC.
11081459	Semiconductor device	--
11081460	Methods and systems for manufacturing pillar structures on semiconductor devices	MICRON TECHNOLOGY, INC.
11081461	Packaging process and packaging structure	DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
11081462	Method for manufacturing a bonding structure	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11081463	Bonding method with electron-stimulated desorption	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11081464	Method for producing an integral join and automatic placement machine	INFINEON TECHNOLOGIES AG
11081465	Method for producing a stable sandwich arrangement of two components with solder situated therebetween	HERAEUS DEUTSCHLAND GMBH & CO. KG
11081466	Method for joining a micorelectronic chip to a wire element	PRIMO1D
11081467	Apparatuses and methods for arranging through-silicon vias and pads in a semiconductor device	MICRON TECHNOLOGY, INC.
11081468	Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses	MICRON TECHNOLOGY, INC.
11081469	Three-dimensional integrated circuit test and improved thermal dissipation	ARM LIMITED
11081470	Semiconductor device and method of manufacturing thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11081472	Stacked die multichip module package	TEXAS INSTRUMENTS INCORPORATED
11081473	Semiconductor device package and method of manufacturing the same	--
11081475	Integrated circuit structure and method for reducing polymer layer delamination	--
11081476	IC with test structures and e-beam pads embedded within a contiguous standard cell area	PDF SOLUTIONS, INC.
11081477	IC with test structures and e-beam pads embedded within a contiguous standard cell area	PDF SOLUTIONS, INC.
11081478	Interconnect structure having a fluorocarbon layer	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11081479	Integrated circuit layout with asymmetric metal lines	--
11081480	Semiconductor structure, capacitor structure thereof and manufacturing method of the same	--
11081491	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
11081492	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11081499	Nonvolatile memory device and method for fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11081503	Array substrate and method of mounting integrated circuit using the same	SAMSUNG DISPLAY CO., LTD.
11081504	Display device	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11081515	Semiconducting device, and appliance having the semiconducting device	CANON KABUSHIKI KAISHA
11081518	Semiconductor packaging method and semiconductor device based on molding process	NINGBO SUNNY OPOTECH CO., LTD.
11081526	Nonvolatile memory device	KIOXIA CORPORATION
11081541	Method of providing partial electrical shielding	INTEL CORPORATION
11081542	Buried MIM capacitor structure with landing pads	INTERNATIONAL BUSINESS MACHINES CORPORATION
11081543	Multi-spheroid BEOL capacitor	INTERNATIONAL BUSINESS MACHINES CORPORATION
11081551	Method for producing a graphene-based sensor	INFINEON TECHNOLOGIES AG
11081557	Memory and method for forming the same	SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
11081565	Memory modules and memory packages including graphene layers for thermal management	MICRON TECHNOLOGY, INC.
11081572	Integrated circuit heat dissipation using nanostructures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11081573	Semiconductor element	MURATA MANUFACTURING CO., LTD.
11081585	Via structure with low resistivity and method for forming the same	--
11081625	Packaged LEDs with phosphor films, and associated systems and methods	MICRON TECHNOLOGY, INC.
11081632	Micro-LED chips and methods for manufacturing the same and display devices	CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
11081669	Encapsulation film	LG CHEM, LTD.
11081768	Fabricating an RF filter on a semiconductor package using selective seeding	INTEL CORPORATION
11081783	Integrated antenna using through silicon vias	MICRON TECHNOLOGY, INC.
11081804	Antenna-integrated type communication module and manufacturing method for the same	MURATA MANUFACTURING CO., LTD.
11081810	TFT substrate and scanned antenna having TFT substrate	SHARP KABUSHIKI KAISHA
11081881	Full swing positive to negative MOSFET supply clamp for electrostatic discharge (ESD) protection	STMICROELECTRONICS INTERNATIONAL N.V.
11081970	Assembly of bus bars forming a casing and heat dissipator for an electronic power device	INSTITUT VEDECOM
11082028	3D-printed protective shell structures with support columns for stress sensitive circuits	TEXAS INSTRUMENTS INCORPORATED
11082040	Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals	PSEMI CORPORATION
11082202	Fault injection attack detection in integrated circuits	ARM LIMITED
11083077	Structure for delivering power	RAMBUS INC.
11083086	Printed wiring board and method for manufacturing printed wiring board	IBIDEN CO., LTD.
11083107	Electronic device and power module thereof	DELTA ELECTRONICS (SHANGHAI) CO., LTD.
11083117	Modular medical article storage container with tortuous path seal	MEPS REAL-TIME, INC.
11084521	Electronic control unit and electric power steering device using the same	DENSO CORPORATION
11084713	Bypass structure	--
11084717	Through-substrate conductor support	TEXAS INSTRUMENTS INCORPORATED
11084928	Transparent siloxane encapsulant and adhesive	INKRON OY
11084941	Underfill material, underfill film, and method for manufacturing semiconductor device using same	DEXERIALS CORPORATION
11085376	Integration of a phase-change material for limiting the temperature of fuel from an electronic module	SAFRAN HELICOPTER ENGINES
11085672	Self-heating thermal interface material	INTERNATIONAL BUSINESS MACHINES CORPORATION
11085702	Heat sink	MITSUBISHI ELECTRIC CORPORATION
11085712	Heat-dissipating sheet	SEKISUI POLYMATECH CO., LTD.
11085977	Method and apparatus for integrating current sensors in a power semiconductor module	WISCONSIN ALUMNI RESEARCH FOUNDATION
11087030	Side-channel attack mitigation for secure devices with embedded sensors	SILICON LABORATORIES INC.
11087055	Method of screening materials using forward conducting modes	SAMSUNG ELECTRONICS CO., LTD.
11087058	Prevention of front-side probing attacks	UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.
11087804	Memory device with configurable input/output interface	MICRON TECHNOLOGY, INC.
11087927	Substrates employing surface-area amplification, for use in fabricating capacitive elements and other devices	MURATA MANUFACTURING CO., LTD.
11087970	Bonded wafer, a method of manufacturing the same, and a method of forming through hole	CANON KABUSHIKI KAISHA
11087991	Integrated structures, capacitors and methods of forming capacitors	MICRON TECHNOLOGY, INC.
11087994	Via connection to a partially filled trench	--
11087995	3D semiconductor device and structure	MONOLITHIC 3D INC.
11088000	Wafer based corrosion and time dependent chemical effects	APPLIED MATERIALS, INC.
11088016	Method for locating devices	SOITEC
11088017	Stair step structures including insulative materials, and related devices	MICRON TECHNOLOGY, INC.
11088020	Structure and formation method of interconnection structure of semiconductor device	--
11088021	Interconnect structure and method of forming the same	--
11088023	Method of forming a semiconductor structure	--
11088025	Contact structure for semiconductor device	--
11088030	Semiconductor device and a method for fabricating the same	--
11088037	Semiconductor device having probe pads and seal ring	--
11088038	Semiconductor package including test pad	SAMSUNG ELECTRONICS CO., LTD.
11088041	Semiconductor packages with shortened talking path	--
11088042	Semiconductor device and production method therefor	HITACHI METALS, LTD.
11088043	Semiconductor device with recessed end surface of lead	ROHM CO, LTD.
11088044	Compound semiconductor device and fabrication method therefor, and amplifier	FUJITSU LIMITED
11088045	Semiconductor device having a cooling body with a groove	MITSUBISHI ELECTRIC CORPORATION
11088046	Semiconductor device package with clip interconnect and dual side cooling	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11088047	Ceramic package opening, heat sink, vias coupled to conductive pad	TEXAS INSTRUMENTS INCORPORATED
11088048	Semiconductor structure	--
11088049	Heat sink formed from a high pipe density silicon carbide substrate	NLIGHT INC.
11088050	3D semiconductor device with isolation layers	MONOLITHIC 3D INC.
11088051	Test socket assembly and related methods	XCERRA CORPORATION
11088052	Integrated circuit package electronic device including pillar contacts and electrical terminations	TEXAS INSTRUMENTS INCORPORATED
11088053	Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same	GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD.
11088054	Lead frame and method for manufacturing the same	--
11088055	Package with dies mounted on opposing surfaces of a leadframe	TEXAS INSTRUMENTS INCORPORATED
11088056	Leadframe and leadframe package	--
11088057	Semiconductor package structure and method for manufacturing the same	--
11088058	Method for forming semiconductor package using carbon nano material in molding compound	--
11088059	Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same	--
11088060	Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package	SAMSUNG ELECTRONICS CO., LTD.
11088061	Substrate, semiconductor device package and method of manufacturing the same	--
11088062	Method to enable 30 microns pitch EMIB or below	INTEL CORPORATION
11088063	Structures with deformable conductors	LIQUID WIRE INC.
11088064	Fine pitch copper pillar package and method	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11088065	Semiconductor device	ROHM CO., LTD.
11088066	Multilayer structure and related method of manufacture for electronics	TACTOTEK OY
11088067	Semiconductor device and layout design thereof	--
11088068	Semiconductor packages and methods of manufacturing the same	--
11088069	Semiconductor package and semiconductor device	--
11088070	Method of forming a multi-level interconnect structure in a semiconductor device	IMEC VZW
11088071	Tank circuit structure and method of making the same	--
11088072	Semiconductor device including a fuse and a transistor coupled to the fuse	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11088073	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11088074	Semiconductor device and method for manufacturing same	MITSUBISHI ELECTRIC CORPORATION
11088075	Layout structures with multiple fingers of multiple lengths	GLOBALFOUNDRIES U.S. INC.
11088076	Bonding pads embedded in a dielectric diffusion barrier and having recessed metallic liners	SANDISK TECHNOLOGIES LLC
11088077	Layer structure including diffusion barrier layer and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11088078	Semiconductor device and method for manufacturing the same	--
11088079	Package structure having line connected via portions	--
11088080	Chip package structure using silicon interposer as interconnection bridge	--
11088081	Semiconductor package having a connection structure with tapering connection via layers	SAMSUNG ELECTRONICS CO., LTD.
11088082	Semiconductor device with partial EMI shielding and method of making the same	STATS CHIPPAC PTE. LTD.
11088083	DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure	--
11088084	Electromagnetic shielding metal-insulator-metal capacitor structure	--
11088085	Layout to reduce noise in semiconductor devices	--
11088086	Chip package structure and method for forming the same	--
11088087	Micro module with a support structure	STMICROELECTRONICS, INC.
11088088	Microelectronic devices with polysilicon fill material between opposing staircase structures, and related devices, systems, and methods	MICRON TECHNOLOGY, INC.
11088089	Package substrate	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11088090	Package comprising a substrate that includes a stress buffer layer	QUALCOMM INCORPORATED
11088091	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11088092	Via rail solution for high power electromigration	--
11088093	Micro-component anti-stiction structures	X-CELEPRINT LIMITED
11088094	Air channel formation in packaging process	--
11088095	Package structure	--
11088096	Transistor outline housing with high return loss	SCHOTT AG
11088097	Effective medium semiconductor cavities for RF applications	INTERNATIONAL BUSINESS MACHINES CORPORATION
11088098	Integrated structures with antenna elements and IC chips employing edge contact connections	VIASAT, INC.
11088099	Multi-metal contact structure in microelectronic component	INVENSAS BONDING TECHNOLOGIES, INC.
11088100	Semiconductor package and manufacturing method thereof	--
11088101	Semiconductor package structure and method of manufacturing the same	--
11088102	Bonded structures for package and substrate	--
11088103	First layer interconnect first on carrier approach for EMIB patch	INTEL CORPORATION
11088104	Process for forming an electric heater	HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC
11088105	Semiconductor device and method for fabricating a semiconductor device	INFINEON TECHNOLOGIES AG
11088106	Stack of electrical components and method of producing the same	TDK CORPORATION
11088107	Vaccum deposition system and method thereof	INTLVAC INC.
11088108	Chip package structure including ring-like structure and method for forming the same	--
11088109	Packages with multi-thermal interface materials and methods of fabricating the same	--
11088110	Semiconductor device, circuit board structure and manufacturing method thereof	--
11088111	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11088112	Radio frequency system-in-package with stacked clocking crystal	SKYWORKS SOLUTIONS, INC.
11088113	Semiconductor storage device and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
11088114	High density pillar interconnect conversion with stack to substrate connection	MICRON TECHNOLOGY, INC.
11088115	Interposer and semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
11088116	Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same	SANDISK TECHNOLOGIES LLC
11088117	Semiconductor package including stacked semiconductor chips	SK HYNIX INC.
11088118	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
11088121	Printed LED arrays with large-scale uniformity	X DISPLAY COMPANY TECHNOLOGY LIMITED
11088122	Method and device for manufacturing flexible light emission device	SAKAI DISPLAY PRODUCTS CORPORATION
11088123	Package system having laterally offset and ovelapping chip packages	MARVELL ISRAEL (M.I.S.L) LTD.
11088124	Package and manufacturing method thereof	--
11088125	IPD modules with flexible connection scheme in packaging	--
11088129	Display apparatus	--
11088130	3D semiconductor device and structure	MONOLITHIC 3D INC.
11088131	Semiconductor device that uses bonding layer to join semiconductor substrates together	--
11088132	Semiconductor device for enhancing electrostatic discharge protection and layout structure thereof	CSMC TECHNOLOGIES FAB1 CO., LTD.
11088134	Electrostatic discharge device and split multi rail network with symmetrical layout design technique	DIALOG SEMICONDUCTOR (UK) LIMITED
11088135	Electrostatic discharge protection apparatus and integrated passive device with capacitors	--
11088138	Semiconductor device for testing characteristics of transistors and method for testing semiconductor device	THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)
11088141	Semiconductor device and method for fabricating the same	--
11088143	Semiconductor and manufacturing method of the same	SAMSUNG ELECTRONICS CO., LTD.
11088157	Three-dimensional semiconductor device having stepped gate electrodes	SAMSUNG ELECTRONICS CO., LTD.
11088161	Three-dimensional semiconductor memory device and method of detecting electrical failure thereof	SAMSUNG ELECTRONICS CO., LTD.
11088163	Semiconductor devices including upper and lower selectors	SAMSUNG ELECTRONICS CO., LTD.
11088164	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11088165	Integrated assemblies, and methods of forming integrated assemblies	MICRON TECHNOLOGY, INC.
11088167	Transistor, three dimensional memory device including such transistor and method of fabricating such memory device	--
11088199	Semiconductor device	--
11088239	Cap structure for trench capacitors	--
11088250	Fin field effect transistor (FinFET) device structure with dual spacers and method for forming the same	--
11088260	On-chip integrated temperature protection device based on gel electrolyte	INTERNATIONAL BUSINESS MACHINES CORPORATION
11088261	Trench contact structures for advanced integrated circuit structure fabrication	INTEL CORPORATION
11088265	Semiconductor structure having a repaired dielectric layer	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11088268	Methods and devices for fabricating and assembling printable semiconductor elements	THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
11088270	Microwave transistor with a patterned gate structure and manufacturing method thereof	XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD. .
11088284	Display apparatus and method of manufacturing the same	SAMSUNG DISPLAY CO., LTD.
11088298	Light-emitting device	--
11088307	Semiconductor light-emitting device	ROHM CO., LTD.
11088308	Junction structure	TDK CORPORATION
11088310	Through-silicon-via fabrication in planar quantum devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
11088311	Three-dimensional integration for qubits on multiple height crystalline dielectric	INTERNATIONAL BUSINESS MACHINES CORPORATION
11088317	Structures and methods for shielding magnetically sensitive components	EVERSPIN TECHNOLOGIES, INC.
11088326	Substrate for use in manufacturing display device and method for forming element on substrate	SAMSUNG DISPLAY CO., LTD.
11089671	Integrated circuit / printed circuit board assembly and method of manufacture	ERIDAN COMMUNICATIONS, INC.
11089673	Wall for isolation enhancement	RAYTHEON COMPANY
11089682	Flexible circuit board, chip package including the same, and electronic device including the chip package	LG INNOTEK CO., LTD.
11089685	Stackable via package and method	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11090779	Method and tool to improve efficiency and effectiveness of waterjet de-burr process	TEXAS INSTRUMENTS INCORPORATED
11091366	Nickel lanthanide alloys for MEMS packaging applications	TEXAS INSTRUMENTS INCORPORATED
11091394	Composition for producing an aqueous coating mass	HERAEUS DEUTSCHLAND GMBH & CO. KG
11091627	Epoxy resin composition	SUMITOMO SEIKA CHEMICALS CO., LTD.
11091630	Resin composition for semiconductor package, prepreg, and metal clad laminate using the same	LG CHEM, LTD.
11092355	System and method to redirect and/or reduce airflow using actuators	INTERNATIONAL BUSINESS MACHINES CORPORATION
11092383	Heat dissipation device	--
11092391	Enhanced boiling with selective placement of nucleation sites	ROCHESTER INSTITUTE OF TECHNOLOGY
11092671	Laser diode optical frequency modulation linearization algorithm	GM GLOBAL TECHNOLOGY OPERATIONS LLC
11092763	Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture	INTERNATIONAL BUSINESS MACHINES CORPORATION
11092860	Display panel and display device	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11093825	Method of forming a semiconductor device	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11094387	Multi-fuse memory cell circuit and method	--
11094388	Anti-fuse device and program method using the same	--
11094528	Surface treatment of substrates using passivation layers	BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD.
11094535	Selective passivation and selective deposition	ASM IP HOLDING B.V.
11094547	Method for producing wiring structure	HAMAMATSU PHOTONICS K.K.
11094553	Semiconductor device and manufacturing method	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11094555	CMP slurry and CMP method	--
11094559	Method of fastening a semiconductor chip on a lead frame, and electronic component	OSRAM OLED GMBH
11094561	Semiconductor package structure	--
11094562	Semiconductor device and method of manufacture	NEXPERIA B.V.
11094567	Mounting apparatus and method for manufacturing semiconductor device	SHINKAWA LTD.
11094576	Methods for producing a 3D semiconductor memory device and structure	MONOLITHIC 3D INC.
11094580	Structure and method to fabricate fully aligned via with reduced contact resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11094581	IC structure with air gaps and protective layer and method for manufacturing the same	THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
11094583	Method of forming a device having a doping layer and device formed	--
11094585	Methods of forming a conductive contact structure to a top electrode of an embedded memory device on an IC product and a corresponding IC product	GLOBALFOUNDRIES U.S. INC.
11094586	Semiconductor device including interconnections having different structures and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11094587	Use of noble metals in the formation of conductive connectors	INTEL CORPORATION
11094588	Interconnection structure of selective deposition process	APPLIED MATERIALS, INC.
11094590	Structurally stable self-aligned subtractive vias	INTERNATIONAL BUSINESS MACHINES CORPORATION
11094591	Semiconductor structure and fabrication method thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11094593	Semiconductor device including contact structure	SAMSUNG ELECTRONICS CO., LTD.
11094594	Semiconductor structure with buried power rail, integrated circuit and method for manufacturing the semiconductor structure	--
11094596	Semiconductor structure	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11094601	Semiconductor element and method for producing the same	ROHM CO., LTD.
11094602	Semiconductor device package	--
11094603	Power semiconductor device, rotating electric machine including same, and method of manufacturing power semiconductor device	DENSO CORPORATION
11094604	System and method to enhance solder joint reliability	WESTERN DIGITAL TECHNOLOGIES, INC.
11094605	Systems and methods for supporting a component	BALL AEROSPACE & TECHNOLOGIES CORP.
11094606	Bonded body, insulated circuit board with heat sink, and heat sink	MITSUBISHI MATERIALS CORPORATION
11094607	Heatsink retainer assembly	RADIAN THERMAL PRODUCTS, INC.
11094608	Heat dissipation structure including stacked chips surrounded by thermal interface material rings	--
11094609	Thermal dissipation structure for integrated circuits comprising thermal dissipation trench	--
11094610	Semiconductor power module	MITSUBISHI ELECTRIC CORPORATION
11094611	Liquid cooled heat dissipation device	CHAMP TECH OPTICAL (FOSHAN) CORPORATION
11094612	Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11094613	Semiconductor structure and manufacturing method thereof	--
11094614	Semiconductor chip contact structure, device assembly, and method of fabrication	LITTELFUSE, INC.
11094615	Semiconductor apparatus including leads and bonding wires	SUMITOMO ELECTRIC INDUSTRIES, LTD.
11094616	Multi-pitch leads	TEXAS INSTRUMENTS INCORPORATED
11094617	Semiconductor package including low side field-effect transistors and high side field-effect transistors and method of making the same	ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD.
11094618	Power switching modular element and dismountable assembly of a plurality of modular elements	INSTITUT VEDECOM
11094619	Package with component connected with carrier via spacer particles	INFINEON TECHNOLOGIES AG
11094620	Integrated capacitor with extended head bump bond pillar	TEXAS INSTRUMENTS INCORPORATED
11094621	Display panel	--
11094622	Packaged semiconductor devices and methods of packaging thereof	--
11094623	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11094624	Semiconductor device having capacitor	SAMSUNG ELECTRONICS CO., LTD.
11094625	Semiconductor package with improved interposer structure	--
11094626	Methods of forming interconnect structures in semiconductor fabrication	--
11094627	Methods used in forming a memory array comprising strings of memory cells	MICRON TECHNOLOGY, INC.
11094628	Techniques for making integrated inductors and related semiconductor devices, electronic systems, and methods	MICROCHIP TECHNOLOGY INCORPORATED
11094629	3D power device and system	IMEC VZW
11094630	Formation of semiconductor devices including electrically programmable fuses	INTERNATIONAL BUSINESS MACHINES CORPORATION
11094631	Graphene layer for reduced contact resistance	--
11094632	Semiconductor device with air gap and method for preparing the same	--
11094633	Bridge die design for high bandwidth memory interface	INTEL CORPORATION
11094634	Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof	--
11094635	Package structure and method for forming the same	--
11094636	Semiconductor package and method of manufacturing the semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11094637	Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers	INTERNATIONAL BUSINESS MACHINES CORPORATION
11094638	Semiconductor device	FUJI ELECTRIC CO., LTD.
11094639	Semiconductor package	--
11094640	Package module	SAMSUNG ELECTRONICS CO., LTD.
11094641	Fan-out package having a main die and a dummy die	--
11094642	Package structure	--
11094643	Determining overlay of features of a memory array	MICRON TECHNOLOGY, INC.
11094644	Integrated circuit with scribe lane patterns for defect reduction	TEXAS INSTRUMENTS INCORPORATED
11094645	Semiconductor device and method of manufacturing a semiconductor device	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11094646	Methods of manufacturing an integrated circuit having stress tuning layer	--
11094647	Methods and apparatus to eliminate wafer bow for CVD and patterning HVM systems	APPLIED MATERIALS, INC.
11094648	Power module	DENKA COMPANY LIMITED
11094649	Semiconductor package structure and method for manufacturing the same	--
11094650	Semiconductor arrangement and method of making	--
11094652	Configurable radio transceiver and method thereof	--
11094653	Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same	SANDISK TECHNOLOGIES LLC
11094654	Package structure and method of manufacturing the same	--
11094655	Semiconductor structure and method for forming the same	--
11094656	Packaged semiconductor device with electroplated pillars	TEXAS INSTRUMENTS INCORPORATED
11094657	Multilayer pillar for reduced stress interconnect and method of making same	INTERNATIONAL BUSINESS MACHINES CORPORATION
11094658	Substrate, electronic substrate, and method for producing electronic substrate	LENOVO (SINGAPORE) PTE. LTD.
11094659	Microelectronic device with pillars having flared ends	TEXAS INSTRUMENTS INCORPORATED
11094660	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11094661	Bonded structure and method of manufacturing the same	KABUSHIKI KAISHA TOSHIBA
11094662	Semiconductor assembly and method of manufacturing the same	--
11094663	Method for transient liquid-phase bonding between metal materials using a magnetic force	RESEARCH AND BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
11094664	Semiconductor device and method of manufacturing semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11094665	Chip package structure	--
11094666	Bonding wire, semiconductor package including the same, and wire bonding method	SAMSUNG ELECTRONICS CO., LTD.
11094667	Bonding apparatus, bonding system, bonding method, and recording medium	TOKYO ELECTRON LIMITED
11094668	Solderless interconnect for semiconductor device assembly	MICRON TECHNOLOGY, INC.
11094669	Wafer level molded PPGA (pad post grid array) for low cost package	DIALOG SEMICONDUCTOR B.V.
11094670	Semiconductor device assemblies including multiple shingled stacks of semiconductor dies	MICRON TECHNOLOGY, INC.
11094671	Package with thinned substrate	--
11094672	Composite IC chips including a chiplet embedded within metallization layers of a host IC chip	INTEL CORPORATION
11094673	Stacked die package with curved spacer	WESTERN DIGITAL TECHNOLOGIES, INC.
11094674	Memory scaling semiconductor device	SANDISK TECHNOLOGIES LLC
11094678	Light emitting device having insulation pattern	SAMSUNG DISPLAY CO., LTD.
11094680	Packages and methods of forming packages	--
11094682	Package structure and method of fabricating the same	--
11094683	Bonded nanofluidic device chip stacks	INTERNATIONAL BUSINESS MACHINES CORPORATION
11094684	Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography	MICRON TECHNOLOGY, INC.
11094685	Static random access memory device	--
11094693	Layout method	SAMSUNG ELECTRONICS CO., LTD.
11094697	Vertical two-transistor single capacitor memory cells and memory arrays	MICRON TECHNOLOGY, INC.
11094701	Layout structure of storage cell and method thereof	--
11094702	One-time programmable memory device including anti-fuse element and manufacturing method thereof	--
11094704	Method of forming a three-dimensional memory device and a driver circuit on opposite sides of a substrate	SANDISK TECHNOLOGIES LLC
11094708	Vertical-type memory device	SAMSUNG ELECTRONICS CO., LTD.
11094712	Three-dimensional memory device with support structures in slit structures and method for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11094713	Three-dimensional memory device with source contacts connected by an adhesion layer and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11094714	Three-dimensional memory devices and fabricating methods thereof	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11094715	Three-dimensional memory device including different height memory stack structures and methods of making the same	SANDISK TECHNOLOGIES LLC
11094718	TFT array substrate	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11094722	Image sensor package and imaging apparatus	SONY CORPORATION
11094729	Semiconductor device and method of manufacturing the same, and electronic apparatus	SONY CORPORATION
11094730	Solid-state imaging device having through electrode provided therein and electronic apparatus incorporating the solid-state imaging device	SONY CORPORATION
11094744	Interconnect landing method for RRAM technology	--
11094776	Structure and formation method of semiconductor device with magnetic element covered by polymer material	--
11094853	Passive micro light-emitting diode matrix device with uniform luminance	--
11094854	Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body	NICHIA CORPORATION
11094858	Tape, encapsulating process and optical device	--
11094865	Semiconductor device and semiconductor device package	SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
11094866	Method for producing an optoelectronic component, and optoelectronic component	OSRAM OLED GMBH
11094868	Method for producing an illumination device and illumination device	OSRAM OLED GMBH
11094882	Method of manufacturing memory device	SAMSUNG ELECTRONICS CO., LTD.
11094899	Method for manufacturing field effect transistor and method for manufacturing wireless communication device	TORAY INDUSTRIES, INC.
11094911	Organic light emitting diode display panel and packaging method thereof	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11095037	Antenna module	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11095280	Efficient IGBT switching	EAGLE HARBOR TECHNOLOGIES, INC.
11095318	Transceiver using active device array and antenna module including the same	SAMSUNG ELECTRONICS CO., LTD.
11096269	Printed circuit board assembly	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11096283	Substrate on substrate structure and electronic device comprising the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11096284	Compact semiconductor chip system and method	INTEL CORPORATION
11096285	Electronic circuit substrate	HITACHI AUTOMOTIVE SYSTEMS, LTD.
11096287	Method of manufacturing packaged board	DISCO CORPORATION
11096313	Heat sink, heat sink arrangement and module for liquid immersion cooling	ICEOTOPE GROUP LIMITED
11096319	Method of manufacturing electronic device using large-scale transferring method	EWHA UNIVERSITY-INDUSTRY COLLABORATION FOUNDATION
11097306	Support for bonding a workpiece and method thereof	MICRO MATERIALS INC.
11097521	OLED panel bottom protection film, and organic light-emitting display device comprising same	SAMSUNG DISPLAY CO., LTD.
11097942	Through silicon via (TSV) formation in integrated circuits	ANALOG DEVICES, INC.
11098170	Film and method for its production	AGC INC.
11098414	Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method	EBARA CORPORATION
11098959	Electronic device having heat collection/diffusion structure	SAMSUNG ELECTRONICS CO., LTD.
11098960	Cooling devices including a variable angle contact surface and methods for cooling heat-generating devices with a cooling device	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11099230	Electromigration test structures for void localization	INTERNATIONAL BUSINESS MACHINES CORPORATION
11099393	Surface emitting light source with lateral variant refractive index profile	FACEBOOK TECHNOLOGIES, LLC
11099748	Fault tolerant memory card	UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA
11100029	Interface bridge between integrated circuit die	INTEL CORPORATION
11101002	Semiconductor memory device including cache latch circuit	SK HYNIX INC.
11101016	Test modes for a semiconductor memory device with stacked memory chips using a chip identification	SK HYNIX INC.
11101140	Semiconductor device and method of manufacture	--
11101144	Semiconductor device and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11101145	Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material	--
11101153	Parameter-stable misregistration measurement amelioration in semiconductor devices	KLA CORPORATION
11101160	Device packaging using a recyclable carrier substrate	SKYWORKS SOLUTIONS, INC.
11101168	Profile of deep trench isolation structure for isolation of high-voltage devices	--
11101169	Interconnect structures with airgaps arranged between capped interconnects	GLOBALFOUNDRIES U.S. INC.
11101170	Dual airgap structure	GLOBALFOUNDRIES U.S. INC.
11101172	Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom	INTERNATIONAL BUSINESS MACHINES CORPORATION
11101175	Tall trenches for via chamferless and self forming barrier	INTERNATIONAL BUSINESS MACHINES CORPORATION
11101176	Method of fabricating redistribution circuit structure	--
11101177	Semiconductor structure and method for forming the same	--
11101186	Substrate structure having pad portions	--
11101188	Cap for package of integrated circuit	STMICROELECTRONICS (GRENOBLE 2) SAS
11101189	Semiconductor device package and method of manufacturing the same	--
11101190	Package and printed circuit board attachment	--
11101191	Laminated circuitry cooling for inter-chip bridges	INTERNATIONAL BUSINESS MACHINES CORPORATION
11101192	Wafer level embedded heat spreader	--
11101193	Power electronics modules including integrated jet cooling	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11101194	Heat sinks and methods for fabricating a heat sink	AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
11101195	Package structure and method for forming the same	--
11101196	Semiconductor device including through substrate vias and method of manufacturing the semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11101197	Leadframe systems and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11101198	Semiconductor die package including a one-body clip	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11101199	Power semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11101200	Surface-mount integrated circuit package with coated surfaces for improved solder connection	MICROCHIP TECHNOLOGY INCORPORATED
11101201	Semiconductor package having leads with a negative standoff	INFINEON TECHNOLOGIES AG
11101202	Lead pin and wiring board having lead pin	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11101203	Wiring structure comprising intermediate layer including a plurality of sub-layers	--
11101204	Semiconductor module	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11101205	Interconnection structure fabrication using grayscale lithography	INTEL CORPORATION
11101206	Semiconductor device and electronic device	RENESAS ELECTRONICS CORPORATION
11101207	Integrated circuit with cells having metal layer configured based on directions from which intercell metal interconnects connects to the metal layer	QUALCOMM INCORPORATED
11101208	Metal-insulator-metal (MIM) capacitor	MICROCHIP TECHNOLOGY INCORPORATED
11101209	Redistribution structures in semiconductor packages and methods of forming same	--
11101210	Methods for manufacturing a memory array having strings of memory cells comprising forming bridge material between memory blocks	MICRON TECHNOLOGY, INC.
11101211	Semiconductor device with backside inductor using through silicon vias	INTERNATIONAL BUSINESS MACHINES CORPORATION
11101212	Thin film resistor with punch-through vias	TEXAS INSTRUMENTS INCORPORATED
11101213	EFuse structure with multiple links	INTERNATIONAL BUSINESS MACHINES CORPORATION
11101214	Package structure with dam structure and method for forming the same	--
11101215	Tapered connectors for superconductor circuits	PSIQUANTUM CORP.
11101216	Metal line structure and method	--
11101217	Buried power rail for transistor devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
11101218	Integrated assemblies having metal-containing regions coupled with semiconductor regions	MICRON TECHNOLOGY, INC.
11101219	Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements	INTERNATIONAL BUSINESS MACHINES CORPORATION
11101220	Through-package partial via on package edge	QUALCOMM INCORPORATED
11101221	Input/output pins for chip-embedded substrate	INFINEON TECHNOLOGIES AMERICAS CORP.
11101222	Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers	INTEL CORPORATION
11101223	Display device	SAMSUNG DISPLAY CO., LTD.
11101224	Wrapped signal shielding in a wafer fanout package	FUTUREWEI TECHNOLOGIES, INC.
11101225	Semiconductor device and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11101226	Method for conveying high frequency module and a high-frequency module	DUSTPHOTONICS LTD.
11101227	Coupled line structures for wideband applications	ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
11101228	Integrated circuit package with a magnetic core	QUALCOMM INCORPORATED
11101229	Semiconductor device and method for fabricating the same	--
11101230	Array substrate and chip bonding method	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11101231	Semiconductor package and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11101232	Conductive micro pin	--
11101233	Semiconductor device and method for forming the same	--
11101234	Cu pillar cylindrical preform for semiconductor connection	NIPPON MICROMETAL CORPORATION
11101235	Fabrication method of semiconductor package with stacked semiconductor chips	--
11101236	Semiconductor package and method of forming the same	--
11101237	Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer	--
11101238	Surface mounting semiconductor components	--
11101239	Process for packaging component	XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
11101240	Isolation bonding film for semiconductor packages and methods of forming the same	--
11101241	Semiconductor device having terminals and semiconductor elements electrically connected to a respective side surface of the terminals	FUJI ELECTRIC CO., LTD.
11101242	Semiconductor device and method of manufacturing same	TOSHIBA MEMORY CORPORATION
11101243	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11101244	Stacked semiconductor die assemblies with die support members and associated systems and methods	MICRON TECHNOLOGY, INC.
11101245	Multi-chip modules including stacked semiconductor dice	MICRON TECHNOLOGY, INC.
11101246	Semiconductor device having chips attached to support members through silver sintered bodies with particles	DENSO CORPORATION
11101252	Package-on-package structure and manufacturing method thereof	--
11101253	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11101254	Flip-chip like integrated passive prepackage for SIP device	INTEL CORPORATION
11101259	Semiconductor device	DENSO CORPORATION
11101260	Method of forming a dummy die of an integrated circuit having an embedded annular structure	--
11101261	Package-on-package structures and methods for forming the same	--
11101262	Stacked semiconductor die assemblies with support members and associated systems and methods	MICRON TECHNOLOGY, INC.
11101263	Resistor with exponential-weighted trim	TEXAS INSTRUMENTS INCORPORATED
11101266	3D device and devices with bonding	MONOLITHIC 3D INC.
11101267	Integrated circuit including multiple-height cell and method of manufacturing the integrated circuit	SAMSUNG ELECTRONICS CO., LTD.
11101276	Word line contact structure for three-dimensional memory devices and fabrication methods thereof	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11101279	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11101280	Memory arrays and methods used in forming a memory array	MICRON TECHNOLOGY, INC.
11101284	Three-dimensional memory device containing etch stop structures and methods of making the same	SANDISK TECHNOLOGIES LLC
11101285	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11101288	Three-dimensional memory device containing plural work function word lines and methods of forming the same	SANDISK TECHNOLOGIES LLC
11101293	Semiconductor device and method for manufacturing the semiconductor device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11101297	Display device	--
11101309	Imaging element, method for manufacturing imaging element, and electronic device	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11101310	Light detection device	HAMAMATSU PHOTONICS K.K.
11101312	Semiconductor apparatus and equipment	CANON KABUSHIKI KAISHA
11101313	Solid-state imaging device and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11101319	Semiconductor storage device including variable resistance elements	TOSHIBA MEMORY CORPORATION
11101329	Display device	SAMSUNG DISPLAY CO., LTD.
11101352	Quantum dot array devices with shared gates	INTEL CORPORATION
11101375	Semiconductor device and method of controlling same	KABUSHIKI KAISHA TOSHIBA
11101397	Solar cell panel	LG ELECTRONICS INC.
11101402	Method of manufacturing light emitting diodes and light emitting diode	OSRAM OLED GMBH
11101405	LED with internally confined current injection area	APPLE INC.
11101417	Structures and methods for electrically connecting printed components	X DISPLAY COMPANY TECHNOLOGY LIMITED
11101540	Semiconductor devices and methods of manufacturing semiconductor devices	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11101541	Semiconductor assembly and method for manufacturing the same	--
11101638	Semiconductor die including multiple controllers for operating over an extended temperature range	ANALOG DEVICES GLOBAL UNLIMITED COMPANY
11101732	Power management system switched capacitor voltage regulator with integrated passive device	APPLE INC.
11101784	Electrical component with heat dissipation	SNAPTRACK, INC.
11101803	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11101840	Chip radio frequency package and radio frequency module	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11102887	Electrical connection device	AUTONETWORKS TECHNOLOGIES, LTD.
11102916	Electric power inverter	MAHLE INTERNATIONAL GMBH
11104788	Composition, cured product and laminate	DIC CORPORATION
11104832	Liquid epoxy resin sealing material and semiconductor device	NAMICS CORPORATION
11104834	Heat dissipation sheet	TEIJIN LIMITED
11105567	Thermal management assembly comprising bulk graphene material	MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
11105738	Sensor wiring substrate, sensor package, and sensor device	KYOCERA CORPORATION
11106128	Method for designing mask set, recording medium, template, and method for manufacturing template	KIOXIA CORPORATION
11106255	Cooling device	NEC PLATFORMS, LTD.
11106835	Method of manufacturing conductive lines in a circuit	--
11107508	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11107539	Semiconductor device and its power supply control method	RENESAS ELECTRONICS CORPORATION
11107675	CVD Mo deposition by using MoOCl<sub>4</sub>	ENTEGRIS, INC.
11107680	Mask assembly and method for fabricating a chip package	--
11107685	Semiconductor manufacturing method and semiconductor manufacturing device	MITSUBISHI ELECTRIC CORPORATION
11107686	Methods for manufacturing semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11107700	Semiconductor package method of fabricating semiconductor package and method of fabricating re-distribution structure	SAMSUNG ELECTRONICS CO., LTD.
11107701	Stiffener package and method of fabricating stiffener package	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11107702	Method for creating through-connected vias and conductors on a substrate	SAMTEC, INC.
11107703	Monolithic, biocompatible feedthrough for hermetically sealed electronics and methods of manufacture	NEURALINK CORP.
11107716	Automation line for processing a molded panel	PYXIS CF PTE. LTD.
11107721	3D semiconductor device and structure with NAND logic	MONOLITHIC 3D INC.
11107725	Interconnect structure and manufacturing method for the same	--
11107727	Double metal double patterning with vias extending into dielectric	INTERNATIONAL BUSINESS MACHINES CORPORATION
11107728	Interconnects with tight pitch and reduced resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11107731	Self-aligned repaired top via	INTERNATIONAL BUSINESS MACHINES CORPORATION
11107739	Power semiconductor module arrangement	INFINEON TECHNOLOGIES AG
11107740	Power semiconductor module	ABB POWER GRIDS SWITZERLAND AG
11107741	Composite ceramic multilayer substrate, heat generating element-mounting module, and method of producing composite ceramic multilayer substrate	MURATA MANUFACTURING CO., LTD.
11107742	Electronic devices and fabricating processes	STMICROELECTRONICS (GRENOBLE 2) SAS
11107743	Chip on film package and display device including the same	SAMSUNG ELECTRONICS CO., LTD.
11107744	Insulated gate bipolar transistor module and manufacturing method thereof	RAYBEN TECHNOLOGIES (ZHUHAI) LIMITED
11107746	Power semiconductor apparatus and manufacturing method therefor	MITSUBISHI ELECTRIC CORPORATION
11107747	Semiconductor package with composite thermal interface material structure and method of forming the same	--
11107748	Semiconductor module and vehicle	FUJI ELECTRIC CO., LTD.
11107749	Heat dissipation fin structure and cooling structure for electric substrate using the same	TOYOTA JIDOSHA KABUSHIKI KAISHA
11107750	Magnetofluid pump device for IGBT heat dissipation and test method therefor	DALIAN UNIVERSITY OF TECHNOLOGY
11107751	Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same	INTEL CORPORATION
11107752	Half buried nFET/pFET epitaxy source/drain strap	INTERNATIONAL BUSINESS MACHINES CORPORATION
11107753	Packaging structure for gallium nitride devices	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11107754	Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframe	INFINEON TECHNOLOGIES AG
11107755	Packaging for lateral high voltage GaN power devices	--
11107756	Semiconductor device and method for manufacturing the same, and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11107757	Integrated circuit structures in package substrates	INTEL CORPORATION
11107758	Fan-out package structure and method	--
11107759	Chip package and manufacturing method thereof	--
11107760	Semiconductor device, electric power conversion apparatus and method for manufacturing semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11107761	Semiconductor device	DENSO CORPORATION
11107762	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11107763	Interconnect structure for stacked die in a microelectronic device	INTEL CORPORATION
11107764	Group III-V semiconductor fuses and their methods of fabrication	INTEL CORPORATION
11107765	Three-dimensional semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11107766	Substrate with embedded stacked through-silicon via die	INTEL CORPORATION
11107767	Structure for standard logic performance improvement having a back-side through-substrate-via	--
11107768	Chip package	--
11107769	Semiconductor package and a method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11107770	Integrated electrical/optical interface with two-tiered packaging	XILINX, INC.
11107771	Segregated power and ground design for yield improvement	--
11107772	Semiconductor package and method of manufacturing semiconductor package	--
11107773	Semiconductor device, semiconductor chip and method of dicing a semiconductor substrate	SAMSUNG ELECTRONICS CO., LTD.
11107774	Semiconductor device package and method of manufacturing the same	--
11107775	Semiconductor device with electrically floating contacts between signal-transmitting contacts	--
11107776	Semiconductor device	FUJI ELECTRIC CO., LTD.
11107777	Substrate structure and semiconductor package structure including the same	--
11107778	Active shielding device and method of active shielding	NXP B.V.
11107779	Semiconductor package and manufacturing method thereof	--
11107780	Pseudo-stripline using double solder-resist structure	INTEL CORPORATION
11107781	RFIC having coaxial interconnect and molded layer	INTEL CORPORATION
11107782	Radio frequency module and communication device	MURATA MANUFACTURING CO., LTD.
11107783	Wafer-level package including under bump metal layer	SAMSUNG ELECTRONICS CO., LTD.
11107784	Semiconductor device having circuit board to which contact part is bonded	FUJI ELECTRIC CO., LTD.
11107785	Semiconductor device with a plurality of landing pads and method for fabricating the same	--
11107786	Pattern decomposition lithography techniques	INTEL CORPORATION
11107787	Member for semiconductor device	FUJI ELECTRIC CO., LTD.
11107788	Method of manufacturing semiconductor device	TOSHIBA MEMORY CORPORATION
11107789	Method for manufacturing semiconductor device	MITSUI CHEMICALS TOHCELLO, INC.
11107790	Laser bonding method	ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
11107791	Semiconductor package structure and method for manufacturing the same	--
11107794	Multi-wafer stack structure and forming method thereof	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11107796	Semiconductor module including memory stack having TSVs	SK HYNIX INC.
11107798	Semiconductor packages and methods of forming the same	--
11107799	Hybrid system including photonic and electronic integrated circuits and cooling plate	PSIQUANTUM, CORP.
11107801	Multi fan-out package structure and method for forming the same	--
11107802	Semiconductor device and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
11107803	Method to construct 3D devices and systems	MONOLITHIC 3D INC.
11107804	IC with test structures and e-beam pads embedded within a contiguous standard cell area	PDF SOLUTIONS, INC.
11107807	IC package having a metal die for ESP protection	--
11107808	3D semiconductor device and structure	MONOLITHIC 3D INC.
11107809	Semiconductor device with nanowire plugs and method for fabricating the same	--
11107810	Fin field effect transistor (FinFET) device structure and method for forming the same	--
11107811	Metallization structures under a semiconductor device layer	INTEL CORPORATION
11107820	Semiconductor device and method for fabricating the same	--
11107822	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11107826	Semiconductor memory device	SAMSUNG ELECTRONICS CO., LTD.
11107834	Staircase and contact structures for three-dimensional memory	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11107848	Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation	AMS AG
11107855	Method for bonding and connecting substrates	SONY CORPORATION
11107878	High resistivity iron-based, thermally stable magnetic material for on-chip integrated inductors	INTERNATIONAL BUSINESS MACHINES CORPORATION
11107879	Capacitor structure and fabrication method thereof	--
11107883	Device isolator with reduced parasitic capacitance	TEXAS INSTRUMENTS INCORPORATED
11107900	Dual-gate transistors and their integrated circuits and preparation method thereof	PEKING UNIVERSITY
11107915	Semiconductor device	NUVOTON TECHNOLOGY CORPORATION JAPAN
11107918	Semiconductor structure for fully depleted silicon-on-insulator (FDSOI) transistor	MEDIATEK SINGAPORE PTE. LTD.
11107982	RRAM structure	--
11108131	Semiconductor device package and method of manufacturing the same	--
11108156	Differential on-chip loop antenna	INTEL CORPORATION
11108361	Integrated multiple-path power amplifier with interdigitated transistors	NXP USA, INC.
11108362	Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof	NXP USA, INC.
11109428	Blade computing system with wireless communication between blades within a blade enclosure	INTEL CORPORATION
11109486	High-speed, flexible integrated circuits and methods for making high-speed, flexible integrated circuits	WISCONSIN ALUMNI RESEARCH FOUNDATION
11109511	Cooling device and method of manufacturing cooling device	SANOH INDUSTRIAL CO., LTD.
11109512	Memory subsystem for a cryogenic digital system	RAMBUS INC.
11109513	Heat conductive sheet and multilayered heat conductive sheet	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11109515	Heatsink for co-packaged optical switch rack package	INPHI CORPORATION
11109750	Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects	DEPUY SYNTHES PRODUCTS, INC.
11110534	Continuous solder transfer to substrates	INTERNATIONAL BUSINESS MACHINES CORPORATION
11111136	Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
11111382	Epoxy resin composition	SUMITOMO SEIKA CHEMICALS CO., LTD.
11111598	Crystal growth method in a semiconductor device	KABUSHIKI KAISHA TOSHIBA
11112130	Refrigeration cycle apparatus	MITSUBISHI ELECTRIC CORPORATION
11112189	Cold plate and manufacturing method of cold plate	FUJIKURA LTD.
11112244	System and method for providing a simple and reliable inertia measurement unit (IMU)	SZ DJI TECHNOLOGY CO., LTD.
11112424	Physical quantity sensor, complex sensor, inertial measurement unit, portable electronic device, electronic device, and vehicle	SEIKO EPSON CORPORATION
11112435	Current transducer with integrated primary conductor	LEM INTERNATIONAL SA
11112436	Spark gap structures for detection and protection against electrical overstress events	ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
11112570	Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump	INTERNATIONAL BUSINESS MACHINES CORPORATION
11112624	Semiconductor device and manufacturing method thereof	RENESAS ELECTRONICS CORPORATION
11113225	Extending multichip package link off package	INTEL CORPORATION
11113443	Integrated circuit with thicker metal lines on lower metallization layer	--
11113827	Pattern-to-design alignment for one-dimensional unique structures	KLA CORPORATION
11114146	Nanosecond non-destructively erasable magnetoresistive random-access memory	INTERNATIONAL BUSINESS MACHINES CORPORATION
11114239	Electronic device, device package, and method of fabrication	NXP B.V.
11114303	Gate all around device, method for manufacturing FinFET device, and method for manufacturing gate all around device	--
11114308	Controlling of height of high-density interconnection structure on substrate	INTERNATIONAL BUSINESS MACHINES CORPORATION
11114309	Articles and methods of forming vias in substrates	CORNING INCORPORATED
11114310	Embedded packaging method capable of realizing heat dissipation	ZHUHAI ACCESS SEMICONDUCTOR CO., LTD
11114311	Chip package structure and method for forming the same	--
11114312	Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover	STMICROELECTRONICS (GRENOBLE 2) SAS
11114315	Chip packaging method and package structure	PEP INNOVATION PTE. LTD.
11114334	Semiconductor device with air gap and method for preparing the same	--
11114336	Semiconductor device and manufacturing method thereof	--
11114337	Method for bonding and interconnecting semiconductor chips	IMEC VZW
11114338	Fully aligned via in ground rule region	GLOBALFOUNDRIES U.S. INC.
11114339	Method for reducing metal plug corrosion and device	--
11114340	Method for producing an interconnection comprising a via extending through a substrate	--
11114341	Laser processing method	DISCO CORPORATION
11114343	Partial backside metal removal singulation system and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11114344	IC die with dummy structures	XILINX, INC.
11114349	System and method for allowing restoration of first interconnection of die of power module	MITSUBISHI ELECTRIC CORPORATION
11114353	Hybrid microelectronic substrates	INTEL CORPORATION
11114354	Printed wiring board, printed circuit board, prepreg	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11114355	Power module and method for manufacturing power module	MURATA MANUFACTURING CO., LTD.
11114356	Glass substrate and laminated substrate	AGC INC.
11114357	Methods and apparatus for package with interposers	--
11114358	Semi-conductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11114359	Wafer level chip scale package structure	DIALOG SEMICONDUCTOR (UK) LIMITED
11114360	Multi-die device structures and methods	XILINX, INC.
11114361	Electronics assemblies and methods of manufacturing electronics assemblies with improved thermal performance	INTELLIGENT PLATFORMS, LLC
11114362	Stacked semiconductor package having heat dissipation structure	SK HYNIX INC.
11114363	Electronic package arrangements and related methods	QORVO US, INC.
11114364	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11114365	Electronic element mounting substrate, electronic device, and electronic module	KYOCERA CORPORATION
11114366	Semiconductor structure with buried conductive line and method for forming the same	--
11114367	Molded integrated circuit packages and methods of forming the same	CARSEM (M) SDN. BHD.
11114368	Base material, mold package, base material manufacturing method, and mold package manufacturing method	DENSO CORPORATION
11114369	Semiconductor device and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11114370	Semiconductor device packages and methods of manufacturing the same	--
11114371	Substrate-on-substrate structure and electronic device comprising the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11114372	Integrated circuit, circuit board with integrated circuit, and display device using the same	LG DISPLAY CO., LTD.
11114373	Metal-insulator-metal structure	--
11114374	Graphene enabled selective barrier layer formation	--
11114375	3D stacked memory and vertical interconnect structures for 3D stacked memory	SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
11114376	System for layout design of structure with inter layer vias	--
11114377	Transformer, transformer manufacturing method and semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11114378	Semiconductor structure with ultra thick metal and manufacturing method thereof	--
11114379	Integrated circuitry, memory integrated circuitry, and methods used in forming integrated circuitry	MICRON TECHNOLOGY, INC.
11114380	Manufacturing method of memory device	--
11114381	Power distribution network for 3D logic and memory	TOKYO ELECTRON LIMITED
11114382	Middle-of-line interconnect having low metal-to-metal interface resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11114383	Semiconductor devices having integrated optical components	MICRON TECHNOLOGY, INC.
11114384	Oxide-peeling stopper	INFINEON TECHNOLOGIES AUSTRIA AG
11114385	Plate-shaped workpiece processing method	DISCO CORPORATION
11114386	Semiconductor device and method of manufacturing the same	MITSUBISHI ELECTRIC CORPORATION
11114387	Electronic packaging structure	--
11114388	Warpage control for microelectronics packages	INTEL CORPORATION
11114389	Substrate structure and method for manufacturing a semiconductor package	--
11114390	Semiconductor device and forming method thereof	--
11114391	Antenna package structure and antenna packaging method	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
11114392	Wireless communication device	MURATA MANUFACTURING CO., LTD.
11114393	Electronic package and method for fabricating the same	--
11114394	Signal routing carrier	INTEL CORPORATION
11114395	Post passivation interconnect	--
11114396	Reduced-length bond pads for broadband power amplifiers	CREE, INC.
11114397	Semiconductor package substrate and method of manufacturing semiconductor package using the same	SAMSUNG ELECTRONICS CO., LTD.
11114398	Integrated circuit device including support patterns and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11114399	Semiconductor wafer with void suppression and method for producing same	JX NIPPON MINING & METALS COPRORATION
11114400	Semiconductor device with improved thermal dissipation and manufacturing methods	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
11114401	Bonding structure and method for manufacturing the same	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11114402	Semiconductor device with backmetal and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11114403	Semiconductor device and method of manufacturing semiconductor device	SK HYNIX INC.
11114404	Electronic device including electrical connections on an encapsulation block	STMICROELECTRONICS (GRENOBLE 2) SAS
11114405	Semiconductor package structure with twinned copper	--
11114406	Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip	SANDISK TECHNOLOGIES LLC
11114407	Integrated fan-out package and manufacturing method thereof	--
11114408	System and method for providing 3D wafer assembly with known-good-dies	INVENSAS CORPORATION
11114409	Chip on wafer on substrate optoelectronic assembly and methods of assembly thereof	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
11114410	Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
11114411	Semiconductor chip transfer method and transfer tool	OSRAM OLED GMBH
11114412	Electronic package and method for fabricating the same	--
11114413	Stacking structure, package structure and method of fabricating the same	--
11114414	Wafer structure with capacitive chip interconnection, method for manufacturing the same, and chip structure with capacitive chip interconnection	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11114415	Semiconductor device with a layered protection mechanism and associated systems, devices, and methods	MICRON TECHNOLOGY, INC.
11114416	Power and temperature management for functional blocks implemented by a 3D stacked integrated circuit	MICRON TECHNOLOGY, INC.
11114417	Through-silicon via (TSV) test circuit, TSV test method and integrated circuits (IC) chip	CHANGXIN MEMORY TECHNOLOGIES, INC.
11114418	Electronic device, method of manufacturing electronic device, and electronic apparatus	FUJITSU LIMITED
11114421	Integrating system in package (SiP) with input/output (IO) board for platform miniaturization	INTEL CORPORATION
11114427	3D semiconductor processor and memory device and structure	MONOLITHIC 3D INC.
11114428	Integrated circuit device	SAMSUNG ELECTRONICS CO., LTD.
11114429	Integrated circuit device with electrostatic discharge (ESD) protection	XILINX, INC.
11114433	3DIC structure and method of fabricating the same	--
11114440	Semiconductor memory device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11114441	Semiconductor memory device	--
11114446	SRAM with hierarchical bit lines in monolithic 3D integrated chips	INTEL CORPORATION
11114448	Semiconductor device and method for fabricating the same	--
11114454	Semiconductor device	SK HYNIX INC.
11114459	Three-dimensional memory device containing width-modulated connection strips and methods of forming the same	SANDISK TECHNOLOGIES LLC
11114461	Three-dimensional semiconductor memory devices having source structure overlaps buried insulating layer	SAMSUNG ELECTRONICS CO., LTD.
11114464	3D semiconductor device and structure	MONOLITHIC 3D INC.
11114524	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11114525	Optoelectronic component and method for producing an optoelectronic component	OSRAM OLED GMBH
11114533	Semiconductor device including contacts having different heights and different widths	SAMSUNG ELECTRONICS CO., LTD.
11114543	Group III-V device structure	--
11114565	Semiconductor device	NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
11114566	Semiconductor device and method of manufacturing the same	--
11114567	Manufacturing method of TFT substrate and TFT substrate	SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11114572	Semiconductor device and method for manufacturing semiconductor device	ROHM CO., LTD.
11114583	Light emitting device encapsulated above electrodes	NICHIA CORPORATION
11114596	Light-emitting device	NICHIA CORPORATION
11114597	Display device having an electronic device disposed on a first pad and a second pad	--
11114602	Method of forming superconducting layers and traces	MICROSOFT TECHNOLOGY LICENSING, LLC
11114740	Coupling mechanism, coupling mechanism group, and antenna device	FUJIKURA LTD.
11114745	Antenna package for signal transmission	--
11114836	Semiconductor device, intelligent power module and power conversion apparatus	MITSUBISHI ELECTRIC CORPORATION
11116072	Discrete circuit having cross-talk noise cancellation circuitry and method thereof	INTEL CORPORATION
11116075	Component carrier comprising dielectric structures with different physical properties	AT&S (CHINA) CO. LTD.
11116084	Method, device and system for providing etched metallization structures	INTEL CORPORATION
11116100	Implementation module for stacked connection between isolated circuit components and the circuit thereof	SHENZHEN XILONG TOY COMPANY LIMITED
11116105	Liquid-cooling termination structure having temperature sensing function	SHANGHAI LUYAO ENERGY TECHNOLOGY CO., LTD.
11116109	Electrically insulating thermal connector having a low thermal resistivity	AVX CORPORATION
11117796	MEMS devices including MEMS dies and connectors thereto	--
11117872	Oxazine compound, composition and cured product	DIC CORPORATION
11117873	Oxazine compound, composition, and cured product	DIC CORPORATION
11119137	Electrical test structure and method for monitoring deep trench impedance to substrate	TEXAS INSTRUMENTS INCORPORATED
11119345	Display device	SAMSUNG DISPLAY CO., LTD.
11119962	Apparatus and method for multiplexing data transport by switching different data protocols through a common bond pad	--
11120190	Metal zero power ground stub route to reduce cell area and improve cell placement at the chip level	ADVANCED MICRO DEVICES, INC.
11120191	Multi-tier co-placement for integrated circuitry	ARM LIMITED
11120735	Light emitting device package and display device including the same	SAMSUNG ELECTRONICS CO., LTD.
11120843	Memory device	SAMSUNG ELECTRONICS CO., LTD.
11120988	Semiconductor device packages and methods of manufacturing the same	--
11121004	Semiconductor module and method for producing the same	INFINEON TECHNOLOGIES AG
11121005	Handler bonding and debonding for semiconductor dies	INTERNATIONAL BUSINESS MACHINES CORPORATION
11121006	Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package	--
11121011	Process system and operation method thereof	SAMSUNG ELECTRONICS CO., LTD.
11121020	Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board	AJINOMOTO CO., INC.
11121021	3D semiconductor device and structure	MONOLITHIC 3D INC.
11121024	Tunable hardmask for overlayer metrology contrast	INTERNATIONAL BUSINESS MACHINES CORPORATION
11121025	Layer for side wall passivation	--
11121028	Semiconductor devices formed using multiple planarization processes	--
11121029	Semiconductor device with air spacer and method for preparing the same	--
11121031	Manufacturing method of chip package and chip package	--
11121032	Fabrication of self-aligned gate contacts and source/drain contacts directly above gate electrodes and source/drains	INTERNATIONAL BUSINESS MACHINES CORPORATION
11121034	Semiconductor device manufacturing method and semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11121047	Semiconductor structure	--
11121048	System and method for a device package	INFINEON TECHNOLOGIES AMERICAS CORP.
11121049	Semiconductor package with a wire bond mesh	TEXAS INSTRUMENTS INCORPORATED
11121050	Method of manufacture of a semiconductor device	--
11121051	Semiconductor packages and method of manufacturing the same	--
11121052	Integrated fan-out device, 3D-IC system, and method	--
11121053	Die heat dissipation structure	ASIA VITAL COMPONENTS (CHINA) CO., LTD.
11121054	Module	MURATA MANUFACTURING CO., LTD.
11121055	Leadframe spacer for double-sided power module	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11121056	Semiconductor device and manufacturing method of the same	--
11121058	Liquid cooled module with device heat spreader	APTIV TECHNOLOGIES LIMITED
11121059	Power module and method for manufacturing power module	MITSUBISHI ELECTRIC CORPORATION
11121060	Electronics assemblies and cooling structures having metalized exterior surface	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11121061	Cooling chip structures having a jet impingement system and assembly having the same	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11121062	Semiconductor device and method for manufacturing the same	--
11121063	Stem	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11121064	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11121065	Semiconductor packaging structure with antenna assembly	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
11121066	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11121067	Interposer and electronic device including the same	SAMSUNG ELECTRONICS CO., LTD.
11121068	Array substrate, display device, method for manufacturing them, and spliced display device	BOE TECHNOLOGY GROUP CO., LTD.
11121069	Semiconductor package including capping pad having crystal grain of different size	SAMSUNG ELECTRONICS CO., LTD.
11121070	Integrated fan-out package	--
11121071	Semiconductor package and fabricating method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11121072	Semiconductor device with isolation structure	NXP USA, INC.
11121073	Through plate interconnect for a vertical MIM capacitor	INTEL CORPORATION
11121074	Packaged die stacks with stacked capacitors and methods of assembling same	INTEL CORPORATION
11121075	Hybrid metallization interconnects for power distribution and signaling	QUALCOMM INCORPORATED
11121076	Semiconductor die with conversion coating	TEXAS INSTRUMENTS INCORPORATED
11121077	Semiconductor device and method of manufacturing a semiconductor device	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11121078	SRAM having irregularly shaped metal lines	--
11121079	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11121080	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11121081	Antifuse element	--
11121082	Sub-ground rule e-Fuse structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
11121083	Semiconductor device with fuse-detecting structure	--
11121084	Integrated circuit device with through interconnect via and methods of manufacturing the same	--
11121085	Trench walls, conductive structures having different widths and methods of making same	MICRON TECHNOLOGY, INC.
11121086	Vertical isolated gate field effect transistor integrated in a semiconductor chip	IMEC VZW
11121087	Methods of forming a conductive contact structure to an embedded memory device on an IC product and a corresponding IC product	GLOBALFOUNDRIES U.S. INC.
11121088	Semiconductor package structure and method of manufacturing the same	--
11121089	Integrated circuit package and method	--
11121090	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11121091	Method for arranging two substrates	EV GROUP E. THALLNER GMBH
11121092	Marking pattern in forming staircase structure of three-dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11121093	Methods for selectively forming identification mark on semiconductor wafer	--
11121094	Semiconductor devices with shield	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11121095	Semiconductor device having electromagnetic wave absorbing layer with heat dissipating vias	MITSUBISHI ELECTRIC CORPORATION
11121096	Active control of electronic package warpage	INTERNATIONAL BUSINESS MACHINES CORPORATION
11121097	Active x-ray attack prevention device	GLOBALFOUNDRIES U.S. INC.
11121098	Trap layer substrate stacking technique to improve performance for RF devices	--
11121099	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11121100	Trap layer substrate stacking technique to improve performance for RF devices	--
11121101	Flip chip packaging rework	INTERNATIONAL BUSINESS MACHINES CORPORATION
11121102	Semiconductor package and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11121103	Semiconductor package including interconnection member and bonding wires and manufacturing method thereof	--
11121104	Method for manufacturing interconnect structure	--
11121105	Semiconductor devices and methods of manufacturing semiconductor devices	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11121106	Integrated circuit package and method	--
11121107	Interconnect substrate having columnar electrodes	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11121108	Flip chip package utilizing trace bump trace interconnection	--
11121109	Innovative interconnect design for package architecture to improve latency	INTEL CORPORATION
11121110	Packaging process and packaging structure	DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
11121111	Semiconductor package structure and method of manufacturing the same	--
11121112	Solid-state image pickup element with dam to control resin outflow	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11121113	Bonding apparatus incorporating variable force distribution	ASM TECHNOLOGY SINGAPORE PTE LTD
11121114	Wire bonding tool including a wedge tool	FUJI ELECTRIC CO., LTD.
11121115	Y-theta table for semiconductor equipment	ASM TECHNOLOGY SINGAPORE PTE LTD.
11121116	Manufacturing method of power semiconductor device, power semiconductor device, and power converter	MITSUBISHI ELECTRIC CORPORATION
11121117	Method for self-assembling microelectronic components	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11121118	Integrated circuit stacking approach	--
11121119	Semiconductor package	--
11121120	Method and system for electronic devices with polycrystalline substrate structure interposer	QROMIS, INC.
11121121	3D semiconductor device and structure	MONOLITHIC 3D INC.
11121123	Semiconductor composite device and package board used therein	MURATA MANUFACTURING CO., LTD.
11121127	Integrated circuit chips, integrated circuit packages including the integrated circuit chips, and display apparatuses including the integrated circuit chips	SAMSUNG ELECTRONICS CO., LTD.
11121129	Semiconductor device	--
11121130	Structure and formation method of semiconductor device with gate stacks	--
11121134	Semiconductor device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11121135	Structure of memory device	--
11121140	Ferroelectric tunnel junction memory device with integrated ovonic threshold switches	SANDISK TECHNOLOGIES LLC
11121141	Semiconductor structure and method for forming the same	--
11121142	Memory structure and manufacturing method therefor	--
11121155	Integrated circuit including multiple height cell and method of fabricating the integrated circuit	SAMSUNG ELECTRONICS CO., LTD.
11121164	Semiconductor device and method for production of semiconductor device	SONY CORPORATION
11121173	Preserving underlying dielectric layer during MRAM device formation	INTERNATIONAL BUSINESS MACHINES CORPORATION
11121178	Electronic device and method for fabricating electronic device	SK HYNIX INC.
11121205	Display panel and display panel test system	SAMSUNG DISPLAY CO., LTD.
11121209	Surface area enhancement for stacked metal-insulator-metal (MIM) capacitor	INTERNATIONAL BUSINESS MACHINES CORPORATION
11121216	III-nitride devices including a graded depleting layer	TRANSPHORM TECHNOLOGY, INC.
11121225	Field plate structure to enhance transistor breakdown voltage	--
11121244	RF device integrated on an engineered substrate	QROMIS, INC.
11121247	Semiconductor device and method for manufacturing same	KABUSHIKI KAISHA TOSHIBA
11121256	Semiconductor device integrating backside power grid and related integrated circuit and fabrication method	--
11121287	Method for producing an optoelectronic component, and optoelectronic component	OSRAM OLED GMBH
11121298	Light-emitting diode packages with individually controllable light-emitting diode chips	CREELED, INC.
11121301	Microwave integrated quantum circuits with cap wafers and their methods of manufacture	RIGETTI & CO, INC.
11121302	System and method for superconducting multi-chip module	--
11121317	Low resistance crosspoint architecture	MICRON TECHNOLOGY, INC.
11121350	Electrode-attached substrate, laminated substrate, and organic device manufacturing method	SUMITOMO CHEMICAL COMPANY, LIMITED
11121467	Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process	NXP USA, INC.
11121710	Semiconductor device	KIOXIA CORPORATION
11121733	Semiconductor device, radio-frequency circuit, and communication apparatus	MURATA MANUFACTURING CO., LTD.
11122216	Solid-state imaging device	SAMSUNG ELECTRONICS CO., LTD.
11122227	Image sensor, image capturing system, and production method of image sensor	SONY CORPORATION
11122678	Packaged device having imbedded array of components	TESLA, INC.
11122683	Bare die integration with printed components on flexible substrate without laser cut	PALO ALTO RESEARCH CENTER INCORPORATED
11122693	Method for forming laminated circuit board	PI-CRYSTAL INCORPORATION
11124646	Heat-dissipating resin composition, cured product thereof, and method of using same	3M INNOVATIVE PROPERTIES COMPANY
11124649	Curable resin composition, cured product of same and semiconductor device	NICHIA CORPORATION
11124888	Copper deposition in wafer level packaging of integrated circuits	MACDERMID ENTHONE INC.
11125429	Folded sheet metal heat sink	SIGNIFY HOLDING B.V.
11125513	Formable interface and shielding structures	MICROSOFT TECHNOLOGY LICENSING, LLC
11125731	Detection of a suspect counterfeit part by chromatography	IEC ELECTRONICS CORP.
11125734	Gas sensor package	SAMSUNG ELECTRONICS CO., LTD.
11125781	Integrated substrate and manufacturing method thereof	--
11126774	Layout optimization of a main pattern and a cut pattern	--
11126781	Integrated circuit including standard cell and method and system for designing and manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11127341	Light emitting module and display device	--
11127451	Memory system with minimized heat generation which includes memory that operates at cryogenic temperature	SK HYNIX INC.
11127455	Fin-FET gain cells	BAR-ILAN UNIVERSITY
11127461	Three-dimensional vertical NOR flash thin-film transistor strings	SUNRISE MEMORY CORPORATION
11127462	Multi-chip package with reduced calibration time and ZQ calibration method thereof	SAMSUNG ELECTRONICS CO., LTD.
11127474	Memory device	SAMSUNG ELECTRONICS CO., LTD.
11127515	Nanostructure barrier for copper wire bonding	TEXAS INSTRUMENTS INCORPORATED
11127585	Out-of-plane deformable semiconductor substrate, method of making an out-of-plane deformable semiconductor substrate, and an in-plane and out-of-plane deformable semiconductor substrate	KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
11127591	Light emitters on transition metal dichalcogenides directly converted from thermally and electrically conductive substrates and method of making the same	KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
11127595	Method for bonding a semiconductor substrate to a carrier	MICROSOFT TECHNOLOGY LICENSING, LLC
11127602	Method of fastening a semiconductor chip on a lead frame, and electronic component	OSRAM OLED GMBH
11127603	Semiconductor module and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11127604	Manufacturing method of semiconductor device	--
11127614	Substrate transfer method and substrate transfer apparatus	TOKYO ELECTRON LIMITED
11127628	Semiconductor device with connecting structure having a step-shaped conductive feature and method for fabricating the same	--
11127629	Semiconductor device and fabricating method thereof	--
11127630	Contact plug without seam hole and methods of forming the same	--
11127631	Semiconductor device with contact structures	--
11127632	Semiconductor device with conductive protrusions and method for fabricating the same	--
11127634	Backside metal removal die singulation systems and related methods	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11127642	Test circuit layout structure for display panel	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11127643	Test structures for validating package fabrication process	XILINX, INC.
11127644	Planarization of semiconductor packages and structures resulting therefrom	--
11127645	Grounding lids in integrated circuit devices	NXP USA, INC.
11127646	Fan-out semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11127647	Semiconductor devices and related methods	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD
11127649	Electronic apparatus	TOSHIBA MEMORY CORPORATION
11127650	Semiconductor device package including thermal dissipation element and method of manufacturing the same	--
11127651	High power module semiconductor package with multiple submodules	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11127652	Semiconductor structures having reduced thermally induced bow	RAYTHEON COMPANY
11127653	Latch assembly, heat sink assembly, and computer product incorporating the same	SOUTHCO, INC.
11127654	Semiconductor device and a manufacturing method thereof	SAMSUNG ELECTRONICS CO., LTD.
11127655	Memory die containing through-memory-level via structure and methods for making the same	SANDISK TECHNOLOGIES LLC
11127656	Crack-resistant semiconductor devices	AMS AG
11127657	Semiconductor device and process for fabricating the same	LAPIS SEMICONDUCTOR CO., LTD.
11127658	Manufacturing method for reflowed solder balls and their under bump metallurgy structure	LBSEMICON CO., LTD.
11127659	Parallel electrode combination, power module and power module group	YANGZHOU GUOYANG ELECTRONIC CO., LTD.
11127660	Surface-mount integrated circuit package with coated surfaces for improved solder connection	MICROCHIP TECHNOLOGY INCORPORATED
11127661	Semiconductor chip package method and semiconductor chip package device	TONGFU MICROELECTRONICS CO., LTD.
11127662	Semiconductor device	ROHM CO., LTD.
11127663	Semiconductor package having exposed heat sink for high thermal conductivity	JMJ KOREA CO., LTD.
11127664	Circuit board and manufacturing method thereof	--
11127665	Module assembly	QORVO US, INC.
11127666	Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure	STATS CHIPPAC PTE. LTD.
11127667	Display device	SAMSUNG DISPLAY CO., LTD.
11127668	Semiconductor device and method of forming double-sided fan-out wafer level package	JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
11127669	Flexible display screen and flexible device	SHENZHEN ROYOLE TECHNOLOGIES CO.
11127670	Component carrier with stabilizing structure for interface adhesion	AT&S (CHINA) CO. LTD.
11127671	Power semiconductor module	ABB POWER GRIDS SWITZERLAND AG
11127672	Busbar assembly	SUNCALL CORPORATION
11127673	Semiconductor device including deep vias, and method of generating layout diagram for same	--
11127674	Back end of the line metal structure and method	GLOBALFOUNDRIES U.S. INC.
11127675	Interconnection structure and manufacturing method thereof	--
11127676	Removal or reduction of chamfer for fully-aligned via	INTERNATIONAL BUSINESS MACHINES CORPORATION
11127677	Resistor structure of series resistor of ESD device	SICHUAN ENERGY INTERNET RESEARCH INSTITUTE, TSINGHUA UNIVERSITY
11127678	Dual dielectric layer for closing seam in air gap structure	GLOBALFOUNDRIES U.S. INC.
11127679	Semiconductor device including dummy patterns and peripheral interconnection patterns at the same level	SAMSUNG ELECTRONICS CO., LTD.
11127680	Semiconductor device and manufacturing method thereof	--
11127681	Three-dimensional memory including molybdenum wiring layer having oxygen impurity and method for manufacturing the same	TOSHIBA MEMORY CORPORATION
11127682	Semiconductor package having nonspherical filler particles	INTEL CORPORATION
11127683	Semiconductor structure with substantially straight contact profile	GLOBALFOUNDRIES U.S. INC.
11127684	Low-resistance interconnect structures	--
11127685	Power semiconductor module with dimples in metallization layer below foot of terminal	ABB POWER GRIDS SWITZERLAND AG
11127686	Radio-frequency module and communication device	MURATA MANUFACTURING CO., LTD.
11127687	Semiconductor packages including modules stacked with interposing bridges	SK HYNIX INC.
11127688	Semiconductor package and manufacturing method thereof	--
11127689	Segmented shielding using wirebonds	QORVO US, INC.
11127690	Dual-sided radio-frequency package with overmold structure	SKYWORKS SOLUTIONS, INC.
11127691	Methods of forming a semiconductor device	MICRON TECHNOLOGY, INC.
11127692	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11127693	Barrier for power metallization in semiconductor devices	INFINEON TECHNOLOGIES AG
11127694	Physical unclonable functions with copper-silicon oxide programmable metallization cells	ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
11127695	Power conversion device for reducing an inductance difference between control signal wires of a power semiconductor and suppressing a current unbalancing of the control signals	HITACHI AUTOMOTIVE SYSTEMS, LTD.
11127696	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11127697	Semiconductor device and method of manufacturing the same	--
11127698	Method for producing conductive film, method for producing field effect transistor using same, and method for producing wireless communication device	TORAY INDUSTRIES, INC.
11127699	Chip package structure and manufacturing method thereof	--
11127700	Integrated circuit device	--
11127701	Method of manufacturing intergrated fan-out package with redistribution structure	--
11127702	Semiconductor device and method for manufacturing same	DENSO CORPORATION
11127703	Semiconductor devices	--
11127704	Semiconductor device with bump structure and method of making semiconductor device	--
11127705	Semiconductor structure and manufacturing method thereof	--
11127706	Electronic package with stud bump electrical connections	INTEL CORPORATION
11127707	Semiconductor package structure and method for manufacturing the same	--
11127708	Package structure and method of manufacturing the same	--
11127709	Capillary transport device, capillary mounting device, capillary replacement device, capillary transport method, capillary mounting method, and capillary replacement method	KAIJO CORPORATION
11127710	Method for transferring structures	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11127711	Semiconductor device	KIOXIA CORPORATION
11127713	High bandwidth memories and systems including the same	SAMSUNG ELECTRONICS CO., LTD.
11127714	Printed board and semiconductor device	FUJI ELECTRIC CO., LTD.
11127715	Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same	INTERNATIONAL BUSINESS MACHINES CORPORATION
11127716	Mounting structures for integrated device packages	ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
11127717	Semiconductor device including memory cell arrays and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
11127718	Multi-chip stacked devices	XILINX, INC.
11127719	Face-to-face dies with enhanced power delivery using extended TSVS	NVIDIA CORPORATION
11127722	Stack packages including vertically stacked sub-packages with interposer bridges	SK HYNIX INC.
11127725	Semiconductor structure and associated manufacturing method	--
11127727	Thermal spreading management of 3D stacked integrated circuits	INTEL CORPORATION
11127728	Three-dimensional semiconductor chip containing memory die bonded to both sides of a support die and methods of making the same	SANDISK TECHNOLOGIES LLC
11127729	Method for removing a bulk substrate from a bonded assembly of wafers	SANDISK TECHNOLOGIES LLC
11127730	Semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11127732	Semiconductor device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11127733	Electronic device	INFINEON TECHNOLOGIES AG
11127734	Vertical nanowire transistor for input/output structure	--
11127735	Display substrate area surrounded by wiring having plurality of tips on side thereof	ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
11127737	Monolithic multi-I region diode limiters	MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
11127738	Back biasing of FD-SOI circuit blocks	XCELSIS CORPORATION
11127742	Semiconductor device and a method for fabricating the same	--
11127746	Fin-based strap cell structure for improving memory performance	--
11127747	Transistors including two-dimensional materials	MICRON TECHNOLOGY, INC.
11127748	Semiconductor device having contact electrode extending through void	TOSHIBA MEMORY CORPORATION
11127754	Semiconductor storage device	KIOXIA CORPORATION
11127764	Circuit substrate, method for manufacturing the same, display substrate and tiled display device	BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
11127773	Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11127776	Hybrid bonding method for semiconductor wafers and related three-dimensional integrated device	LFOUNDRY S.R.L.
11127780	Display panel	--
11127789	Magnetic memory devices	SAMSUNG ELECTRONICS CO., LTD.
11127791	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11127793	Manufacturing methods of three-dimensional vertical memory	HANGZHOU HAICUN INFORMATION TECHNOLOGY CO., LTD.
11127813	Semiconductor inductors	INTEL CORPORATION
11127827	Control gate strap layout to improve a word line etch process window	--
11127833	Method to improve HKMG contact resistance	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11127837	Method of forming MOSFET structure	--
11127860	Extended-drain field-effect transistors including a floating gate	GLOBALFOUNDRIES U.S. INC.
11127876	Method of preventing contamination of LED die	LUMILEDS LLC
11127889	Displays with unpatterned layers of light-absorbing material	X DISPLAY COMPANY TECHNOLOGY LIMITED
11127890	Method for assembling a carrier with components, pigment for assembling a carrier with a component and method for producing a pigment	OSRAM OLED GMBH
11128029	Die with embedded communication cavity	INTEL CORPORATION
11128030	Antenna module and electronic device including the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11128131	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11128268	Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof	NXP USA, INC.
11128269	Multiple-stage power amplifiers and devices with low-voltage driver stages	NXP USA, INC.
11128339	Radio frequency switch based on negative-capacitance field effect transistors	--
11129298	Process for liquid immersion cooling	TMGCORE, INC.
11129299	Heat sink	TEJAS NETWORK LIMITED
11129300	Module and power conversion device	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11129301	Thermally conductive insulator	SIEMENS AKTIENGESELLSCHAFT
11129302	Apparatus, system, and method for electromagnetic interference mitigation in split heatsink technologies	JUNIPER NETWORKS, INC.
11129304	Electronic device	FUJITSU LIMITED
11130845	Thermal interface materials including polymeric phase-change materials	INTERNATIONAL BUSINESS MACHINES CORPORATION
11131506	Burst resistant thin wall heat sink	INTERNATIONAL BUSINESS MACHINES CORPORATION
11131711	Testing system and method for in chip decoupling capacitor circuits	NVIDIA CORPORATION
11132017	Clock distribution system	NORTHROP GRUMANN SYSTEMS CORPORATION
11133038	Multi-die peak power management for three-dimensional memory	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11133128	System in package module assembly, system in package module, and electronic device	HUAWEI TECHNOLOGIES CO., LTD.
11133188	Non-volatile memory semiconductor device with electrostatic discharge protection, planarization layers, and manufacturing method thereof	--
11133197	Semiconductor structure and method of forming	--
11133198	Method of manufacturing packaged device chip	DISCO CORPORATION
11133199	Mold heel crack problem reduction	TEXAS INSTRUMENTS INCORPORATED
11133206	Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking	TOKYO ELECTRON LIMITED
11133215	Glass substrate, laminated substrate, laminated substrate manufacturing method, laminate, package, and glass substrate manufacturing method	AGC INC.
11133216	Interconnect structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
11133218	Semiconductor apparatus having through silicon via structure and manufacturing method thereof	--
11133234	Semiconductor device and semiconductor device manufacturing method	LAPIS SEMICONDUCTOR CO., LTD.
11133235	Heat-dissipating semiconductor package including a plurality of metal pins between first and second encapsulation members	DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
11133236	Polymer-based-semiconductor structure with cavity	--
11133237	Package with embedded heat dissipation features	--
11133238	Heat sink fastening seat and securing device with gasket for use with electrical connector	FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
11133239	Mechanical part for fastening processor, assembly, and computer device	HUAWEI TECHNOLOGIES CO., LTD.
11133240	Semiconductor device and semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11133241	Semiconductor package with a cavity in a die pad for reducing voids in the solder	STMICROELECTRONICS, INC.
11133242	Method of manufacturing semiconductor devices, corresponding device and circuit	STMICROELECTRONICS S.R.L.
11133243	Electronic device and wiring board	LAPIS SEMICONDUCTOR CO., LTD.
11133244	Semiconductor device package and method for manufacturing the same	--
11133245	Semiconductor package structure and method for manufacturing the same	--
11133246	Semiconductor structure employing conductive paste on lead frame	--
11133247	Vias with metal caps for underlying conductive lines	--
11133248	Semiconductor structure and method for fabricating the same	XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
11133249	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11133250	Semiconductor component and method for producing a semiconductor component	OSRAM OPTO SEMICONDUCTORS GMBH
11133251	Semiconductor assembly having T-shaped interconnection and method of manufacturing the same	--
11133252	Three-dimensional memory device containing horizontal and vertical word line interconnections and methods of forming the same	SANDISK TECHNOLOGIES LLC
11133253	Semiconductor devices including a thick metal layer	SAMSUNG ELECTRONICS CO., LTD.
11133254	Hybrid power rail structure	--
11133255	Metal patterning for internal cell routing	--
11133256	Embedded bridge substrate having an integral device	INTEL CORPORATION
11133257	Bridge interconnection with layered interconnect structures	INTEL CORPORATION
11133258	Package with bridge die for interconnection and method forming same	--
11133259	Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network	INTERNATIONAL BUSINESS MACHINES CORPORATION
11133260	Self-aligned top via	INTERNATIONAL BUSINESS MACHINES CORPORATION
11133261	Electronic device packaging	INTEL CORPORATION
11133262	Semiconductor packages and display devices including the same	SAMSUNG ELECTRONICS CO., LTD.
11133263	High-density interconnects for integrated circuit packages	INTEL CORPORATION
11133264	Electronic system comprising a lower redistribution layer and method for manufacturing such an electronic system	3DIS TECHNOLOGIES
11133265	Integrated fan-out package and method of fabricating the same	--
11133266	Semiconductor device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11133267	Semiconductor device including a peripheral circuit region and memory cell regions	SAMSUNG ELECTRONICS CO., LTD.
11133268	Crack bifurcation in back-end-of-line	INTERNATIONAL BUSINESS MACHINES CORPORATION
11133269	Semiconductor package and manufacturing method thereof	--
11133270	Integrated circuit device and fabrication method thereof	--
11133271	Semiconductor device	FUJI ELECTRIC CO., LTD.
11133272	Vertically-aligned and conductive dummies in integrated circuit layers for capacitance reduction and bias independence and methods of manufacture	QUALCOMM INCORPORATED
11133273	Semiconductor device with waveguide and method therefor	NXP USA, INC.
11133274	Fan-out interconnect structure and method for forming same	--
11133275	Method for improving wire bonding strength of an image sensor	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11133276	Semiconductor device and method for manufacturing the same	ROHM CO., LTD.
11133277	Semiconductor device bonded by bonding pads	SAMSUNG ELECTRONICS CO., LTD.
11133278	Semiconductor package including cap layer and dam structure and method of manufacturing the same	--
11133279	Connection structure	MIKUNI ELECTRON CORPORATION
11133280	Integrated circuit chip and configuration adjustment method for the same	--
11133281	Chip to chip interconnect in encapsulant of molded semiconductor package	INFINEON TECHNOLOGIES AG
11133282	COWOS structures and methods forming same	--
11133283	Integrated fan-out device	--
11133284	Semiconductor package device	--
11133285	Package-on-package structure having polymer-based material for warpage control	--
11133286	Chip packages and methods of manufacture thereof	--
11133287	Semiconductor package including stacked semiconductor chips and method for fabricating the same	SK HYNIX INC.
11133288	Semiconductor package including stacked semiconductor chips	SK HYNIX INC.
11133290	Chip package structure with stacked chips and manufacturing method thereof	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11133291	Chip package structure with multi-chip stack	--
11133293	Three-dimensional memory device with three-dimensional phase-change memory	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11133295	Methods for manufacturing a display device	--
11133296	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11133297	Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof	SANDISK TECHNOLOGIES LLC
11133301	Integrated circuit having a MOM capacitor and transistor	--
11133302	Semiconductor carrier with vertical power FET module	--
11133304	Packaging scheme involving metal-insulator-metal capacitor	--
11133312	Semiconductor device, and method for manufacturing the same	SK HYNIX INC.
11133318	Semiconductor structure and manufacturing method of the same	--
11133319	Semiconductor device and method for fabricating the same	--
11133321	Semiconductor device and method of fabricating the same	--
11133323	High-voltage transistor having shielding gate	TOSHIBA MEMORY CORPORATION
11133325	Memory cell structure of a three-dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11133327	Three-dimensional semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11133328	Semiconductor device and manufacturing method thereof	SK HYNIX INC.
11133344	Multilevel semiconductor device and structure with image sensors	MONOLITHIC 3D INC.
11133348	Sensor package structure and sensing module thereof	--
11133367	Thin film transistor and fabricating method thereof, array substrate and display device	BOE TECHNOLOGY GROUP CO., LTD.
11133375	Semiconductor substrate with integrated inductive component	TEXAS INSTRUMENTS INCORPORATED
11133395	N-work function metal with crystal structure	--
11133398	Semiconductor device including sense insulated-gate bipolar transistor	ROHM CO., LTD.
11133412	Integrated circuit devices including vertical field-effect transistors (VFETs)	SAMSUNG ELECTRONICS CO., LTD.
11133432	Display panel and manufacturing method thereof, and display device	SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
11133450	Superconducting bump bonds	GOOGLE LLC
11133451	Superconducting bump bonds	GOOGLE LLC
11133568	Semiconductor package structure having antenna module	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
11133578	Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide	NXP B.V.
11133609	Semiconductor device having terminal pin connected by connecting member and method of manufacturing semiconductor device	FUJI ELECTRIC CO., LTD.
11133750	Power module	DELTA ELECTRONICS (SHANGHAI) CO., LTD.
11133803	Multiple via structure for high performance standard cells	QUALCOMM INCORPORATED
11133805	Superconducting logic circuits	PSIQUANTUM CORP.
11134240	Device and method for determining a fingerprint for a device using a voltage offset distribution pattern	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11134560	Heat exchange plate with slotted airfoil fins	XI'AN JIAOTONG UNIVERSITY
11134561	Wiring board and method for producing the same	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11134572	Circuit board structure and method for manufacturing a circuit board structure	IMBERATEK, LLC
11134573	Printed wiring-board islands for connecting chip packages and methods of assembling same	INTEL CORPORATION
11134587	Power module with integrated cooling device	DANFOSS SILICON POWER GMBH
11134595	Compliant die attach systems having spring-driven bond tools	ASSEMBLEON B.V.
11134598	3D packaging with low-force thermocompression bonding of oxidizable materials	SET NORTH AMERICA, LLC
11134829	Image pickup apparatus, endoscope, and method for manufacturing image pickup apparatus	OLYMPUS CORPORATION
11135669	Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly	CREE, INC.
11135683	Solder alloy and junction structure using same	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11136437	Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member	DOW TORAY CO., LTD.
11136476	Method of producing anisotropic conductive film and anisotropic conductive film	DEXERIALS CORPORATION
11136479	Electrically conductive adhesive film and dicing-die bonding film using the same	FURUKAWA ELECTRIC CO., LTD.
11136484	Thermally conductive sheet	SEKISUI CHEMICAL CO., LTD.
11137213	Water cooling head	--
11137560	Semiconductor module, manufacturing method thereof, and communication method using the same	RENESAS ELECTRONICS CORPORATION
11137649	Display device	SAMSUNG DISPLAY CO., LTD.
11137689	Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system	ASML NETHERLANDS B.V.
11137806	Thermal management of integrated circuits	INTEL CORPORATION
11138360	Semiconductor device with filler cell region, method of generating layout diagram and system for same	--
11138487	Method for manufacturing RFID inlet and antenna pattern	SATO HOLDINGS KABUSHIKI KAISHA
11139164	Electronic device including hermetic micro-cavity and methods of preparing the same	RAYTHEON COMPANY
11139177	Method of fabricating semiconductor package structure	--
11139178	Semiconductor package with filler particles in a mold compound	TEXAS INSTRUMENTS INCORPORATED
11139179	Embedded component package structure and manufacturing method thereof	--
11139193	Device and method for positioning first object in relation to second object	SHINKAWA LTD.
11139199	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11139201	Top via with hybrid metallization	INTERNATIONAL BUSINESS MACHINES CORPORATION
11139202	Fully aligned top vias with replacement metal lines	INTERNATIONAL BUSINESS MACHINES CORPORATION
11139204	Semiconductor device comprised of contact plugs having pillar portions and protrusion portions extending from the pillar portions	SK HYNIX INC.
11139206	Semiconductor device with conductive shielding structure	--
11139207	Method for manufacturing a semiconductor device and semiconductor device	AMS AG
11139208	Semiconductor device and method of manufacturing semiconductor device	TOSHIBA MEMORY CORPORATION
11139210	Bonding support structure (and related process) for wafer stacking	--
11139212	Semiconductor arrangement and method for making	--
11139219	Bypass thyristor device with gas expansion cavity within a contact plate	ABB SCHWEIZ AG
11139220	Flexible semiconductor package formed by roll-to-roll process	HAESUNG DS CO., LTD.
11139221	Pins for heat exchangers	HAMILTON SUNDSTRAND CORPORATION
11139222	Electronic device comprising heat pipe contacting a cover structure for heat dissipation	--
11139223	Semiconductor device and manufacturing method thereof	--
11139224	Package comprising a substrate having a via wall configured as a shield	QUALCOMM INCORPORATED
11139225	Device including a plurality of leads surrounding a die paddle and method for manufacturing the same	--
11139226	Semiconductor package structure and assembly structure	--
11139228	Semiconductor device	TOSHIBA MEMORY CORPORATION
11139229	Package-on-package semiconductor assemblies and methods of manufacturing the same	MICRON TECHNOLOGY, INC.
11139230	Flip-chip package substrate and method for preparing the same	--
11139231	Radio frequency module and communication device	MURATA MANUFACTURING CO., LTD.
11139232	Wiring structure and method for manufacturing the same	--
11139233	Cavity wall structure for semiconductor packaging	UTAC HEADQUARTERS PTE. LTD.
11139234	Package carrier and manufacturing method thereof	--
11139235	Semiconductor device and manufacturing method thereof	LAPIS SEMICONDUCTOR CO., LTD.
11139236	Semiconductor devices and methods of forming the same	--
11139237	Three-dimensional memory device containing horizontal and vertical word line interconnections and methods of forming the same	SANDISK TECHNOLOGIES LLC
11139238	High Q factor inductor structure	QORVO US, INC.
11139239	Recessed inductor structure to reduce step height	--
11139240	Semiconductor module and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
11139241	Integrated circuit device with crenellated metal trace layout	INTEL CORPORATION
11139242	Via-to-metal tip connections in multi-layer chips	INTERNATIONAL BUSINESS MACHINES CORPORATION
11139243	Semiconductor memory device	--
11139244	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11139245	Advanced node interconnect routing methodology	--
11139246	Semiconductor device with aligned vias	TOSHIBA MEMORY CORPORATION
11139247	Interconnection structure, semiconductor package and method of manufacturing the same	--
11139248	Mounting substrate and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11139249	Semiconductor devices and methods of forming the same	--
11139250	Integrated module with electromagnetic shielding	QORVO US, INC.
11139251	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11139252	Semiconductor package and method for manufacturing the same	--
11139253	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11139254	Semiconductor device and electronic device	FUJITSU LIMITED
11139255	Protection of integrated circuits	STMICROELECTRONICS (ROUSSET) SAS
11139256	Tamper-resistant integrated circuits, and related methods	MICRON TECHNOLOGY, INC.
11139257	Methods related to dual-sided module with land-grid array (LGA) footprint	SKYWORKS SOLUTIONS, INC.
11139258	Bonding pads with thermal pathways	MICRON TECHNOLOGY, INC.
11139259	Display driving system, display panel and electronic device	BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
11139260	Plurality of stacked pillar portions on a semiconductor structure	--
11139261	Film-like adhesive and method for producing semiconductor package using film-like adhesive	FURUKAWA ELECTRIC CO., LTD.
11139262	Use of pre-channeled materials for anisotropic conductors	MICRON TECHNOLOGY, INC.
11139263	Semiconductor device	VOLKSWAGEN AKTIENGESELLSCHAFT
11139264	Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate	INTEL CORPORATION
11139265	Anisotropic conductive film and connected structure	DEXERIALS CORPORATION
11139266	Manufacturing method for electronic component, and electronic component	MURATA MANUFACTURING CO., LTD.
11139267	Packaging structure and forming method thereof	TONGFU MICROELECTRONICS CO., LTD.
11139268	Semiconductor package structure and method of manufacturing the same	--
11139269	Mixed under bump metallurgy (UBM) interconnect bridge structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
11139270	Artificial intelligence processor with three-dimensional stacked memory	KEPLER COMPUTING INC.
11139271	Semiconductor device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11139272	Bonded assembly containing oxidation barriers and/or adhesion enhancers and methods of forming the same	SANDISK TECHNOLOGIES LLC
11139273	Dynamically configurable multi-chip package	INTEL CORPORATION
11139274	Semiconductor device package and method of manufacturing the same	--
11139275	Semiconductor device and method of manufacturing the same	KIOXIA CORPORATION
11139277	Semiconductor device including contact fingers on opposed surfaces	WESTERN DIGITAL TECHNOLOGIES, INC.
11139278	Low parasitic inductance power module and double-faced heat-dissipation low parasitic inductance power module	YANGZHOU GUOYANG ELECTRONIC CO., LTD.
11139281	Molded underfilling for package on package devices	--
11139282	Semiconductor package structure and method for manufacturing the same	--
11139283	Abstracted NAND logic in stacks	XCELSIS CORPORATION
11139285	Semiconductor package	--
11139286	Semiconductor device including a capacitor structure and a thin film resistor and a method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11139287	Transient voltage suppression device with thermal cutoff	LITTEFLUSE SEMICONDUCTOR (WUXI) CO., LTD.
11139296	CMOS circuit with vertically oriented n-type transistor and method of providing same	INTEL CORPORATION
11139297	Circuit arrangement, redistribution board, module and method of fabricating a half-bridge circuit	INFINEON TECHNOLOGIES AUSTRIA AG
11139300	Three-dimensional memory arrays with layer selector transistors	INTEL CORPORATION
11139301	Semiconductor device including side surface conductor contact	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11139302	Integrated assemblies comprising spaces between bitlines and comprising conductive plates operationally proximate the bitlines, and methods of forming integrated assemblies	MICRON TECHNOLOGY, INC.
11139307	Vertical field effect transistor including integrated antifuse	SAMSUNG ELECTRONICS CO., LTD.
11139312	Semiconductor device	TOSHIBA MEMORY CORPORATION
11139340	Spin element and reservoir element	TDK CORPORATION
11139373	Scalable circuit-under-pad device topologies for lateral GaN power transistors	GAN SYSTEMS INC.
11139375	Semiconductor device and method of manufacturing a semiconductor device	INFINEON TECHNOLOGIES AG
11139412	Electrical coupling assemblies and methods for optoelectronic modules	II-VI DELAWARE, INC.
11139420	LED package structure	LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
11139552	Method of forming a semiconductor device	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11139637	Manufacturable RGB laser diode source and system	KYOCERA SLD LASER, INC.
11139695	Flat panel substrate with integrated antennas and wireless power transmission system	OSSIA INC.
11139748	Power module, power converter device, and electrically powered vehicle	HITACHI ASTEMO, LTD.
11139753	Semiconductor device, power conversion apparatus, and vehicle	KABUSHIKI KAISHA TOSHIBA
11140723	Patch on interposer package with wireless communication interface	INTEL CORPORATION
11140750	Closed loop temperature controlled circuit to improve device stability	STMICROELECTRONICS, INC.
11140772	Printed circuit board including warpage offset regions and semiconductor packages including the same	SAMSUNG ELECTRONICS CO., LTD.
11140786	Thermal interface adhesion for transfer molded electronic components	INTERNATIONAL BUSINESS MACHINES CORPORATION
11141810	Non-eutectic bonding	TECHNI HOLDING AS
11141822	System and method for assembling hook type heatsink	ARRIS ENTERPRISES LLC
11142453	MEMS device stress-reducing structure	TDK CORPORATION
11142669	Adhesive and method of encapsulating organic electronic device using the same	LG CHEM, LTD.
11143461	Flat loop heat pipe	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11143466	Heat transfer system and method incorporating tapered flow field	ROCHESTER INSTITUTE OF TECHNOLOGY
11143690	Testing structure and testing method	--
11143961	Resist composition	THE UNIVERSITY OF MANCHESTER
11145371	Semiconductor memory device	KIOXIA CORPORATION
11145513	Method of manufacturing semiconductor device	NICHIA CORPORATION
11145521	Method for cleaning a semiconductor substrate	--
11145530	System and method for alignment of an integrated circuit	CEREBRAS SYSTEMS INC.
11145538	High resistivity silicon-on-insulator structure and method of manufacture thereof	--
11145540	Semiconductor structure having air gap dielectric and the method of preparing the same	--
11145541	Conductive via and metal line end fabrication and structures resulting therefrom	INTEL CORPORATION
11145542	Global dielectric and barrier layer	--
11145543	Semiconductor via structure with lower electrical resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11145545	Semiconductor device	TOSHIBA MEMORY CORPORATION
11145547	Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same	QORVO US, INC.
11145548	Manufacturing process of element chip using laser grooving and plasma-etching	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11145554	Method for source/drain contact formation in semiconductor devices	--
11145558	Manufacturing method of semiconductor module	FUJI ELECTRIC CO., LTD.
11145560	Semiconductor device and methods of manufacturing	--
11145562	Package structure and method of manufacturing the same	--
11145563	Semiconductor devices having cutouts in an encapsulation material and associated production methods	INFINEON TECHNOLOGIES AG
11145564	Multi-layer passivation structure and method	--
11145565	Method of fabricating a chip package module with improve heat dissipation effect	--
11145566	Stacked silicon package assembly having thermal management	XILINX, INC.
11145567	Heat-radiating substrate	NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
11145568	Magnetically affixed heat spreader	INTEL CORPORATION
11145569	Module equipped with a heat dissipation member	MURATA MANUFACTURING CO., LTD.
11145570	Closed loop liquid cooler and electronic device using the same	CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD
11145571	Heat transfer for power modules	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11145572	Semiconductor structure having through-substrate via (TSV) in porous semiconductor region	NEWPORT FAB, LLC
11145573	Semiconductor package including a pad pattern	SAMSUNG ELECTRONICS CO., LTD.
11145574	Semiconductor device packages with electrical routing improvements and related methods	MICROCHIP TECHNOLOGY INCORPORATED
11145575	Conductive bonding layer with spacers between a package substrate and chip	UTAC HEADQUARTERS PTE. LTD.
11145576	Electronic module	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11145577	Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus	INTEL CORPORATION
11145578	Semiconductor package with top or bottom side cooling and method for manufacturing the semiconductor package	INFINEON TECHNOLOGIES AG
11145579	Thermally enhanced electronic packages for GaN power integrated circuits	NAVITAS SEMICONDUCTOR LIMITED
11145580	IoT and AI system package with solid-state battery enhanced performance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11145581	Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11145582	Method of manufacturing semiconductor devices with a paddle and electrically conductive clip connected to a leadframe and corresponding semiconductor device	STMICROELECTRONICS S.R.L.
11145583	Method to achieve variable dielectric thickness in packages for better electrical performance	INTEL CORPORATION
11145584	Semiconductor device, lead frame, and method for manufacturing semiconductor device	FUJI ELECTRIC CO., LTD.
11145585	Wiring board having each pad with tapered section continuously formed on columnar section	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11145586	Interposer and electronic device	MURATA MANUFACTURING CO., LTD.
11145587	Electronic component mounting substrate, electronic device, and electronic module	KYOCERA CORPORATION
11145588	Method for fabricating semiconductor package and semiconductor package using the same	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11145589	Semiconductor module bonding structure and bonding method	DENSO CORPORATION
11145590	Semiconductor memory device and method of manufacturing the same	KIOXIA CORPORATION
11145591	Integrated circuit (IC) device integral capacitor and anti-fuse	INTERNATIONAL BUSINESS MACHINES CORPORATION
11145592	Process for forming metal-insulator-metal structures	--
11145593	Semiconductor device with integrated capacitor and manufacturing method thereof	--
11145594	Semiconductor device and method of manufacturing the same	SK HYNIX INC.
11145595	Integrated fan-out package with antenna components and manufacturing method thereof	--
11145596	Package structure and method of forming the same	--
11145597	Semiconductor device and method of manufacturing the same	RENESAS ELECTRONICS CORPORATION
11145598	Lattice bump interconnect	TEXAS INSTRUMENTS INCORPORATED
11145599	Method of fabricating a memory device having multiple metal interconnect lines	--
11145600	Electronic device with multilayer electrode and methods for manufacturing the same	--
11145601	Semiconductor chip including alignment pattern	SAMSUNG ELECTRONICS CO., LTD.
11145602	Alignment mark structure and method of fabricating the same	--
11145603	Integrated circuit packaging system with shielding and method of manufacture thereof	STATS CHIPPAC PTE. LTD.
11145604	Semiconductor structure, integrated circuit device, and method of forming semiconductor structure	--
11145605	Semiconductor device and method for fabricating the same	--
11145606	Corner structures for an optical fiber groove	GLOBALFOUNDRIES U.S. INC.
11145607	Semiconductor chip	MURATA MANUFACTURING CO., LTD.
11145608	Detection of laser-based security attacks	QUALCOMM INCORPORATED
11145609	Doherty amplifier with surface-mount packaged carrier and peaking amplifiers	NXP USA, INC.
11145610	Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof	--
11145611	Semiconductor package and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11145612	Methods for bump planarity control	TEXAS INSTRUMENTS INCORPORATED
11145613	Method for forming bump structure	--
11145614	Semiconductor device and method of manufacture	--
11145615	Solder material for semiconductor device	FUJI ELECTRIC CO., LTD.
11145616	Semiconductor device, power conversion apparatus, and method for manufacturing semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11145617	Semiconductor structure	--
11145618	Bonding equipment	SHARP KABUSHIKI KAISHA
11145619	Electrical connecting structure having nano-twins copper and method of forming the same	--
11145620	Formation of bonding wire vertical interconnects	ASM TECHNOLOGY SINGAPORE PTE LTD
11145621	Semiconductor package device and method of manufacturing the same	--
11145622	Discrete polymer in fan-out packages	--
11145623	Integrated circuit packages and methods of forming the same	--
11145624	Semiconductor device package and method for manufacturing the same	--
11145625	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11145626	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11145627	Semiconductor package and manufacturing method thereof	--
11145628	Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same	SANDISK TECHNOLOGIES LLC
11145629	Semiconductor device and power conversion device	ROHM CO., LTD.
11145632	High density die package configuration on system boards	INTEL CORPORATION
11145633	Semiconductor package and manufacturing method thereof	--
11145634	Power converter	MITSUBISHI ELECTRIC CORPORATION
11145635	LED display unit	SHENZHEN GLOSHINE TECHNOLOGY CO., LTD.
11145637	Semiconductor package including a substrate having two silicon layers formed on each other	SAMSUNG ELECTRONICS CO., LTD.
11145638	Semiconductor devices and methods of manufacturing semiconductor devices	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11145639	Semiconductor package and manufacturing method thereof	--
11145643	Semiconductor device, method for manufacturing semiconductor device, and PID protection device	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11145645	Multi-stack three-dimensional memory devices	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11145655	Memory device with reduced-resistance interconnect	--
11145656	Transistors, arrays of transistors, arrays of memory cells individually comprising a capacitor and an elevationally-extending transistor, and methods of forming an array of transistors	MICRON TECHNOLOGY, INC.
11145669	Semiconductor devices including a contact structure that contacts a dummy channel structure	SAMSUNG ELECTRONICS CO., LTD.
11145671	Three-dimensional semiconductor memory device and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11145672	Semiconductor device including stack structures having gate pads with different thicknesses	SAMSUNG ELECTRONICS CO., LTD.
11145689	Indicia for light emitting diode chips	CREELED, INC.
11145706	Display device and method of manufacturing the same	SAMSUNG DISPLAY CO., LTD.
11145712	Semiconductor apparatus and method for manufacturing the same	MITSUBISHI ELECTRIC CORPORATION
11145714	Semiconductor device	ROHM CO., LTD.
11145719	Semiconductor device having a contact	--
11145735	Ohmic alloy contact region sealing layer	RAYTHEON COMPANY
11145736	Semiconductor device with electrically connected doping regions and fabrication method thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11145767	Semiconductor structure	--
11145768	Trench capacitor component with reduced equivalent series resistance and equivalent series inductance	QUALCOMM INCORPORATED
11145782	Processing an optical device	TEXAS INSTRUMENTS INCORPORATED
11145795	Light emitting apparatus and method for manufacturing same	CITIZEN ELECTRONICS CO., LTD.
11145796	Compact opto-electronic modules and fabrication methods for such modules	AMS SENSORS SINGAPORE PTE. LTD.
11145799	LED module having LED chips as light source	ROHM CO., LTD.
11145842	Organic light emitting diode display panel comprising multi-layer encapsulation	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11145961	Vehicle radar signaling device including a substrate integrated waveguide	APTIV TECHNOLOGIES LIMITED
11146254	Driving device and power module	MITSUBISHI ELECTRIC CORPORATION
11146259	Voltage equalization method for use in radiofrequency switch having multiple transistors connected in series and radiofrequency switch	VANCHIP (TIANJIN) TECHNOLOGY CO., LTD.
11147153	Thermal conductivity for integrated circuit packaging	INTEL CORPORATION
11147156	Composite member, heat radiation member, semiconductor device, and method of manufacturing composite member	SUMITOMO ELECTRIC INDUSTRIES, LTD.
11147158	Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout	INTERNATIONAL BUSINESS MACHINES CORPORATION
11147166	Method for producing semiconductor device	SHOWA DENKO MATERIALS CO., LTD.
11147185	Heat sink and electronic device	SONY INTERACTIVE ENTERTAINMENT INC.
11147187	Radiative cooling device with liquid pump	NIDEC CORPORATION
11147197	Microelectronic package electrostatic discharge (ESD) protection	INTEL CORPORATION
11147851	Method of fabricating an electronic power module by additive manufacturing, and associated substrate and module	SAFRAN
11148938	Substrate bonding apparatus, substrate pairing apparatus, and semiconductor device manufacturing method	TOSHIBA MEMORY CORPORATION
11148943	Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces	INFINEON TECHNOLOGIES AG
11149118	Insulating film forming composition, insulating film, and semiconductor device provided with insulating film	DAICEL CORPORATION
11149937	Functionally graded manifold microchannel heat sinks	TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
11150028	Cooling device with superimposed fin groups and parallel heatpipes	FURUKAWA ELECTRIC CO., LTD.
11150273	Current sensor integrated circuits	ALLEGRO MICROSYSTEMS, LLC
11150409	Saw assisted facet etch dicing	GENXCOMM, INC.
11150710	Apparatuses and methods for encapsulated devices	INTERSIL AMERICAS LLC
11151299	Integrated circuit	--
11151953	Liquid crystal display device and electronic device including the same	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11152074	Memory device with improved program performance and method of operating the same	SAMSUNG ELECTRONICS CO., LTD.
11152213	Transistor device with ultra low-k self aligned contact cap and ultra low-k spacer	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152221	Methods and apparatus for metal silicide deposition	APPLIED MATERIALS, INC.
11152226	Structure with controlled capillary coverage	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152227	Lift-off embedded micro and nanostructures	MASSACHUSETTS INSTITUTE OF TECHNOLOGY
11152230	Device and method for bonding alignment	SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
11152251	Method for manufacturing semiconductor device having via formed by ion beam	--
11152252	Semiconductor device with reduced contact resistance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152253	Semiconductor structure and method for fabricating the same	XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
11152254	Pitch quartered three-dimensional air gaps	INTEL CORPORATION
11152255	Methods of performing chemical-mechanical polishing process in semiconductor devices	--
11152257	Barrier-less prefilled via formation	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152258	Method of forming an interconnect in a semiconductor device	--
11152259	Interconnection element and method of manufacturing the same	STMICROELECTRONICS (CROLLES 2) SAS
11152261	Self-aligned top via formation at line ends	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152270	Monitoring structure for critical dimension of lithography process	--
11152271	Semiconductor module and semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11152272	Die-to-wafer hybrid bonding with forming glass	QUALCOMM INCORPORATED
11152273	Conductive structures and redistribution circuit structures	--
11152274	Multi-moldings fan-out package and process	--
11152275	Semiconductor device and method for manufacturing semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11152276	Trim wall protection method for multi-wafer stacking	--
11152277	Three-dimensional memory devices having hydrogen blocking layer and fabrication methods thereof	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11152278	Heat sink, integrated circuit chip and circuit board	BITMAIN TECHNOLOGIES INC.
11152279	Monolithic microwave integrated circuit (MMIC) cooling structure	RAYTHEON COMPANY
11152280	Semiconductor device and method for manufacturing the same	MITSUBISHI ELECTRIC CORPORATION
11152281	Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11152282	Localized catalyst for enhanced thermal interface material heat transfer	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152283	Rack and row-scale cooling	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
11152284	Three-dimensional memory device with a dielectric isolation spacer and methods of forming the same	SANDISK TECHNOLOGIES LLC
11152285	Display device	--
11152286	Power semiconductor module device	WASEDA UNIVERSITY
11152287	Semiconductor module and semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11152288	Lead frames for semiconductor packages	INFINEON TECHNOLOGIES AG
11152289	Semiconductor device and corresponding method	STMICROELECTRONICS S.R.L.
11152290	Wide bandgap group IV subfin to reduce leakage	INTEL CORPORATION
11152291	Multilayer substrate	FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
11152292	Fan-out semiconductor package having metal pattern layer electrically connected embedded semiconductor chip and redistribution layer	SAMSUNG ELECTRONICS CO., LTD.
11152293	Wiring board having two insulating films and hole penetrating therethrough	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11152294	Hermetic metallized via with improved reliability	CORNING INCORPORATED
11152295	Semiconductor package structure and method for manufacturing the same	--
11152296	Semiconductor package and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.
11152297	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11152298	Metal via structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152299	Hybrid selective dielectric deposition for aligned via integration	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152300	Electrical fuse with metal line migration	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152301	Memory cell having multi-level word line	--
11152302	Fabricating unique chips using a charged particle multi-beamlet lithography system	ASML NETHERLANDS B.V.
11152303	Different scaling ratio in FEOL / MOL/ BEOL	--
11152304	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11152305	Semiconductor device and method of manufacturing the same	--
11152306	Dielectric film for semiconductor fabrication	--
11152307	Buried local interconnect	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152308	Interposer circuit	II-VI DELAWARE, INC.
11152309	Semiconductor package, method of fabricating semiconductor package, and method of fabricating redistribution structure	SAMSUNG ELECTRONICS CO., LTD.
11152311	Semiconductor device with protection structure and air gaps and method for fabricating the same	--
11152312	Packages with interposers and methods for forming the same	--
11152313	Using threading dislocations in GaN/Si systems to generate physically unclonable functions	SYNOPSYS, INC.
11152314	Integrated circuit with supply circuit comprising field-effect transistors	INFINEON TECHNOLOGIES AG
11152315	Electronic device package and method for manufacturing the same	--
11152316	Method of forming contact holes in a fan out package	--
11152317	Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
11152318	Semiconductor device and manufacturing method of semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11152319	Micro-connection structure and manufacturing method thereof	--
11152320	Semiconductor package structure and method of the same	--
11152321	Semiconductor device having a copper pillar interconnect structure	INFINEON TECHNOLOGIES AG
11152322	Leadframes in semiconductor devices	TEXAS INSTRUMENTS INCORPORATED
11152323	Package with UBM and methods of forming	--
11152324	Method and apparatus for making integrated circuit packages	TEXAS INSTRUMENTS INCORPORATED
11152325	Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys	CREE, INC.
11152326	Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame	STMICROELECTRONICS, INC.
11152327	Semiconductor device with fuse portion comprising wires of different electrical resistance	MITSUBISHI ELECTRIC CORPORATION
11152328	System and method for uniform pressure gang bonding	ELUX, INC.
11152329	Method of separating bonded substrate, method of manufacturing semiconductor storage device, and substrate separation apparatus	TOSHIBA MEMORY CORPORATION
11152330	Semiconductor package structure and method for forming the same	--
11152331	Electronic package and method for fabricating the same	--
11152332	Modular voltage regulators	--
11152333	Semiconductor device packages with enhanced heat management and related systems	MICRON TECHNOLOGY, INC.
11152334	Semiconductor device and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
11152335	Stack packages including a supporting substrate	SK HYNIX INC.
11152336	3D processor having stacked integrated circuit die	XCELSIS CORPORATION
11152337	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11152339	Method for improved transfer of semiconductor die	ROHINNI, LLC
11152340	Power module having a multilayered structure with liquid cooled busbar and method for manufacturing same	MITSUBISHI ELECTRIC CORPORATION
11152342	Receiver optical module and process of assembling the same	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
11152343	3D integrated ultra high-bandwidth multi-stacked memory	KEPLER COMPUTING, INC.
11152344	Integrated circuit package and methods of forming same	--
11152345	Method for manufacturing semiconductor device	KIOXIA CORPORATION
11152347	Cell circuits formed in circuit cells employing offset gate cut areas in a non-active area for routing transistor gate cross-connections	QUALCOMM INCORPORATED
11152355	Structure with embedded memory device and contact isolation scheme	--
11152357	Rectifier diode encapsulation structure with common electrodes	ZHANGZHOU GO WIN LIGHIING CO., LTD
11152363	Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process	QORVO US, INC.
11152368	Semiconductor device including storage node electrode having filler and method for manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11152371	Apparatus comprising monocrystalline semiconductor materials and monocrystalline metal silicide materials, and related methods, electronic devices, and electronic systems	MICRON TECHNOLOGY, INC.
11152380	Memory device and a method for forming the memory device	GLOBALFOUNDRIES SINGAPORE PTE. LTD.
11152388	Memory arrays and methods used in forming a memory array comprising strings of memory cells	MICRON TECHNOLOGY, INC.
11152391	Semiconductor memory device and production method thereof	TOSHIBA MEMORY CORPORATION
11152392	Integrated circuit including clubfoot structure conductive patterns	SAMSUNG ELECTRONICS CO., LTD.
11152396	Semiconductor device having stacked transistors and multiple threshold voltage control	INTEL CORPORATION
11152401	Flexible display substrate and preparation method thereof	KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD.
11152416	Semiconductor package including a redistribution line	SAMSUNG ELECTRONICS CO., LTD.
11152418	Solid-state imaging device and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11152426	Memory device using an etch stop dielectric layer and methods for forming the same	--
11152440	Display apparatus with thin pad-area insulator and method of manufacturing the same	SAMSUNG DISPLAY CO., LTD.
11152455	Method to reduce breakdown failure in a MIM capacitor	--
11152457	Method of manufacturing capacitor	SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
11152458	Metal capacitor	--
11152463	Semiconductor nanocrystal structure and optoelectronic device	OSRAM OPTO SEMICONDUCTORS GMBH
11152472	Crystalline oxide semiconductor	FLOSFIA INC.
11152489	Additive core subtractive liner for metal cut etch processes	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152495	Integrated circuit heat dissipation using nanostructures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11152529	Semicondutor package structures and methods of manufacturing the same	--
11152547	Metallic structure for optical semiconductor device, method for producing the same, and optical semiconductor device using the same	NICHIA CORPORATION
11152551	Electronic device	--
11152677	Integration of self-biased magnetic circulators with microwave devices	QORVO US, INC.
11152928	Electronic circuit, electronic apparatus, and method	KABUSHIKI KAISHA TOSHIBA
11153962	Header for semiconductor device, and semiconductor device	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11153967	High-frequency module	MURATA MANUFACTURING CO., LTD.
11153977	Circuit carrier, package, and method for manufacturing a package	SIEMENS AKTIENGESELLSCHAFT
11153985	Modular hybrid circuit packaging	ROSEMOUNT INC.
11155717	Storage container storing liquid composition and method for storing liquid composition	FUJIFILM CORPORATION
11155739	Resin-impregnated boron nitride body and a method for producing a resin-impregnated boron nitride body	INFINEON TECHNOLOGIES AG
11156408	Heat sink with condensing fins and phase change material	UNITED ARAB EMIRATES UNIVERSITY
11156638	Contactors with signal pins, ground pins, and short ground pins	TEXAS INSTRUMENTS INCORPORATED
11156677	Semiconductor sensor structure	TDK-MICRONAS GMBH
11157096	Foldable flexible circuit board	DUS OPERATING, INC.
11157674	Transistor sizing for parameter obfuscation of analog circuits	DREXEL UNIVERSITY
11157717	Thermally conductive and protective coating for electronic device	NEXT BIOMETRICS GROUP ASA
11158379	Nonvolatile memory device, storage device, and operating method of nonvolatile memory device	SAMSUNG ELECTRONICS CO., LTD.
11158444	Magnetic material having coated ferromagnetic filler particles	INTEL CORPORATION
11158448	Packaging layer inductor	--
11158499	Semiconductor component and method for fabricating the same	XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
11158511	Semiconductor device and power converter including a copper film with a small grain size stress relaxtion layer	MITSUBISHI ELECTRIC CORPORATION
11158515	Selective metal removal for conductive interconnects in integrated circuitry	INTEL CORPORATION
11158518	Methods of etching metals in semiconductor devices	--
11158519	Method of forming capped metallized vias	CORNING INCORPORATED
11158520	Method to protect die during metal-embedded chip assembly (MECA) process	HRL LABORATORIES, LLC
11158538	Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap	INTERNATIONAL BUSINESS MACHINES CORPORATION
11158539	Method and structure for barrier-less plug	--
11158550	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11158551	Modular WLCSP die daisy chain design for multiple die sizes	DIALOG SEMICONDUCTOR (UK) LIMITED
11158552	Semiconductor device and method to manufacture the same	--
11158553	Package and semiconductor device	NGK INSULATORS, LTD.
11158554	Shielded fan-out packaged semiconductor device and method of manufacturing	MICRON TECHNOLOGY, INC.
11158555	Package structure having sensor die with touch sensing electrode, and method of fabricating the same	--
11158556	Electronic chip package having a support and a conductive layer on the support	STMICROELECTRONICS (TOURS) SAS
11158557	Semiconductor device with a passivation layer and method for producing thereof	INFINEON TECHNOLOGIES AG
11158558	Package with underfill containment barrier	INTEL CORPORATION
11158560	Thermal structures for dissipating heat and methods for manufacture thereof	--
11158561	Memory device with low density thermal barrier	MICRON TECHNOLOGY, INC.
11158562	Conformal integrated circuit (IC) device package lid	INTERNATIONAL BUSINESS MACHINES CORPORATION
11158563	Power semiconductor module and vehicle	FUJI ELECTRIC CO., LTD.
11158564	Apparatus, system, and method for dynamic compensation of heatsink-clamping mechanisms	JUNIPER NETWORKS, INC.
11158565	Compliant pin fin heat sink and methods	INTERNATIONAL BUSINESS MACHINES CORPORATION
11158566	Integrated circuit with a ring-shaped hot spot area and multidirectional cooling	GOOGLE LLC
11158567	Package with stacked power stage and integrated control die	TEXAS INSTRUMENTS INCORPORATED
11158568	Package with wall-side capacitors	INTEL CORPORATION
11158569	Semiconductor component and semiconductor package	INFINEON TECHNOLOGIES AUSTRIA AG
11158570	Semiconductor devices having electrostatic discharge layouts for reduced capacitance	MICRON TECHNOLOGY, INC.
11158571	Devices including conductive interconnect structures, related electronic systems, and related methods	MICRON TECHNOLOGY, INC.
11158572	Package structure including a first electronic device, a second electronic device and a plurality of dummy pillars	--
11158573	Interconnect structures	INVENSAS BONDING TECHNOLOGIES, INC.
11158574	Methods of forming a conductive contact structure to an embedded memory device on an IC product and a corresponding IC product	GLOBALFOUNDRIES U.S. INC.
11158575	Parasitic capacitance reduction in GaN-on-silicon devices	MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
11158576	Package structure having redistribution layer structures	--
11158577	Methods for fabricating microelectronic devices with contacts to conductive staircase steps, and related devices and systems	MICRON TECHNOLOGY, INC.
11158578	High density interconnect device and method	INTEL CORPORATION
11158579	Semiconductor package including a backside redistribution layer	SAMSUNG ELECTRONICS CO., LTD.
11158580	Semiconductor devices with backside power distribution network and frontside through silicon via	--
11158581	Semiconductor package having semiconductor chip between first and second redistribution layers	SAMSUNG ELECTRONICS CO., LTD.
11158582	Semiconductor devices and methods of manufacturing semiconductor devices	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11158583	Substrate with built-in component	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11158584	Selective CVD alignment-mark topography assist for non-volatile memory	INTERNATIONAL BUSINESS MACHINES CORPORATION
11158585	Warpage compensating RF shield frame	INTEL IP CORPORATION
11158586	Semiconductor structure and manufacturing method thereof	--
11158587	Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices	--
11158588	Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices	--
11158589	Semiconductor device and semiconductor package comprising the same	SAMSUNG ELECTRONICS CO., LTD.
11158590	Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)	QUALCOMM INCORPORATED
11158591	Bond pad structure for bonding improvement	--
11158592	Semiconductor device	MURATA MANUFACTURING CO., LTD.
11158593	Structures for bonding a group III-V device to a substrate by stacked conductive bumps	--
11158594	Semiconductor packages having improved reliability in bonds between connection conductors and pads	SAMSUNG ELECTRONICS CO., LTD.
11158595	Embedded die package multichip module	TEXAS INSTRUMENTS INCORPORATED
11158596	Semiconductor device package comprising power module and passive elements	--
11158597	Electronic device including through conductors in sealing body	RENESAS ELECTRONICS CORPORATION
11158598	Method to construct 3D devices and systems	MONOLITHIC 3D INC.
11158599	Method for manufacturing electronic device	SUMITOMO BAKELITE CO., LTD.
11158600	Lithography process for semiconductor packaging and structures resulting therefrom	--
11158601	Laminated element manufacturing method	HAMAMATSU PHOTONICS K.K.
11158602	Batch diffusion soldering and electronic devices produced by batch diffusion soldering	INFINEON TECHNOLOGIES AUSTRIA AG
11158603	Semiconductor package and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11158604	Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11158605	Semiconductor packaging structure and method	--
11158606	Molded direct bonded and interconnected stack	INVENSAS BONDING TECHNOLOGIES, INC.
11158607	Wafer reconstitution and die-stitching	APPLE INC.
11158608	Semiconductor package including offset stack of semiconductor dies between first and second redistribution structures, and manufacturing method therefor	--
11158609	Three-dimensional integrated package device for high-voltage silicon carbide power module	XI'AN JIAOTONG UNIVERSITY
11158614	Thermal performance structure for semiconductor packages and method of forming same	--
11158615	Semiconductor device and method of manufacturing a semiconductor device	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11158616	Semiconductor package with first and second encapsulants	SAMSUNG ELECTRONICS CO., LTD.
11158617	Semiconductor device including a circuit for transmitting a signal	RENESAS ELECTRONICS CORPORATION
11158618	Light conversion device	--
11158619	Redistribution layers in semiconductor packages and methods of forming same	--
11158621	Double side mounted large MCM package with memory channel length reduction	APPLE INC.
11158622	Three-dimensional memory devices	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11158625	Electrostatic protection device and manufacturing method thereof and array substrate	BOE TECHNOLOGY GROUP CO., LTD.
11158640	Apparatus comprising compensation capacitors and related memory devices and electronic systems	MICRON TECHNOLOGY, INC.
11158649	Semiconductor storage device with columnar body having impurity containing channel film	TOSHIBA MEMORY CORPORATION
11158650	Memory cell fabrication for 3D nand applications	APPLIED MATERIALS, INC.
11158664	Band-pass filter for stacked sensor	--
11158683	Display device having an alignment structure	SAMSUNG DISPLAY CO., LTD.
11158712	Field-effect transistors with buried gates and methods of manufacturing the same	INTEL CORPORATION
11158717	Method for manufacturing thin-film transistor (TFT) substrate and TFT substrate	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11158743	Passivated and faceted for fin field effect transistor	--
11158772	Lighting assembly and method for manufacturing a lighting assembly	LUMILEDS LLC
11158773	LED package	LUMENS CO., LTD.
11158775	Semiconductor device and method	--
11158776	Lead frame and method of manufacturing light emitting device	NICHIA CORPORATION
11159158	Switch resistor networks	SKYWORKS SOLUTIONS, INC.
11159164	Integrated circuit and method of manufacturing the same	--
11159165	Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells	--
11159166	Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells	--
11160160	PCB for bare die mount and process therefore	--
11160163	Electronic substrate having differential coaxial vias	TEXAS INSTRUMENTS INCORPORATED
11160174	Method of manufacturing multilayer substrate	MURATA MANUFACTURING CO., LTD.
11160192	Apparatus, system, and method for increasing the cooling efficiency of cold plate devices	JUNIPER NETWORKS, INC.
11160193	Shrinking device for liquid cooling system and the liquid cooling system having the same	BEIJING DEEPCOOL INDUSTRIES CO., LTD.
11160198	Power electric device for a vehicle	MAHLE INTERNATIONAL GMBH
11161146	IC die, probe and ultrasound system	KONINKLIJKE PHILIPS N.V.
11161737	Method for forming hermetic seals in MEMS devices	ELBIT SYSTEMS OF AMERICA, LLC
11161981	One-component, storage-stable, UV-crosslinkable organosiloxane composition	ELANTAS BECK GMBH
11161996	Printed electronics	E2IP TECHNOLOGIES INC.
11162745	Heat radiating plate and method for producing same	DOWA METALTECH CO., LTD.
11162777	Wafer alignment mark scheme	--
11163933	Layout method	--
11164497	Display device	SAMSUNG DISPLAY CO., LTD.
11164654	Method for driving an electronic device including a semiconductor memory in a test mode	SK HYNIX INC.
11164740	Semiconductor structure having porous semiconductor layer for RF devices	NEWPORT FAB, LLC
11164749	Warpage reduction	XILINX, INC.
11164752	Method of etching a dielectric layer	COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
11164754	Fan-out packages and methods of forming the same	--
11164755	Electronic package and method for fabricating the same	--
11164756	Semiconductor device package having continously formed tapered protrusions	--
11164770	Method for producing a 3D semiconductor memory device and structure	MONOLITHIC 3D INC.
11164773	Method for forming semiconductor device structure with air gap	--
11164774	Interconnects with spacer structure for forming air-gaps	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164776	Metallic interconnect structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164777	Top via with damascene line and via	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164778	Barrier-free vertical interconnect structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164779	Bamboo tall via interconnect structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164782	Self-aligned gate contact compatible cross couple contact formation	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164784	Open-drain transistor monitoring circuit in a multi-chip package to control power	MICRON TECHNOLOGY, INC.
11164785	Three-dimensional integrated circuits (3DICs) including upper-level transistors with epitaxial source and drain material	INTEL CORPORATION
11164786	Power reduction in finFET structures	--
11164801	Electrically testable integrated circuit packaging	PSEMI CORPORATION
11164802	Wafer manufacturing method and multilayer device chip manufacturing method	DISCO CORPORATION
11164803	Unit with wiring board, module, and equipment	CANON KABUSHIKI KAISHA
11164804	Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164805	Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon	SAMSUNG ELECTRONICS CO., LTD.
11164806	Temperature calculation based on non-uniform leakage power	INTEL CORPORATION
11164807	Arrangement and thermal management of 3D stacked dies	ADVANCED MICRO DEVICES, INC.
11164808	Semiconductor devices and methods of manufacturing the same	--
11164809	Integrated circuits and methods for forming integrated circuits	INTEL CORPORATION
11164811	3D semiconductor device with isolation layers and oxide-to-oxide bonding	MONOLITHIC 3D INC.
11164812	Semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11164813	Transistor semiconductor die with increased active area	CREE, INC.
11164814	Package structure and method of manufacturing the same	--
11164815	Bottom barrier free interconnects without voids	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164816	Semiconductor device and method for fabricating the same	--
11164817	Multi-chip package structures with discrete redistribution layers	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164818	Inorganic-based embedded-die layers for modular semiconductive devices	INTEL CORPORATION
11164819	Semiconductor package and manufacturing method thereof	--
11164821	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11164822	Structure of semiconductor device and method for bonding two substrates	--
11164823	Semiconductor device with crack-detecting structure and method for fabricating the same	--
11164824	Package structure and method of fabricating the same	--
11164825	CoWos interposer with selectable/programmable capacitance arrays	--
11164826	Packaged integrated circuit having stacked die and method for making	NXP USA, INC.
11164827	Substrate with gradiated dielectric for reducing impedance mismatch	INTEL CORPORATION
11164828	Amplifier	MITSUBISHI ELECTRIC CORPORATION
11164829	Method of forming contact holes in a fan out package	--
11164830	Semiconductor chip and method of processing a semiconductor chip	INFINEON TECHNOLOGIES AG
11164831	Carrier-foil-attached ultra-thin copper foil	ILJIN MATERIALS CO., LTD.
11164832	Package with UBM and methods of forming	--
11164833	Semiconductor device using wires and stacked semiconductor package	SK HYNIX INC.
11164834	Wafer structure and method for manufacturing the same, and chip structure	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11164835	Semiconductor wafer and method of ball drop on thin wafer with edge support ring	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11164836	Film scheme for bumping	--
11164837	Semiconductor device packages with angled pillars for decreasing stress	MICRON TECHNOLOGY, INC.
11164838	Semiconductor package including plurality of semiconductor chips on common connection structure	SAMSUNG ELECTRONICS CO., LTD.
11164839	Package structure and method of manufacturing the same	--
11164840	Chip interconnection structure, wafer interconnection structure and method for manufacturing the same	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11164841	Semiconductor device	DENSO CORPORATION
11164842	Bonding apparatus and bonding system	TOKYO ELECTRON LIMITED
11164843	Substrate bonding apparatus	KIOXIA CORPORATION
11164844	Double etch stop layer to protect semiconductor device layers from wet chemical etch	--
11164845	Resist structure for forming bumps	INTERNATIONAL BUSINESS MACHINES CORPORATION
11164846	Semiconductor device manufacturing method and soldering support jig	FUJI ELECTRIC CO., LTD.
11164848	Semiconductor structure and method manufacturing the same	--
11164849	Chip assembly and chip	CHANGXIN MEMORY TECHNOLOGIES, INC.
11164852	Method of forming package structure	--
11164853	Chip package and manufacturing method thereof	--
11164855	Package structure with a heat dissipating element and method of manufacturing the same	--
11164856	TSV check circuit with replica path	MICRON TECHNOLOGY, INC.
11164857	Semiconductor device packages, packaging methods, and packaged semiconductor devices	--
11164863	Integrated circuit having vertical transistor and semiconductor device including the integrated circuit	SAMSUNG ELECTRONICS CO., LTD.
11164886	Three-dimensional semiconductor memory device	SAMSUNG ELECTRONICS CO., LTD.
11164893	Radio-frequency loss reduction for integrated devices	JUNIPER NETWORKS, INC.
11164895	Array substrate, method for manufacturing the same, display panel and display device	BOE TECHNOLOGY GROUP CO., LTD.
11164900	Image sensor chip-scale-package	OMNIVISION TECHNOLOGIES, INC.
11164903	Image sensor with pad structure	--
11164963	Bipolar transistor and radio-frequency power amplifier module	MURATA MANUFACTURING CO., LTD.
11164969	Segmented power transistor	TEXAS INSTRUMENTS INCORPORATED
11164970	Contact field plate	--
11164973	Semiconductor device and manufacturing method therefor	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11165010	Cold-welded flip chip interconnect structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
11165136	Flex integrated antenna array	QUALCOMM INCORPORATED
11165137	Antenna-integrated radio frequency module	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11165143	Antenna module and electronic system including the same	SAMSUNG ELECTRONICS CO., LTD.
11165185	Electrical connector heat sink with protective ramp	MOLEX, LLC
11165211	Device and method for producing a tested weld joint	SCHUNK SONOSYSTEMS GMBH
11165341	Noise reduction circuit and noise reduction element	MURATA MANUFACTURING CO., LTD.
11165363	Electronic module	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11165509	Method for co-packaging light engine chiplets on switch substrate	MARVELL ASIA PTE, LTD.
11166351	Solder reflow apparatus and method of manufacturing an electronic device	SAMSUNG ELECTRONICS CO., LTD.
11166368	Printed circuit board and semiconductor package including the same	SAMSUNG ELECTRONICS CO., LTD.
11166379	Integrated circuit package substrate	INTEL CORPORATION
11166380	Method of manufacture of a structure and structure	TACTOTEK OY
11166381	Solder-pinning metal pads for electronic components	INTERNATIONAL BUSINESS MACHINES CORPORATION
11166382	Connection structure including circuit body and conductive body	YAZAKI CORPORATION
11166385	Component carrier having a laser via and method of manufacturing	AT&S (CHINA) CO. LTD.
11166399	Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components	SKYWORKS SOLUTIONS, INC.
11166642	Measurement sensor package and measurement sensor	KYOCERA CORPORATION
11167375	Additive manufacturing processes and additively manufactured products	THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
11167391	Fabrication of flexible conductive films, with semiconductive material, formed with rubbing-in technology for elastic or deformable devices	KING ABDULAZIZ UNIVERSITY
11168216	Resin material and laminate	SEKISUI CHEMICAL CO., LTD.
11168234	Enhanced adhesive materials and processes for 3D applications	INTERNATIONAL BUSINESS MACHINES CORPORATION
11168407	Copper electrodeposition on cobalt lined features	LAM RESEARCH COMPORATION
11169207	Testing of semiconductor chips with microbumps	--
11169250	Radar module incorporated with a pattern-shaping device	--
11170842	Stacked semiconductor device	RAMBUS INC.
11170926	Isolated coupling structure	ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
11171015	Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer	--
11171016	Semiconductor package and manufacturing process thereof	--
11171017	Shutter disk	APPLIED MATERIALS, INC.
11171018	Method of fabricating semiconductor device and encapsulant	SAMSUNG ELECTRONICS CO., LTD.
11171039	Composite semiconductor substrate, semiconductor device and method for manufacturing the same	--
11171041	Etch damage and ESL free dual damascene metal interconnect	--
11171043	Plug and trench architectures for integrated circuits and methods of manufacture	INTEL CORPORATION
11171044	Planarization controllability for interconnect structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171046	Methods for forming cobalt and ruthenium capping layers for interconnect structures	APPLIED MATERIALS, INC.
11171049	Semiconductor device and a method of forming the semiconductor device	INFINEON TECHNOLOGIES AG
11171050	Method for manufacturing a contact pad, method for manufacturing a semiconductor device using same, and semiconductor device	TOKYO ELECTRON LIMITED
11171051	Contacts and liners having multi-segmented protective caps	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171052	Methods of forming interconnect structures with selectively deposited pillars and structures formed thereby	--
11171054	Selective deposition with SAM for fully aligned via	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171063	Metalization repair in semiconductor wafers	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171064	Metalization repair in semiconductor wafers	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171066	Semiconductor panels, semiconductor packages, and methods for manufacturing thereof	INFINEON TECHNOLOGIES AG
11171067	Module having a sealing resin layer with radiating member filled depressions	MURATA MANUFACTURING CO., LTD.
11171069	Display module, manufacturing method thereof and electronic device	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11171070	Component carrier with integrated thermally conductive cooling structures	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11171071	Power module and fabrication method of the power module	ROHM CO., LTD.
11171072	Heat dissipation substrate and manufacturing method thereof	--
11171073	Switching semiconductor device and cooling apparatus thereof	LG ELECTRONICS INC.
11171074	Heat sink board, manufacturing method thereof, and semiconductor package including the same	JMJ KOREA CO., LTD.
11171075	Stacked microfluidic cooled 3D electronic-photonic integrated circuit	TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
11171076	Compute-in-memory packages and methods forming the same	--
11171077	Semiconductor device with lead frame that accommodates various die sizes	NXP USA, INC.
11171078	Semiconductor device and method for manufacturing the same	FUJI ELECTRIC CO., LTD.
11171079	Semiconductor device and method of manufacturing semiconductor device	TOSHIBA MEMORY CORPORATION
11171080	Wiring substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11171081	Wiring substrate, semiconductor package and method of manufacturing wiring substrate	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11171082	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11171083	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11171084	Top via with next level line selective growth	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171085	Semiconductor device structure with magnetic layer and method for forming the same	--
11171086	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11171087	Semiconductor structure and controlling method thereof	--
11171088	Electronic apparatus including antennas and directors	--
11171089	Line space, routing and patterning methodology	--
11171090	Semiconductor device and method of manufacture	--
11171091	Semiconductor device having contact plug connected to gate structure on PMOS region	--
11171092	Component with dielectric layer for embedding in component carrier	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11171093	Semiconductor structure and fabrication method thereof	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11171094	Hermetic fully-filled metallized through-hole vias	CORNING INCORPORATED
11171095	Active attack prevention for secure integrated circuits using latchup sensitive diode circuit	GLOBALFOUNDRIES U.S. INC.
11171096	Semiconductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11171097	Bonded assembly containing metal-organic framework bonding dielectric and methods of forming the same	SANDISK TECHNOLOGIES LLC
11171098	Package and manufacturing method thereof	--
11171099	Single-shot encapsulation	SEMTECH CORPORATION
11171100	Semiconductor device structure with protected bump and method of forming the same	--
11171101	Process for removing bond film from cavities in printed circuit boards	RAYTHEON COMPANY
11171102	Multilayer pillar for reduced stress interconnect and method of making same	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171103	Solder ball dimension management	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171104	IC chip package with dummy solder structure under corner, and related method	MARVELL ASIA PTE, LTD.
11171105	Semiconductor package and manufacturing method of the same	--
11171106	Semiconductor package structure with circuit substrate and manufacturing method thereof	--
11171107	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11171108	Semiconductor package and method for manufacturing the same	--
11171109	Techniques for forming semiconductor device packages and related packages, intermediate products, and methods	MICRON TECHNOLOGY, INC.
11171110	Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances	SKYWORKS SOLUTIONS, INC.
11171111	Integrated circuit device and electronic device	SYNAPTICS INCORPORATED
11171112	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11171113	Semiconductor package structure having an annular frame with truncated corners	--
11171114	Die stack with cascade and vertical connections	INTEL CORPORATION
11171115	Artificial intelligence processor with three-dimensional stacked memory	KEPLER COMPUTING INC.
11171116	Semiconductor devices and manufacturing methods of the same	SAMSUNG ELECTRONICS CO., LTD.
11171117	Interlayer connection of stacked microelectronic components	INVENSAS BONDING TECHNOLOGIES, INC.
11171118	Semiconductor assemblies including thermal circuits and methods of manufacturing the same	MICRON TECHNOLOGY, INC.
11171119	Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire	SAMSUNG ELECTRONICS CO., LTD.
11171120	Integrated circuit package assembly	--
11171122	Semiconductor device	FUJI ELECTRIC CO., LTD.
11171126	Configurable substrate and systems	OCTAVO SYSTEMS LLC
11171127	Semiconductor device and method of manufacturing semiconductor device	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11171128	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11171138	Semiconductor arrangement and method of manufacture	--
11171142	Integrated circuit with vertical structures on nodes of a grid	INTERNATIONAL BUSINESS MACHINES CORPORATION
11171150	Three-dimensional memory device containing a channel connection strap and method for making the same	SANDISK TECHNOLOGIES LLC
11171151	Vertical memory devices and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11171154	Vertical memory devices	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11171166	Camera assembly and packaging method thereof, lens module, electronic device	NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
11171170	Image sensor package with flexible printed circuits	SONY CORPORATION
11171177	Phase change memory devices with enhanced vias	INTEL CORPORATION
11171194	Display apparatus	SAMSUNG DISPLAY CO., LTD.
11171216	Semiconductor device and control system	KABUSHIKI KAISHA TOSHIBA
11171222	Semiconductor device and manufacturing method thereof	MAGNACHIP SEMICONDUCTOR, LTD.
11171229	Low switching loss high performance power module	CREE, INC.
11171234	Semiconductor device	NUVOTON TECHNOLOGY CORPORATION JAPAN
11171237	Middle of line gate structures	GLOBALFOUNDRIES U.S. INC.
11171240	Recessed thin-channel thin-film transistor	INTEL CORPORATION
11171266	Shaped phosphor to reduce repeated reflections	LUMILEDS LLC
11171273	LED package with integrated features for gas or liquid cooling	LUMILEDS LLC
11171290	Cross linked surface coating and interfacial layer for a perovskite material photovoltaic device	HUNT PEROVSKITE TECHNOLOGIES, L.L.C.
11171571	Alternating current solid-state switch	GM GLOBAL TECHNOLOGY OPERATIONS LLC
11172567	Assembly method and device for circuit structural member and circuit structural member	XI'AN ZHONGXING NEW SOFTWARE CO. LTD.
11172569	Strip for an electronic device and manufacturing method thereof	--
11172576	Method for producing a printed circuit board structure	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11172594	Heat dissipation structure	--
11172597	Mounting apparatus, for mounting at least one heat dissipating electrical device, optionally including a heat sink body for solid, gas and fluid heat exchange, and circuit board assembly providing interface between circuits	ALGOZEN CORPORATION
11172599	Electromagnetic-wave shielding sheet and electronic component-mounted substrate	TOYO INK SC HOLDINGS CO., LTD.
11173567	Bonding apparatus with rotating bonding stage	KAIJO CORPORATION
11174157	Semiconductor device packages and methods of manufacturing the same	--
11174394	Surface treatment compositions and articles containing same	FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
11175100	Heat sinks using memory shaping materials	INTERNATIONAL BUSINESS MACHINES CORPORATION
11175219	Throughput-scalable analytical system using single molecule analysis sensors	GENESENSE TECHNOLOGY INC.
11175339	IC analog boundary scan cell, digital cell, comparator, analog switches	TEXAS INSTRUMENTS INCORPORATED
11175707	Heat pipe with support post	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11176302	System on chip (SoC) builder	NETSPEED SYSTEMS, INC.
11176450	Three dimensional circuit implementing machine trained network	XCELSIS CORPORATION
11176970	Routing for power signals including a redistribution layer	MICRON TECHNOLOGY, INC.
11176971	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11176999	Semiconductor memory device	TOSHIBA MEMORY CORPORATION
11177004	Semiconductor memory device including page buffers	SK HYNIX INC.
11177065	Thermal paths for glass substrates	QUALCOMM INCORPORATED
11177134	Conductive pattern and method for manufacturing the same, thin film transistor, display substrate, and display device	BOE TECHNOLOGY GROUP CO., LTD.
11177140	3D semiconductor device and structure	MONOLITHIC 3D INC.
11177141	Method for packaging a chip	JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD
11177142	Method for dicing integrated fan-out packages without seal rings	--
11177148	Laser processing apparatus	DISCO CORPORATION
11177149	Wafer jig with identification mark	DISCO CORPORATION
11177155	Direct bond method providing thermal expansion matched devices	RAYTHEON COMPANY
11177156	Semiconductor package, manufacturing method of semiconductor device and semiconductor package	--
11177157	Method for constructing micro-LED display module	LUMENS CO., LTD.
11177159	Memory arrays and methods used in forming a memory array comprising strings of memory cells	MICRON TECHNOLOGY, INC.
11177160	Double patterned lithography using spacer assisted cuts for patterning steps	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177161	Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus with multi-layer interconnects	SONY CORPORATION
11177162	Trapezoidal interconnect at tight BEOL pitch	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177163	Top via structure with enlarged contact area with upper metallization level	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177165	Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide	--
11177166	Etch stop layer removal for capacitance reduction in damascene top via integration	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177167	Ultrathin multilayer metal alloy liner for nano Cu interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177168	Device and method for reducing contact resistance of a metal	--
11177171	Encapsulated top via interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177172	Semiconductor structure	--
11177173	Semiconductor device with an interconnect structure and method for forming the same	--
11177175	Microelectronic devices and methods for filling vias in microelectronic devices	MICRON TECHNOLOGY, INC.
11177184	Method of manufacturing a flip chip package and an apparatus for testing flip chips	SK HYNIX INC.
11177185	Semiconductor memory and method of manufacturing the semiconductor memory	TOSHIBA MEMORY CORPORATION
11177186	Bonded body and insulated circuit board	MITSUBISHI MATERIALS CORPORATION
11177187	Sensor package and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11177188	Heat dissipation substrate for multi-chip package	--
11177189	Module including heat dissipation structure	MURATA MANUFACTURING CO., LTD.
11177190	Semiconductor device	FUJI ELECTRIC CO., LTD.
11177191	Rivet spacer for compromising assembling between two parts secured to each other via screw structure	FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
11177192	Semiconductor device including heat dissipation structure and fabricating method of the same	--
11177193	Reservoir structure and system forming gap for liquid thermal interface material	--
11177194	Semiconductor device with interconnect structure and method for preparing the same	--
11177195	Multi-lead adapter	TEXAS INSTRUMENTS INCORPORATED
11177196	Lead frame, semiconductor device, and method for manufacturing semiconductor device	FUJI ELECTRIC CO., LTD.
11177197	Semiconductor package with solder standoff	TEXAS INSTRUMENTS INCORPORATED
11177198	Plurality of lead frames electrically connected to inductor chip	ROHM CO., LTD.
11177199	Semiconductor packages with external bump pads having trench portions and semiconductor modules including the semiconductor packages	SAMSUNG ELECTRONICS CO., LTD.
11177200	Pad design for reliability enhancement in packages	--
11177201	Semiconductor packages including routing dies and methods of forming same	--
11177202	Multilayer structure and method for fabricating the same	--
11177203	Vertical and horizontal circuit assemblies	FAIRCHILD SEMICONDUCTOR CORPORATION
11177204	Power electronics package and method of manufacturing thereof	GENERAL ELECTRIC COMPANY
11177205	Semiconductor package having multi-level and multi-directional shape narrowing vias	SAMSUNG ELECTRONICS CO., LTD.
11177206	Double-sided flexible circuit board and layout structure thereof	--
11177207	Compact transistor utilizing shield structure arrangement	NXP USA, INC.
11177208	Interconnect structures and methods of forming the same	--
11177209	Semiconductor memory device and manufacturing method of the semiconductor memory device	SK HYNIX INC.
11177210	Integrated circuit with non-functional structures	NXP B.V.
11177211	Method of manufacturing via structures of semiconductor devices	--
11177212	Contact formation method and related structure	--
11177213	Embedded small via anti-fuse device	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177214	Interconnects with hybrid metal conductors	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177215	Integrated circuit device	SAMSUNG ELECTRONICS CO., LTD.
11177216	Nitride structures having low capacitance gate contacts integrated with copper damascene structures	RAYTHEON COMPANY
11177217	Direct bonded heterogeneous integration packaging structures	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177218	Package including metallic bolstering pattern and manufacturing method of the package	--
11177219	Photonic integrated circuit with integrated optical transceiver front-end circuitry for photonic devices and methods of fabricating the same	HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
11177220	Vertical and lateral interconnects between dies	INTEL CORPORATION
11177221	Semiconductor device package and method of manufacturing the same	--
11177222	Semiconductor packages and associated methods with antennas and EMI isolation shields	MICRON TECHNOLOGY, INC.
11177223	Electromagnetic interference shielding for packages and modules	QUALCOMM INCORPORATED
11177224	Method of manufacturing semiconductor device	FUJI ELECTRIC CO., LTD.
11177225	Semiconductor device including physical unclonable function	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177226	Flexible shield for semiconductor devices	INTEL CORPORATION
11177227	Method and apparatus for heat sinking high frequency IC with absorbing material	ANOKIWAVE, INC.
11177228	Semiconductor device and bump formation process	--
11177229	IC chip layout for minimizing thermal expansion misalignment	SYNAPTICS INCORPORATED
11177230	Electronic device including at least one row of bumps	--
11177231	Bonding contacts having capping layer and method for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11177232	Circuit device with monolayer bonding between surface structures	INTEL CORPORATION
11177233	Solder pads of variable thickness in an optoelectronic semiconductor chip, on a connection substrate for mounting a semiconductor chip, method of producing an optoelectronic component, and optoelectronic component having the solder pads	OSRAM OLED GMBH
11177234	Package architecture with improved via drill process and method for forming such package	INTEL CORPORATION
11177235	Semiconductor device with improved signal transmission characteristics	RENESAS ELECTRONICS CORPORATION
11177236	Semiconductor device having case to which circuit board is bonded by bonding material and method of manafacturing thereof	FUJI ELECTRIC CO., LTD.
11177237	Manufacturing method of semiconductor package	--
11177241	Semiconductor device with top die positioned to reduce die cracking	WESTERN DIGITAL TECHNOLOGIES, INC.
11177242	Semiconductor device including magnetic hold-down layer	WESTERN DIGITAL TECHNOLOGIES, INC.
11177246	Photo-sensitive silicon package embedding self-powered electronic system	TEXAS INSTRUMENTS INCORPORATED
11177249	Semiconductor memory device and method of manufacturing the same	SK HYNIX INC.
11177250	Method for fabrication of high density logic and memory for advanced circuit architecture	TOKYO ELECTRON LIMITED
11177251	Circuit overvoltage protection	TEXAS INSTRUMENTS INCORPORATED
11177253	Transistor with integrated capacitor	TEXAS INSTRUMENTS INCORPORATED
11177271	Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent thereto	MICRON TECHNOLOGY, INC.
11177272	Three-dimensional memory device and method for manufacturing the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11177273	Nonvolatile memory device including row decoder	SAMSUNG ELECTRONICS CO., LTD.
11177276	Conductive structures, assemblies having vertically-stacked memory cells over conductive structures, and methods of forming conductive structures	MICRON TECHNOLOGY, INC.
11177277	Word line architecture for three dimensional NAND flash memory	SANDISK TECHNOLOGIES LLC
11177282	Semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11177285	Conductive contacts in semiconductor on insulator substrate	ELPIS TECHNOLOGIES INC.
11177294	Array substrate with via hole structures, manufacturing method thereof and display device	BOE TECHNOLOGY GROUP CO., LTD.
11177300	Solid-state image pickup apparatus, method of manufacturing solid-state image pickup apparatus, and electronic apparatus	SONY CORPORATION
11177306	Support structure for integrated circuitry	--
11177307	Stacked semiconductor dies with a conductive feature passing through a passivation layer	--
11177308	CMOS sensors and methods of forming the same	--
11177318	Semiconductor package and method of forming the same	AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
11177320	Variable resistance memory device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11177343	Three-dimensional memory devices with backside isolation structures	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11177355	Semiconductor structure and manufacturing method thereof	--
11177374	Heterojunction bipolar transistor and method for forming the same	--
11177383	Semiconductor device structure and method for forming the same	--
11177394	Wide bandgap semiconductor switching device with wide area schottky junction, and manufacturing process thereof	STMICROELECTRONICS S.R.L.
11177434	Chip package	--
11177437	Alignment through topography on intermediate component for memory device patterning	INTERNATIONAL BUSINESS MACHINES CORPORATION
11177551	Antenna module	SAMSUNG ELECTRONICS CO., LTD.
11177552	Semiconductor device package and method for manufacturing the same	--
11177626	CTE-tuned pyrolytic graphite (PG) substrate to minimize joining stress between laser diode and the substrate	LAWRENCE LIVEREMORE NATIONAL SECURITY, LLC
11177628	Assembly comprising an electric component	OSRAM OLED GMBH
11177887	Substrate with stepped profile for mounting transmitter optical subassemblies and an optical transmitter or transceiver implementing same	APPLIED OPTOELECTRONICS, INC.
11178754	Display device and method of manufacturing flexible printed circuit board	SAMSUNG DISPLAY CO., LTD.
11178759	Electronic component and camera module	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11178765	Electronic device	MURATA MANUFACTURING CO., LTD.
11178771	Integrating Josephson amplifiers or Josephson mixers into printed circuit boards	INTERNATIONAL BUSINESS MACHINES CORPORATION
11178772	Component carrier connected with a separate tilted component carrier for short electric connection	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11178773	Conductor trace structure reducing insertion loss of circuit board	--
11178786	Method for manufacturing hermetic sealing lid member	HITACHI METALS, LTD.
11179029	Image sensor with tolerance optimizing interconnects	DEPUY SYNTHES PRODUCTS, INC.
11179748	Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus	SEIKO EPSON CORPORATION
11179809	Manufacturing method of glass substrate having holes, manufacturing method of interposer substrate, and method for forming hole in glass substrate	AGC INC.
11180364	Covering for a component and method for producing a covering for a component	SNAPTRACK, INC.
11180373	Nanocrystalline graphene and method of forming nanocrystalline graphene	SAMSUNG ELECTRONICS CO., LTD.
11180861	3-dimensional NOR string arrays in segmented stacks	SUNRISE MEMORY CORPORATION
11181124	Compact cooling device with radial fan adhesively bonded to a heat sink	ELEKTROSIL GMBH
11181323	Heat-dissipating device with interfacial enhancements	QUALCOMM INCORPORATED
11181566	Detection circuit of electromagnetic fault injection and security chip	SHENZHEN GOODIX TECHNOLOGY CO., LTD.
11181589	Semiconductor device	DENSO CORPORATION
11181689	Low temperature solder in a photonic device	CISCO TECHNOLOGY, INC.
11181704	Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump	INTERNATIONAL BUSINESS MACHINES CORPORATION
11181955	Electronic device having thermal diffusion structure	SAMSUNG ELECTRONICS CO., LTD.
11181959	System for transmitting power to a remote PoE subsystem by forwarding PD input voltage	CLEARONE, INC.
11182037	Display device	SAMSUNG DISPLAY CO., LTD.
11182526	Methods for engineering integrated circuit design and development	EFABLESS CORPORATION
11182529	Semiconductor device including power-grid-adapted route-spacing and method for generating layout diagram of same	--
11182530	Automatic routing system workflow	DIALOG SEMICONDUCTOR (UK) LIMITED
11182532	Hierarchical density uniformization for semiconductor feature surface planarization	--
11183226	Data and clock synchronization and variation compensation apparatus and method	INTEL CORPORATION
11183233	Semiconductor device for selectively performing isolation function and layout displacement method thereof	SAMSUNG ELECTRONICS CO., LTD.
11183246	Memory device	SK HYNIX INC.
11183257	Programmable memory	SHANGHAI HUALI MICROELECTRONICS CORPORATION
11183381	Semiconductor device	KABUSHIKI KAISHA TOSHIBA
11183394	Structure and method to expose memory cells with different sizes	--
11183399	Semiconductor device and method of manufacture	--
11183401	System and related techniques for handling aligned substrate pairs	SUSS MICROTEC LITHOGRAPHY GMBH
11183413	Methods related to preparation of a stencil to receive a plurality of IC units	ROKKO SYSTEMS PTE LTD
11183414	Secondary packaging method and secondary package of through silicon via chip	SHENZHEN GOODIX TECHNOLOGY CO., LTD.
11183419	Unconfined buried interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
11183421	Interconnection structure of metal lines, method of fabricating the same and semiconductor device	CHANGXIN MEMORY TECHNOLOGIES, INC.
11183422	Semiconductor structure and method for manufacturing the same	--
11183424	Barrier layer formation for conductive feature	--
11183436	Power module package and packaging techniques	ALLEGRO MICROSYSTEMS, LLC
11183437	Circuit package	HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
11183438	Compression-loaded printed circuit assembly for solder defect mitigation	GOOGLE LLC
11183439	Package structure for power device	--
11183440	Power modules for ultra-fast wide-bandgap power switching devices	GAN SYSTEMS INC.
11183441	Stress buffer layer in embedded package	TEXAS INSTRUMENTS INCORPORATED
11183442	Manufacturing method of heat dissipation component	--
11183443	Semiconductor structure and method for manufacturing the same	--
11183444	Packaging of a semiconductor device with a plurality of leads	ROHM CO., LTD.
11183445	Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement	INFINEON TECHNOLOGIES AG
11183446	X.5 layer substrate	QUALCOMM INCORPORATED
11183447	Flip-chip package substrate and method for fabricating the same	--
11183448	Wiring circuit board and imaging device	NITTO DENKO CORPORATION
11183449	Cryogenic integrated circuits	--
11183450	Electronic device having inverted lead pins	TEXAS INSTRUMENTS INCORPORATED
11183451	Interconnect clip with angled contact surface and raised bridge	INFINEON TECHNOLOGIES AG
11183452	Transfering informations across a high voltage gap using capacitive coupling with DTI integrated in silicon technology	INFINEON TECHNOLOGIES AUSTRIA AG
11183453	Electronic-component-embedded substrate having a wiring line with a roughened surface, electronic component device, and communication module	MURATA MANUFACTURING CO., LTD.
11183454	Functional component within interconnect structure of semiconductor device and method of forming same	--
11183455	Interconnects with enlarged contact area	INTERNATIONAL BUSINESS MACHINES CORPORATION
11183456	Memory arrays and methods used in forming a memory array	MICRON TECHNOLOGY, INC.
11183457	Semiconductor device, power converter, method for manufacturing semiconductor device, and method for manufacturing power converter	MITSUBISHI ELECTRIC CORPORATION
11183458	Integrated circuit packaging structure and method	SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
11183459	Fabric-based items with electrical component arrays	APPLE INC.
11183460	Embedded die packaging with integrated ceramic substrate	TEXAS INSTRUMENTS INCORPORATED
11183461	Semiconductor structure and manufacturing method thereof	--
11183462	Substrate having electronic component embedded therein	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11183463	Chip package method and chip package structure	SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
11183464	Package substrate processing method and protective tape	DISCO CORPORATION
11183465	Radio-frequency module	MURATA MANUFACTURING CO., LTD.
11183466	Semiconductor package including an electromagnetic shield and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11183467	Flexible circuit board, method for mounting the same, and display device	BOE TECHNOLOGY GROUP CO., LTD.
11183468	Chip protected against back-face attacks	STMICROELECTRONICS (CROLLES 2) SAS
11183469	Semiconductor device	KIOXIA CORPORATION
11183470	Semiconductor package including decoupling capacitor	SK HYNIX INC.
11183471	Semiconductor device	RENESAS ELECTRONICS CORPORATION
11183472	Semiconductor device and manufacturing method of semiconductor device for improving solder connection strength	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11183473	Integrated circuit structure having dies with connectors of different sizes	--
11183474	Electronic device package and method for manufacturing the same	--
11183475	Semiconductor structure	--
11183476	Silicon carbide semiconductor device, silicon carbide semiconductor assembly, and method of manufacturing silicon carbide semiconductor device	FUJI ELECTRIC CO., LTD.
11183477	Mixed hybrid bonding structures and methods of forming the same	INTEL CORPORATION
11183478	Apparatus and method for transferring semiconductor devices from a substrate and stacking semiconductor devices on each other	ROHINNI, LLC
11183479	Semiconductor device, method for manufacturing the same, and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11183480	Semiconductor device	DENSO CORPORATION
11183482	Shift control method in manufacture of semiconductor device	--
11183483	Multichip module and electronic device	MITSUBISHI HEAVY INDUSTRIES, LTD.
11183484	Semiconductor module, DIMM module, manufacturing method of semiconductor module, and manufacturing method of DIMM module	ULTRAMEMORY INC.
11183485	Semiconductor module	SUMITOMO ELECTRIC INDUSTRIES, LTD.
11183487	Integrated circuit package and method	--
11183488	Three-dimensional memory devices with stacked device chips using interposers	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11183489	Power electronics module	AUDI AG
11183490	Multi-layer power converter with devices having reduced lateral current	PSEMI CORPORATION
11183493	Semiconductor device using EMC wafer support system and fabricating method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11183498	Semiconductor memory device having an electrically floating body transistor	ZENO SEMICONDUCTOR, INC.
11183502	Memory cell and Method for reading out data therefrom	--
11183504	Structures for testing nanoscale devices including ferroelectric capacitors and methods for forming the same	--
11183509	Non-volatile memory with silicided bit line contacts	CYPRESS SEMICONDUCTOR CORPORATION
11183513	Semiconductor device and method for fabricating the same	--
11183517	Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same	SAMSUNG DISPLAY CO., LTD.
11183521	Display device having an embedded shielding layer flexible substrate	SAMSUNG DISPLAY CO., LTD.
11183540	Imaging element, method of manufacturing imaging element, and imaging device	SONY CORPORATION
11183577	Formation of air gap spacers for reducing parasitic capacitance	INTERNATIONAL BUSINESS MACHINES CORPORATION
11183588	Semiconductor device and inverter	MITSUBISHI ELECTRIC CORPORATION
11183621	Component having a buffer layer and method for producing a component	OSRAM OLED GMBH
11183949	Power conversion device with a coolant passage	DENSO CORPORATION
11184973	Printed circuit board including auxiliary power supply and electronic apparatus including the same	SAMSUNG ELECTRONICS CO., LTD.
11184983	Embedding known-good component between known-good component carrier blocks with late formed electric connection structure	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11184991	Break out module system	MOLEX, LLC
11186060	Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same	CORNING INCORPORATED
11186742	Sealing resin composition, electronic component device, and method of manufacturing electronic component device	SHOWA DENKO MATERIALS CO., LTD.
11187468	Loop heat pipe wick, loop heat pipe, cooling device, and electronic device, and method for manufacturing porous rubber and method for manufacturing loop heat pipe wick	RICOH COMPANY, LTD.
11187742	Display panel and method for testing for occurrence of crack in display panel	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11187926	Binding device, display panel, binding system and operating method thereof	BOE TECHNOLOGY GROUP CO., LTD.
11188133	System for transmitting power to a remote PoE subsystem by forwarding PD input voltage	CLEARONE, INC.
11188237	Anti-hacking mechanisms for flash memory device	SILICON STORAGE TECHNOLOGY, INC.
11188701	Stacked chip layout	--
11189207	Chip-on-film and display including the same	LG DISPLAY CO., LTD.
11189338	Multi-rank high bandwidth memory (HBM) memory	XILINX, INC.
11189340	Circuit in memory device for parasitic resistance reduction	--
11189409	Electronic substrates having embedded dielectric magnetic material to form inductors	INTEL CORPORATION
11189466	High voltage switching circuit	RENO TECHNOLOGIES, INC.
11189479	Diffusion barrier layer	APPLIED MATERIALS, INC.
11189485	Steam oxidation initiation for high aspect ratio conformal radical oxidation	APPLIED MATERIALS, INC.
11189500	Method of manufacturing a component carrier with an embedded cluster and the component carrier	AT&S (CHONGQING) COMPANY LIMITED
11189501	Chip package structure and manufacturing method thereof	--
11189507	Chip packaging apparatus and method thereof	CAPCON LIMITED
11189515	Method for alignment, process tool and method for wafer-level alignment	--
11189523	Semiconductor structure and fabrication method thereof	--
11189524	Semiconductor arrangement and method of making	--
11189525	Via-first process for connecting a contact and a gate electrode	--
11189526	Apparatus comprising staircase structures	MICRON TECHNOLOGY, INC.
11189527	Self-aligned top vias over metal lines formed by a damascene process	INTERNATIONAL BUSINESS MACHINES CORPORATION
11189528	Subtractive RIE interconnect	INTERNATIONAL BUSINESS MACHINES CORPORATION
11189530	Manufacturing method of chips	DISCO CORPORATION
11189534	Semiconductor assembly and deterioration detection method	FUJI ELECTRIC CO., LTD.
11189535	Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad	SAMSUNG ELECTRONICS CO., LTD.
11189537	Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit	INFINEON TECHNOLOGIES AG
11189538	Semiconductor structure with polyimide packaging and manufacturing method	--
11189539	Apparatus having a functional structure delimited by a frame structure and method for producing same	INFINEON TECHNOLOGIES AG
11189540	Arrangement and thermal management of 3D stacked dies	ADVANCED MICRO DEVICES, INC.
11189541	Semiconductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11189542	Method for fabricating an electronic module via compression molding	INFINEON TECHNOLOGIES AUSTRIA AG
11189543	Board assembly with chemical vapor deposition diamond (CVDD) windows for thermal transport	MICROCHIP TECHNOLOGY CALDICOT LIMITED
11189544	Plurality of cooling tubes with coolant for a power conversion package	DENSO CORPORATION
11189545	Semiconductor device and method for manufacturing the same	--
11189546	Semiconductor arrangement and method for making	--
11189547	Semiconductor module and semiconductor module manufacturing method	FUJI ELECTRIC CO., LTD.
11189548	Pre-encapsulated lead frames for microelectronic device packages, and associated methods	MICRON TECHNOLOGY, INC.
11189549	Semiconductor device and method for manufacturing the same	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11189550	Low-cost semiconductor package using conductive metal structure	JMJ KOREA CO., LTD.
11189551	Semiconductor device	TDK CORPORATION
11189552	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11189553	Wiring substrate, semiconductor package having the wiring substrate, and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11189554	Semiconductor device	NUFLARE TECHNOLOGY, INC.
11189555	Chip packaging with multilayer conductive circuit	--
11189556	Manufacturing of a power semiconductor module	ABB POWER GRIDS SWITZERLAND AG
11189557	Hybrid package	NXP USA, INC.
11189558	Process to yield ultra-large integrated circuits and associated integrated circuits	RAYTHEON COMPANY
11189559	Semiconductor device and fabrication method thereof	--
11189560	Semiconductor device comprising etch stop layer over dielectric layer and method of manufacture	--
11189561	Placing top vias at line ends by selective growth of via mask from line cut dielectric	INTERNATIONAL BUSINESS MACHINES CORPORATION
11189562	Interconnection structure having increased conductive features and method of manufacturing the same	--
11189563	Semiconductor structure and manufacturing method thereof	--
11189564	Metal-oxide-semiconductor field-effect-transistors (MOSFET) as antifuse elements	INTEL CORPORATION
11189565	Semiconductor device with programmable anti-fuse feature and method for fabricating the same	--
11189566	Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias	INTERNATIONAL BUSINESS MACHINES CORPORATION
11189567	Semiconductor package	SAMSUNG ELECTRONICS CO., LTD.
11189568	Top via interconnect having a line with a reduced bottom dimension	INTERNATIONAL BUSINESS MACHINES CORPORATION
11189569	Power grid layout designs for integrated circuits	ADVANCED MICRO DEVICES, INC.
11189570	Integrated circuit (IC) device	SAMSUNG ELECTRONICS CO., LTD.
11189571	Electronic circuit device and method of manufacturing electronic circuit device	RISING TECHNOLOGIES CO., LTD.
11189572	Maintaining height of alignment key in semiconductor devices	SAMSUNG ELECTRONICS CO., LTD.
11189573	Semiconductor package with electromagnetic interference shielding using metal layers and vias	INTEL CORPORATION
11189574	Microelectronic package having electromagnetic interference shielding	INTEL CORPORATION
11189575	Specialized surface mount device for symmetric heat distribution in package	QUALCOMM INCORPORATED
11189576	Semiconductor device package and a method of manufacturing the same	--
11189577	Semiconductor structure	--
11189578	Electronic chip	STMICROELECTRONICS (ROUSSET) SAS
11189579	Semiconductor module and semiconductor device using the same	FUJI ELECTRIC CO., LTD.
11189580	Electrostatic discharge protection in integrated circuits	INTEL CORPORATION
11189581	Electronic device including semiconductor package including package ball	SAMSUNG ELECTRONICS CO., LTD.
11189582	Wire bond pad design for compact stacked-die package	WESTERN DIGITAL TECHNOLOGIES INC.
11189583	Semiconductor structure and manufacturing method thereof	--
11189584	Driving chip including bonding pads in non-display area and display panel	WUHAN CHINA STAR OPTOELEETRONIES TECHNOLOGY CO., LTD.
11189585	Selective recess of interconnects for probing hybrid bond devices	INTEL CORPORATION
11189586	Semiconductor device and fabrication method of the semiconductor device	ROHM CO., LTD.
11189587	Semiconductor device package with organic reinforcement structure	--
11189588	Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methods	MICRON TECHNOLOGY, INC.
11189589	Semiconductor structure with raised implanted region and manufacturing method thereof	--
11189590	Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies	MICRON TECHNOLOGY, INC.
11189591	Electronic module	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11189592	Multi-clip structure for die bonding	INFINEON TECHNOLOGIES AUSTRIA AG
11189593	Integrated device package	ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
11189594	Bonding apparatus and bonding method	SHINKAWA LTD.
11189595	Package-on-package assembly with wire bond vias	INVENSAS CORPORATION
11189596	Methods of forming multi-chip wafer level packages	--
11189597	Chip on film package	--
11189598	Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same	STATS CHIPPAC PTE. LTD.
11189599	System formed through package-in-package formation	--
11189600	Method of forming sacrificial self-aligned features for assisting die-to-die and die-to-wafer direct bonding	SAMSUNG ELECTRONICS CO., LTD.
11189603	Semiconductor packages and methods of forming same	--
11189604	Device assembly structure and method of manufacturing the same	--
11189608	Semiconductor device	FUJI ELECTRIC CO., LTD.
11189609	Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devices	MICRON TECHNOLOGY, INC.
11189610	Substrate structure and manufacturing process	--
11189612	Semiconductor device for downsizing and reducing resistance and inductance	ROHM CO., LTD.
11189630	Memory device and electronic device including insulating patterns with different thermal conductivities	SK HYNIX INC.
11189631	Three-dimensional flash memory device including channel structures having enlarged portions	SAMSUNG ELECTRONICS CO., LTD.
11189632	Integrated circuit devices and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11189634	Non-volatile memory device including vertical pass transistors having a greater width in an area between a gate and a word line than a width of a channel structure in an area between a ground select line and the word line	SAMSUNG ELECTRONICS CO., LTD.
11189636	Vertical memory device with a channel layer in a stacked dielectric layer	SAMSUNG ELECTRONICS CO., LTD.
11189637	Three-dimensional memory array including self-aligned dielectric pillar structures and methods of making the same	SANDISK TECHNOLOGIES LLC
11189638	Semiconductor memory device including three-dimensionally stacked memory cells	KIOXIA CORPORATION
11189640	Integrated circuit including asymmetric ending cells and system-on-chip including the same	SAMSUNG ELECTRONICS CO., LTD.
11189648	Array substrate and display device	BOE TECHNOLOGY GROUP CO., LTD.
11189662	Memory cell stack and via formation for a memory device	MICRON TECHNOLOGY, INC.
11189686	Integrated device coupled to a capacitor structure comprising a trench capacitor	QUALCOMM INCORPORATED
11189755	Light emitting diode having side reflection layer	SEOUL VIOSYS CO., LTD.
11189770	LS grid core LED connector system and manufacturing method	--
11189905	Integrated antenna array packaging structures and methods	INTERNATIONAL BUSINESS MACHINES CORPORATION
11189990	Semiconductor laser component and method of producing a semiconductor laser component	OSRAM OLED GMBH
11190145	Power amplifier with integrated bias circuit having multi-point input	NXP USA, INC.
11190182	Control circuitry for silicon-on-insulator chip	SKYWORKS SOLUTIONS, INC.
11190460	System-in-package network processors	INTEL CORPORATION
11191164	Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board	DAI NIPPON PRINTING CO., LTD.
11191168	Method of manufacturing composite circuit board and composite circuit board	HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
11191169	Method and apparatus for flexible circuit cable attachment	JABIL INC.
11191187	Electronic assembly with phase-change material for thermal performance	DEERE & COMPANY
11191192	Electric power conversion apparatus	DENSO CORPORATION
11191198	Shield package	TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
11191445	Reflector markers and systems and methods for identifying and locating them	CIANNA MEDICAL, INC.
11192209	Laser pretreatment of metal substrates for electrical circuit boards	AB MIKROELEKTRONIK GMBH
11192777	MEMS sensor package systems and methods	INFINEON TECHNOLOGIES AG
11193015	Thermosetting resin composition for semiconductor package and prepreg using the same	LG CHEM, LTD.
11193047	Electrically conductive adhesive film and dicing-die bonding film using the same	FURUKAWA ELECTRIC CO., LTD.
11193953	3D chip testing through micro-C4 interface	INTERNATIONAL BUSINESS MACHINES CORPORATION
11193957	Shunt resistor averaging techniques	ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
11194180	Optical adjustable filter sub-assembly	IL-VI DELAWARE, INC.
11194199	Method of manufacturing array substrate, array substrate, and LCD panel	TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD
11194944	False path timing exception handler circuit	TEXAS INSTRUMENTS INCORPORATED
11194990	Fingerprint sensor device and method	--
11195088	Data processing device using neural network, electronic component, and electronic device	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11195269	Exposed pad integrated circuit package	TEXAS INSTRUMENTS INCORPORATED
11195470	Display device	--
11195572	Multi-die memory device	RAMBUS INC.
11195587	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11195648	Electronic appliance and power conversion apparatus	FUJI ELECTRIC CO., LTD.
11195698	RF impedance matching circuit and systems and methods incorporating same	RENO TECHNOLOGIES, INC.
11195725	Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby	TEXAS INSTRUMENTS INCORPORATED
11195726	Semiconductor device and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11195727	High density organic interconnect structures	INTEL CORPORATION
11195728	Temporary protective film for semiconductor sealing molding	SHOWA DENKO MATERIALS CO., LTD.
11195740	Methods and apparatus for wafer handling and processing	MICRON TECHNOLOGY, INC.
11195741	Micro device arrangement in donor substrate	VUEREAL INC.
11195748	Interconnect structures and methods for forming same	INVENSAS CORPORATION
11195749	Semiconductor device and manufacturing method	FUJI ELECTRIC CO., LTD.
11195750	Etch profile control of interconnect structures	--
11195751	Bilayer barrier for interconnect and memory structures formed in the BEOL	INTERNATIONAL BUSINESS MACHINES CORPORATION
11195752	Semiconductor device and method of forming same	--
11195753	Tiered-profile contact for semiconductor	INTERNATIONAL BUSINESS MACHINES CORPORATION
11195755	Field effect transistor devices with self-aligned source/drain contacts and gate contacts positioned over active transistors	INTERNATIONAL BUSINESS MACHINES CORPORATION
11195761	IC structure with short channel gate structure having shorter gate height than long channel gate structure	GLOBALFOUNDRIES U.S. INC.
11195768	Through electrode substrate, manufacturing method thereof and mounting substrate	DAI NIPPON PRINTING CO., LTD.
11195769	Thermosetting composition for use as underfill material, and semiconductor device	PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
11195770	Method of manufacturing semiconductor device, semiconductor device, and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11195771	Substrate structure of semiconductor device package and method of manufacturing the same	--
11195772	CMOS based devices for harsh media	MELEXIS TECHNOLOGIES NV
11195773	Flip chip assembly of quantum computing devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
11195774	Semiconductor packages	SAMSUNG ELECTRONICS CO., LTD.
11195775	Semiconductor module, semiconductor device, and manufacturing method of semiconductor module	FUJI ELECTRIC CO., LTD.
11195776	Power module substrate and power module	KYOCERA CORPORATION
11195777	Semiconductor module and method of evaluating semiconductor module	MITSUBISHI ELECTRIC CORPORATION
11195778	Electronic power module	AUDI AG
11195779	Electronic module for motherboard	RAYTHEON COMPANY
11195780	Stacked silicon package assembly having thermal management using phase change material	XILINX, INC.
11195781	Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer	SANDISK TECHNOLOGIES LLC
11195782	Semiconductor device and manufacturing method thereof	RENESAS ELECTRONICS CORPORATION
11195783	Semiconductor device	ROHM CO., LTD.
11195784	Semiconductor device sub-assembly	DYNEX SEMICONDUCTOR LIMITED
11195785	Interposer with through electrode having a wiring protection layer	SAMSUNG ELECTRONICS CO., LTD.
11195786	Ball grid array substrate	WESTERN DIGITAL TECHNOLOGIES, INC.
11195787	Semiconductor device including an antenna	INFINEON TECHNOLOGIES AG
11195788	Hybrid dielectric scheme in packages	--
11195789	Integrated circuit module with a structurally balanced package using a bottom side interposer	INTERNATIONAL BUSINESS MACHINES CORPORATION
11195790	Fan-out semiconductor package	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11195791	Method for forming semiconductor contact structure	--
11195792	Top via stack	INTERNATIONAL BUSINESS MACHINES CORPORATION
11195793	Metal filling in a dielectric layer under metal layer one (M1)and above an active device layer in semiconductor devices	QUALCOMM INCORPORATED
11195794	Stacked integrated circuit devices including a routing wire	SAMSUNG ELECTRONICS CO., LTD.
11195795	Well-controlled edge-to-edge spacing between adjacent interconnects	INTERNATIONAL BUSINESS MACHINES CORPORATION
11195796	Semiconductor device structure and method for forming the same	--
11195797	Applications of buried power rails	SAMSUNG ELECTRONICS CO., LTD.
11195798	Tungsten alloys in semiconductor devices	INTEL CORPORATION
11195799	Hybrid readout package for quantum multichip bonding	INTERNATIONAL BUSINESS MACHINES CORPORATION
11195800	Electronic device module and method of manufacturing the same	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11195801	Embedded reference layers for semiconductor package substrates	INTEL CORPORATION
11195802	Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof	--
11195803	Semiconductor element, semiconductor device, power conversion device, and method of manufacturing semiconductor element	MITSUBISHI ELECTRIC CORPORATION
11195804	Semiconductor structure	--
11195805	Capacitor die embedded in package substrate for providing capacitance to surface mounted die	INTEL CORPORATION
11195806	High frequency waveguide structure	INTEL CORPORATION
11195807	Semiconductor device, high-frequency power amplifier, and method of manufacturing semiconductor device	MITSUBISHI ELECTRIC CORPORATION
11195808	Electronic package having antenna function and fabrication method thereof	--
11195809	Semiconductor package having a sidewall connection	STMICROELECTRONICS LTD
11195810	Bonding structure and method of forming same	--
11195811	Dielectric and metallic nanowire bond layers	TEXAS INSTRUMENTS INCORPORATED
11195812	Method for fabricating an encapsulated electronic package using a supporting plate	--
11195813	Anisotropic conductive film and production method of the same	DEXERIALS CORPORATION
11195814	Semiconductor device having second connector that overlaps a part of first connector	KABUSHIKI KAISHA TOSHIBA
11195815	Semiconductor device and manufacturing method thereof with Cu and Sn intermetallic compound	DENSO CORPORATION
11195816	Integrated circuit packages comprising a plurality of redistribution structures and methods of forming the same	--
11195817	Semiconductor package and manufacturing method thereof	--
11195818	Backside contact for thermal displacement in a multi-wafer stacked integrated circuit	--
11195819	Semiconductor device	LONGITUDE LICENSING LIMITED
11195820	Semiconductor device including fractured semiconductor dies	SANDISK TECHNOLOGIES LLC
11195823	Semiconductor package and manufacturing method thereof	--
11195830	Memory devices	MICRON TECHNOLOGY, INC.
11195837	Semiconductor devices including support patterns	SAMSUNG ELECTRONICS CO., LTD.
11195846	Staircase structures for three-dimensional memory device double-sided routing	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11195849	Semiconductor device and method of manufacturing the same	TOSHIBA MEMORY CORPORATION
11195851	Semiconductor memory device	SK HYNIX INC.
11195852	Semiconductor memory device having wiring line structure	SK HYNIX INC.
11195853	Contact structures having conductive portions in substrate in three-dimensional memory devices and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11195855	Semiconductor memory device and method of manufacturing the same	KIOXIA CORPORATION
11195870	Semiconductor apparatus and device	CANON KABUSHIKI KAISHA
11195876	Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods	MICRON TECHNOLOGY, INC.
11195898	Organic light emitting diode display device	SAMSUNG DISPLAY CO., LTD.
11195904	High-frequency transistor	NUVOTON TECHNOLOGY CORPORATION JAPAN
11195920	Semiconductor structure having porous semiconductor segment for RF devices and bulk semiconductor region for non-RF devices	NEWPORT FAB, LLC
11195930	Semiconductor devices with backside power rail and methods of fabrication thereof	--
11195932	Ferroelectric gate dielectrics in integrated circuits	INTEL CORPORATION
11195939	Common-emitter and common-base heterojunction bipolar transistor	WAYTHON INTELLIGENT TECHNOLOGIES SUZHOU CO., LTD
11195971	Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate	SONY CORPORATION
11195997	Variable resistance memory devices including self-heating layer and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11196019	Display device and method of fabricating the same	SAMSUNG DISPLAY CO., LTD.
11196142	Millimeter wave antenna and EMI shielding integrated with fan-out package	MICRON TECHNOLOGY, INC.
11196165	Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications	INTEL CORPORATION
11196243	Pin-short detection circuits	TEXAS INSTRUMENTS INCORPORATED
11196394	Power amplifier module	MURATA MANUFACTURING CO., LTD.
11197367	Component carrier comprising a double layer structure	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11197377	Flexible circuit board and method for producing same	STEMCO CO., LTD.
11197398	Installation structure and installation method of plug-in switch tube	SHENZHEN VMAX NEW ENERGY CO., LTD.
11198807	Thermal interface materials with radiative coupling heat transfer	INTERNATIONAL BUSINESS MACHINES CORPORATION
11199776	Resin composition	TORAY INDUSTRIES, INC.
11199866	Voltage regulator with power rail tracking	--
11200952	Non-volatile memory device	SAMSUNG ELECTRONICS CO., LTD.
11201007	Modulated inductance module	--
11201049	Thiourea organic compound for gallium arsenide based optoelectronics surface passivation	INTERNATIONAL BUSINESS MACHINES CORPORATION
11201057	Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation	APPLIED MATERIALS, INC.
11201066	Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package	SKYWORKS SOLUTIONS, INC.
11201069	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11201095	Chip package having a cover with window	XILINX, INC.
11201096	Packaged device with die wrapped by a substrate	TEXAS INSTRUMENTS INCORPORATED
11201097	Method of manufacture of a semiconductor device	--
11201098	Semiconductor module having a base plate with a concave curvature	SIEMENS AKTIENGESELLSCHAFT
11201099	Semiconductor device and method of manufacturing the same	DENSO CORPORATION
11201100	Solid-state storage device	--
11201101	Electronic component	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11201102	Module lid with embedded two-phase cooling and insulating layer	INTERNATIONAL BUSINESS MACHINES CORPORATION
11201103	Vapor chamber on heat-generating component	MICROSOFT TECHNOLOGY LICENSING, LLC
11201104	Thermal management using variation of thermal resistance of thermal interface	ADVANCED MICRO DEVICES, INC.
11201105	Semiconductor package having a spacer with a junction cooling pipe	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11201106	Semiconductor device with conductors embedded in a substrate	--
11201107	Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer	SANDISK TECHNOLOGIES LLC
11201108	Semiconductor package mounted substrate	SAMSUNG ELECTRONICS CO., LTD.
11201109	Hermetic metallized via with improved reliability	CORNING INCORPORATED
11201110	Semiconductor device package with conductive pillars and method for manufacturing the same	--
11201111	Three-dimensional memory device containing structures for enhancing gate-induced drain leakage current and methods of forming the same	SANDISK TECHNOLOGIES LLC
11201112	Fully-aligned skip-vias	INTERNATIONAL BUSINESS MACHINES CORPORATION
11201113	Integrated passive coupler and method	NXP B.V.
11201114	Methods of forming thin film resistor structures utilizing interconnect liner materials	INTEL CORPORATION
11201115	Semiconductor device	--
11201116	Semiconductor device having inter-metal dielectric patterns and method for fabricating the same	UNITED SEMICONDUCTOR (XIAMEN) CO., LTD.
11201118	Chip package and method of forming the same	--
11201119	RF functionality and electromagnetic radiation shielding in a component carrier	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11201120	Display having an amorphous silicon light shield below a thin film transistor	BOE TECHNOLOGY GROUP CO., LTD.
11201121	Semiconductor device	FUJI ELECTRIC CO., LTD.
11201122	Method of fabricating semiconductor device with reduced warpage and better trench filling performance	--
11201123	Substrate structure and manufacturing method thereof	--
11201124	Semiconductor devices, semiconductor wafers, and methods of manufacturing the same	OMNIVISION TECHNOLOGIES, INC.
11201125	Semiconductor package and semiconductor process	--
11201126	Method of producing a substrate and system for producing a substrate	DISCO CORPORATION
11201127	Device comprising contact to contact coupling of packages	QUALCOMM INCORPORATED
11201128	Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages	INTEL CORPORATION
11201129	Designs and methods for conductive bumps	INTEL CORPORATION
11201130	Semiconductor device	SUMITOMO ELECTRIC INDUSTRIES, LTD.
11201131	Light emitting module	NICHIA CORPORATION
11201132	Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus	SHINKAWA LTD.
11201133	Bonding apparatus and method	SAMSUNG DISPLAY CO., LTD.
11201134	Method of manufacturing semiconductor device	--
11201135	Three dimensional integrated circuits stacking approach	--
11201136	High bandwidth module	INTERNATIONAL BUSINESS MACHINES CORPORATION
11201137	Systems and methods for powering an integrated circuit having multiple interconnected die	CEREBRAS SYSTEMS INC.
11201138	Wafer level integration including design/co-design, structure process, equipment stress management and thermal management	INTERNATIONAL BUSINESS MACHINES CORPORATION
11201139	Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same	SANDISK TECHNOLOGIES LLC
11201140	Semiconductor packages including stacked sub-packages with interposing bridges	SK HYNIX INC.
11201142	Semiconductor package, package on package structure and method of froming package on package structure	--
11201143	Semiconductor device with a protruding base member	HITACHI ASTEMO, LTD.
11201146	Semiconductor device structures	--
11201148	Architecture for monolithic 3D integration of semiconductor devices	TOKYO ELECTRON LIMITED
11201149	Semiconductor devices	SK HYNIX INC.
11201150	System on chip	SAMSUNG ELECTRONICS CO., LTD.
11201159	SRAM structure and connection	--
11201161	Efuse memory cell, eFuse memory array and using method thereof, and eFuse system	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11201165	Memory having memory cell string and coupling components	MICRON TECHNOLOGY, INC.
11201170	Three-dimensional semiconductor memory device and manufacturing method of the three-dimensional semiconductor memory device	SK HYNIX INC.
11201173	Array substrate, display panel and display device	HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
11201185	Solid-state imaging device and electronic apparatus	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11201190	RRAM memory cell with multiple filaments	--
11201199	Chip on film package including a protection layer and display device including the chip on film package	SAMSUNG DISPLAY CO., LTD.
11201205	Interconnect layout for semiconductor device	--
11201206	Semiconductor device including metal insulator metal capacitor	--
11201212	MOSFET with ultra low drain leakage	INTERNATIONAL BUSINESS MACHINES CORPORATION
11201219	Integrated circuit device and method of manufacturing integrated circuit device	TOSHIBA MEMORY CORPORATION
11201235	Semiconductor device, method for producing semiconductor device, power supply device, and amplifier	FUJITSU LIMITED
11201270	Method for increasing the light output of microLED devices using quantum dots	NANOSYS, INC.
11201281	Method for forming a flat bottom electrode via (BEVA) top surface for memory	--
11201386	Semiconductor device package and method for manufacturing the same	--
11201466	Electrostatic discharge clamp structures	GLOBALFOUNDRIES U.S. INC.
11201602	Apparatus and methods for tunable filtering	ANALOG DEVICES, INC.
11202390	Heat dissipation unit connection reinforcement structure	--
11203524	Microelectromechanical system cavity packaging	TEXAS INSTRUMENTS INCORPORATED
11203525	Method of controlling the placement of micro-objects	PALO ALTO RESEARCH CENTER INCORPORATED
11204313	Throughput-scalable analytical system using transmembrane pore sensors	GENESENSE TECHNOLOGY INC.
11204530	Array substrate and display device	WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
11204549	Superstrate with an offset mesa and methods of using the same	CANON KABUSHIKI KAISHA
11205033	Method, apparatus and system for wide metal line for SADP routing	GLOBALFOUNDRIES INC.
11205035	Bump connection placement in quantum devices in a flip chip configuration	INTERNATIONAL BUSINESS MACHINES CORPORATION
11205485	Three-dimensional NAND flash memory device having improved data reliability by varying program intervals, and method of operating the same	SAMSUNG ELECTRONICS CO., LTD.
11205573	Ge-containing Co-film forming material, Ge-containing Co film and film forming method thereof	L'AIR LIQUIDE, SOCIET&#XE9; ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROC&#XE9;D&#XE9;S GEORGES CLAUDE
11205579	Molding wafer chamber	--
11205586	Integrated circuits with line breaks and line bridges within a single interconnect level	INTEL CORPORATION
11205587	Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability	INTERNATIONAL BUSINESS MACHINES CORPORATION
11205590	Self-aligned contacts for MOL	INTERNATIONAL BUSINESS MACHINES CORPORATION
11205591	Top via interconnect with self-aligned barrier layer	INTERNATIONAL BUSINESS MACHINES CORPORATION
11205592	Self-aligned top via structure	INTERNATIONAL BUSINESS MACHINES CORPORATION
11205600	Integrated circuits protected by substrates with cavities, and methods of manufacture	INVENSAS CORPORATION
11205601	Semiconductor package and semiconductor apparatus	SAMSUNG ELECTRONICS CO., LTD.
11205602	Semiconductor device and manufacturing method thereof	AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
11205603	Semiconductor package and method manufacturing the same	--
11205604	Semiconductor package including a thermal conductive layer and method of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11205605	Semiconductor structure with back gate and method of fabricating the same	--
11205606	Semiconductor device package	--
11205607	Semiconductor structure and method of manufacturing thereof	--
11205608	Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus	ADVANCED INTERCONNECT SYSTEMS LIMITED
11205609	Semiconductor structure with an air gap	--
11205610	Base body with soldered-on ground pin, method for its production and uses thereof	SCHOTT AG
11205611	Leadframe capacitors	TEXAS INSTRUMENTS INCORPORATED
11205612	Integrated circuit package and method	--
11205613	Organic mold interconnects in shielded interconnects frames for integrated-circuit packages	INTEL CORPORATION
11205614	Stack packages	SAMSUNG ELECTRONICS CO., LTD.
11205615	Semiconductor device and method of manufacture	--
11205616	Internal node jumper for memory bit cells	INTEL CORPORATION
11205617	Interconnect structure having a graphene layer	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11205618	Graphene barrier layer	--
11205619	Hybrid bonding using dummy bonding contacts and dummy interconnects	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11205620	Method and apparatus for supplying power to VLSI silicon chips	INTERNATIONAL BUSINESS MACHINES CORPORATION
11205621	Device and method for alignment of vertically stacked wafers and die	STMICROELECTRONICS, INC.
11205622	Stiffener shield for device integration	INTEL CORPORATION
11205623	Microwave device and antenna for improving heat dissipation	MITSUBISHI ELECTRIC CORPORATION
11205625	Wafer-level bonding of obstructive elements	INVENSAS BONDING TECHNOLOGIES, INC.
11205626	Coreless organic packages with embedded die and magnetic inductor structures	INTEL CORPORATION
11205627	Semiconductor device package including emitting devices and method of manufacturing the same	--
11205628	Semiconductor device package and method of manufacturing the same	--
11205629	Package structure and method of fabricating the same	--
11205630	Vias in composite IC chip structures	INTEL CORPORATION
11205631	Semiconductor package including multiple semiconductor chips	SAMSUNG ELECTRONICS CO., LTD.
11205632	Wiring substrate and semiconductor device	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11205633	Methods of bonding of semiconductor elements to substrates, and related bonding systems	KULICKE AND SOFFA INDUSTRIES, INC.
11205634	Bonding apparatus with replaceable bonding tool	ASM TECHNOLOGY SINGAPORE PTE LTD
11205635	Low temperature hybrid bonding structures and manufacturing method thereof	--
11205636	Semiconductor package and method of manufacturing the same	--
11205637	Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics	SAMSUNG ELECTRONICS CO., LTD.
11205638	Stack packages including an interconnection structure	SK HYNIX INC.
11205640	Semiconductor packages having package-on-package (PoP) structures	SAMSUNG ELECTRONICS CO., LTD.
11205642	Twistable light emitting diode display module	--
11205643	Optoelectronic circuit assembly and method for repairing an optoelectronic circuit assembly	OSRAM OLED GMBH
11205644	Method for fabricating electronic package	--
11205645	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11205652	Semiconductor memory device and method of fabricating the same	SAMSUNG ELECTRONICS CO., LTD.
11205658	Three-dimensional memory device with corrosion-resistant composite spacer	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11205662	Methods for reducing defects in semiconductor plug in three-dimensional memory device	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11205663	Vertical memory devices and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11205670	Alignment of multiple image dice in package	TELEDYNE DIGITAL IMAGING, INC.
11205695	Method of fabricating a thick oxide feature on a semiconductor wafer	TEXAS INSTRUMENTS INCORPORATED
11205696	High dielectric constant material at locations of high fields	SKYWORKS SOLUTIONS, INC.
11205702	Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit	SOITEC
11205704	Semiconductor device and production method therefor	MITSUBISHI ELECTRIC CORPORATION
11205724	Self-aligned gate hard mask and method forming same	--
11205768	Method for manufacturing of display device	SAMSUNG DISPLAY CO., LTD.
11205867	Grid array connector system	MOLEX, LLC
11205873	Connector cage and radiator	TYCO ELECTRONICS (SHANGHAI) CO. LTD.
11205937	Driving system having reduced vibration transmission	ASM TECHNOLOGY SINGAPORE PTE LTD
11206005	Compositions of influenza hemagglutinin with heterologous epitopes and/or altered maturation cleavage sites and methods of use thereof	CG DISCOVERY, INC.
11206731	Communication module	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11206734	Electronic device and wiring structure thereof	--
11206740	High voltage power module	CREE FAYETTEVILLE, INC.
11206749	Tubular heat spreaders for memory modules and memory modules incorporating the same	MICRON TECHNOLOGY, INC.
11207744	Two-step solder-mask-defined design	MICRON TECHNOLOGY, INC.
11208009	Electrical apparatus	HONDA MOTOR CO., LTD.
11208540	Method of making cured parts	SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
11209214	Heat dissipation device	--
11209216	Ultra thin heat exchangers for thermal management	DANA CANADA CORPORATION
11209220	Fractal heat transfer device	FRACTAL HEATSINK TECHNOLOGIES LLC
11209323	Sensor package with reduced height cavity walls and sensor package module including the same	HAESUNG DS CO., LTD.
11209739	Method and apparatus for aligning two optical subsystems	EV GROUP E. THALLNER GMBH
11209872	Electronic device module, method of manufacturing the same and electronic apparatus	SAMSUNG ELECTRO-MECHANICS CO., LTD.
11210447	Reconfiguring layout and sizing for transistor components to simultaneously optimize logic devices and non-logic devices	--
11210601	Circuit assembly, a system and a method for cooling quantum electric devices	IQM FINLAND OY
11211105	Memory device comprising programmable command-and-address and/or data interfaces	RAMBUS INC.
11211108	Ferroelectric memory device	IMEC VZW
11211114	Memories and memory components with interconnected and redundant data interfaces	RAMBUS INC.
11211134	Efuse circuit, method, layout, and structure	--
11211255	Semiconductor structure	SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
11211261	Package structures and methods for forming the same	--
11211262	Electronic apparatus having inter-chip stiffener	INTERNATIONAL BUSINESS MACHINES CORPORATION
11211263	Structure for arrayed partial molding of packages	QUALCOMM INCORPORATED
11211273	Carrier substrate and packaging method using the same	SAMSUNG ELECTRONICS CO., LTD.
11211279	Method for processing a 3D integrated circuit and structure	MONOLITHIC 3D INC.
11211287	Semiconductor device and method for fabricating the same	--
11211288	Semiconductor device	TOKYO ELECTRON LIMITED
11211289	Metal loss prevention using implantation	--
11211290	MIM capacitor with adjustable capacitance via electronic fuses	QUALCOMM INCORPORATED
11211291	Via formation with robust hardmask removal	INTERNATIONAL BUSINESS MACHINES CORPORATION
11211292	Assemblies containing PMOS decks vertically-integrated with NMOS decks, and methods of forming integrated assemblies	MICRON TECHNOLOGY, INC.
11211298	System and method for a transducer in an EWLB package	INFINEON TECHNOLOGIES AG
11211299	Wiring structure having at least one sub-unit	--
11211300	Electronic component and camera module	SONY SEMICONDUCTOR SOLUTIONS CORPORATION
11211301	Semiconductor device and method of manufacture	--
11211302	Semiconductor device package	--
11211303	Semiconductor device including a passivation structure and manufacturing method	INFINEON TECHNOLOGIES AG
11211304	Assembly and method for mounting an electronic component to a substrate	INFINEON TECHNOLOGIES AUSTRIA AG
11211305	Apparatus and method to support thermal management of semiconductor-based components	TEXAS INSTRUMENTS INCORPORATED
11211306	Synthetic diamond plates	ELEMENT SIX TECHNOLOGIES LIMITED
11211307	Semiconductor substrate	INFINEON TECHNOLOGIES AG
11211308	Semiconductor device and manufacturing method thereof	--
11211310	Package structures	--
11211311	Electronic device and connection body	SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
11211312	Semiconductor device	ROHM CO., LTD.
11211313	Lead frame array for carrying chips and LED package structure with multiple chips	LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
11211314	Interposer for electrically connecting stacked integrated circuit device packages	INTEL CORPORATION
11211315	Semiconductor package with terminal pattern for increased channel density	TEXAS INSTRUMENTS INCORPORATED
11211316	Wiring structure and method for manufacturing the same	--
11211317	Component carrier comprising a component having vertical through connection	AT&S AUSTRIA TECHNOLOGIE &#X26; SYSTEMTECHNIK AKTIENGESELLSCHAFT
11211318	Bump layout for coplanarity improvement	--
11211319	Device structure	--
11211320	Package with shifted lead neck	TEXAS INSTRUMENTS INCORPORATED
11211321	Package structure and manufacturing method thereof	--
11211322	Printed circuit board and electronic equipment	CANON KABUSHIKI KAISHA
11211323	Method of fabricating field effect transistor having non-orthogonal gate electrode	--
11211324	Via contact patterning method to increase edge placement error margin	INTEL CORPORATION
11211325	Semiconductor device package and method for manufacturing the same	--
11211326	Wiring substrate and manufacturing method thereof	SHINKO ELECTRIC INDUSTRIES CO., LTD.
11211327	Via sizing for IR drop reduction	--
11211328	Semiconductor memory device of three-dimensional structure	SK HYNIX INC.
11211329	Power island segmentation for selective bond-out	KIOXIA CORPORATION
11211330	Standard cell layout architectures and drawing styles for 5nm and beyond	ADVANCED MICRO DEVICES, INC.
11211331	Semiconductor structure having a via and methods of manufacturing the same	--
11211332	Molded die last chip combination	ADVANCED MICRO DEVICES, INC.
11211333	Through silicon via optimization for three-dimensional integrated circuits	--
11211334	Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip	--
11211335	Semiconductor packages incorporating alternating conductive bumps	SAMSUNG ELECTRONICS CO., LTD.
11211336	Integrated fan-out package and method for fabricating the same	--
11211337	Face-up fan-out electronic package with passive components using a support	INTEL CORPORATION
11211338	Apparatus for stacking substrates and method for the same	NIKON CORPORATION
11211339	Semiconductor device	--
11211340	Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding	--
11211341	Package structure and method of fabrcating the same	--
11211342	Multiplexer cell and semiconductor device having camouflage design, and method for forming multiplexer cell	--
11211343	Fan-out antenna packaging structure and packaging method	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
11211344	Integrated tunable filter architecture	PSEMI CORPORATION
11211345	In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same	INTEL CORPORATION
11211346	Semiconductor device and method of manufacture	--
11211347	Integrated circuit structures and methods of forming an opening in a material	MICRON TECHNOLOGY, INC.
11211348	First wafer, fabricating method thereof and wafer stack	WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
11211349	Semiconductor device including a plurality of bonding pads	RENESAS ELECTRONICS CORPORATION
11211350	Semiconductor package and manufacturing method thereof	--
11211351	Apparatuses including redistribution layers and related microelectronic devices	MICRON TECHNOLOGY, INC.
11211352	Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion	--
11211353	Clips for semiconductor packages	INFINEON TECHNOLOGIES AG
11211354	Systems and methods for semi-flexible eutectic bonder piece arranegments	--
11211355	Semiconductor device, method for manufacturing semiconductor device, and power conversion device	MITSUBISHI ELECTRIC CORPORATION
11211356	Power semiconductor package and method for fabricating a power semiconductor package	INFINEON TECHNOLOGIES AG
11211357	Method for processing an ultra-high density space interconnect lead under light source guidance	GUANGDONG UNIVERSITY OF TECHNOLOGY
11211358	Packaged semiconductor devices and packaging methods	--
11211359	Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates	SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
11211360	Passive device module, semiconductor package including the same, and manufacturing method thereof	--
11211361	Semiconductor device and method for manufacturing the same	KIOXIA CORPORATION
11211362	3D trench capacitor for integrated passive devices	--
11211363	Semiconductor device having through silicon vias and manufacturing method thereof	LONGITUDE LICENSING LIMITED
11211364	Semiconductor device assemblies and systems with improved thermal performance and methods for making the same	MICRON TECHNOLOGY, INC.
11211367	Display panel and method for fabricating the same	--
11211368	Semiconductor device	ROHM CO., LTD.
11211369	Service module for SIP devices	OCTAVO SYSTEMS LLC
11211370	Bonded assembly with vertical power and control signal connection adjacent to sense amplifier regions and methods of forming the same	SANDISK TECHNOLOGIES LLC
11211371	Integrated circuit package and method	--
11211372	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11211373	Double-sided chip stack assembly	UNITED SILICON CARBIDE, INC.
11211376	Three-dimensional integrated circuit having ESD protection circuit	--
11211377	Resistive element	FUJI ELECTRIC CO., LTD.
11211385	Semiconductor device and manufacturing method thereof	--
11211386	Semiconductor structure and manufacturing method thereof	--
11211387	Fin-based strap cell structure for improving memory performance	--
11211388	Array boundfary structure to reduce dishing	--
11211395	3D memory array having select lines	--
11211397	Three-dimensional memory devices and methods for forming the same	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11211400	Three-dimensional flash memory device with increased storage density	YANGTZE MEMORY TECHNOLOGIES CO., LTD.
11211401	Memory device and method for fabricating the same	--
11211403	Nonvolatile memory device having a vertical structure and a memory system including the same	SAMSUNG ELECTRONICS CO., LTD.
11211408	Wiring layer and manufacturing method therefor	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
11211425	Magnetic memory devices	SAMSUNG ELECTRONICS CO., LTD.
11211445	Foldable display panel	--
11211448	Capacitor structure with MIM layer over metal pillars	GLOBALFOUNDRIES U.S. INC.
11211451	Stretchable electronic structures and techniques for the formation thereof	NORTHEASTERN UNIVERSITY
11211459	Semiconductor device and method of manufacturing a semiconductor device	INFINEON TECHNOLOGIES AG
11211490	FinFETs having step sided contact plugs and methods of manufacturing the same	SAMSUNG ELECTRONICS CO., LTD.
11211496	FinFET device and method of forming	--
11211497	Semiconductor device	SAMSUNG ELECTRONICS CO., LTD.
11211542	Cryogenic refrigeration for low temperature devices	INTERNATIONAL BUSINESS MACHINES CORPORATION
11211551	Current sensor package with continuous insulation	INFINEON TECHNOLOGIES AG
11211687	Method of fabricating a semiconductor structure with an antenna module	SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
11212908	Semiconductor apparatus	MITSUBISHI ELECTRIC CORPORATION
11212914	Circuit board and display device	BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
11212939	Board level shield for electrical assembly	TE CONNECTIVITY SERVICES GMBH
11212947	Power module with capacitor configured for improved thermal management	EPCOS AG

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